Specific Chassis Or Ground Patents (Class 361/753)
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Patent number: 8213183Abstract: An electronic device includes a case, a board module, and an electrostatic discharging module. The case has a conductive area. The board module is disposed in the case and has a ground end. The electrostatic discharging module is disposed on the case. Besides, the electrostatic discharging module includes a first discharging element and a second discharging element. The first discharging element is electrically connected to the ground end, and the second discharging element is electrically connected to the conductive area. There exists a gap between the first discharging element and the second discharging element, so that leak current generated by the board module can be prevented from being transmitted to the case, and that an electrostatic charge can be transmitted from the case to the ground end.Type: GrantFiled: April 28, 2010Date of Patent: July 3, 2012Assignee: Compal Electronics, Inc.Inventors: Chun-Lung Juan, Kuo-Cheng Chu
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Publication number: 20120147573Abstract: A mobile terminal includes a main body; at least one circuit board placed in the main body and comprising an upper surface, a lower surface, and at least one lateral surface; at least one conductive body disposed at the at least one lateral surface of the at least one circuit board and electrically connected to a ground of the at least one circuit board; and at least one shield member mounted on the at least one circuit board. The at least one shield member includes a base portion formed to cover at least part of the upper surface or the lower surface of the at least one circuit board and at least one protrusion portion protruded from the base portion and formed to be electrically in contact with the at least one conductive body.Type: ApplicationFiled: September 24, 2011Publication date: June 14, 2012Inventors: Gukchan Lim, Hyokune Hwang, Hyunok Lee, Jungwoo Sohn, Jinsu Lee, Taejong Jeong, Dongsu Han, Yongheon He, Hongjo Shim
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Patent number: 8199528Abstract: An electronic device including: a circuit board on which an electronic component is mounted; a plate material which is used as a ground, the plate material being extended in parallel with the circuit board; and a ground connection member which includes a fixed section and multiple elastic leg sections, the fixed section being tightened to the circuit board and connected to a ground on the circuit board, the elastic leg sections being extended from the fixed section toward different directions along the circuit board, each of the elastic leg sections being extended onto the plate material side to elastically press the plate material.Type: GrantFiled: January 27, 2009Date of Patent: June 12, 2012Assignee: Fujitsu LimitedInventors: Tadanori Tachikawa, Masuo Ohnishi
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Publication number: 20120127678Abstract: Provided is a portable wireless device which has a waterproofing effect and, at the same time, can improve resistance to static electricity. The portable wireless device (100) comprises a box-shaped housing (101) formed by fitting two cases at respective annular fitting surfaces of the two cases. In the portable wireless device (100), a circuit board (102) is provided in the housing (101). A waterproofing packing (103) has an annular shape and is provided between the fitting surfaces of the two cases and held by the two cases which constitute the housing (101). A conductor pattern (105) is integrally formed with the waterproofing packing (103) and is electrically connected to the circuit board (102).Type: ApplicationFiled: March 2, 2010Publication date: May 24, 2012Applicant: PANASONIC CORPORATIONInventors: Nobuharu Mashima, Yasuhiro Nakamura, Yoshio Koyanagi, Noriyoshi Sato
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Patent number: 8179684Abstract: An adapter panel including a chassis and a plurality of sliding adapter packs that define a front adapter field of the adapter panel. The sliding adapter packs includes a frame assembly having a living hinge and a lever arm. The living hinge locks the sliding adapter packs into both a forward and a rearward position. The living hinge is activated by either pulling or pushing the lever arm.Type: GrantFiled: October 7, 2008Date of Patent: May 15, 2012Assignee: ADC Telecommunications, Inc.Inventors: Mark Smrha, Thomas C Tinucci, Chad James Sjodin
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Patent number: 8174845Abstract: The purpose of the present invention is providing an electronic apparatus cover easily detached in the electronic apparatus cover that protects a connector installed in a recess portion of the electronic apparatus. The present invention is an electronic apparatus cover that covers a first connector for electrically connecting to a portable apparatus of an electronic apparatus that includes a recess portion to which the portable apparatus can be attached and a first engagement portion that engages the portable apparatus, including: a third engagement portion that engages with the first engagement portion.Type: GrantFiled: March 17, 2008Date of Patent: May 8, 2012Assignee: Fujitsu Ten LimitedInventors: Yukisuke Ozaki, Yuusuke Itoh
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Patent number: 8159833Abstract: According to one embodiment, there is provided a printed circuit board, including a frame ground portion in which conductor patterns are formed around a board-fixation hole, and a plurality of through-holes formed around the board-fixation hole in the frame ground portion.Type: GrantFiled: February 25, 2009Date of Patent: April 17, 2012Assignee: Kabushiki Kaisha ToshibaInventors: Norihiro Ishii, Kuniyasu Hosoda, Shinya Ainai
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Publication number: 20120081864Abstract: There is provided a collective printed circuit board including a plurality of printed circuit boards each having a mounting unit on which a semiconductor element is mounted at an upper-surface central portion, and a frame having a plurality of through holes having sizes to surround the mounting portion. Upper-surface peripheral edge portions of the printed circuit boards and a through-hole peripheral portion of the frame are bonded to each other such that the mounting units are exposed from the through holes.Type: ApplicationFiled: September 29, 2011Publication date: April 5, 2012Applicant: KYOCERA SLC TECHNOLOGIES CORPORATIONInventors: Keizou SAKURAI, Toshiaki TAKAGI
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Patent number: 8139376Abstract: An electronic housing assembly is formed with an environmental seal (20), EMI control (56) and a good thermal coupling (44, 46) made between enclosed hot electric components (48, 50) and an exterior heat sink (52, 54).Type: GrantFiled: October 4, 2004Date of Patent: March 20, 2012Assignee: OSRAM SYLVANIA Inc.Inventors: John P. Sanroma, Russell R. Holden, Andrew O. Johnson, Guy P. Bouchard
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Patent number: 8139364Abstract: An electronic control module includes a body portion, a printed circuit board positioned within the body portion, and a cap portion adapted to mate with the body portion. One of the body portion and the cap portion is formed with a groove and the other of the body portion and the cap portion is formed with a projection that is resiliently deformable upon entry into the groove to mechanically and sealingly couple the body portion and the cap portion. In some constructions, the projection is a U-shaped flange. In some constructions, the body portion and the cap portion are formed by molding a metal alloy from a thixotropic state.Type: GrantFiled: January 31, 2007Date of Patent: March 20, 2012Assignee: Robert Bosch GmbHInventor: Paul Wickett
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Patent number: 8139365Abstract: A flat panel display module includes a display panel, a chassis configured to support the display panel and having a chassis base and a first extending portion, the first extending portion being parallel to the display panel and extending away from the chassis base, the first extending portion including a seating portion having a predetermined depth, and a circuit board configured to drive the display panel, at least one part of the circuit board being mounted on the seating portion of the first extending portion.Type: GrantFiled: July 28, 2008Date of Patent: March 20, 2012Assignee: Samsung SDI Co., Ltd.Inventor: Ok-Sun Jung
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Patent number: 8138864Abstract: A circuit interrupter includes a housing having a molded case made of liquid crystal polymer. Separable contacts are disposed within the housing. An operating mechanism is disposed within the housing and is structured to open and close the separable contacts. A trip mechanism is disposed within the housing and is structured to cooperate with the operating mechanism to trip open the separable contacts. The trip mechanism includes an electronic trip circuit and a rigid, conductive base providing a ground to the electronic trip circuit. The rigid, conductive base is insert molded to a portion of the molded case.Type: GrantFiled: June 1, 2009Date of Patent: March 20, 2012Assignee: Eaton CorporationInventors: Patrick W. Mills, Richard G. Benshoff, James M. McCormick
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Publication number: 20120057317Abstract: The present invention provides a server architecture, which comprises a plurality of first middle planes disposed horizontally in the server chassis, and each of the first middle plane electrically coupled to a server board such that the server board is also horizontally disposed in the server chassis. By means of the server architecture in the present invention, in addition to providing a hot-swappable function to the server board, for the whole server system, horizontally arranged first middle plane and server board will not block the route for heat dissipating flow so that the heat dissipating efficiency with respect to the server will not be reduced.Type: ApplicationFiled: February 24, 2011Publication date: March 8, 2012Applicant: INVENTEC CORPORATIONInventor: HONG-CHOU LIN
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Publication number: 20120057318Abstract: A resin board is fixed to a plate member made of metal by a fixing member. A semi-conductor module and a capacitor are mounted on a first surface of the resin board. A first ground pattern is formed on the fist surface and electrically connected to the plate member by means of the fixing member. A connector is also provided on the first surface such that the first ground pattern is interposed between the semi-conductor module and the connector. The heat from the semi-conductor module and the capacitor is transmitted to the plate member via the first ground pattern and the fixing member.Type: ApplicationFiled: September 2, 2011Publication date: March 8, 2012Applicant: DENSO CORPORATIONInventor: Shinsuke Oota
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Publication number: 20120051012Abstract: A display device including a front cover and a rear cover coupled to each other in order to receive a display panel, drive board and power supply board, is provided. A shield case mounted on the power supply board and coupled to the rear cover removes noise conducted to the rear cover. The shield case serves to disperse and absorb noise conducted to the rear cover, enabling removal of the noise. A frame ground terminal of a socket is connected to the shield case in order to allow the shield case to be used as a ground, resulting in an increased ground area. Further, the shield case may reduce radiation noise and conduction noise generated during driving of a plurality of drive units provided in the display device.Type: ApplicationFiled: June 28, 2011Publication date: March 1, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Yong JOO, Won Myung WOO, Sung Bum JUNG
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Patent number: 8116099Abstract: Provided is a circuit board device, wherein degrees of freedom are provided for a GND connecting position among plural printed boards, and noise shield and/or heat sink effects are provided. An electronic device provided with the circuit board device and a GND connecting method are also provided. Circuit board device (100) includes a pair of printed boards (110, 120), noise generating component (112) and/or heat generating component (122), and metal plate (140). Printed boards (110, 120) include mounting surfaces and GND connecting terminals (111, 121) arranged on the respective mounting surfaces, and the mounting surfaces are arranged to face each other. Noise generating component (112) and/or heat generating component (122) is mounted on the mounting surface of at least one of a pair of printed boards (110, 120).Type: GrantFiled: July 18, 2007Date of Patent: February 14, 2012Assignee: NEC CorporationInventor: Akihito Kubota
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Patent number: 8077472Abstract: A printed circuit board of the present disclosure includes a main body, a tin layer, and a solder mask. The main body defines a through hole configured for being connected to a grounding component. The tin layer is formed on a surface of the main body around the through hole. The tin layer contacts the grounding component. The solder mask is formed between a periphery of the through hole and the tin layer. The solder mask is configured to prevent tin cream of the tin layer from flowing into the through hole.Type: GrantFiled: September 15, 2008Date of Patent: December 13, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Shu-Tzu Liu
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Patent number: 8077471Abstract: A pressure guide for an electric connection between strip conductors on a circuit board and electric contacts arranged in an edge connector is provided. The pressing device aligns a circuit board guided between two guide bars by a spring element arranged in the one of the guide bars, such that the electric strip conductors applied on the circuit board exactly conform to the contacts arranged within the edge connector.Type: GrantFiled: June 27, 2007Date of Patent: December 13, 2011Assignee: Harting Electronics GmbH & Co. KGInventors: Dieter Luettermann, Guenter Pape
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Patent number: 8071886Abstract: A wired circuit board includes a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a plurality of wires, and a semiconductive layer formed on a surface of the insulating layer exposed from the conductive pattern so as to be in contact with the conductive pattern. The insulating layer is formed with a groove exposing the metal supporting board between at least two adjacent wires, and the semiconductive layer is in contact with the metal supporting board in the groove.Type: GrantFiled: December 21, 2007Date of Patent: December 6, 2011Assignee: Nitto Denko CorporationInventors: Jun Ishii, Yasunari Ooyabu, Yasuhito Funada
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Patent number: 8059425Abstract: An integrated circuit module with temperature compensation crystal oscillator (TCXO) applying to an electronic device comprises: one substrate having one top surface; one temperature compensation crystal oscillator (TCXO) disposed on the top surface; at least one chip disposed on the top surface; one encapsulating piece formed on the top surface for covering the TCXO and the chip. As above-described structure, TCXO is prevented from exchanging heat due to the temperature difference so that the stability of the TCXO is improved.Type: GrantFiled: May 28, 2008Date of Patent: November 15, 2011Assignee: Azurewave Technologies, Inc.Inventors: Chung-Er Huang, Chien-Yu Huang
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Patent number: 8054639Abstract: An image-sensing module for reducing its overall thickness and preventing electromagnetic interference (EMI) includes a flexible substrate, an image sensor, and a plurality of electronic elements. The flexible substrate has a first PCB (Printed Circuit Board), a flexible bending board bent upwards from one side of the first PCB, and a second PCB extending forwards from the flexible bending board and disposed above the first PCB. The second PCB has at least one first opening. The image sensor is electrically disposed on the first PCB, and the image sensor is exposed by the first opening of the second PCB. The electronic elements are selectively electrically disposed on the first PCB and/or on the second PCB so that the electronic elements are disposed between the first PCB and the second PCB.Type: GrantFiled: December 1, 2008Date of Patent: November 8, 2011Assignee: Azurewave Technologies, Inc.Inventor: Chi-Hsing Hsu
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Publication number: 20110261544Abstract: A user panel assembly includes a printed circuit board (PCB), a panel element, a flexible connector and a mounting element. The flexible connector is configured to enable electrical communication between the panel element and the PCB. The mounting element includes a plurality of slots on which the panel element can be mounted. An overlay is configured to conceal a subset of the plurality of slots.Type: ApplicationFiled: April 27, 2010Publication date: October 27, 2011Applicant: Electrolux Home Products, Inc.Inventor: Paul H. Kelly
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Patent number: 8023274Abstract: Insulating ribs are formed into one or more portions of a housing that encloses circuitry of an electrical device. Components mounted on a board are separated according to whether they are related to a primary side of a power transformer or a secondary side. Primary related components are typically mounted on the primary side of an isolation slot formed into a circuit board and components related to the secondary are mounted on the other side. The insulating ribs are strategically placed to protrude through the slots when circuit board is mounted to the housing portion. Thus, when the housing portion is joined to another housing portion, which also may include insulating ribs strategically placed, the ribs increase the breakdown voltage of the boundary.Type: GrantFiled: February 19, 2008Date of Patent: September 20, 2011Assignee: ARRIS Group, Inc.Inventors: Brent Scott Hughes, Jason Pierce
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Patent number: 8023287Abstract: An electronic device includes: a board having a first connector; a housing in which the board is disposed and which has a work opening for allowing external work for the board; and a cable which has an end reaching the board by passing through a path within the housing and has a second connector to be mated with the first connector and disposed at the end. The electronic device further includes a cable holding section provided at an inner wall of the housing and having a slit whose width is smaller than a size of the second connector. The cable holding section holds the cable so that a part of the cable reaches the work opening.Type: GrantFiled: July 15, 2009Date of Patent: September 20, 2011Assignee: Fujitsu LimitedInventors: Tadanori Tachikawa, Sonomasa Kobayashi
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Patent number: 8014130Abstract: Various embodiments of a USB drive pen device are disclosed herein. In one embodiment, a USB drive pen device includes a USB plug assembly having a flash controller and a flash memory device, a pusher assembly including a rotator having one or more tabs disposed thereon, and a housing for housing at least a portion of the USB plug assembly and the pusher assembly. The housing includes a tunnel and an inner tube extended from the tunnel disposed within the housing. An intersection between the tunnel and inner tube includes one or more angled corners to lock the USB plug assembly in either a deployed position or a retracted position. Other methods and apparatuses are also described.Type: GrantFiled: December 4, 2007Date of Patent: September 6, 2011Assignee: Super Talent Electronics, Inc.Inventors: David Nguyen, Nan Nan, Abraham C. Ma, Jim Chin-Nan Ni, Charles Chung Lee, Ming-Shiang Shen
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Patent number: 8014161Abstract: In a communication device, a ground plane disposed on the upper or lower surface of a board or inside the board includes a first ground region disposed on a semiconductor circuit and connected thereto, and a second ground region disposed under an amplifier and connected thereto. The first ground region and the second ground region do not overlap with each other.Type: GrantFiled: June 8, 2007Date of Patent: September 6, 2011Assignee: Panasonic CorporationInventors: Hiroki Iwamiya, Yukio Sakai, Yuji Osumi
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Patent number: 8004860Abstract: An electrical device comprising an electronic component mounted to a surface of a printed circuit board, a ground connection on said surface, and electromagnetic interference (EMI) shielding. The EMI shielding includes an electrical insulator coating the electronic component, the insulator contacting the surface, and a conductive layer covering the electrical insulator, and contacting the electrical insulator and the ground connection.Type: GrantFiled: August 29, 2006Date of Patent: August 23, 2011Assignee: Texas Instruments IncorporatedInventor: James F. Salzman
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Patent number: 8000104Abstract: An electronic device including a housing, a main circuit substrate disposed in one side of the housing; a connector unit which is disposed in an other side of the housing and is electrically connected to the main circuit substrate, and a discharging sheet disposed in the one side of the housing and is conductively connected to the connector unit to discharge static electricity generated in the connector unit is provided.Type: GrantFiled: February 7, 2008Date of Patent: August 16, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Chul-kwi Kim, Koang-sik Lee, Dok-hwan Cha, Pil-sub Kim, Hyung-keun Song, Ba-da Kang
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Patent number: 7990512Abstract: A liquid crystal display module includes a liquid crystal display panel and a backlight unit under the liquid crystal display panel. The backlight unit includes at least one light emitting diode. The liquid crystal display module further comprises a bottom frame surrounding the backlight unit. The bottom frame comprises a printed circuit board and the at least one light emitting diode is disposed on the printed circuit board. The liquid crystal display module also includes a main frame surrounding the liquid crystal display panel and a top frame surrounding a front edge of the liquid crystal display panel and combined with the bottom frame through the main frame.Type: GrantFiled: August 27, 2009Date of Patent: August 2, 2011Assignee: LG Display Co., Ltd.Inventor: Seung-Hoon Yang
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Patent number: 7990724Abstract: A motherboard for a computer box having internal circuitry and communication ports comprises a portable motherboard having a connector for connection to an externally accessible connector of said computer box; wherein, connection of said portable motherboard connector to said externally accessible computer box connector enables said computer box to perform computing operations. The inventive motherboard is portably configured to serve one or more computers, preferably a personal computer or laptop. The portable motherboard provides a computer box with a brain. Alternatively, where a computer with a brain is slow, the portable motherboard may be used to boost the brainpower of the slow computer. Whether the portable motherboard brings life to a computer box or boosts the microprocessor power of a computer containing an internal microprocessor, the portable motherboard is a powerful invention that makes microprocessor power more efficient and ubiquitous.Type: GrantFiled: December 14, 2007Date of Patent: August 2, 2011Inventor: Paul R. Juhasz
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Patent number: 7990731Abstract: An electronic device includes a housing defining a through hole, a circuit board fixed in the housing, including a switch and a grounding portion connecting with the ground, a fastening member received in the through hole fixed on the housing and contacting the grounding portion, passing static electricity therethrough and defining a mounting hole, and an actuating member received in the mounting hole and contacting the fastening member, and pressing the switch when actuated; wherein the fastening member and the actuating member are conductive.Type: GrantFiled: December 27, 2008Date of Patent: August 2, 2011Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Shi-Kun Guo, Ke-Hui Peng, Guo-Ping Yao
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Patent number: 7982331Abstract: A transfer switch assembly is disclosed that includes a power switch device with a number engagement landings and a printed circuit board defining an opening bordered by a number of tabs. The tabs engage the landings as the switch device extends through the openings, and can be fastened together.Type: GrantFiled: December 28, 2007Date of Patent: July 19, 2011Assignee: Cummins Power Generation IP, Inc.Inventors: Jerry Murray, Allen B. Carney, Randall L. Bax, Elias Ayana, Roger Pautzke, John McCarthy
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Patent number: 7974101Abstract: A power converter in which the structure of a connecting portion is highly resistant against vibration and has a low inductance. The power converter includes a plurality of capacitors and a laminate made up of a first wide conductor and a second wide conductor joined in a layered form with an insulation sheet interposed between the first and second wide conductors. The laminate comprises a first flat portion including the plurality of capacitors which are supported thereon and electrically connected thereto, a second flat portion continuously extending from the first flat portion while being bent, and connecting portions formed at ends of the first flat portion and the second flat portion and electrically connected to the exterior.Type: GrantFiled: November 16, 2006Date of Patent: July 5, 2011Assignee: Hitachi, Ltd.Inventors: Katsunori Azuma, Masamitsu Inaba, Mutsuhiro Mori, Kenichiro Nakajima
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Patent number: 7965517Abstract: A digital camera contains a circuit board and a battery box inside a housing. The housing and the battery box are made of plastic. The housing is fixed to the battery box with a tapping screw. A conductive plate for preventing the tapping screw from being charged is arranged between the housing and the battery box. Projections of the conductive plate penetrate into thread grooves of the tapping screw. The conductive plate transmits static electricity of the tapping screw to a grounding member of the circuit board.Type: GrantFiled: February 6, 2008Date of Patent: June 21, 2011Assignee: FUJIFILM CorporationInventors: Kazuya Mayumi, Shinji Suzuki, Takao Takasu
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Publication number: 20110141707Abstract: According to an aspect of the present invention, there is provided a printed wiring board including: a substrate including an edge and a fixing hole located adjacent to the edge, the fixing hole configured to receive a bolt; and a land formed in a vicinity of the fixing hole and extending in at least a first direction and a second direction, the first direction being a direction from the fixing hole toward a center of the substrate, the second direction being direction along the edge.Type: ApplicationFiled: February 22, 2011Publication date: June 16, 2011Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Kenji Hasegawa, Tsuyoshi Kozai, Terunari Kanou
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Patent number: 7952886Abstract: According to one embodiment, an electronic apparatus is provided with a case, a module contained in the case, a ground provided in the case, a plurality of protrusions which protrude from an inner surface of the case, and a cable connected electrically to the module. At least one of the protrusions includes, on a side face thereof, a conductor connected electrically to the ground. The cable includes an electrically conductive film and is supported by the respective side faces of the protrusions.Type: GrantFiled: December 21, 2006Date of Patent: May 31, 2011Assignee: Kabushiki Kaisha ToshibaInventor: Masashi Mikami
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Patent number: 7952889Abstract: A stacking structure (20) of printed circuit board is provided. The stacking structure includes a first printed circuit board (22), a second printed circuit board (24), and at least one electronic component. The first printed circuit board has a first shielding frame (262) arranged thereon, and the second printed circuit board has a second shielding frame (264) arranged thereon. The second printed circuit board is stacked on the first printed circuit board. The at least one electronic component is disposed on at least one opposite surfaces of the first and the second printed circuit board. The first shielding frame is engaged with the second shielding frame for shielding the at least one electronic element. In addition, an electronic device incorporating the stacking structure of printed circuit board (10) is also provided.Type: GrantFiled: June 5, 2008Date of Patent: May 31, 2011Assignee: Chi Mei Communication Systems, Inc.Inventor: Yuan-Hsiao Chao
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Patent number: 7939377Abstract: A semiconductor element sealed substrate including a semiconductor element covered by an insulating layer is fabricated while a wiring substrate formed by stacking wiring layers is fabricated by a process different from the process of fabricating the semiconductor element sealed substrate. Next, the semiconductor element sealed substrate and the wiring substrate are stacked on each other in such a way that electrode terminals of the semiconductor element and corresponding conductive bumps on the outermost wiring layer face each other. The electrode terminals and the conductive bumps are thus connected to each other.Type: GrantFiled: October 27, 2010Date of Patent: May 10, 2011Assignee: Shinko Electric Industries Co., Ltd.Inventors: Fumimasa Katagiri, Akihiko Tateiwa
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Publication number: 20110103028Abstract: An electrical assembly having controlled impedance signal traces and a portable electronic device comprising an electrical assembly having controlled impedance signal traces are provided. In accordance with one embodiment, there is provided an electrical assembly, comprising: a chassis for mounting electronic components, the chassis being made from a conductive material and forming a first ground plane; a first dielectric layer overlaying the chassis; a first signal trace overlaying the first dielectric layer; and a second dielectric layer overlaying the first signal trace.Type: ApplicationFiled: October 30, 2009Publication date: May 5, 2011Applicant: RESEARCH IN MOTION LIMITEDInventors: Eric Gary MALO, Cameron Russell STEEVES, Hassan Daniel HOSSEINPOR
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Patent number: 7936565Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board accommodated in the hosing and including a first surface and a second surface located on an opposite side to the first surface, a flexible printed wiring board having an elasticity, electrically connected to the circuit board and provided from the first surface of the circuit board over to the second surface, and a pressing portion formed from a part of the flexible printed wiring board as it is bent, and pressing the flexible printed wiring board towards the first surface as it is brought into contact with the inner surface of the housing, which opposes the first surface of the circuit board.Type: GrantFiled: November 9, 2009Date of Patent: May 3, 2011Assignee: Kabushiki Kaisha ToshibaInventors: Kiyomi Muro, Sadahiro Tamai
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Patent number: 7924572Abstract: A module comprises a metallic terminal pins for connection and a circuit board with electronic components mounted thereon, a circuit board connecting side of the connector. The electronic components and the circuit board with the electronic components mounted thereon are encapsulated with the same resin. A metallic base is united to the module to obtain an electric conduction between the metallic base and the circuit board.Type: GrantFiled: February 28, 2008Date of Patent: April 12, 2011Assignee: Hitachi, Ltd.Inventors: Takuya Mayuzumi, Shuji Eguchi, Masahiro Sasaki, Kiyoomi Kadoya
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Patent number: 7911806Abstract: A power inverter for a hybrid automotive vehicle having a case with an interior and at least one electrical port mounted on the case to electrically connect electrical signals from the interior of the case to an exterior device. A cable connector is associated with each electrical port while a non-electrical sensing conductor extends serially through each electrical port and its associated cable connector. A circuit is provided which detects a break in the continuity of the sensing conductor and generates a signal representative of that break in continuity. The non-electrical sensing conductor thus minimizes the emission of EMI from the inverter. Additionally, a circuit board is mounted within the interior of the case by fasteners which minimize the spacing between the circuit board and the case to further reduce EMI emissions.Type: GrantFiled: September 28, 2007Date of Patent: March 22, 2011Assignee: Hitachi, LtdInventors: Hiroki Funato, Liang Shao, Makato Torigoe
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Patent number: 7898506Abstract: A plasma display device includes a plasma display, a chassis having conductivity that supports the plasma display, a tuner circuit, a scan driver, a sustaining driver and so forth used to display a video on the plasma display, a back cover that covers the chassis, the scan driver, the sustaining driver, etc., and a shield body that covers the tuner circuit. The shield body is electrically connected to the chassis and to the back cover.Type: GrantFiled: August 26, 2004Date of Patent: March 1, 2011Assignee: Panasonic CorporationInventor: Yasuhito Fukui
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Patent number: 7894206Abstract: A modular protection housing with a first housing module and a second housing module is provided. The first housing module comprises a first volume and a first potential rail, while the second housing module comprises a second volume and a second potential rail. In this arrangement the first housing module and the second housing module are coupleable to an operating state in such a way that the first volume and the second volume form a shared volume. In this arrangement the first potential rail and the second potential rail are coupleable such that in the coupled operating state the first potential rail and the second potential rail form a shared potential rail for the overall volume.Type: GrantFiled: January 18, 2007Date of Patent: February 22, 2011Assignee: Vega Grieshaber KGInventor: Thomas Kopp
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Patent number: 7889503Abstract: An electronic appliance includes a circuit board mounted with an electronic-circuit component. The circuit board is covered with a shield, and a metallic heat-dissipating member is arranged on the electronic-circuit component. The shield is grounded on the circuit board, and arranged such that at least one of the surfaces is in the vicinity of the heat-dissipating member. The heat-dissipating member is grounded on the circuit board by a ground member, and at the periphery of the ground member, magnetic members are arranged.Type: GrantFiled: July 11, 2007Date of Patent: February 15, 2011Assignee: Nintendo Co., Ltd.Inventors: Takeshi Nagareda, Yasuhisa Kitano, Sadayoshi Hattori
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Patent number: 7885082Abstract: A communication cabinet and methods for installing active component into a communication cabinet, the method includes: removing at least one passive communication connector being connected by at least one wire to at least one customer connector within the communication cabinet; installing at least one printed circuit board that are connected to at least one active communication component and to at least one slim edge connector; wherein the printed circuit boards are shaped such as to be completely positioned within the communication cabinet; and connecting the at least one wire to the at least one slim edge connector.Type: GrantFiled: September 11, 2006Date of Patent: February 8, 2011Assignee: Teledata Networks LimitedInventor: Hanoch Eshel
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Patent number: 7881065Abstract: An RFID tag includes a capacitor between the ASIC ground pin and the circuit ground. The value of the capacitor is selected so that in the case of electrostatic discharge (ESD), the potential drop is primarily across the capacitor rather than the ASIC. Thus, the ASIC is protected against ESD.Type: GrantFiled: April 25, 2006Date of Patent: February 1, 2011Assignee: TC License Ltd.Inventor: Tai Won Youn
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Publication number: 20110007485Abstract: A conductive chassis plate faces a printed circuit board at a distance. One end of the conductive chassis plate is aligned with one end of the printed circuit board. One end of the conductive chassis plate is electrically connected to a ground wiring pattern provided on one end of the printed circuit board. One end of the conductive chassis plate is electrically connected to a conductive member that extends from one end of the conductive chassis plate toward the other end. As a result, in transmitting or receiving a signal with respect to external equipment attached to a connector, an influence of electrostatic discharge is reduced with a simple configuration.Type: ApplicationFiled: June 18, 2010Publication date: January 13, 2011Applicant: CANON KABUSHIKI KAISHAInventor: Koji Hirai
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Patent number: 7869224Abstract: A housing structure for pluggable transceiver module includes a case being internally provided with a plurality of vertical partitioning plates, and having first protrusions provided on an upper and a lower side of a free edge at an open end of the case, and second protrusions provided on two opposite sides of a free end of each of the partitioning plates at the open end of the case; a plurality of first elastic-leaf members being clamped to the free edge of the case and having retaining holes engaged with the first protrusions; and a plurality of second elastic-leaf members being clamped to the free ends of the partitioning plates and having retaining holes engaged with the second protrusions. Therefore, the first and second elastic-leaf members are easily and securely assembled to the case and the partitioning plates via the first and second protrusions, respectively, without the need of spot welding.Type: GrantFiled: September 18, 2009Date of Patent: January 11, 2011Assignee: All Best Precision Technology Co., Ltd.Inventor: Haven Yang
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Patent number: RE42331Abstract: An all stainless steel grounding electrode uses a coating of stainless steel for an upper collar which has a dual purpose cable connector. The cable connector can accommodate a cable lug and bolt connection or a cad weld connection. A cap for the collar has a one quarter turn dual heavy duty thread set to prevent corrosion from locking up the cap. An osmotic material is placed and replaced in the grounding electrode via the cap.Type: GrantFiled: February 26, 2010Date of Patent: May 10, 2011Assignee: Lightning Eliminators & Consultants, Inc.Inventors: Roy B. Carpenter, Jr., Peter Carpenter, legal representative, Nathan M. Mascarenas, Darwin N. Sletten