Specific Chassis Or Ground Patents (Class 361/753)
  • Patent number: 8902600
    Abstract: A thermally deformable assembly is formed in an integrated-circuit metallization level. The physical behavior of the metal forming the assembly brings the assembly into contact with a stop-forming body when subjected to a temperature change caused by a current flow. A natural rollback to the initial configuration in which the assembly is a certain distance away from the body is prevented. The state or configuration of the assembly is determined by a capacitive reader.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: December 2, 2014
    Assignee: STMicroelectronics (Rousset) SAS
    Inventors: Albert Martinez, Pascal Fornara
  • Publication number: 20140334119
    Abstract: An exemplary shielding assembly includes a printed circuit board (PCB) and a shielding case. The PCB includes a sensitive circuit and a grounding layer. A groove extends from a top surface of the PCB down into the inside of the PCB, and the groove is in communication with the grounding layer. The shielding case is inserted into the groove and covers the sensitive circuit, and the shielding case is electrically connected with the grounding layer.
    Type: Application
    Filed: July 22, 2013
    Publication date: November 13, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: YU-HUA HO
  • Patent number: 8885355
    Abstract: A structure such as a button may have a substrate. Components such as switches may be mounted on the substrate. The substrate may be a printed circuit board with solder pads. A snap member may be soldered to one of the solder pads. A metal clip may have a snap arm with an opening. The metal clip may be attached to the printed circuit board. When attached, the opening in the snap arm may mate with the snap member that is soldered to the solder pad on the printed circuit board. The printed circuit board may be attached to a button housing member. A button cover member may be attached to the clip. A ground connection may be formed between the metal clip and the snap member by providing the snap member with structures that bear against the metal clip and form an electrical connection.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: November 11, 2014
    Assignee: Apple Inc.
    Inventor: Craig Matthew Stanley
  • Publication number: 20140321081
    Abstract: A circuit board mounting apparatus includes a circuit board, a chassis, two mounting members, and two fasteners. A front side of the circuit board defines two positioning holes. The chassis includes a side plate defining two through holes. Two opposite ends of each mounting member define a latching slot and a mounting hole. A resilient arm extends toward the latching slot from each mounting member. The front side of the circuit board is inserted into the latching slots of the mounting members, and the resilient arms are engaged in the corresponding positioning holes of the circuit board. The fasteners extend through the through holes of the side plate, to be fastened into the mounting holes of the mounting members, to perpendicularly mount the circuit board to the side plate.
    Type: Application
    Filed: June 4, 2013
    Publication date: October 30, 2014
    Inventor: ZHENG-HENG SUN
  • Publication number: 20140321082
    Abstract: A method for placing an electronic printed card in contact with contact elements in a housing receiving or surrounding card. The card is received in the housing and has a plurality of contact recesses. The contact elements have a first end on the outer side of the housing and a second end on the inner side of the housing, and each comprises, at the second end, a flexible extension capable of being positioned in a first rest position and a second contact position. In a first step the electronic printed card is positioned relative to the housing such that the two ends of the contact elements are located facing the contact recesses, the flexible extensions being positioned in their first position. Then the card is electrically contacted by the plurality of contact recesses and the flexible extensions of the second end of the contact elements, in their second position.
    Type: Application
    Filed: October 31, 2012
    Publication date: October 30, 2014
    Inventor: Benoit Box
  • Patent number: 8867221
    Abstract: A lid opening and closing device includes a first supporting shaft, a guide surface, a second supporting shaft, an opening and closing key supported by the second supporting shaft, an arm member and a lever member, wherein when an insert is not present in a box, a lid is suspended from the first supporting shaft and covers the box and enters a closed state, and when the insert is inserted into the box through an opening, the insert causes the opening and closing key to swing in an insertion direction, an end of an arm member rises along the guide surface in synchronization with the swinging of the opening and closing key, the risen arm member lifts an end of the lever member, and the lid, to which the lever member is secured, swings around the first supporting shaft and enters an open state.
    Type: Grant
    Filed: January 3, 2013
    Date of Patent: October 21, 2014
    Assignee: Fujitsu Limited
    Inventor: Yuta Sasaki
  • Patent number: 8854832
    Abstract: Provided is a grounding structure of a high voltage secondary battery for a vehicle capable of securing stable ground potential of various electric devices included in the vehicle and reducing a risk factor that may be generated due to a potential difference by connecting a battery pack including a secondary battery and an inverter for the vehicle provided in the next generation vehicle such as a hybrid electric vehicle (HEV), an electric vehicle (EV), a plug-in hybrid electric vehicle (PHEV) to each other by a ground wire formed of an electric wire in order to allow a vehicle body and a battery pack to have equipotential.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: October 7, 2014
    Assignee: SK Innovation Co., Ltd.
    Inventor: Jongguk Yoon
  • Patent number: 8848396
    Abstract: An electronic device includes a metal shield, a housing, a circuit board, an engaging element, and a fixing element. The circuit board is located between the metal shield and the housing. The engaging element is disposed on the circuit board. The circuit board is fixed on the housing and connected to the metal shield via the engaging element.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: September 30, 2014
    Assignee: Wistron Corp.
    Inventor: Wei-Cheng Wang
  • Patent number: 8848382
    Abstract: The instant disclosure relates to a data access module, which includes a plurality of data access devices, a circuit board defining a plurality of holes, a base frame, a plurality of partition panels, a cover frame, and a plurality of locking pieces. The base frame includes a bottom plate and a pair of sidewalls. A plurality of fixing pieces and ridges are formed on the bottom plate. The partition panels are directed along the retrieving direction of the data access devices and fixed on the bottom plate. Each partition panel has a hooking portion for engaging the corresponding hole of the circuit board. The cover frame includes a top plate and a pair of side plates. The locking pieces are rotatably disposed on the cover frame. Each locking piece has a pressing portion selectively pressing against the circuit board. A chassis is also discussed.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: September 30, 2014
    Assignee: Wistron Corp.
    Inventors: Hai-Nan Qiu, Chia-Hsin Hsieh
  • Patent number: 8835773
    Abstract: A method of manufacturing a wiring board for use in mounting of an electronic component includes: forming an outermost wiring layer on a surface side where the electronic component is mounted; forming an insulating layer so as to cover the wiring layer; and forming a concave portion in the insulating layer. The concave portion is formed by removing, using a mask formed in a required shape by patterning, an exposed portion of the insulating layer in a step-like shape until a surface of a pad defined at a portion of the wiring layer is exposed. The concave portion is preferably formed by removing the portion of the insulating layer by sand blast.
    Type: Grant
    Filed: April 1, 2010
    Date of Patent: September 16, 2014
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Shigetsugu Muramatsu, Yasuhiko Kusama
  • Patent number: 8830686
    Abstract: A housing for an in-vehicle electronic control unit is disclosed. The housing includes: a case made of resin and formed into a box shape having an opening; a board received in the case and provided with an electronic part, the electronic part being mounted to the board; a cover made of metal and covering the opening of the case so that the board is arranged between the case and the cover; and multiple stays each provided to fix the cover or the case to a vehicle. The multiple stays include a first stay made of the resin and formed on the case, and a second stay made of the metal and formed on the cover.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: September 9, 2014
    Assignee: Denso Corporation
    Inventor: Kazuo Nomoto
  • Patent number: 8829362
    Abstract: An electronic device including a first ground conductor layer positioned at an underside of a first insulation layer; a second ground conductor layer positioned at an upper side of the first insulation layer; a second insulation layer positioned at an upper side of the second ground conductor layer; a first connection pattern formed on an inside wall of a first opening penetrating the first insulation layer and the second insulation layer and interconnecting the first ground conductor layer and the second ground conductor layer; a conductive member provided in the first opening and connected to the first ground conductor layer; and an electronic element mounted on the member and grounded to the member.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: September 9, 2014
    Assignee: Fujitsu Limited
    Inventor: Satoshi Masuda
  • Patent number: 8824140
    Abstract: A handheld computing device that includes an enclosure having structural walls formed from a glass material that can be radio-transparent. The enclosure can be formed from a hollow glass tube or two glass members bonded together. A laser frit bonding process may be used to hermetically seal the two glass members together to create a water resistant electronic device.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: September 2, 2014
    Assignee: Apple Inc.
    Inventors: Christopher D. Prest, Emery A. Sanford
  • Patent number: 8824150
    Abstract: The present disclosure discloses a driving printed circuit board (PCB) for use in a display device. More particularly, a driving printed circuit board improving the bonding by preventing PCB warpage is provided. The rear surface stiffener plate includes polygonal patterns to prevent a PCB warpage of the driving printed circuit board due to different heat shrinkage from that of the board during the surface mounting technology (SMT) process.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: September 2, 2014
    Assignee: LG Display Co., Ltd.
    Inventors: JungYoul Kang, SeongHun Kim
  • Patent number: 8818319
    Abstract: Various embodiments implement waveguides for signal distribution or signal filtering in satellite receivers. According to some embodiments, a low noise block downconverter (LNB) is implemented using waveguides configured for signal distribution, band pass filtering, low pass filtering, high pass filtering, or band stop filtering. For some embodiments, the waveguides may be formed by the LNB chassis and the ground plane of a printed circuit board mounted to the LNB chassis.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: August 26, 2014
    Assignee: Entropic Communications, Inc.
    Inventor: Martin Christopher Alderton
  • Patent number: 8817483
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a connector assembly for a sensor assembly may include an electrical connector, a printed circuit board and a conductive outer housing. The electrical connector may include a mechanical connector and electrical terminals exposed at a first end and at a second end of the mechanical connector. The electrical connector, printed circuit board and conductive outer housing may all be electrically connected to one another. In some instances, a plurality of electrical connectors having different mechanically shaped second ends and similarly shaped first ends may be provided, from which one electrical connector may be chosen for use in the connector assembly.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: August 26, 2014
    Assignee: Honeywell International Inc.
    Inventors: Todd Eckhardt, Paul Rozgo, Ian Bentley, Jim Machir, Ryan Jones
  • Publication number: 20140218606
    Abstract: Various systems of an electronic deice and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield and electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.
    Type: Application
    Filed: April 8, 2014
    Publication date: August 7, 2014
    Applicant: Apple Inc.
    Inventors: Shayan Malek, Benjamin J. Pope, Daniel W. Jarvis, Tang Yew Tan, Richard H. Dinh, Robert J. Steinfeld, Ramachandran Chundru
  • Patent number: 8792246
    Abstract: A device for protecting a circuit board from electromagnetic interference, and which includes shield to be attached to the circuit board. The device includes a metal plate and a plurality of tangs. The metal plate has a perimeter portion. The plurality of tangs are spaced about and extend transversely away from at least a portion of the perimeter portion of the metal plate. Each tang includes a bridge portion and a finger portion. The bridge portion has a first end attached to the perimeter portion and a second end spaced away from the perimeter portion and attached to the finger portion. The finger portion extends away from the second end of the bridge potion and is disposed at an obtuse angle relative to the bridge portion such that the plurality of tangs, in combination, are adapted to receive the circuit board.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: July 29, 2014
    Assignee: Fisher Controls International LLC
    Inventors: Scott R. Kratzer, Davin S. Nicholas, Barry L. Gaarder
  • Patent number: 8780575
    Abstract: A printed circuit board includes a board body having a routing-limited area. The routing-limited area is provided with at least one solder pad that is adapted for supporting a metal support thereon. Preferably, the printed circuit board further includes a protrusion block disposed on the solder pad, and having a height greater than that of a signal trace that passes the routing-limited area.
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: July 15, 2014
    Assignee: Wistron Corporation
    Inventor: Chih-Yung Chia
  • Patent number: 8773868
    Abstract: A holder includes a main-body disposed on a main circuit-board, a moving-arm, a fixed metal piece, and a moving metal piece. A support portion protrudes from a front side of the main-body and provides a supporting surface. The moving-arm includes a support block and an extension block. The support block is disposed to the front side, and an upper edge of the support block and the supporting surface are arranged in the same plane. The moving-arm moves to make the extension block protrude from the main-body. The fixed metal piece extends to a location between the support block and the front side. A part of the moving metal piece is located between the supporting block and the front side, while the other part extends to the extension block, so that at the moving metal piece is partially exposed corresponding to the front side.
    Type: Grant
    Filed: April 23, 2012
    Date of Patent: July 8, 2014
    Assignee: Wistron Corporation
    Inventor: Hao-Cheng Ku
  • Patent number: 8767406
    Abstract: A mobile phone that is an electronic device includes a bottom housing including a first bottom subhousing. On the first bottom subhousing a rib is provided so as to surround a position where an earphone jack is to be provided and be in with a substrate on which the earphone jack is to be provided. This rib prevents liquid from infiltrating into the bottom housing. Connection terminals of the earphone jack are each connected with other components of the mobile phone such as a CPU via an inner layer of the substrate.
    Type: Grant
    Filed: January 22, 2010
    Date of Patent: July 1, 2014
    Assignee: KYOCERA Corporation
    Inventor: Masayuki Otani
  • Patent number: 8767407
    Abstract: A mobile terminal includes a main body; at least one circuit board placed in the main body and comprising an upper surface, a lower surface, and at least one lateral surface; at least one conductive body disposed at the at least one lateral surface of the at least one circuit board and electrically connected to a ground of the at least one circuit board; and at least one shield member mounted on the at least one circuit board. The at least one shield member includes a base portion formed to cover at least part of the upper surface or the lower surface of the at least one circuit board and at least one protrusion portion protruded from the base portion and formed to be electrically in contact with the at least one conductive body.
    Type: Grant
    Filed: September 24, 2011
    Date of Patent: July 1, 2014
    Assignee: LG Electronics Inc.
    Inventors: Gukchan Lim, Hyokune Hwang, Hyunok Lee, Jungwoo Sohn, Jinsu Lee, Taejong Jeong, Dongsu Han, Yongheon He, Hongjo Shim
  • Publication number: 20140177186
    Abstract: An electronic device is provided including a mainboard having a ground; a conductive bracket coupled to the mainboard; and an elastic member coupled to the mainboard, and electrically connected with the ground of the mainboard; wherein the elastic member is in elastic contact with the conductive bracket; and wherein the elastic member is electrically connected to the conductive bracket.
    Type: Application
    Filed: December 23, 2013
    Publication date: June 26, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Young-Kwang SONG, Sung-Won PARK, Yong-Lak CHO
  • Patent number: 8755195
    Abstract: In described embodiments, a printed circuit board assembly capable of discharging electro-static discharge (ESD) surges includes an isolation trench track provided in the printed circuit board in close proximity to the peripheral edges between the peripheral edges and the mounting area, and a discharge path formed of conductive material to ground provided between the isolation trench track and the peripheral edges. The discharge path includes the board mounting screws and connects to a power connector ground of the printed circuit board.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: June 17, 2014
    Assignee: LSI Corporation
    Inventors: David Alan Savory, Joshua A. Johnson
  • Publication number: 20140160662
    Abstract: A bracket of an add-in card of an electronic device is provided. The bracket, in one embodiment, includes a body in a shape of a sheet, wherein the body is provided with an opening, the opening configured to correspond to an interface adapter on the add-in card and expose an interface part of the interface adapter in an installed state when the bracket is installed to the add-in card. The bracket, in this embodiment, further includes a conductive component in electrical connection with the body, the conductive component configured to electrically connect with a housing of the interface adapter in the installed state, wherein at least a portion of the body is made of a conductive material so that the conductive component is electrically connected with a chassis via the body when installed.
    Type: Application
    Filed: December 20, 2012
    Publication date: June 12, 2014
    Applicant: NVIDIA CORPORATION
    Inventors: Zhi Li, Qiang CHEN, Charlie J. Shu
  • Patent number: 8749988
    Abstract: A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: June 10, 2014
    Assignee: Delphi Technologies, Inc.
    Inventors: Chris R. Snider, Vineet Gupta, Joseph K. Huntzinger, Michael G. Coady, Curtis Allen Stapert, Timothy D. Garner, Jeffrey T. Bell, Robert L. Vadas, Allen E. Oberlin
  • Publication number: 20140146495
    Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.
    Type: Application
    Filed: February 3, 2014
    Publication date: May 29, 2014
    Applicant: Apple Inc.
    Inventors: Joseph Fisher, JR., Sean Mayo, Dennis R. Pyper, Paul Nangeroni, Jose Mantovani
  • Patent number: 8717778
    Abstract: An electronic device including: a circuit board on which an electronic component is mounted; a plate material which is used as a ground, the plate material being extended in parallel with the circuit board; and a ground connection member which includes a fixed section and multiple elastic leg sections, the fixed section being tightened to the circuit board and connected to a ground on the circuit board, the elastic leg sections being extended from the fixed section toward different directions along the circuit board, each of the elastic leg sections being extended onto the plate material side to elastically press the plate material.
    Type: Grant
    Filed: May 1, 2012
    Date of Patent: May 6, 2014
    Assignee: Fujitsu Limited
    Inventors: Tadanori Tachikawa, Masuo Ohnishi
  • Patent number: 8716611
    Abstract: A weighing scale (10) has a display/operating unit (20), a scale platform (30), an electronic system (60) for the control of the scale (10), and a pedestal (40) that connects the display/operating unit to the scale platform. The pedestal contains a pedestal chamber (41). The pedestal also has a pedestal opening (42). A carrier element (70) is arranged in or at the pedestal chamber. At least parts of the electronic system are arranged on the carrier element, and the parts of the electronic system which are arranged on the carrier element can be at least partially taken out of the pedestal opening for servicing.
    Type: Grant
    Filed: August 4, 2011
    Date of Patent: May 6, 2014
    Assignee: Mettler-Toledo (Albstadt) GmbH
    Inventor: Thomas Schön
  • Publication number: 20140112511
    Abstract: An electronic device may have a housing such as a metal housing. A display may be mounted in the metal housing. Antenna structures may be mounted in the housing under an inactive peripheral portion of the display. Integrated circuits and other electrical components may be mounted in the housing under an active central portion of the display. Shielding structures may be configured to form a wall that extends between the display and the metal housing. The shielding structures may include a sheet of conductive fabric that is shorted to the metal housing and metal chassis structures in the display. The shielding structures may also include a tube of conductive fabric that is capacitively coupled to ground traces in a touch sensor panel. The conductive fabric tube and the sheet of conductive fabric may be shorted to each other using conductive adhesive.
    Type: Application
    Filed: October 18, 2012
    Publication date: April 24, 2014
    Applicant: Apple Inc.
    Inventors: Sean S. Corbin, Taylor H. Gilbert, Rodney A. Gomez Angulo, Qingxiang Li, Stephen R. McClure, Julio C. Quintero, Miroslav Samardzija, Robert W. Schlub, Jiang Zhu
  • Patent number: 8699229
    Abstract: A display capable of inhibiting deformation of a component during transport or the like and an electronic unit including the display are provided. A display includes: a main section; and a board-mounting plate disposed on one surface of the main section, and having a board-mounting region on a main surface on a side opposite to a side facing the main section, in which the board-mounting plate includes, at corners at both ends of a side of the mounting region, hook sections allowing corners of a board to be hooked thereto, and the hook sections each are fixed to the main surface on two sides of the corner of the mounting region.
    Type: Grant
    Filed: January 10, 2012
    Date of Patent: April 15, 2014
    Assignee: Sony Corporation
    Inventor: Koji Masaki
  • Patent number: 8693212
    Abstract: A chassis having a cover moveable between open and closed positions and circuitry for detecting whether the cover is in the open or the closed position. The circuitry includes a transmitter of optical energy disposed at a fixed position within the chassis for transmitting pulses of optical energy at a predetermined frequency and a receiver for optical energy disposed at a fixed position within the chassis. A reflector is mounted to an inner surface of the cover and is disposed in a path to intercept and then reflect the intercepted transmitted energy to the receiver when the cover is moved to the closed position and being disposed away from the path to prevent the transmitted energy to be intercepted and then reflected to the receiver when the cover is moved to the open position.
    Type: Grant
    Filed: September 15, 2010
    Date of Patent: April 8, 2014
    Assignee: EMC Corporation
    Inventors: Brian D. Kennedy, Antonio L. Fontes
  • Patent number: 8681507
    Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.
    Type: Grant
    Filed: January 6, 2012
    Date of Patent: March 25, 2014
    Assignee: Delphi Technologies, Inc.
    Inventor: Edgar Glenn Hassler
  • Publication number: 20140071642
    Abstract: Representative implementations of devices and techniques provide mechanical isolation to a sensor component mounted within a housing. The housing may have a cavity, and may be arranged such that the cavity faces a carrier. An aperture may be located in a surface of the housing to provide access to the sensor component.
    Type: Application
    Filed: September 11, 2012
    Publication date: March 13, 2014
    Inventor: Horst THEUSS
  • Patent number: 8634200
    Abstract: A portable terminal, which has easily adjustable reception sensitivity, includes an operating section side case section (2) having a first case member (30) which forms appearance; a display section side case section (3); a circuit section (33), which is arranged on the operating section side case section (2) or the display section side case section (3), and has a ground section (31), a power feed section (32), and a signal processing section (36) connected to the power feed section (32); a first conductive section (34), which is arranged on the operating section side case section (2) and electrically connected to the ground section (31); and a second conductive section (35) which is arranged on the display section side case section (3) and electrically connected to the power feed section (32). The first conductive section (34) is formed in the first case member (30).
    Type: Grant
    Filed: February 25, 2009
    Date of Patent: January 21, 2014
    Assignee: Kyocera Corporation
    Inventor: Daisuke Togashi
  • Patent number: 8630098
    Abstract: A circuit board adapted for use in an switching converter for connecting a plurality of switches including a first switch, a second switch, a third switch and a fourth switch. The circuit board has a layout for connecting the switches. The layout is adapted for locating the switches substantially at or symmetrically with respect to the endpoints of a right-angle cross. The right-angle cross is formed from two line segments intersecting with a ninety degree angle. The circuit board may offsets the switches perpendicularly to the line segments at the endpoints of the line segments either in a clockwise or a counterclockwise direction.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: January 14, 2014
    Assignee: Solaredge Technologies Ltd.
    Inventors: Lior Handelsman, Tzachi Glovinsky, Amir Grossberg, Sönke Rogalia, Heribert Schmidt
  • Patent number: 8625303
    Abstract: A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a first circuit board, an expansion slot, and an expansion card with a second circuit board. A first edge connector is arranged on a bottom edge of the first circuit board and includes first power pins connected to a control chip and first storage chips, and first ground pins. A second edge connector is arranged on a top edge of the second circuit board and includes second power pins connected to a power unit, and second ground pins. A third edge connector is arranged on a bottom edge of the second circuit board and includes third power pins connected to the power unit, third ground pins, and signal pins connected to a display unit.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: January 7, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xiao-Gang Yin, Guo-Yi Chen
  • Patent number: 8616311
    Abstract: An electrical storage device includes: a conductive battery house casing electrically connected to a chassis; a plurality of battery cells held in the battery house casing; and a control unit that comprises a circuit that manages the plurality of battery cells and is mounted on the battery house casing so that a negative terminal of the circuit and the battery house casing are electrically conducting.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: December 31, 2013
    Assignees: Hitachi, Ltd., Hitachi Vehicle Energy, Ltd.
    Inventors: Yoshihisa Tsurumi, Shinichi Fujino, Sadashi Seto
  • Patent number: 8611097
    Abstract: A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a first circuit board, an expansion slot, and an expansion card with a second circuit board. A first edge connector is arranged on a bottom edge of the first circuit board and includes first power pins connected to a control chip and first storage chips, and first ground pins. A second edge connector connected to the expansion slot is arranged on a top edge of the first circuit board and includes second power pins connected to the first power pins, second ground pins, and four first signal pins connected to the control chip. A third edge connector engaged in the expansion slot is arranged on a bottom edge of the second circuit board and includes third power pins and four second signal pins connected to the second storage chips, and third ground pins.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: December 17, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xiao-Gang Yin, Wei-Min He, Guo-Yi Chen
  • Patent number: 8611100
    Abstract: The present invention provides a display device back panel with adjustable PCB mounting seat, which includes a hollow body and paired mounting seats. The mounting seats are arranged in a hollow portion of the body and have opposite ends extended to connect to the body. Each of the mounting seats includes a first bracket and a second bracket that are symmetrically arranged and a connection board connected between the first bracket and the second bracket. The first bracket has an end adjustably connected to the body and an opposite end adjustably connected to the connection board. The second bracket has an end adjustably connected to the body and an opposite end adjustably connected to the connection board. The first bracket has a first bent section that is bent downward, and the second bracket has a second bent section that is bent down. The pair of mounting seats forms a receiving space between the two first bent sections and the two second bent sections that receive a PCB supported and mounted thereon.
    Type: Grant
    Filed: November 24, 2011
    Date of Patent: December 17, 2013
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
    Inventors: Yicheng Kuo, Yuchun Hsiao, Chong Huang, Jiahe Cheng, Chengwen Que, Quan Li, Liuyang Yang
  • Patent number: 8611096
    Abstract: This invention is directed to a support plate for reinforcing a portion of a circuit board. The support plate may be coupled to a portion of the circuit board that is subject to forces (e.g., portions of the circuit board having switches) to prevent flexing of the board. The support plate may be coupled to the circuit board. This invention is also directed to a switch constructed from a button, a label plate, and a backer plate. The label plate and the backer plate may include apertures operative to receive a protrusion extending from the button, where the protrusion is welded to the backer plate. Labels may be printed or attached to the bottom surface of the label plate to protect the labels. In some embodiments, the protrusion may be welded to the backer plate. The protrusion may be operative to engage an electrical switch of an electronic device in which the switch is placed.
    Type: Grant
    Filed: May 11, 2011
    Date of Patent: December 17, 2013
    Assignee: Apple Inc.
    Inventors: Stephen Brian Lynch, Dinesh Mathew
  • Publication number: 20130329353
    Abstract: In described embodiments, a printed circuit board assembly capable of discharging electro-static discharge (ESD) surges includes an isolation trench track provided in the printed circuit board in close proximity to the peripheral edges between the peripheral edges and the mounting area, and a discharge path formed of conductive material to ground provided between the isolation trench track and the peripheral edges. The discharge path includes the board mounting screws and connects to a power connector ground of the printed circuit board.
    Type: Application
    Filed: June 8, 2012
    Publication date: December 12, 2013
    Inventors: David Alan Savory, Joshua A. Johnson
  • Publication number: 20130322039
    Abstract: A cap for a microelectromechanical system device includes a first layer of, e.g., Bismaleimide Triazine (BT) resin material in which a through-aperture is formed, laminated to a second layer of BT resin material that closes the aperture in the first layer, forming a cavity. The first and second layers are laminated with a thermosetting adhesive that is sufficiently thick to encapsulate particles that may remain from a routing operation for forming the apertures. The interior of the cavity, including exposed portions of the adhesive, and the exposed face of the first layer are coated with an electrically conductive paint. The cap is adhered to a substrate over the MEMS device using an electrically conductive adhesive, which couples the conductive paint layer to a ground plane of the substrate. The layer of conductive paint serves as a shield to prevent or reduce electromagnetic interference acting on the MEMS device.
    Type: Application
    Filed: May 31, 2012
    Publication date: December 5, 2013
    Applicant: STMICROELECTRONICS PTE LTD.
    Inventors: Jerome Teysseyre, Glenn de los Reyes, Wee Chin Judy Lim
  • Patent number: 8599576
    Abstract: Equipment and systems for protecting electronics against damage or upsets from electromagnetic pulse (HEMP or EMP), intentional electromagnetic interference (IEMI), and high power RF weapons are disclosed. This equipment can include a shielding arrangement includes a metallic enclosure having an interior volume defining a protected portion and an unprotected portion separated by an electromagnetically shielding barrier, and having a portal providing access to the protective portion and including an access opening, a shielding cover sized to cover the access opening, and an electromagnetically sealing gasket positioned around a perimeter of the access opening. The shielding arrangement also includes one or more filters positioned at least partially within the unprotected portion and along the electromagnetically shielding barrier to dampen electromagnetic signals and/or power signals outside a predetermined acceptable range.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: December 3, 2013
    Assignee: Emprimus, LLC
    Inventors: Frederick R. Faxvog, Greg Fuchs, Wallace Jensen, David Blake Jackson, Bill Volna, Gale Nordling, James Nicholas Ruehl
  • Patent number: 8599568
    Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.
    Type: Grant
    Filed: August 12, 2011
    Date of Patent: December 3, 2013
    Assignee: Delphi Technologies, Inc.
    Inventors: Vineet Gupta, Joseph K. Huntzinger, Michael G. Coady, Curtis Allen Stapert, Kevin Earl Meyer, Timothy D. Garner, Jeffrey T. Bell, Robert L. Vadas, Donald G. Moeschberger, Rick L. Hatcher, Quan N. Nguyen
  • Patent number: 8587952
    Abstract: Insulating ribs are formed into one or more portions of a housing that encloses circuitry of an electrical device. Components mounted on a board are separated according to whether they are related to a primary side of a power transformer or a secondary side. Primary related components are typically mounted on the primary side of an isolation slot formed into a circuit board and components related to the secondary are mounted on the other side. The insulating ribs are strategically placed to protrude through the slots when circuit board is mounted to the housing portion. Thus, when the housing portion is joined to another housing portion, which also may include insulating ribs strategically placed, the ribs increase the breakdown voltage of the boundary.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: November 19, 2013
    Assignee: ARRIS Enterprises, Inc.
    Inventors: Brent Scott Hughes, Jason Pierce
  • Publication number: 20130293322
    Abstract: Various embodiments implement waveguides for signal distribution or signal filtering in satellite receivers. According to some embodiments, a low noise block downconverter (LNB) is implemented using waveguides configured for signal distribution, band pass filtering, low pass filtering, high pass filtering, or band stop filtering. For some embodiments, the waveguides may be formed by the LNB chassis and the ground plane of a printed circuit board mounted to the LNB chassis.
    Type: Application
    Filed: June 29, 2012
    Publication date: November 7, 2013
    Inventor: Martin Christopher ALDERTON
  • Patent number: 8570756
    Abstract: A sliding electronic apparatus that prevents foreign matter from entering a housing is provided. In the apparatus, upper housing 1 and lower housing 2 are slidably coupled, and it is switched by sliding one of upper housing 1 and lower housing 2 with respect to the other, a closed state in which operation section 2b provided on lower housing 2 is covered by upper housing 1 and an open state in which operation section 2b is exposed. The apparatus includes opening 1c formed in a lower surface of upper housing 1, opening 2c formed in an upper surface of lower housing 2, and FPC 3 for electrically connecting wiring board 9 and wiring board 10. FPC 3 includes cover portion 3a mounted on the lower surface of upper housing 1 so as to cover opening 1c and cover portion 3b mounted on the upper surface of lower housing 2 so as to cover opening 2c. Cover portion 3a is electrically connected to wiring board 9 in upper housing 1, and cover portion 3b is electrically connected to wiring board 10 in lower housing 2.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: October 29, 2013
    Assignee: NEC Corporation
    Inventors: Takahiro Sakai, Toshiki Yamanaka, Hiroshi Yamada
  • Patent number: 8570739
    Abstract: A modular power supply (1) includes a primary input portion (2) operating with predetermined input parameters, and an output portion (3) comprising at least two modules (4) to be selected for modifying the power supply's output parameters. It is further provided a container (5) in which the primary input portion and the output portion are housed. The container comprises an inaccessible portion (6) adapted to house the primary input portion separated from the output portion, and a cover (7) hinged on a base structure (8) of the container for access to the output portion. The inaccessible portion of the container comprises a partition (9) disposed between the primary input portion and the output portion and provided with openings (10) for cooling the primary input and secondary portions. The openings are such disposed that access to the primary input portion is not allowed.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: October 29, 2013
    Assignee: Roal Electronics S.p.A.
    Inventors: Sauro Pergolesi, Daniele Vispi
  • Publication number: 20130279131
    Abstract: An electronic device includes a housing, a circuit board contained in the hosing, a pin, and a fitting member. The pin is inserted, from outside, in a through-hole formed in a wall of the housing, and has a head which is exposed to the outside and a shaft portion which projects into an inside space of the housing. The fitting member has a linear shape, and is formed with a nip spring portion and a circuit board contact portion. The nip spring portion nips the shaft portion elastically in its radial direction in the inside space of the housing to contact with the pin projected as a contact. The circuit board contact portion is in contact with a contact of the circuit board.
    Type: Application
    Filed: January 18, 2012
    Publication date: October 24, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Tatsuya Higashii, Takahiro Naruse