Specific Chassis Or Ground Patents (Class 361/753)
-
Publication number: 20130271935Abstract: The present invention provides a grounding structure for a printed circuit board which is fixed onto a chassis by a force applied at a first side of the printed circuit board towards the chassis.Type: ApplicationFiled: December 31, 2010Publication date: October 17, 2013Applicant: THOMSON LICENSINGInventors: Kian Choy Kiew, Hongtao Liu, Ke Zhang
-
Patent number: 8553396Abstract: A communications device capable of coupling current reduction includes a first casing, a second casing, and an antenna. The first casing includes a first metal layer part. The second casing includes a second metal layer part. The antenna is adjacent to the first and second metal layer parts when the second casing is at a covering position. The first metal layer part has a surface that confronts the second metal layer part when the second casing is at the covering position and that is formed with a plurality of first recesses. The second metal layer part has a surface that confronts the first metal layer part when the second casing is at the covering position and that is formed with a plurality of second recesses.Type: GrantFiled: April 13, 2011Date of Patent: October 8, 2013Assignee: Quanta Computer, Inc.Inventors: Chieh-Ping Chiu, Feng-Jen Weng, Hsiao-Wei Wu, I-Ping Yen
-
Patent number: 8550824Abstract: A display card assembly includes a display card with a first circuit board, a straight through connector, and an expansion card with a second circuit board. A first edge connector is arranged on a bottom edge of the first circuit board and includes first power pins connected to a control chip and first storage chips, first ground pins, and first signal pins. A second edge connector connected to the straight through connector is arranged on an end edge of the first circuit board adjoining the bottom edge and includes second power pins connected to the first power pins, second ground pins, and second signal pins connected to the control chip. A third edge connector engaged in the straight through connector is arranged on an end edge of the second circuit board and includes third power pins and third signal pins connected to the second storage chips, and third ground pins.Type: GrantFiled: December 29, 2011Date of Patent: October 8, 2013Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Kang Wu, Bo Tian
-
Publication number: 20130258619Abstract: Various circuit boards and stiffener frames and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes fabricating a stiffener frame that has a surface adapted to engage a side of a circuit board. The surface includes a projection to protect a corner of the circuit board.Type: ApplicationFiled: March 30, 2012Publication date: October 3, 2013Inventors: Tom J. Ley, Eric S. Tosaya, Chia-Ken Leong
-
Patent number: 8542496Abstract: A mounting device for mounting an expansion card which forms a fixing piece at an end includes a rack and a frame detachably mounted to the rack. The rack defines two spaced recessed portions. Each recessed portion includes two opposite sidewalls and a bottom wall connected between the sidewalls. A resilient member is formed on each of the bottom walls. Two parallel tabs and a connection portion connected between the tabs are formed on the frame. The tabs are respectively received in the recessed portions and each abuts against one of the sidewalls of the corresponding recessed portion. The fixing piece of the expansion card is sandwiched between one of the tabs and the corresponding resilient member.Type: GrantFiled: December 6, 2011Date of Patent: September 24, 2013Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co. Ltd.Inventor: Lei Liu
-
Patent number: 8534628Abstract: A mounting apparatus for a motherboard includes a chassis, a bracket, a resilient plate, and a handle. The chassis includes a sidewall, and a fastener formed on an inner surface of the sidewall. The bracket is fixed to a side of the motherboard. The resilient plate includes a fixing portion fixed to a side of the bracket facing the sidewall, a connecting portion slantingly extending toward the sidewall from the fixing portion, and a resilient arm extending from the connecting portion away from the fixing portion and defining a latching hole. The handle is pivotably connected to the bracket and includes a first plate. When the handle is rotated towards the bracket, the first plate is inserted into a space between the resilient arm and the bracket, and deforms the resilient arm towards the sidewall. The fastener engages in the latching hole of the resilient arm.Type: GrantFiled: September 21, 2011Date of Patent: September 17, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Hung-Chun Lu
-
Patent number: 8531846Abstract: An AC/DC power supply and platform for a military radio has been developed. The apparatus includes a base that supports at least one SINCGARS RT-1523 radio. The base is connected to an AC power supply and at least one DC power supply. The AC supply and DC power supply are configured to switch automatically to the DC power supply should the AC power supply fail.Type: GrantFiled: June 7, 2010Date of Patent: September 10, 2013Assignee: Perkins Technical Services, Inc.Inventors: Frank N. Perkins, III, Jeffrey K. Taylor, Bruce C. Weddendorf, Lloyd W. Childs
-
Patent number: 8526170Abstract: Electronic equipment is provided with a board 24a that includes an antenna circuit for transmitting and receiving a wireless signal and a ground pattern 24c for electrically grounding the antenna circuit, and a second casing 23 formed integrally with an antenna holding portion 23f for holding the board 24a. At least the antenna holding portion 23f in the second casing 23 is formed of a conductor. A clip 40 sandwiches the antenna holding portion 23f and the board 24a in a state where the ground pattern 24c and the antenna holding portion 23f are in contact with each other.Type: GrantFiled: October 1, 2010Date of Patent: September 3, 2013Assignee: Panasonic CorporationInventors: Kenji Nishikawa, Yasuharu Matsuoka
-
Publication number: 20130223025Abstract: Provided is an electronic device including a housing, at least a part of which has conductive properties; a substrate on which a heating element is mounted and which has a ground pattern; and a spacer which is located between the housing and the ground pattern and which includes a main body portion having heat insulating properties and a conductive portion which is in contact with the ground pattern and the housing and which conducts current between the ground pattern and the housing.Type: ApplicationFiled: August 17, 2012Publication date: August 29, 2013Applicant: SONY CORPORATIONInventors: Tadaomi Fujieda, Takashi Nakamura
-
Patent number: 8514589Abstract: According to one embodiment, an electronic apparatus is provided with a first housing that comprises a first ground and a second housing comprising a second ground. The electronic apparatus further comprises (i) a plurality of first protrusions on an inner surface of the first housing, at least one of the plurality of first protrusions comprising, on a peripheral surface thereof, a first conductor electrically connected to the first ground; (ii) a hinge pivotably connecting the first housing and the second housing; and (iii) a cable extending between inside the first housing and inside the second housing through the hinge, supported by the plurality of first protrusions, electrically connected to the first conductor in the first housing, and electrically connected to the second ground in the second housing, the cable electrically connecting the first ground and the second ground.Type: GrantFiled: May 17, 2011Date of Patent: August 20, 2013Assignee: Kabushiki Kaisha ToshibaInventor: Masashi Mikami
-
Patent number: 8508948Abstract: A communication apparatus includes first and second housings connected to each other by a hinge mechanism. The first housing includes a first substrate having electronic components electrically connected to an antenna, a first hinge portion configuring a portion of the hinge mechanism, and a first conductive member provided in the first hinge portion. The second housing includes a second substrate having electronic components, a waterproofing partition wall surrounding the second substrate, a second hinge portion configuring a portion of the hinge mechanism, a second conductive member provided in the second hinge portion to be capacitively-coupled with the first conductive member, and a third conductive member insertion-molded therein. The third conductive member includes an inner portion positioned on an inner side of the partition wall, and an outer portion extending from the inner portion toward an outer side of the partition wall and capacitively-coupled with the second conductive member.Type: GrantFiled: October 25, 2011Date of Patent: August 13, 2013Assignee: Kyocera CorporationInventor: Naohiro Katou
-
Publication number: 20130188325Abstract: A retention housing having a housing body is provided, the retention housing configured to be mounted to a substrate. At least one, such as a plurality of cables can be electrically connected to a respective surface of the substrate to which the retention housing is mounted. When the retention housing is mounted to the respective surface of the substrate, at least a portion of the at least one cable can be compressed between a ground element supported by the respective surface of the substrate and a corresponding upper wall of the housing body, such that the at least one cable is placed into electrical communication with a ground plane defined by the substrate.Type: ApplicationFiled: January 2, 2013Publication date: July 25, 2013Inventors: Joshua A. Garman, Charles M. Gross
-
Patent number: 8493719Abstract: An electronic device enclosure includes a convex bottom plate, a first side plate connected to a first side of the convex bottom plate, and a second side plate connected to a second side of the convex bottom plate. An electronic component is attached to the convex bottom plate. A horizontal plane is defined by connecting bottom edges of the first side plate and the second side plate, and a distance is defined between a highest point of the convex bottom plate and the horizontal plane. The distance is in a range of about 0.7 mm to about 1.4 mm.Type: GrantFiled: May 13, 2011Date of Patent: July 23, 2013Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Nai-Juan Li, Zhi-Ping Wu, Xu-Dong Nan
-
Publication number: 20130170159Abstract: A housing for a portable electronic device includes a first housing member. The first housing member includes a metal member and a plastic member integrally molded with the metal member. The metal member includes a main portion and a peripheral wall perpendicular to the main portion. The peripheral wall defines a plurality of notches. Each notch is substantially wedge-shaped with a top opening smaller than a bottom thereof. The peripheral wall tightly abuts against the plastic member with portions of the plastic member filling in the notches.Type: ApplicationFiled: September 13, 2012Publication date: July 4, 2013Applicants: CHI MEI COMMUNICATION SYSTEMS, INC., SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.Inventor: QIU-SHENG JIANG
-
Publication number: 20130163214Abstract: A display apparatus having an electromagnetic wave shielding structure and an electromagnetic wave reducing structure, are provided. The electromagnetic wave shielding and reducing structures are applicable to various materials. The display apparatus includes a display panel, a rear case disposed at a rear of the display panel and formed of a non-conductive material, a printed circuit board disposed at a rear of the rear case, and an electromagnetic wave reducer provided at one surface of the rear case and being formed of a conductive material to reduce the electromagnetic wave generated at the printed circuit board, wherein the electromagnetic wave reducer is electrically connected to the printed circuit board.Type: ApplicationFiled: December 21, 2012Publication date: June 27, 2013Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventor: SAMSUNG ELECTRONICS CO., LTD.
-
Patent number: 8472204Abstract: A card assembly is disclosed comprising a carrier host card, an interposer printed wiring board (PWB) situated between the carrier host card and a hosted card, wherein the carrier host card and the interposer printed wiring board (PWB) are configured to have a space there-between. The card assembly further comprising a customized front panel including a first cutout for the carrier host card and a second cutout for said hosted card.Type: GrantFiled: September 15, 2010Date of Patent: June 25, 2013Assignee: BAE Systems Information and Electronic Systems Integration Inc.Inventors: Mark E. Leibowitz, Michael M. Borthwick, Saeed Karamooz
-
Patent number: 8472203Abstract: This invention is directed to several mechanical features of an electronic device. The electronic device may include a spring for simultaneously grounding several components. The electronic device may include several interlocking fences for protecting electronic device components from RF radiation. The electronic device may include an antenna assembly that includes distinct components for functional and aesthetic purposes. The electronic device may include a window for permitting RF transmissions. The electronic device may include a metal frame for stiffening the electronic device. The electronic device may include a bezel used for aesthetic purposes and to support numerous electronic device components. The electronic device may include a flexible housing operative to elastically deform to assemble the electronic device. The electronic device may include an unsupported button.Type: GrantFiled: September 4, 2008Date of Patent: June 25, 2013Assignee: Apple Inc.Inventors: Teodor Dabov, Fletcher R. Rothkopf, Philippe Manoux
-
Patent number: 8467193Abstract: A resin board is fixed to a plate member made of metal by a fixing member. A semi-conductor module and a capacitor are mounted on a first surface of the resin board. A first ground pattern is formed on the first surface and electrically connected to the plate member by means of the fixing member. A connector is also provided on the first surface such that the first ground pattern is interposed between the semi-conductor module and the connector. The heat from the semi-conductor module and the capacitor is transmitted to the plate member via the first ground pattern and the fixing member.Type: GrantFiled: September 2, 2011Date of Patent: June 18, 2013Assignee: Denso CorporationInventor: Shinsuke Oota
-
Patent number: 8451622Abstract: A circuit board module includes a circuit board, a plurality of electronic components, a plurality of connectors and a cover. The circuit board includes a heat dissipation unit. The electronic components, the connectors and the heat dissipation unit are disposed on a first surface of the circuit board. The cover has a plurality of openings with the shapes and the sizes corresponding to the connectors and the heat dissipation unit. When the cover covers the circuit board, the openings expose the connectors and the heat dissipation unit. Users can plug and pull the connectors of the circuit board through the openings. The size of the cover is corresponding to the circuit board. The circuit board module is dust-proof and can prevent the users from accidentally touching the electronic components.Type: GrantFiled: November 26, 2010Date of Patent: May 28, 2013Assignee: ASUSTeK Computer Inc.Inventor: Yen-Po Yu
-
Patent number: 8450616Abstract: A circuit board having a removing area is provided. The circuit board includes a first dielectric layer, a first laser resistant structure disposed on the first dielectric layer and located at the periphery of the removing area, a second dielectric layer disposed on the first dielectric layer, a circuit layer disposed on the second dielectric layer, a second laser resistant structure disposed on the second dielectric layer and located at the periphery of the removing area, and a third dielectric layer disposed on the second dielectric layer. The second laser resistant structure is insulated from the circuit layer. There is a gap between the second laser resistant structure and the circuit layer, and the vertical projection of the gap on a first surface overlaps the first laser resistant structure. The third dielectric layer exposes the portion of the circuit layer within the removing area.Type: GrantFiled: April 1, 2010Date of Patent: May 28, 2013Assignee: Unimicron Technology Corp.Inventor: Chen-Chuan Chang
-
Publication number: 20130128478Abstract: A holder includes a main-body disposed on a main circuit-board, a moving-arm, a fixed metal piece, and a moving metal piece. A support portion protrudes from a front side of the main-body and provides a supporting surface. The moving-arm includes a support block and an extension block. The support block is disposed to the front side, and an upper edge of the support block and the supporting surface are arranged in the same plane. The moving-arm moves to make the extension block protrude from the main-body. The fixed metal piece extends to a location between the support block and the front side. A part of the moving metal piece is located between the supporting block and the front side, while the other part extends to the extension block, so that at the moving metal piece is partially exposed corresponding to the front side.Type: ApplicationFiled: April 23, 2012Publication date: May 23, 2013Inventor: Hao-Cheng KU
-
Patent number: 8441801Abstract: A user panel assembly includes a printed circuit board (PCB), a panel element, a flexible connector and a mounting element. The flexible connector is configured to enable electrical communication between the panel element and the PCB. The mounting element includes a plurality of slots on which the panel element can be mounted. An overlay is configured to conceal a subset of the plurality of slots.Type: GrantFiled: April 27, 2010Date of Patent: May 14, 2013Assignee: Electrolux Home Products, Inc.Inventor: Paul H. Kelly
-
Patent number: 8432702Abstract: According to an aspect of the present invention, there is provided a printed wiring board including: a substrate including an edge and a fixing hole located adjacent to the edge, the fixing hole configured to receive a bolt; and a land formed in a vicinity of the fixing hole and extending in at least a first direction and a second direction, the first direction being a direction from the fixing hole toward a center of the substrate, the second direction being direction along the edge.Type: GrantFiled: February 22, 2011Date of Patent: April 30, 2013Assignee: Kabushiki Kaisha ToshibaInventors: Kenji Hasegawa, Tsuyoshi Kozai, Terunari Kanou
-
Patent number: 8422244Abstract: A power converter structure in which the structure of a connecting portion is highly resistant against vibration and has a low inductance. The power converter structure includes a plurality of capacitors and a laminate made up of a first wide conductor and a second wide conductor joined in a layered form with an insulation sheet interposed between the first and second wide conductors. The laminate comprises a first flat portion including the plurality of capacitors which are supported thereon and electrically connected thereto, a second flat portion continuously extending from the first flat portion while being bent, and connecting portions formed at ends of the first flat portion and the second flat portion and electrically connected to the exterior.Type: GrantFiled: March 3, 2011Date of Patent: April 16, 2013Assignee: Hitachi, Ltd.Inventors: Katsunori Azuma, Masamitsu Inaba, Mutsuhiro Mori, Kenichiro Nakajima
-
Patent number: 8416566Abstract: An input/output panel for use with a server chassis may comprise a cover, an input/output interface circuit board, a plurality of interfaces, and a ground clip. The cover of non-conductive plastic may be configured to mount to a rear cover of the server chassis. The input/output interface circuit board may be disposed on a first side of the cover. The plurality of interfaces may be disposed on the input/output interface circuit board and extend at least partially through the cover to the second side of the cover. The ground clip may include a conductive component partially disposed within the plastic cover. A first end of the ground clip may extend from the first side of the cover and be configured to mate with the input/output interface circuit board. A second end of the ground clip may extend from the first side of cover and be configured to mate with a ground circuit associated with the rear cover of the server chassis.Type: GrantFiled: July 6, 2010Date of Patent: April 9, 2013Assignee: Fujitsu LimitedInventors: Leonard R. Renkel, Jr., Robert Pellacani, Corey Dayton, Willie Braun, Larry Fox, Mahesh Mistry
-
Patent number: 8411452Abstract: An electronic apparatus comprises a body chassis to which a cabinet is fastened by a screw, the screw is screwed from outside of the cabinet into a boss made of synthetic resin on the body chassis to pass through the boss, the body chassis is provided with a component having a metal surface arranged thereon, and the screw includes a tip opposed to the metal surface of the component. The body chassis is provided with a grounded metal plate arranged thereon, on which a projection intervening between the tip of the screw and the metal surface of the component is formed, the projection includes a through-hole through which the tip of the screw can pass, and the smallest gap length between inner peripheral surface of the through-hole and the screw is set to be smaller than the smallest gap length between the metal surface of the component and the screw.Type: GrantFiled: June 22, 2010Date of Patent: April 2, 2013Assignee: SANYO Electric Co., Ltd.Inventors: Noriyuki Tsubota, Daizo Kobayashi
-
Patent number: 8411447Abstract: A power amplifier chassis for an n+1 redundant power amplifier system. The power amplifier chassis includes an embedded controller and a power amplifier. The embedded controller operates the power amplifier chassis in a master controller mode or a slave controller mode. When operated in the master controller mode, the embedded controller monitors operating parameters associated with the power amplifier chassis, and can transfer control of the power amplifier system when the embedded controller senses that the monitored operating parameters indicate a failure or impending failure of the power amplifier chassis. When operated in the slave controller mode, the embedded controller receives control instructions from the master controller power amplifier module, and is enabled to reconfigure the power amplifier chassis from the slave controller mode to the master controller mode in response to a failure or imminent failure indication of a first power amplifier chassis operated in master controller mode.Type: GrantFiled: December 18, 2009Date of Patent: April 2, 2013Assignee: Teledyne Paradise Datacom, LLCInventor: Stephen D. Turner
-
Patent number: 8406001Abstract: An electronic housing is provided comprising a first cover assembly combinable with a second cover assembly to house or enclose a printed circuit board therebetween. Each cover assembly includes a cover and a frame, the cover attachable to the frame by bending portions of the cover thereabout. The cover is preferably stamped metal and the frame is preferably injection molded plastic. Each cover may include recesses such that, when the cover is bent around the frame, the cover bends at the recesses and closely engages the frame on multiple mating surfaces. The cover assemblies may be welded together, such as by ultrasonic welding, to form a complete package or housing, and may include intermittingly spaced shear weld features to improve bond strength therebetween. Methods of manufacturing and/or assembling electronic housings and cover assemblies are also provided.Type: GrantFiled: February 25, 2010Date of Patent: March 26, 2013Assignee: DualSonic, Inc.Inventor: Michael Chy Chao
-
Patent number: 8375575Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a fold-up case formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case is of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Side wall closure members are extruded of aluminum defining self-engaging attachment features for affixing to the case, providing electrical self-grounding with the wire screen and thermal grounding with internal power devices.Type: GrantFiled: February 19, 2010Date of Patent: February 19, 2013Assignee: Delphi Technologies, Inc.Inventors: Chris R. Snider, Mark A. Jackson
-
Patent number: 8379390Abstract: A package substrate includes a circuit board, an electronic component, an electromagnetic shield cover, and a heat conducting member. The electronic component is disposed on the circuit board. The electromagnetic shield cover is fixedly coupled to the circuit board. The electromagnetic shield cover houses the electronic component within an inside space defined between the electromagnetic shield cover and the circuit board. The heat conducting member is disposed between the electronic component and the electromagnetic shield cover within the inside space. The heat conducting member contacts both of the electronic component and the electromagnetic shield cover such that the heat conducting member establishes a thermal connection between the electronic component and the electromagnetic shield cover.Type: GrantFiled: August 27, 2010Date of Patent: February 19, 2013Assignee: Funai Electric Co., Ltd.Inventor: Yoshihiko Inoue
-
Publication number: 20130033830Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a connector assembly for a sensor assembly may include an electrical connector, a printed circuit board and a conductive outer housing. The electrical connector may include a mechanical connector and electrical terminals exposed at a first end and at a second end of the mechanical connector. The electrical connector, printed circuit board and conductive outer housing may all be electrically connected to one another. In some instances, a plurality of electrical connectors having different mechanically shaped second ends and similarly shaped first ends may be provided, from which one electrical connector may be chosen for use in the connector assembly.Type: ApplicationFiled: August 1, 2011Publication date: February 7, 2013Inventors: Todd Eckhardt, Paul Rozgo, Ian Bentley, Jim Machir, Ryan Jones
-
Publication number: 20130016486Abstract: A mobile electronic device 10 with an enhanced chassis is disclosed. The device 10 can include: a frame 12 including an upper portion 14 and a lower portion 16 defining a narrow profile height 18 having an open top 20 and an open bottom 22; the frame 12 includes an interior portion 24 configured to surround components in a predetermined arrangement and an exterior portion 26; the exterior portion 26 of the frame 12 being connected to a printed circuit board (PCB) 28; and the open top 20 being configured to receive components on the printed circuit board 28 and the open bottom 22 being configured to receive a battery 32. Advantageously, the frame 12 height 13 provides a narrow profile structural system to securely support and connect components in connection with mobile electronic devices. Beneficially, the height is structurally passive and free from contributing to the Z dimension.Type: ApplicationFiled: March 27, 2012Publication date: January 17, 2013Applicant: MOTOROLA MOBILITY, INC.Inventors: Joseph L. Allore, Gary R. Weiss, Jason P. Wojack
-
Publication number: 20130003326Abstract: According to one embodiment, an electronic device includes a printed circuit board includes a plurality of circuit parts, a conductive shield case provided on the printed circuit board, a tuner provided on the printed circuit board and inside the shield case, a first ground portion provided on the printed circuit board and outside the shield case and a second ground portion provided on the printed circuit board and inside the shield case. The first ground portion is electrically connected to the second ground portion via the shield case.Type: ApplicationFiled: February 22, 2012Publication date: January 3, 2013Inventors: Masahiro Kobayashi, Noriaki Sakamoto
-
Patent number: 8300417Abstract: There is provided an apparatus for accommodating at least two different sized cards, the apparatus comprising a card housing comprising one or more card slots, each card slot being adaptable for inserting the at least two different sized cards; and a card guide system for adapting said one or more card slots for insertion of at least one of the at least two different sized cards. There is also provided a modified mezzanine card having at least one increased non-standard physical dimension relative to a standard mezzanine card suitable for insertion in the apparatus using the card guide system.Type: GrantFiled: December 8, 2008Date of Patent: October 30, 2012Assignee: BAE Systems Information and Electronic Systems Integration Inc.Inventors: Mark E. Leibowitz, James Limardo, William F. Aversano, Michael Borthwick, Elliot Samuel, Saeed Karamooz
-
Patent number: 8300415Abstract: An electronic component for an integrated mechatronic system has at least two housing parts with at least one housing base, a housing cover, and an electrical connection between the components disposed in the interior of the housing and components located outside the housing. The electrical connection is fixed on the housing base. The housing cover is glued directly to the electrical connection and/or the housing base and, in this manner, enables lasting hermetically sealed protection for the sensitive electronic components.Type: GrantFiled: February 13, 2008Date of Patent: October 30, 2012Assignee: Continental Automotive GmbHInventors: Joseph Loibl, Karl Smirra
-
Patent number: 8279614Abstract: A modem, in particular for subsea power line communication, has electronic components on a circuit board, and a metal encapsulation, wherein the encapsulation forms at least two chambers separated by at least one wall, wherein each of the chambers surrounds at least one of the electronic components.Type: GrantFiled: July 24, 2006Date of Patent: October 2, 2012Assignee: Siemens AktiengesellschaftInventors: Vegard Horten, Vidar Steigen
-
Patent number: 8264844Abstract: A conductive chassis plate faces a printed circuit board at a distance. One end of the conductive chassis plate is aligned with one end of the printed circuit board. One end of the conductive chassis plate is electrically connected to a ground wiring pattern provided on one end of the printed circuit board. One end of the conductive chassis plate is electrically connected to a conductive member that extends from one end of the conductive chassis plate toward the other end. As a result, in transmitting or receiving a signal with respect to external equipment attached to a connector, an influence of electrostatic discharge is reduced with a simple configuration.Type: GrantFiled: June 18, 2010Date of Patent: September 11, 2012Assignee: Canon Kabushiki KaishaInventor: Koji Hirai
-
Patent number: 8259457Abstract: An metal housing comprising an electrical device includes electrical pins that protrude from the metal housing, and the metal housing formed with a compressible protrusion around the pins.Type: GrantFiled: August 18, 2008Date of Patent: September 4, 2012Assignee: ARRIS Group, Inc.Inventor: Brent Mills
-
Publication number: 20120218725Abstract: A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture integrally forms a resilient beam portion adjacent an edge thereof carrying a grounding pad.Type: ApplicationFiled: April 25, 2012Publication date: August 30, 2012Applicant: DELPHI TECHNOLOGIES, INC.Inventors: CHRIS R. SNIDER, EDGAR GLENN HASSLER
-
Patent number: 8254139Abstract: A motherboard of a communication device includes a baseboard, an antenna, a wireless communication module, a first connecting component, a second connecting component, and a main microstrip line. The base board includes a circuit area provided with the wireless communication module and the first connecting component, an antenna area provided with the antenna, and a protecting area disposed between the circuit area and the antenna area to separate the circuit area and the antenna area from each other. The antenna includes a feed-in end for signal feed-in. The second connecting component is disposed at the wireless communication module, and is separably connected to the first connecting component. The main microstrip line is disposed on the base board, and electrically connects the first connecting component and the feed-in end. The main microstrip line is electrically connected to the wireless communication module through the first and second connecting components.Type: GrantFiled: February 24, 2010Date of Patent: August 28, 2012Assignee: Wistron CorporationInventor: Chi Hen Lee
-
Patent number: 8253015Abstract: An electronic device enclosure includes a fixing frame, a chassis, and two panels. The chassis and the panels are correspondingly mounted to different sides of the fixing frame. The fixing frame is sealed by the chassis and the panels. A plurality of rubber gaskets is correspondingly mounted between the fixing frame and each of the panels and the chassis, to prevent moisture and dust from entering.Type: GrantFiled: December 1, 2009Date of Patent: August 28, 2012Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Chin-Ming Chang
-
Publication number: 20120212914Abstract: A lightweight radio/CD player for vehicular application and includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture integrally forms a resilient beam portion adjacent an edge thereof carrying a grounding pad.Type: ApplicationFiled: April 25, 2012Publication date: August 23, 2012Applicant: DELPHI TECHNOLOGIES, INC.Inventors: CHRIS R. SNIDER, EDGAR GLENN HASSLER
-
Patent number: 8248810Abstract: An electronic device having an integral feeling between a display and an operating member is provided. A mobile phone 1 includes a reinforcing frame 31 arranged between a first case 2 and a sub-display device 29 and having a frame opening 31h formed at a position facing a display surface 29a of the sub-display device 29; a trim plate 35 arranged on a surface facing the case opening 2h of the reinforcing frame 31 to cover the frame opening 31h and positioned in the case opening 2h; a sensor board 39 arranged on the surface facing the case opening 2h of the reinforcing frame 31 and having a board opening 39h in which the trim plate 35 is inserted; a dome switch 45 arranged on a mounting surface 39a facing the case opening 2h of a sensor board 39; and a ring key 7 arranged between the case opening 2h and the trim plate 35 to be able to depress the dome switch 45.Type: GrantFiled: August 24, 2007Date of Patent: August 21, 2012Assignee: Kyocera CorporationInventor: Shiro Arita
-
Patent number: 8233284Abstract: A grounding structure, for connecting to an opposite connecting electrical device with a metal casing, is assembled on a circuit board having at least one grounding component. The grounding structure includes a conductive mechanism electrically connected to the metal casing of the opposite connecting electrical device; and at least one conductive pad, disposed between the conductive mechanism and the circuit board, and contacting the conductive mechanism and the grounding component of the circuit board. The grounding structure of the invention can transmit the disturbance to be advantageous for signal transmitting between the opposite connecting electrical device and the circuit board.Type: GrantFiled: February 3, 2010Date of Patent: July 31, 2012Assignee: Lotes Co., Ltd.Inventors: Ted Ju, Chien-Chih Ho
-
Patent number: 8223504Abstract: A structure for supporting a printed wiring board housed in a housing of an electronic device. The supporting structure includes a first projection formed on the housing and projecting toward the printed wiring board. The electronic device includes a conductor plate, which is grounded and accommodated in the housing. A second projection is formed on the conductor plate and projects toward the printed wiring board. The printed wiring board includes a substrate and a ground layer, which is arranged on the substrate. The first projection of the housing and the second projection of the conductor plate hold and support the printed wiring board in between and thereby electrically connect the ground layer to the conductor plate.Type: GrantFiled: December 3, 2009Date of Patent: July 17, 2012Assignee: SANYO Electric Co., Ltd.Inventor: Kazunori Kotani
-
Patent number: 8223503Abstract: The present invention is available for the field of electronic circuit protection, and provides a security cover for enclosing a protective area on the protected PCB and protecting the components in this area. The security cover comprises a flexible PCB that is folded with a receiving space and an opening in a side in the space. The flexible PCB is covered on the protective area of the protected PCB and encloses the components in the protective area. The flexible PCB triggers the related circuits to remove or destroy the information on the components in this protective area in case of physical attack. The present invention is to enclose the key components on PCB via the flexible PCB with the receiving space so as to prevent the key components from being attacked.Type: GrantFiled: October 9, 2007Date of Patent: July 17, 2012Inventors: Suxian Shi, Cunliang Tong
-
Patent number: 8213183Abstract: An electronic device includes a case, a board module, and an electrostatic discharging module. The case has a conductive area. The board module is disposed in the case and has a ground end. The electrostatic discharging module is disposed on the case. Besides, the electrostatic discharging module includes a first discharging element and a second discharging element. The first discharging element is electrically connected to the ground end, and the second discharging element is electrically connected to the conductive area. There exists a gap between the first discharging element and the second discharging element, so that leak current generated by the board module can be prevented from being transmitted to the case, and that an electrostatic charge can be transmitted from the case to the ground end.Type: GrantFiled: April 28, 2010Date of Patent: July 3, 2012Assignee: Compal Electronics, Inc.Inventors: Chun-Lung Juan, Kuo-Cheng Chu
-
Publication number: 20120147573Abstract: A mobile terminal includes a main body; at least one circuit board placed in the main body and comprising an upper surface, a lower surface, and at least one lateral surface; at least one conductive body disposed at the at least one lateral surface of the at least one circuit board and electrically connected to a ground of the at least one circuit board; and at least one shield member mounted on the at least one circuit board. The at least one shield member includes a base portion formed to cover at least part of the upper surface or the lower surface of the at least one circuit board and at least one protrusion portion protruded from the base portion and formed to be electrically in contact with the at least one conductive body.Type: ApplicationFiled: September 24, 2011Publication date: June 14, 2012Inventors: Gukchan Lim, Hyokune Hwang, Hyunok Lee, Jungwoo Sohn, Jinsu Lee, Taejong Jeong, Dongsu Han, Yongheon He, Hongjo Shim
-
Patent number: 8199528Abstract: An electronic device including: a circuit board on which an electronic component is mounted; a plate material which is used as a ground, the plate material being extended in parallel with the circuit board; and a ground connection member which includes a fixed section and multiple elastic leg sections, the fixed section being tightened to the circuit board and connected to a ground on the circuit board, the elastic leg sections being extended from the fixed section toward different directions along the circuit board, each of the elastic leg sections being extended onto the plate material side to elastically press the plate material.Type: GrantFiled: January 27, 2009Date of Patent: June 12, 2012Assignee: Fujitsu LimitedInventors: Tadanori Tachikawa, Masuo Ohnishi
-
Patent number: RE44040Abstract: A plasma display device includes a plasma display, a chassis having conductivity that supports the plasma display, a tuner circuit, a scan driver, a sustaining driver and so forth used to display a video on the plasma display, a back cover that covers the chassis, the scan driver, the sustaining driver, etc., and a shield body that covers the tuner circuit. The shield body is electrically connected to the chassis and to the back cover.Type: GrantFiled: August 26, 2004Date of Patent: March 5, 2013Assignee: Panasonic CorporationInventor: Yasuhito Fukui