Specific Chassis Or Ground Patents (Class 361/753)
  • Patent number: 7852636
    Abstract: An electronic device includes a shell, a printed circuit board, and a dummy connector. The shell defines a through hole and accommodates the printed circuit board. The dummy connector includes a main body and a grounded portion. The main body includes a projection engaging the through hole. The grounded portion extends from the main body and is electrically fixed to the printed circuit board to be grounded.
    Type: Grant
    Filed: April 15, 2009
    Date of Patent: December 14, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xiao-Feng Ma, Zheng-Heng Sun
  • Patent number: 7848114
    Abstract: An electronic ballast and ballast housing having an integral ground for a circuit board positioned within the housing. A ‘snap in’ capture means holds circuit board under flexion so as to press a circuit grounding means in electrical contact with an integral grounding device attached to the ballast housing and providing electrical continuity between the circuit grounding means and the ballast housing. The coupler includes a grounding tab with a fulcrum extension extending from the housing and holding a ground plane surface of the circuit board by means of serrated teeth. An alignment tab disposed on a housing wall receives an alignment slot disposed in the circuit board so as to provide proper alignment of the electrical contacts. The coupler includes an overhead extension that engages a jumper wire in the circuit of the circuit board.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: December 7, 2010
    Assignee: Universal Lighting Technologies, Inc.
    Inventors: James Van Pelt, David McCarty, J. C. Kelley
  • Publication number: 20100277879
    Abstract: An electronic device includes a case, a board module, and an electrostatic discharging module. The case has a conductive area. The board module is disposed in the case and has a ground end. The electrostatic discharging module is disposed on the case. Besides, the electrostatic discharging module includes a first discharging element and a second discharging element. The first discharging element is electrically connected to the ground end, and the second discharging element is electrically connected to the conductive area. There exists a gap between the first discharging element and the second discharging element, so that leak current generated by the board module can be prevented from being transmitted to the case, and that an electrostatic charge can be transmitted from the case to the ground end.
    Type: Application
    Filed: April 28, 2010
    Publication date: November 4, 2010
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Lung Juan, Kuo-Cheng Chu
  • Patent number: 7817442
    Abstract: An input device of the invention includes a body formed with an accommodating part; an operation member having a basal end accommodated in the accommodating part and a distal end projected in a swinging operable manner to either side in a width direction and in a pushing operable manner from an neutral position; and an earth terminal for dissipating static electricity charged in the operation member. The input device is attachable to a circuit board. The earth terminal, being a metal plate insert molded in a wall, includes a contacting portion and first and second projections arranged near the operation member, and connecting parts exposed from the other end face of the body and solder connectable to respective earth patterns of the circuit board.
    Type: Grant
    Filed: August 23, 2007
    Date of Patent: October 19, 2010
    Assignee: Hosiden Corporation
    Inventor: Satoshi Yamanaka
  • Publication number: 20100259901
    Abstract: An electronic housing assembly is formed with an environmental seal (20), EMI control (56) and a good thermal coupling (44, 46) made between enclosed hot electric components (48, 50) and an exterior heat sink (52, 54).
    Type: Application
    Filed: October 4, 2004
    Publication date: October 14, 2010
    Applicant: OSRAM SYLVANIA INC.
    Inventors: John Sanroma, Russell R. Holden, Andrew O. Johnson, Guy P. Bouchard
  • Publication number: 20100254103
    Abstract: An electronic circuit unit electrically connected to a motherboard via a terminal soldered on a lower surface of a circuit board is provided, wherein the terminal has a bridge connection portion disposed on an upper surface of the circuit board, a first lead portion extending downwardly from one end of the bridge connection portion so as to be inserted through a first through-hole of the circuit board, and a second lead portion extending downwardly longer than the first lead portion from the other end of the bridge connection portion so as to be inserted through a second through-hole of the circuit board, the terminal having a bent form, and wherein the first lead portion is soldered on the lower surface of the circuit board, and the second lead portion is inserted into a terminal installation hole of the motherboard when the electronic circuit unit is mounted on the motherboard.
    Type: Application
    Filed: March 24, 2010
    Publication date: October 7, 2010
    Inventor: Norihito Okada
  • Patent number: 7796403
    Abstract: A spectrophotometric sensor is provided that includes a mating surface upon which electrical and optical components may be secured and a Faraday shield assembly secured to the mating surface enclosing a photodetector. The Faraday shield assembly includes alignment features that may be employed to provide mechanical registration and/or electrical coupling of the Faraday shield assembly. The spectrophotometric sensor may be placed on a patient's finger, toe, ear, and so forth to obtain hemoglobin oxygen saturation using pulse oximetry, or for other physiological measurements.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: September 14, 2010
    Assignee: Nellcor Puritan Bennett LLC
    Inventor: Joseph Coakley
  • Patent number: 7791902
    Abstract: A system for protecting electronic components to be disposed inside a computer housing comprising a gliding connector aligner for disposing inside the housing. The aligner has a central flat surface to be disposed over electronic components and a plurality of appendages with at least one nub each disposed at an opposing end to that of the central surface. The appendages are substantially perpendicular to the flat surface. An EMC gasket is also provided around the housing. The gasket in one embodiment has a plurality of portions with each portion having a central support line from which a plurality of complementary spring fingers emanates. The portions are connected to one another via a tab such that said gasket can be stretched around all housing corners such that said spring fingers from different portions are placed in a substantially perpendicular direction to one another.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: September 7, 2010
    Assignee: International Business Machines Corporation
    Inventor: Michael T. Peets
  • Patent number: 7787255
    Abstract: A grounding apparatus (200) includes at least one conductive member (20), a sliding mechanism (30) and a flexible printed circuit board (40). The sliding mechanism is conductive and electrically connected to the conductive member. The flexible printed circuit board includes a conductive layer (421) and a grounding end (4231), the conductive layer and the grounding end are electrically connected to the sliding mechanism.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: August 31, 2010
    Assignee: Chi Mei Communication Systems, Inc.
    Inventors: Ching-Sen Tsai, Mei-Tsu Tsao, Cheng-Lung Chang
  • Patent number: 7765687
    Abstract: Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material to provide thermal conduction from the printed circuit board to the case. The case may be a conduit having open ends through which the printed circuit board is inserted or it may comprise a cover mounted to a base plate.
    Type: Grant
    Filed: August 11, 2006
    Date of Patent: August 3, 2010
    Assignee: SynQor, Inc.
    Inventors: Lennart Pitzele, Abram P. Dancy, Leif E. LaWhite, Rene Hemond, Martin F. Schlecht
  • Patent number: 7755913
    Abstract: A disk drive cage comprises a bracket (3) and a shielding member (1). The bracket comprises a top wall (31) and a securing wall (32) parallel to the top wall. The securing wall defines a plurality of securing holes (321) therein. The shielding member comprises a shielding cover (20) and a bezel (10) attached to the shielding cover. The shielding cover defines a plurality of cross-shaped slots (23). Each cross-shaped slot comprises a first slot (231) and a second slot (232) crossing the first slot. A receiving area (236) is defined in a crossing portion formed by the first and second slots. The bezel comprises a plurality of securing posts (12) interferentially engaging with the plurality of cross-shaped slots, and a plurality of hooks (162) engaging with the securing holes of the securing wall of the bracket. Each securing post comprises a securing portion (124). The securing portion is larger in cross-section than the receiving area. The shielding member is mounted between the top wall and the securing wall.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: July 13, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co. Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Yu-Wei He
  • Publication number: 20100157554
    Abstract: A fixing mechanism capable of reducing electromagnetic radiation interference includes a fixing component passing through a first hole on a circuit board and a second hole on a casing so as to fix the circuit board on the casing, and a conductive film covering the fixing component for contacting the circuit board and the casing so as to ground the circuit board via the casing.
    Type: Application
    Filed: July 27, 2009
    Publication date: June 24, 2010
    Inventor: Chih-Kang Ho
  • Patent number: 7738264
    Abstract: The present invention provides methods and devices for protecting electronic components of handheld electronic devices from electrostatic discharge. An electronic device in accordance with the present invention includes an enclosure having first and second housing portions, a mating edge connection between the first and second housing portions, an electronic component, and an electrically insulating frame. The electrically insulating frame is positioned within the enclosure and surrounds at least a portion of the electronic component thus providing an electrostatic discharge barrier between the mating edge connection and the electronic component.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: June 15, 2010
    Assignee: Lifescan Scotland Ltd.
    Inventors: Jim Christol, Wayne Kvenvold, Joseph A. McCluskey, Enrico Tresoldi
  • Publication number: 20100142165
    Abstract: A structure for supporting a printed wiring board housed in a housing of an electronic device. The supporting structure includes a first projection formed on the housing and projecting toward the printed wiring board. The electronic device includes a conductor plate, which is grounded and accommodated in the housing. A second projection is formed on the conductor plate and projects toward the printed wiring board. The printed wiring board includes a substrate and a ground layer, which is arranged on the substrate. The first projection of the housing and the second projection of the conductor plate hold and support the printed wiring board in between and thereby electrically connect the ground layer to the conductor plate.
    Type: Application
    Filed: December 3, 2009
    Publication date: June 10, 2010
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventor: Kazunori Kotani
  • Patent number: 7729125
    Abstract: A printed circuit board unit is configured so that, when a charged electrical circuit unit is electrically connected to the printed circuit board unit, first, the ground potential of the electrical circuit unit is dropped to the frame ground potential, and next, the ground potential of the electrical circuit unit is dropped to the ground potential of an electrical circuit on the printed circuit board unit.
    Type: Grant
    Filed: November 2, 2006
    Date of Patent: June 1, 2010
    Assignee: Fujitsu Limited
    Inventors: Hideo Araki, Naoya Yamazaki
  • Patent number: 7719849
    Abstract: Included are systems and methods for providing access of test points. An embodiment of a system includes an electrical module including at least one electrical circuit configured to communicate at least one electrical signal, the electrical module further including at least one multiple access test point configured to provide access for measurements of the electrical circuit. Some embodiments include an environmental housing that includes at least one access port, the environmental housing configured to receive the electrical module such that at least one access port provides access to at least one multiple access test point.
    Type: Grant
    Filed: July 7, 2006
    Date of Patent: May 18, 2010
    Assignee: Scientific-Atlanta, Inc.
    Inventors: Steven E. Blashewski, Robert R. Riggsby, William G. Mahoney
  • Patent number: 7719857
    Abstract: A structure of mounting a shield cover according to the present invention includes a shield cover having an insertion part which is inserted into a gap formed between a circuit substrate and a shield cover fastening part along the circuit substrate. The insertion part of the shield cover includes a convex part that is elastic and deformable, and the end of the insertion part and the shield cover fastening part come in contact with each other by the elasticity with the convex part being in contact with the circuit substrate as the fulcrum.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: May 18, 2010
    Assignee: Mitsubishi Electric Corporation
    Inventor: Yuji Ogawa
  • Patent number: 7697305
    Abstract: An apparatus is provided comprising a chassis of a sheet of an electrically conductive material having a substantially non-conductive coating. An exposed portion of the chassis can be deformed to provide at least one protrusion such that the non-conductive coating on the at least one protrusion is thinner than a portion of the sheet spaced apart from the at least one protrusion to provide a conductivity path through the sheet.
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: April 13, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Gregory S. Meyer, Karl Conrad
  • Patent number: 7692932
    Abstract: The devices and methods herein provide ground for computer cards inserted into a computer card chassis (e.g., VME chassis, CompactPCI chassis, ATCA chassis, etc.). A resilient clip may be configured with a chassis member of the computer card chassis. The clip is affixed to the computer card chassis and maintains contact with a ground plane, such as an ESD shield. The clip may have a self locking mechanism which insurers that the clip resides at a fixed position with the chassis member. A computer card may then be inserted into the computer card chassis and thereby make contact with the resilient clip. The computer card may include a ground pin which inserts through an aperture within the chassis member to make contact with the resilient clip. Accordingly, the inserted computer card may be provided with ESD protection as well as a ground reference potential from the computer card chassis.
    Type: Grant
    Filed: March 16, 2007
    Date of Patent: April 6, 2010
    Assignee: Flextronics AP, LLC
    Inventors: Steve Bisbikis, Steve Koo, Todd Collis
  • Patent number: 7679931
    Abstract: A plasma display apparatus comprises a plasma display panel and a chassis disposed on a rear portion of the plasma display panel to support the plasma display panel. The chassis is formed of plastic, and thus the weight of the plasma display apparatus is reduced. A conductive grounding member is disposed between the chassis and the plasma display panel. The apparatus further comprises a circuit unit having a grounding portion electrically connected to the conductive grounding member. A thermal conductive sheet is disposed between the plasma display panel and the chassis.
    Type: Grant
    Filed: June 9, 2006
    Date of Patent: March 16, 2010
    Assignee: Samsung SDI Co., Ltd.
    Inventor: Yeung-Ki Kim
  • Patent number: 7679935
    Abstract: An electromagnetic-shielding device disposed in an electronic device prevents that an electric component in the electronic device is interfered by electromagnetic wave. The electromagnetic-shielding device has at least one positioning and leaning wall, which is mounted on a laminate member as a part of a housing of the electronic device or a central plate within the electronic device. By means of the positioning and leaning wall, an electromagnetic-shielding mask is conveniently mounted within the electronic device so as to cover the electronic component.
    Type: Grant
    Filed: June 14, 2007
    Date of Patent: March 16, 2010
    Inventor: Chin-Fu Horng
  • Patent number: 7672145
    Abstract: An electronic component module includes a module body including a substrate having components mounted thereon. A metal case is attached to the substrate to cover the components of the module body. The metal case includes a top-plate portion arranged substantially parallel to the main surface of the substrate and claw portions arranged at both edges thereof. The claw portions each include a claw body defined by a rectangular portion that is bent at an edge of the top-plate portion and extends in the direction of the substrate and a holding claw. In addition, contacting portions are bent at both ends of the rectangular portion to extend towards the inner portion of the main surface of the substrate. The contacting portions come into contact with the main surface of the substrate, and the holding claws are soldered to the side surfaces of the substrate.
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: March 2, 2010
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Junya Shimakawa, Hideyuki Fujiki, Keiji Ogawa
  • Patent number: 7667985
    Abstract: One embodiment of the present computer network device comprises a subassembly. The subassembly includes a support plate, a standoff extending from the support plate, a printed circuit board (PCB) secured to the standoff, an electromechanical connector secured to the PCB, an electromagnetic interference (EMI) cage secured to the PCB, and an EMI gasket engaging the EMI cage. The computer network device further comprises a guiding and retaining member that engages the support plate and assists in securing the subassembly within an enclosure. In a method of assembling the computer network device, the subassembly is first assembled before the subassembly is secured within an enclosure. Relative motion of the PCB and the standoffs is thus eliminated during the assembly process.
    Type: Grant
    Filed: August 28, 2008
    Date of Patent: February 23, 2010
    Assignee: QLogic, Corporation
    Inventors: Vladimir Tamarkin, Mark W. Wessel
  • Patent number: 7660132
    Abstract: A highly reliable covered multilayer module includes a plurality of side electrodes extending in a lamination direction of ceramic layers are provided at least at one of side surfaces of a multilayer module body. At least one of inner conductor layers is exposed at the side surface provided with the side electrodes, in a region interposed between an adjacently arranged pair of the side electrodes. A claw portion of a metal case is soldered to the side electrodes and the inner conductor layer. The plurality of inner conductor layers may be exposed at the side surface of the multilayer module body in the region interposed between the adjacently arranged pair of side electrodes such that at least a part of the inner conductor layer is superposed on the other inner conductor layer when seen in the lamination direction of the ceramic layers.
    Type: Grant
    Filed: November 6, 2008
    Date of Patent: February 9, 2010
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Koji Tanaka
  • Patent number: 7655861
    Abstract: A surge protector which has a metal grounding plate having holes and tubular sleeve guides, standard UL-approved ground rods that are inserted through the sleeve guides and are affixed to the sleeve guides using a durable exothermic weld, and leads attached at one end to the grounding plate also using an exothermic weld to affix any number of grounding devices, traditional ground rings, electronic equipment, structures, sites or combinations thereof. The durable exothermic weld is a permanent connection that stands in contrast to commonly used mechanical connections. The present invention also has a minimal footprint requirement allowing for placement in areas where space limitations are unsuitable for placement of conventional grounding rings. The present invention can be used in combination with or in lieu of conventional grounding rings.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: February 2, 2010
    Inventor: Wayne C. Duley
  • Publication number: 20100020513
    Abstract: An hermetically sealed integrated microwave circuit comprising a coplanar waveguide on a printed circuit board (PCB) electrically connected on one major surface to an integrated circuit, and thermally and electrically connected to a ball grid array (BGA) on its opposite major surface, in which the PCB has at least first and second printed layers, a microwave signal path extends from a ball of the BGA through a through-hole in both printed layers to the coplanar wave guide, and plural ground paths extend from balls of the BGA through first through-holes in the first printed layer of the PCB and through second through-holes of the second printed layer of the PCB, the first and second through-holes being non-coincident, to allow for an hermetic seal across the PCB whilst introducing a predetermined impedance in the PCB between the signal and ground paths.
    Type: Application
    Filed: July 8, 2009
    Publication date: January 28, 2010
    Applicant: Thales Holdings UK PLC
    Inventors: Graham Lawson, Emmanuel Loiselet
  • Patent number: 7646613
    Abstract: A latch mechanism for removably securing a module in a bay of an electronic device. The latch mechanism includes a first wireform configured to move along a first wall of the bay to latch a first side of the module and a tang configured to move substantially perpendicularly to a second side of the module to latch the second side of the module. The latch mechanism includes a control member operatively connected with the first wireform and the tang to actuate the first wireform and the tang simultaneously in response to user input such that when the module is inserted into the bay, the first wireform and the tang simultaneously latch the first side of the module and the second side of the module.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: January 12, 2010
    Assignee: Apple Inc.
    Inventors: Chris Ligtenberg, Brett William Degner, Bartley K. Andre
  • Patent number: 7643311
    Abstract: An electronic device protected against electromagnetic disturbances comprising: a support structure having a first and second electronic component, wherein the support structure includes a conductive means surrounding each of the first and second electronic components; a first and second insulating block formed overlying the first and second electronic components on the support structure; and a metal layer overlying the first and second insulating blocks that are formed over the first and second electronic components, wherein the metal layer is electrically connected to the support structure through the conductive means to protect the first and second electronic components from the electromagnetic disturbances irradiating from each of the first and second electronic components.
    Type: Grant
    Filed: April 20, 2006
    Date of Patent: January 5, 2010
    Assignee: STMicroelectronics SA
    Inventor: Romain Coffy
  • Publication number: 20090323266
    Abstract: An electronic apparatus that includes: a grounding body that is kept at a ground potential; a cable that extends with its outer surface being in contact with the grounding body; and a circuit board that holds the cable interposed between the circuit board and the grounding body and that has a ground pattern extending on a portion contacting the cable, wherein the cable has a conductive outer surface extending over at least both a contact portion with the grounding body and a contact portion with the circuit board.
    Type: Application
    Filed: February 25, 2009
    Publication date: December 31, 2009
    Applicant: FUJITSU LIMITED
    Inventor: Yusuke Mizuno
  • Publication number: 20090310324
    Abstract: An aircraft circuit breaker includes a housing and a conductive member coupled thereto. The conductive member has a first conductive portion structured to be electrically and mechanically coupled to a conductive panel and a plurality of second conductive portions with a plurality of openings therethrough. An electronic circuit cooperates with an operating mechanism to trip open separable contacts. The circuit includes printed circuit boards having a plurality of conductive pads defining a ground. Each conductive pad has an opening therethrough. Each of a plurality of threaded conductive fasteners includes a conductive end portion, a conductive shaft disposed from the conductive end portion, and a plurality of conductive threads disposed on the conductive shaft. A number of the conductive threads electrically and mechanically engage a corresponding second conductive portion at a corresponding one of the openings. The conductive end portion electrically engages a corresponding one of the conductive pads.
    Type: Application
    Filed: June 16, 2008
    Publication date: December 17, 2009
    Inventors: Patrick W. Mills, Richard G. Benshoff, James M. McCormick
  • Patent number: 7633762
    Abstract: On a circuit board to be mounted on a metal chassis, a tuner having a metal sleeve protruding from a side of its case is mounted, with the sleeve protruding beyond an edge of the circuit board. A metal ground plate is fitted on the sleeve. With a flexible leg portion formed at a lower portion of the ground plate disposed on the chassis, the circuit board is fixed to the chassis with screws, thereby the leg portion comes into elastic contact with the chassis.
    Type: Grant
    Filed: August 15, 2008
    Date of Patent: December 15, 2009
    Assignee: Funai Electric Co., Ltd.
    Inventors: Hideo Yonezawa, Naohito Doi
  • Patent number: 7631421
    Abstract: A structure of fixing a printed circuit board includes a mold frame coupled with a display panel, a printed circuit board positioned at a rear surface of the display panel and electrically connected to a pad portion of the display panel, and an insulating film covering an outer surface of the printed circuit board.
    Type: Grant
    Filed: October 2, 2007
    Date of Patent: December 15, 2009
    Assignee: LG Display Co., Ltd.
    Inventors: Chul Park, Moon Kyo Bae
  • Patent number: 7616449
    Abstract: A crash-hardened memory device in which only a single electronic component, such as a memory chip, mounted on a small printed circuit board (PCB), is protected against an impact. The portion of the PCB containing the electronic component is wrapped in fire-retardant material and RF shielding tape. The wrapped PCB assembly is placed in a rigid, hardened enclosure which provides an environmental seal for the portion of the PCB containing the electronic component. A portion of the PCB extends outside of the enclosure to allow electrical connections to be made to the electronic component contained inside. A score line is created on the PCB to create an acceptable shear point between the internal and external portions of the PCB in the event of a crash. Threaded fasteners extend through and beyond both enclosure halves to provide a means for mounting the crash-hardened memory device on an external surface.
    Type: Grant
    Filed: September 21, 2007
    Date of Patent: November 10, 2009
    Assignee: Appareo Systems, LLC
    Inventors: Barry Douglas Batcheller, Peder Alfred Nystuen, Robert Michael Allen
  • Patent number: 7597487
    Abstract: An optical communication device includes a top cover, a bottom cover, a circuit board and an electrostatic discharge element. The bottom cover is disposed opposite to the top cover, and an accommodating space is formed between the top and bottom covers. The circuit board is disposed in the accommodating space. The electrostatic discharge element is disposed on the circuit board and electrically connected to the circuit board.
    Type: Grant
    Filed: January 9, 2008
    Date of Patent: October 6, 2009
    Assignee: Delta Electronics, Inc.
    Inventors: San-Ching Kuo, Chiung-Hung Wang, Chia-Wen Lin, Ming-Chia Wu
  • Patent number: 7596000
    Abstract: The disclosure relates to a signal transmitting apparatus. The signal transmitting apparatus includes a conductor, a first and a second circuit boards, and a signal transmitting medium that is electrically interconnected between the first circuit board and the second circuit board. The signal transmitting medium includes a ground wire and an insulating layer wrapping the ground wire, wherein at least an end portion of the ground wire is not wrapped by the insulating layer and is bent to overlap the insulating layer and electrically connected to the conductor via a conductive adhesive material so as to conduct the electrostatic charges accumulated in the signal transmitting medium to the conductor as a ground.
    Type: Grant
    Filed: July 31, 2006
    Date of Patent: September 29, 2009
    Assignee: Lite-On It Corp.
    Inventors: Shih-Lin Yeh, Jung-Fu Chen, Min-Cheng Yang
  • Patent number: 7586752
    Abstract: Embodiments of tubular telecommunications cabinets are presented herein. Specifically, Telecommunications equipment cabinets are described which are configured to protect a plurality of components from environmental influences and provide a high degree of access to the interior of the cabinet. In an implementation a cabinet is configured with a plurality of mountings to mount a plurality of telecommunications equipment within a tubular enclosure. A plurality of partially-tubular sides may be joined to form the tubular enclosure around the mountings. Thus, equipment may be mounted within the cabinet to protect the equipment, for instance, at an outside location. The sides further are operable to permit access to the interior and corresponding equipment around substantially the entire perimeter of the cabinet.
    Type: Grant
    Filed: March 1, 2006
    Date of Patent: September 8, 2009
    Assignee: Telect Inc.
    Inventors: Pedro A. Fernandez, Lloyd W. Lohf
  • Publication number: 20090219704
    Abstract: In a high frequency component, a case made up of metal having a shape of frame for containing a board includes tabs and stoppers. During producing of the high frequency component, the board is inserted from an opening on a side on which the tabs are provided. Each of the tabs has a height in a direction perpendicular to an insertion direction of the board, which becomes lower toward upstream in the insertion direction. Each of the tabs has elasticity so as to return to its original state after being pushed toward an inner side surface of the case by a force applied from upstream side in the insertion direction. By this, the board can be easily inserted and fixed between the tabs and the stoppers in the case. This makes it possible to provide a printed board holding case to which a printed board can be easily inserted and sufficiently fixed.
    Type: Application
    Filed: February 27, 2009
    Publication date: September 3, 2009
    Inventor: Atsumi YOKOYAMA
  • Publication number: 20090219703
    Abstract: According to one embodiment, there is provided a printed circuit board, including a frame ground portion in which conductor patterns are formed around a board-fixation hole, and a plurality of through-holes formed around the board-fixation hole in the frame ground portion.
    Type: Application
    Filed: February 25, 2009
    Publication date: September 3, 2009
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Norihiro ISHII, Kuniyasu HOSODA, Shinya AINAI
  • Patent number: 7583510
    Abstract: A transceiver cage assembly includes a housing (10) and a grounding device (20). The housing includes at least one receiving space for receiving at least one transceiver module. The grounding device mounted on the housing includes a flat main member (200), and at least one resilient member (220) protruding from the main member. The grounding device provides electrical connection between the housing and bezels.
    Type: Grant
    Filed: September 1, 2006
    Date of Patent: September 1, 2009
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Wan-Cheng Wang
  • Publication number: 20090207572
    Abstract: An electronic device includes a housing defining a through hole, a circuit board fixed in the housing, including a switch and a grounding portion connecting with the ground, a fastening member received in the through hole fixed on the housing and contacting the grounding portion, passing static electricity therethrough and defining a mounting hole, and an actuating member received in the mounting hole and contacting the fastening member, and pressing the switch when actuated; wherein the fastening member and the actuating member are conductive.
    Type: Application
    Filed: December 27, 2008
    Publication date: August 20, 2009
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Shi-Kun Guo, Ke-Hui Peng, Guo-Ping Yao
  • Patent number: 7576993
    Abstract: An elastic grounding clip, set between a PCB and a housing of an electronic device, includes two first main pieces, a first connection piece connected between the two first main pieces, a second main piece adjacent one of the first main pieces, and a second connection piece connected between the one of the first main pieces and the second main piece. The two first main pieces and the first connection piece bound a first clamping part configured for clamping the PCB, and the corresponding first main piece, the second connection piece, and the second main piece bound a second clamping part configured for clamping a protruding portion of the housing of the electronic device.
    Type: Grant
    Filed: February 27, 2008
    Date of Patent: August 18, 2009
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Ming-Chih Hsieh, Tsung-Hsi Li
  • Patent number: 7576994
    Abstract: A structure of fixing a printed circuit board includes a mold frame coupled with a display panel, a printed circuit board positioned at a rear surface of the display panel and electrically connected to a pad portion of the display panel, and an insulating film covering an outer surface of the printed circuit board.
    Type: Grant
    Filed: October 2, 2007
    Date of Patent: August 18, 2009
    Assignee: LG Display Co., Ltd.
    Inventors: Chul Park, Moon Kyo Bae
  • Patent number: 7573705
    Abstract: A data storage system for removably storing information is disclosed. The data storage system includes a cartridge receptacle adapted to electrically and mechanically engage a removable data cartridge. The cartridge receptacle includes a second electrical connector and a conductive member. The second electrical connector is adapted to electrically engage a first electrical connector of the removable data cartridge. The conductive member is configured to engage a resistive portion of the removable data cartridge before the first and second electrical connectors engage. The conductive member is coupled to a ground of the cartridge receptacle.
    Type: Grant
    Filed: January 12, 2006
    Date of Patent: August 11, 2009
    Assignee: ProStor Systems, Inc.
    Inventors: S. Christopher Alaimo, Alan Holstein, Randall A. Spalding, Michael H. Ulrich, Paul M. Williams
  • Patent number: 7573709
    Abstract: A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. During compression, the movement of each spring finger's tip is substantially limited to the z-axis. Accordingly, the final installed location of the tip can be precisely controlled even when the grounding spring must accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that is less susceptible to sliding off the conductive pads.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: August 11, 2009
    Assignee: International Business Machines Corporation
    Inventors: Don Alan Gilliland, Max John Christopher Koschmeder
  • Patent number: 7570496
    Abstract: An electromagnetic interference shielding apparatus for a signal transceiver employs two folded-edge mechanisms coupled together and an adhesive. The electromagnetic interference shielding apparatus includes a metal cover, a chassis having a waveguide output hole, and an adhesive. A first combination portion having a first curved section is disposed on an edge of the metal cover. A second combination portion having a second curved section corresponding to the first combination portion is disposed on an edge of the chassis. The adhesive is used to combine the first combination portion and the second combination portion. The waveguide output hole outputs a signal transmitted by the signal transceiver. The first combination portion and the second combination portion form a curved space that is used with the adhesive to prevent leakage of the transmitted signal and the interference of external noises.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: August 4, 2009
    Assignee: Microelectronics Technology Inc.
    Inventors: Ruei Yuen Chen, Fang Yu Kuo, Yi Hsiang Huang
  • Publication number: 20090190316
    Abstract: A mounting device includes a chassis, a transfer card electronically connected to a motherboard, and a mounting bracket assembly. The mounting bracket assembly includes a clamping member and a fastening member. The clamping member clamping a first end of the transfer card and restricting movement of the transfer card in a first direction. The fastening member fastening an opposite second end of the transfer card to restrict movement of the transfer card in a second direction perpendicular to the first direction.
    Type: Application
    Filed: April 14, 2008
    Publication date: July 30, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHIA-KANG WU, LI-PING CHEN
  • Patent number: 7564699
    Abstract: A planar circuit housing (300) for containing a planar circuit (120) is disclosed. The planar circuit housing (300) comprises a support portion (341) for supporting edges of the planar circuit (120), the support portion (341) being provided on at least one housing internal surface substantially perpendicular to the planar circuit substrate (120); an upper cavity (380) in the housing (300) above the planar circuit (120); and a lower cavity (382) in the housing (300) below the planar circuit (120), the lower cavity (382) having the same sizes as the upper cavity (380) in directions parallel with the planar circuit substrate (120).
    Type: Grant
    Filed: September 19, 2005
    Date of Patent: July 21, 2009
    Assignee: NTT DoCoMo, Inc.
    Inventors: Daisuke Koizumi, Kei Satoh, Shoichi Narahashi, Tatsuro Masamura
  • Patent number: 7561444
    Abstract: A mounting assembly for shielding EMI, the mounting assembly includes a drive bracket (10) and a shielding apparatus (30). The drive bracket includes a bottom wall (11), a first retaining wall (16), a second retaining wall (18), and a dividing wall (15), the first retaining wall defines a first hole (161), the second retaining wall defines a second hole (181), the dividing wall defines an upper hole (153) and a lower hole (151). The shielding apparatus includes a shielding cover (31) and a bezel (33), the shielding cover has a first flange (36) and a second flange (38), the first flange has a protuberance (361) engaged in the first hole, the second flange has a protuberance (381) engaged in the lower hole, the second shielding apparatus (40) engaged in the upper hole of the dividing wall and the second hole of the second retaining wall.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: July 14, 2009
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Yu-Wei He
  • Patent number: 7558971
    Abstract: An adaptable power supply for a computer system is provided, including: a power supply case, a power adapter, an input power connector, and a plurality of output connectors fixably mounted to the power supply case, and clustered into at least two clusters for connection to computer system components or subsystems via individual power cables. A method of manufacturing a computer system is also described, including: providing an adaptable power supply having output connectors, and connecting a plurality of computer system components to the power supply output connectors using individual cables. A computer system containing an adaptable power supply is also described.
    Type: Grant
    Filed: April 4, 2005
    Date of Patent: July 7, 2009
    Assignee: Rackable Systems, Inc.
    Inventors: Matthew P. Casebolt, Jack E. Randall
  • Patent number: 7554815
    Abstract: An device including a fastener. In some embodiments, the device is an electronic device that includes a circuit board, a support structure, and a resilient conductive clip. The circuit board may include a slot extending between opposite faces. The resilient conductive clip may couple to the support structure and be removably inserted through the slot so that it is disposed at least partially about the opposite faces. The resilient conductive clip may include lower and upper grounding portions engaged against the opposite faces of the circuit board.
    Type: Grant
    Filed: May 31, 2006
    Date of Patent: June 30, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Thomas T. Hardt, Carlos Torres, David E. Thomas