Specific Chassis Or Ground Patents (Class 361/753)
  • Publication number: 20120127678
    Abstract: Provided is a portable wireless device which has a waterproofing effect and, at the same time, can improve resistance to static electricity. The portable wireless device (100) comprises a box-shaped housing (101) formed by fitting two cases at respective annular fitting surfaces of the two cases. In the portable wireless device (100), a circuit board (102) is provided in the housing (101). A waterproofing packing (103) has an annular shape and is provided between the fitting surfaces of the two cases and held by the two cases which constitute the housing (101). A conductor pattern (105) is integrally formed with the waterproofing packing (103) and is electrically connected to the circuit board (102).
    Type: Application
    Filed: March 2, 2010
    Publication date: May 24, 2012
    Applicant: PANASONIC CORPORATION
    Inventors: Nobuharu Mashima, Yasuhiro Nakamura, Yoshio Koyanagi, Noriyoshi Sato
  • Patent number: 8179684
    Abstract: An adapter panel including a chassis and a plurality of sliding adapter packs that define a front adapter field of the adapter panel. The sliding adapter packs includes a frame assembly having a living hinge and a lever arm. The living hinge locks the sliding adapter packs into both a forward and a rearward position. The living hinge is activated by either pulling or pushing the lever arm.
    Type: Grant
    Filed: October 7, 2008
    Date of Patent: May 15, 2012
    Assignee: ADC Telecommunications, Inc.
    Inventors: Mark Smrha, Thomas C Tinucci, Chad James Sjodin
  • Patent number: 8174845
    Abstract: The purpose of the present invention is providing an electronic apparatus cover easily detached in the electronic apparatus cover that protects a connector installed in a recess portion of the electronic apparatus. The present invention is an electronic apparatus cover that covers a first connector for electrically connecting to a portable apparatus of an electronic apparatus that includes a recess portion to which the portable apparatus can be attached and a first engagement portion that engages the portable apparatus, including: a third engagement portion that engages with the first engagement portion.
    Type: Grant
    Filed: March 17, 2008
    Date of Patent: May 8, 2012
    Assignee: Fujitsu Ten Limited
    Inventors: Yukisuke Ozaki, Yuusuke Itoh
  • Patent number: 8159833
    Abstract: According to one embodiment, there is provided a printed circuit board, including a frame ground portion in which conductor patterns are formed around a board-fixation hole, and a plurality of through-holes formed around the board-fixation hole in the frame ground portion.
    Type: Grant
    Filed: February 25, 2009
    Date of Patent: April 17, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Norihiro Ishii, Kuniyasu Hosoda, Shinya Ainai
  • Publication number: 20120081864
    Abstract: There is provided a collective printed circuit board including a plurality of printed circuit boards each having a mounting unit on which a semiconductor element is mounted at an upper-surface central portion, and a frame having a plurality of through holes having sizes to surround the mounting portion. Upper-surface peripheral edge portions of the printed circuit boards and a through-hole peripheral portion of the frame are bonded to each other such that the mounting units are exposed from the through holes.
    Type: Application
    Filed: September 29, 2011
    Publication date: April 5, 2012
    Applicant: KYOCERA SLC TECHNOLOGIES CORPORATION
    Inventors: Keizou SAKURAI, Toshiaki TAKAGI
  • Patent number: 8138864
    Abstract: A circuit interrupter includes a housing having a molded case made of liquid crystal polymer. Separable contacts are disposed within the housing. An operating mechanism is disposed within the housing and is structured to open and close the separable contacts. A trip mechanism is disposed within the housing and is structured to cooperate with the operating mechanism to trip open the separable contacts. The trip mechanism includes an electronic trip circuit and a rigid, conductive base providing a ground to the electronic trip circuit. The rigid, conductive base is insert molded to a portion of the molded case.
    Type: Grant
    Filed: June 1, 2009
    Date of Patent: March 20, 2012
    Assignee: Eaton Corporation
    Inventors: Patrick W. Mills, Richard G. Benshoff, James M. McCormick
  • Patent number: 8139376
    Abstract: An electronic housing assembly is formed with an environmental seal (20), EMI control (56) and a good thermal coupling (44, 46) made between enclosed hot electric components (48, 50) and an exterior heat sink (52, 54).
    Type: Grant
    Filed: October 4, 2004
    Date of Patent: March 20, 2012
    Assignee: OSRAM SYLVANIA Inc.
    Inventors: John P. Sanroma, Russell R. Holden, Andrew O. Johnson, Guy P. Bouchard
  • Patent number: 8139365
    Abstract: A flat panel display module includes a display panel, a chassis configured to support the display panel and having a chassis base and a first extending portion, the first extending portion being parallel to the display panel and extending away from the chassis base, the first extending portion including a seating portion having a predetermined depth, and a circuit board configured to drive the display panel, at least one part of the circuit board being mounted on the seating portion of the first extending portion.
    Type: Grant
    Filed: July 28, 2008
    Date of Patent: March 20, 2012
    Assignee: Samsung SDI Co., Ltd.
    Inventor: Ok-Sun Jung
  • Patent number: 8139364
    Abstract: An electronic control module includes a body portion, a printed circuit board positioned within the body portion, and a cap portion adapted to mate with the body portion. One of the body portion and the cap portion is formed with a groove and the other of the body portion and the cap portion is formed with a projection that is resiliently deformable upon entry into the groove to mechanically and sealingly couple the body portion and the cap portion. In some constructions, the projection is a U-shaped flange. In some constructions, the body portion and the cap portion are formed by molding a metal alloy from a thixotropic state.
    Type: Grant
    Filed: January 31, 2007
    Date of Patent: March 20, 2012
    Assignee: Robert Bosch GmbH
    Inventor: Paul Wickett
  • Publication number: 20120057318
    Abstract: A resin board is fixed to a plate member made of metal by a fixing member. A semi-conductor module and a capacitor are mounted on a first surface of the resin board. A first ground pattern is formed on the fist surface and electrically connected to the plate member by means of the fixing member. A connector is also provided on the first surface such that the first ground pattern is interposed between the semi-conductor module and the connector. The heat from the semi-conductor module and the capacitor is transmitted to the plate member via the first ground pattern and the fixing member.
    Type: Application
    Filed: September 2, 2011
    Publication date: March 8, 2012
    Applicant: DENSO CORPORATION
    Inventor: Shinsuke Oota
  • Publication number: 20120057317
    Abstract: The present invention provides a server architecture, which comprises a plurality of first middle planes disposed horizontally in the server chassis, and each of the first middle plane electrically coupled to a server board such that the server board is also horizontally disposed in the server chassis. By means of the server architecture in the present invention, in addition to providing a hot-swappable function to the server board, for the whole server system, horizontally arranged first middle plane and server board will not block the route for heat dissipating flow so that the heat dissipating efficiency with respect to the server will not be reduced.
    Type: Application
    Filed: February 24, 2011
    Publication date: March 8, 2012
    Applicant: INVENTEC CORPORATION
    Inventor: HONG-CHOU LIN
  • Publication number: 20120051012
    Abstract: A display device including a front cover and a rear cover coupled to each other in order to receive a display panel, drive board and power supply board, is provided. A shield case mounted on the power supply board and coupled to the rear cover removes noise conducted to the rear cover. The shield case serves to disperse and absorb noise conducted to the rear cover, enabling removal of the noise. A frame ground terminal of a socket is connected to the shield case in order to allow the shield case to be used as a ground, resulting in an increased ground area. Further, the shield case may reduce radiation noise and conduction noise generated during driving of a plurality of drive units provided in the display device.
    Type: Application
    Filed: June 28, 2011
    Publication date: March 1, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Yong JOO, Won Myung WOO, Sung Bum JUNG
  • Patent number: 8116099
    Abstract: Provided is a circuit board device, wherein degrees of freedom are provided for a GND connecting position among plural printed boards, and noise shield and/or heat sink effects are provided. An electronic device provided with the circuit board device and a GND connecting method are also provided. Circuit board device (100) includes a pair of printed boards (110, 120), noise generating component (112) and/or heat generating component (122), and metal plate (140). Printed boards (110, 120) include mounting surfaces and GND connecting terminals (111, 121) arranged on the respective mounting surfaces, and the mounting surfaces are arranged to face each other. Noise generating component (112) and/or heat generating component (122) is mounted on the mounting surface of at least one of a pair of printed boards (110, 120).
    Type: Grant
    Filed: July 18, 2007
    Date of Patent: February 14, 2012
    Assignee: NEC Corporation
    Inventor: Akihito Kubota
  • Patent number: 8077472
    Abstract: A printed circuit board of the present disclosure includes a main body, a tin layer, and a solder mask. The main body defines a through hole configured for being connected to a grounding component. The tin layer is formed on a surface of the main body around the through hole. The tin layer contacts the grounding component. The solder mask is formed between a periphery of the through hole and the tin layer. The solder mask is configured to prevent tin cream of the tin layer from flowing into the through hole.
    Type: Grant
    Filed: September 15, 2008
    Date of Patent: December 13, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shu-Tzu Liu
  • Patent number: 8077471
    Abstract: A pressure guide for an electric connection between strip conductors on a circuit board and electric contacts arranged in an edge connector is provided. The pressing device aligns a circuit board guided between two guide bars by a spring element arranged in the one of the guide bars, such that the electric strip conductors applied on the circuit board exactly conform to the contacts arranged within the edge connector.
    Type: Grant
    Filed: June 27, 2007
    Date of Patent: December 13, 2011
    Assignee: Harting Electronics GmbH & Co. KG
    Inventors: Dieter Luettermann, Guenter Pape
  • Patent number: 8071886
    Abstract: A wired circuit board includes a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a plurality of wires, and a semiconductive layer formed on a surface of the insulating layer exposed from the conductive pattern so as to be in contact with the conductive pattern. The insulating layer is formed with a groove exposing the metal supporting board between at least two adjacent wires, and the semiconductive layer is in contact with the metal supporting board in the groove.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: December 6, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Jun Ishii, Yasunari Ooyabu, Yasuhito Funada
  • Patent number: 8059425
    Abstract: An integrated circuit module with temperature compensation crystal oscillator (TCXO) applying to an electronic device comprises: one substrate having one top surface; one temperature compensation crystal oscillator (TCXO) disposed on the top surface; at least one chip disposed on the top surface; one encapsulating piece formed on the top surface for covering the TCXO and the chip. As above-described structure, TCXO is prevented from exchanging heat due to the temperature difference so that the stability of the TCXO is improved.
    Type: Grant
    Filed: May 28, 2008
    Date of Patent: November 15, 2011
    Assignee: Azurewave Technologies, Inc.
    Inventors: Chung-Er Huang, Chien-Yu Huang
  • Patent number: 8054639
    Abstract: An image-sensing module for reducing its overall thickness and preventing electromagnetic interference (EMI) includes a flexible substrate, an image sensor, and a plurality of electronic elements. The flexible substrate has a first PCB (Printed Circuit Board), a flexible bending board bent upwards from one side of the first PCB, and a second PCB extending forwards from the flexible bending board and disposed above the first PCB. The second PCB has at least one first opening. The image sensor is electrically disposed on the first PCB, and the image sensor is exposed by the first opening of the second PCB. The electronic elements are selectively electrically disposed on the first PCB and/or on the second PCB so that the electronic elements are disposed between the first PCB and the second PCB.
    Type: Grant
    Filed: December 1, 2008
    Date of Patent: November 8, 2011
    Assignee: Azurewave Technologies, Inc.
    Inventor: Chi-Hsing Hsu
  • Publication number: 20110261544
    Abstract: A user panel assembly includes a printed circuit board (PCB), a panel element, a flexible connector and a mounting element. The flexible connector is configured to enable electrical communication between the panel element and the PCB. The mounting element includes a plurality of slots on which the panel element can be mounted. An overlay is configured to conceal a subset of the plurality of slots.
    Type: Application
    Filed: April 27, 2010
    Publication date: October 27, 2011
    Applicant: Electrolux Home Products, Inc.
    Inventor: Paul H. Kelly
  • Patent number: 8023274
    Abstract: Insulating ribs are formed into one or more portions of a housing that encloses circuitry of an electrical device. Components mounted on a board are separated according to whether they are related to a primary side of a power transformer or a secondary side. Primary related components are typically mounted on the primary side of an isolation slot formed into a circuit board and components related to the secondary are mounted on the other side. The insulating ribs are strategically placed to protrude through the slots when circuit board is mounted to the housing portion. Thus, when the housing portion is joined to another housing portion, which also may include insulating ribs strategically placed, the ribs increase the breakdown voltage of the boundary.
    Type: Grant
    Filed: February 19, 2008
    Date of Patent: September 20, 2011
    Assignee: ARRIS Group, Inc.
    Inventors: Brent Scott Hughes, Jason Pierce
  • Patent number: 8023287
    Abstract: An electronic device includes: a board having a first connector; a housing in which the board is disposed and which has a work opening for allowing external work for the board; and a cable which has an end reaching the board by passing through a path within the housing and has a second connector to be mated with the first connector and disposed at the end. The electronic device further includes a cable holding section provided at an inner wall of the housing and having a slit whose width is smaller than a size of the second connector. The cable holding section holds the cable so that a part of the cable reaches the work opening.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: September 20, 2011
    Assignee: Fujitsu Limited
    Inventors: Tadanori Tachikawa, Sonomasa Kobayashi
  • Patent number: 8014161
    Abstract: In a communication device, a ground plane disposed on the upper or lower surface of a board or inside the board includes a first ground region disposed on a semiconductor circuit and connected thereto, and a second ground region disposed under an amplifier and connected thereto. The first ground region and the second ground region do not overlap with each other.
    Type: Grant
    Filed: June 8, 2007
    Date of Patent: September 6, 2011
    Assignee: Panasonic Corporation
    Inventors: Hiroki Iwamiya, Yukio Sakai, Yuji Osumi
  • Patent number: 8014130
    Abstract: Various embodiments of a USB drive pen device are disclosed herein. In one embodiment, a USB drive pen device includes a USB plug assembly having a flash controller and a flash memory device, a pusher assembly including a rotator having one or more tabs disposed thereon, and a housing for housing at least a portion of the USB plug assembly and the pusher assembly. The housing includes a tunnel and an inner tube extended from the tunnel disposed within the housing. An intersection between the tunnel and inner tube includes one or more angled corners to lock the USB plug assembly in either a deployed position or a retracted position. Other methods and apparatuses are also described.
    Type: Grant
    Filed: December 4, 2007
    Date of Patent: September 6, 2011
    Assignee: Super Talent Electronics, Inc.
    Inventors: David Nguyen, Nan Nan, Abraham C. Ma, Jim Chin-Nan Ni, Charles Chung Lee, Ming-Shiang Shen
  • Patent number: 8004860
    Abstract: An electrical device comprising an electronic component mounted to a surface of a printed circuit board, a ground connection on said surface, and electromagnetic interference (EMI) shielding. The EMI shielding includes an electrical insulator coating the electronic component, the insulator contacting the surface, and a conductive layer covering the electrical insulator, and contacting the electrical insulator and the ground connection.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: August 23, 2011
    Assignee: Texas Instruments Incorporated
    Inventor: James F. Salzman
  • Patent number: 8000104
    Abstract: An electronic device including a housing, a main circuit substrate disposed in one side of the housing; a connector unit which is disposed in an other side of the housing and is electrically connected to the main circuit substrate, and a discharging sheet disposed in the one side of the housing and is conductively connected to the connector unit to discharge static electricity generated in the connector unit is provided.
    Type: Grant
    Filed: February 7, 2008
    Date of Patent: August 16, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chul-kwi Kim, Koang-sik Lee, Dok-hwan Cha, Pil-sub Kim, Hyung-keun Song, Ba-da Kang
  • Patent number: 7990724
    Abstract: A motherboard for a computer box having internal circuitry and communication ports comprises a portable motherboard having a connector for connection to an externally accessible connector of said computer box; wherein, connection of said portable motherboard connector to said externally accessible computer box connector enables said computer box to perform computing operations. The inventive motherboard is portably configured to serve one or more computers, preferably a personal computer or laptop. The portable motherboard provides a computer box with a brain. Alternatively, where a computer with a brain is slow, the portable motherboard may be used to boost the brainpower of the slow computer. Whether the portable motherboard brings life to a computer box or boosts the microprocessor power of a computer containing an internal microprocessor, the portable motherboard is a powerful invention that makes microprocessor power more efficient and ubiquitous.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: August 2, 2011
    Inventor: Paul R. Juhasz
  • Patent number: 7990512
    Abstract: A liquid crystal display module includes a liquid crystal display panel and a backlight unit under the liquid crystal display panel. The backlight unit includes at least one light emitting diode. The liquid crystal display module further comprises a bottom frame surrounding the backlight unit. The bottom frame comprises a printed circuit board and the at least one light emitting diode is disposed on the printed circuit board. The liquid crystal display module also includes a main frame surrounding the liquid crystal display panel and a top frame surrounding a front edge of the liquid crystal display panel and combined with the bottom frame through the main frame.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: August 2, 2011
    Assignee: LG Display Co., Ltd.
    Inventor: Seung-Hoon Yang
  • Patent number: 7990731
    Abstract: An electronic device includes a housing defining a through hole, a circuit board fixed in the housing, including a switch and a grounding portion connecting with the ground, a fastening member received in the through hole fixed on the housing and contacting the grounding portion, passing static electricity therethrough and defining a mounting hole, and an actuating member received in the mounting hole and contacting the fastening member, and pressing the switch when actuated; wherein the fastening member and the actuating member are conductive.
    Type: Grant
    Filed: December 27, 2008
    Date of Patent: August 2, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Shi-Kun Guo, Ke-Hui Peng, Guo-Ping Yao
  • Patent number: 7982331
    Abstract: A transfer switch assembly is disclosed that includes a power switch device with a number engagement landings and a printed circuit board defining an opening bordered by a number of tabs. The tabs engage the landings as the switch device extends through the openings, and can be fastened together.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: July 19, 2011
    Assignee: Cummins Power Generation IP, Inc.
    Inventors: Jerry Murray, Allen B. Carney, Randall L. Bax, Elias Ayana, Roger Pautzke, John McCarthy
  • Patent number: 7974101
    Abstract: A power converter in which the structure of a connecting portion is highly resistant against vibration and has a low inductance. The power converter includes a plurality of capacitors and a laminate made up of a first wide conductor and a second wide conductor joined in a layered form with an insulation sheet interposed between the first and second wide conductors. The laminate comprises a first flat portion including the plurality of capacitors which are supported thereon and electrically connected thereto, a second flat portion continuously extending from the first flat portion while being bent, and connecting portions formed at ends of the first flat portion and the second flat portion and electrically connected to the exterior.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: July 5, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Katsunori Azuma, Masamitsu Inaba, Mutsuhiro Mori, Kenichiro Nakajima
  • Patent number: 7965517
    Abstract: A digital camera contains a circuit board and a battery box inside a housing. The housing and the battery box are made of plastic. The housing is fixed to the battery box with a tapping screw. A conductive plate for preventing the tapping screw from being charged is arranged between the housing and the battery box. Projections of the conductive plate penetrate into thread grooves of the tapping screw. The conductive plate transmits static electricity of the tapping screw to a grounding member of the circuit board.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: June 21, 2011
    Assignee: FUJIFILM Corporation
    Inventors: Kazuya Mayumi, Shinji Suzuki, Takao Takasu
  • Publication number: 20110141707
    Abstract: According to an aspect of the present invention, there is provided a printed wiring board including: a substrate including an edge and a fixing hole located adjacent to the edge, the fixing hole configured to receive a bolt; and a land formed in a vicinity of the fixing hole and extending in at least a first direction and a second direction, the first direction being a direction from the fixing hole toward a center of the substrate, the second direction being direction along the edge.
    Type: Application
    Filed: February 22, 2011
    Publication date: June 16, 2011
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kenji Hasegawa, Tsuyoshi Kozai, Terunari Kanou
  • Patent number: 7952886
    Abstract: According to one embodiment, an electronic apparatus is provided with a case, a module contained in the case, a ground provided in the case, a plurality of protrusions which protrude from an inner surface of the case, and a cable connected electrically to the module. At least one of the protrusions includes, on a side face thereof, a conductor connected electrically to the ground. The cable includes an electrically conductive film and is supported by the respective side faces of the protrusions.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: May 31, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Masashi Mikami
  • Patent number: 7952889
    Abstract: A stacking structure (20) of printed circuit board is provided. The stacking structure includes a first printed circuit board (22), a second printed circuit board (24), and at least one electronic component. The first printed circuit board has a first shielding frame (262) arranged thereon, and the second printed circuit board has a second shielding frame (264) arranged thereon. The second printed circuit board is stacked on the first printed circuit board. The at least one electronic component is disposed on at least one opposite surfaces of the first and the second printed circuit board. The first shielding frame is engaged with the second shielding frame for shielding the at least one electronic element. In addition, an electronic device incorporating the stacking structure of printed circuit board (10) is also provided.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: May 31, 2011
    Assignee: Chi Mei Communication Systems, Inc.
    Inventor: Yuan-Hsiao Chao
  • Patent number: 7939377
    Abstract: A semiconductor element sealed substrate including a semiconductor element covered by an insulating layer is fabricated while a wiring substrate formed by stacking wiring layers is fabricated by a process different from the process of fabricating the semiconductor element sealed substrate. Next, the semiconductor element sealed substrate and the wiring substrate are stacked on each other in such a way that electrode terminals of the semiconductor element and corresponding conductive bumps on the outermost wiring layer face each other. The electrode terminals and the conductive bumps are thus connected to each other.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: May 10, 2011
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Fumimasa Katagiri, Akihiko Tateiwa
  • Publication number: 20110103028
    Abstract: An electrical assembly having controlled impedance signal traces and a portable electronic device comprising an electrical assembly having controlled impedance signal traces are provided. In accordance with one embodiment, there is provided an electrical assembly, comprising: a chassis for mounting electronic components, the chassis being made from a conductive material and forming a first ground plane; a first dielectric layer overlaying the chassis; a first signal trace overlaying the first dielectric layer; and a second dielectric layer overlaying the first signal trace.
    Type: Application
    Filed: October 30, 2009
    Publication date: May 5, 2011
    Applicant: RESEARCH IN MOTION LIMITED
    Inventors: Eric Gary MALO, Cameron Russell STEEVES, Hassan Daniel HOSSEINPOR
  • Patent number: 7936565
    Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board accommodated in the hosing and including a first surface and a second surface located on an opposite side to the first surface, a flexible printed wiring board having an elasticity, electrically connected to the circuit board and provided from the first surface of the circuit board over to the second surface, and a pressing portion formed from a part of the flexible printed wiring board as it is bent, and pressing the flexible printed wiring board towards the first surface as it is brought into contact with the inner surface of the housing, which opposes the first surface of the circuit board.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: May 3, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kiyomi Muro, Sadahiro Tamai
  • Patent number: 7924572
    Abstract: A module comprises a metallic terminal pins for connection and a circuit board with electronic components mounted thereon, a circuit board connecting side of the connector. The electronic components and the circuit board with the electronic components mounted thereon are encapsulated with the same resin. A metallic base is united to the module to obtain an electric conduction between the metallic base and the circuit board.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: April 12, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Takuya Mayuzumi, Shuji Eguchi, Masahiro Sasaki, Kiyoomi Kadoya
  • Patent number: 7911806
    Abstract: A power inverter for a hybrid automotive vehicle having a case with an interior and at least one electrical port mounted on the case to electrically connect electrical signals from the interior of the case to an exterior device. A cable connector is associated with each electrical port while a non-electrical sensing conductor extends serially through each electrical port and its associated cable connector. A circuit is provided which detects a break in the continuity of the sensing conductor and generates a signal representative of that break in continuity. The non-electrical sensing conductor thus minimizes the emission of EMI from the inverter. Additionally, a circuit board is mounted within the interior of the case by fasteners which minimize the spacing between the circuit board and the case to further reduce EMI emissions.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: March 22, 2011
    Assignee: Hitachi, Ltd
    Inventors: Hiroki Funato, Liang Shao, Makato Torigoe
  • Patent number: 7898506
    Abstract: A plasma display device includes a plasma display, a chassis having conductivity that supports the plasma display, a tuner circuit, a scan driver, a sustaining driver and so forth used to display a video on the plasma display, a back cover that covers the chassis, the scan driver, the sustaining driver, etc., and a shield body that covers the tuner circuit. The shield body is electrically connected to the chassis and to the back cover.
    Type: Grant
    Filed: August 26, 2004
    Date of Patent: March 1, 2011
    Assignee: Panasonic Corporation
    Inventor: Yasuhito Fukui
  • Patent number: 7894206
    Abstract: A modular protection housing with a first housing module and a second housing module is provided. The first housing module comprises a first volume and a first potential rail, while the second housing module comprises a second volume and a second potential rail. In this arrangement the first housing module and the second housing module are coupleable to an operating state in such a way that the first volume and the second volume form a shared volume. In this arrangement the first potential rail and the second potential rail are coupleable such that in the coupled operating state the first potential rail and the second potential rail form a shared potential rail for the overall volume.
    Type: Grant
    Filed: January 18, 2007
    Date of Patent: February 22, 2011
    Assignee: Vega Grieshaber KG
    Inventor: Thomas Kopp
  • Patent number: 7889503
    Abstract: An electronic appliance includes a circuit board mounted with an electronic-circuit component. The circuit board is covered with a shield, and a metallic heat-dissipating member is arranged on the electronic-circuit component. The shield is grounded on the circuit board, and arranged such that at least one of the surfaces is in the vicinity of the heat-dissipating member. The heat-dissipating member is grounded on the circuit board by a ground member, and at the periphery of the ground member, magnetic members are arranged.
    Type: Grant
    Filed: July 11, 2007
    Date of Patent: February 15, 2011
    Assignee: Nintendo Co., Ltd.
    Inventors: Takeshi Nagareda, Yasuhisa Kitano, Sadayoshi Hattori
  • Patent number: 7885082
    Abstract: A communication cabinet and methods for installing active component into a communication cabinet, the method includes: removing at least one passive communication connector being connected by at least one wire to at least one customer connector within the communication cabinet; installing at least one printed circuit board that are connected to at least one active communication component and to at least one slim edge connector; wherein the printed circuit boards are shaped such as to be completely positioned within the communication cabinet; and connecting the at least one wire to the at least one slim edge connector.
    Type: Grant
    Filed: September 11, 2006
    Date of Patent: February 8, 2011
    Assignee: Teledata Networks Limited
    Inventor: Hanoch Eshel
  • Patent number: 7881065
    Abstract: An RFID tag includes a capacitor between the ASIC ground pin and the circuit ground. The value of the capacitor is selected so that in the case of electrostatic discharge (ESD), the potential drop is primarily across the capacitor rather than the ASIC. Thus, the ASIC is protected against ESD.
    Type: Grant
    Filed: April 25, 2006
    Date of Patent: February 1, 2011
    Assignee: TC License Ltd.
    Inventor: Tai Won Youn
  • Publication number: 20110007485
    Abstract: A conductive chassis plate faces a printed circuit board at a distance. One end of the conductive chassis plate is aligned with one end of the printed circuit board. One end of the conductive chassis plate is electrically connected to a ground wiring pattern provided on one end of the printed circuit board. One end of the conductive chassis plate is electrically connected to a conductive member that extends from one end of the conductive chassis plate toward the other end. As a result, in transmitting or receiving a signal with respect to external equipment attached to a connector, an influence of electrostatic discharge is reduced with a simple configuration.
    Type: Application
    Filed: June 18, 2010
    Publication date: January 13, 2011
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Koji Hirai
  • Patent number: 7869224
    Abstract: A housing structure for pluggable transceiver module includes a case being internally provided with a plurality of vertical partitioning plates, and having first protrusions provided on an upper and a lower side of a free edge at an open end of the case, and second protrusions provided on two opposite sides of a free end of each of the partitioning plates at the open end of the case; a plurality of first elastic-leaf members being clamped to the free edge of the case and having retaining holes engaged with the first protrusions; and a plurality of second elastic-leaf members being clamped to the free ends of the partitioning plates and having retaining holes engaged with the second protrusions. Therefore, the first and second elastic-leaf members are easily and securely assembled to the case and the partitioning plates via the first and second protrusions, respectively, without the need of spot welding.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: January 11, 2011
    Assignee: All Best Precision Technology Co., Ltd.
    Inventor: Haven Yang
  • Patent number: 7859854
    Abstract: In-vehicle electronic equipment includes an operation display panel, an opening-closing mechanism, a housing unit, a photosensor, and a control device. The opening-closing mechanism selectively moves the operation display panel to an open position and a closed position. The housing unit is configured to house an electronic device together with a connector connected to the electronic device. The photosensor detects whether an electronic device is housed in the housing unit. The control device controls the opening-closing mechanism. When the photosensor detects that no electronic device is housed in the housing unit while the operation display panel is in the open position, the control unit controls the opening-closing mechanism not to bring the display unit to the closed position.
    Type: Grant
    Filed: August 14, 2006
    Date of Patent: December 28, 2010
    Assignee: Pioneer Corporation
    Inventors: Hideki Kinoshita, Jun Togashi
  • Patent number: 7855897
    Abstract: An electronic device including a first portion, a second portion, and a circuit board is provided. The first portion has a first surface including a first conductive region. The second portion has a second surface including a second conductive region and a second nonconductive region. The second conductive region and the second nonconductive region are respectively in contact with a part of the first conductive region. The circuit board has a plurality of electronic components thereon, and the circuit board is disposed at one side of the first portion and the second portion.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: December 21, 2010
    Assignee: ASUSTeK Computer Inc.
    Inventors: Shi-Tan Lin, Shih-Jen Chuang, Chien-Hsu Hou, Hsiang-Li Yu, Pei-Chin Wang
  • Publication number: 20100315792
    Abstract: A module includes an outer housing comprising an additive. A first holder is disposed so as to be in integral relationship the outer housing. A second holder is disposed so as to be in integral relationship with the outer housing. A first circuit board is in removable engagement with first holder and the first circuit board adapted to being held in place by the holder without the use of a fastener. A second circuit board is in removable engagement with the second holder, the second circuit board adapted to being held in place by the holder without the use of a fastener. At least one electrical trace element is disposed so as to be in integral relationship with the outer housing. A conductive portion of the trace element provides a first electrical pathway between the first circuit board and the second circuit board. The insulator material and the additive act to provide electromagnetic compatibility (EMC) shielding for electrical components disposed within the outer housing.
    Type: Application
    Filed: June 16, 2009
    Publication date: December 16, 2010
    Inventor: Thomas L. Jones
  • Patent number: RE42331
    Abstract: An all stainless steel grounding electrode uses a coating of stainless steel for an upper collar which has a dual purpose cable connector. The cable connector can accommodate a cable lug and bolt connection or a cad weld connection. A cap for the collar has a one quarter turn dual heavy duty thread set to prevent corrosion from locking up the cap. An osmotic material is placed and replaced in the grounding electrode via the cap.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: May 10, 2011
    Assignee: Lightning Eliminators & Consultants, Inc.
    Inventors: Roy B. Carpenter, Jr., Peter Carpenter, legal representative, Nathan M. Mascarenas, Darwin N. Sletten