Abstract: An optical transceiver module that includes an enclosure within which are disposed a transmitter module and a receiver module. A primary and secondary board are disposed as well in the enclosure, and the transmitter module and the receiver module are each connected with one of the boards. The primary and secondary boards each have a ground plane, and a third ground plane is provided by a ground signal plate that disposed within the enclosure and electrically coupled with the primary board and the secondary board.

Abstract: Electronic equipment comprises a main body, a front panel and a recording medium receiving unit. The front panel is provided movably between an opened position and a closed position on a front side of the main body. A card-type recording medium is to be loaded or unloaded into or from the recording medium receiving unit. The recording medium receiving unit is concealed and inaccessible in case where the front panel is in the closed position. The recording medium receiving unit is displaced along with movement of the front panel so as to be exposed and accessible when the front panel moves from the closed position to the opened position.

Abstract: The device includes a housing, a printed circuit board, a first optical subassembly, a second optical subassembly, and a lever. The device is pluggable to a host structure. The housing has a channel and ground spring fingers. The printed circuit board has contact traces and is mounted to the housing. The first and second optical subassemblies are mounted to the printed circuit board. The lever is rotatably mounted to the housing. The lever includes a rotatably mounted portion, a free end, and an actuation surface for actuation by a user. The free end of the lever forms a hook. In a locked position of the device to the host structure, the ground spring fingers contact and make electrical contact with a faceplate of the host structure, and the hook engages a slot of a circuit board of the host structure.

Abstract: The present invention is to provide a grounding part of hard disk (HDD) against EMI and shock, which includes a HDD body and two conducting frames, wherein the two conducting frames are composed of a narrow vertical plane and two parallel planes extending along two corresponding sides of the vertical planes to form a U-type conducting frame with an opening, a plurality of elastic projections are disposed on the two parallel planes of the two conducting frames, and the openings of the two frames just accommodate the two corresponding sides of the HDD body. When the HDD body and the two conducting frames is installed in a containing room of an electronic device (e.g. notebook computer), the requirements of shock protection, EMI protection and grounding for the HDD body is achieved by virtue of the compression of those elastic projections.

Abstract: A flexible grounding strip includes an electrically conductive strip having an elongated base, opposite sides of which extend to respective flanges spaced from the base. Each flange extends from one side of the base and terminates at an edge generally facing the opposed side of the base. The edges are spaced from each other. Each of the opposite sides have lengthwise spaced slots extending partly across the base towards the opposite side of the base. The slots extending from one side of the base are interleaved with slots extending from the opposite side of the base.

Abstract: The present invention relates to power supplies and methods of installing power supplies.

Abstract: To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection with a piezoelectric resonator are formed on the upper lead frame and the connection leads are erected upwards so as to form connection terminals, and mounting leads for mounting to a mounting board are formed on the lower lead frame and the mounting leads are erected downwards so as to form mounting terminals, and an IC forming an oscillating circuit is mounted on the layered lead frame, the piezoelectric resonator formed by sealing a piezoelectric resonator element within a package is mounted on the layered lead frame, and the layered lead frame and the piezoelectric resonator are sealed within a resin package such that the principal surface of the mounting terminals are exposed outwards, thereby forming a completed article.

Abstract: The present invention provides methods and devices for shielding an electronic component package. In one embodiment, an EMI shield is integrally formed within the package adjacent the die and grounded. The EMI shield may be a metallized shaped polymer layer and may be disposed fully within the package or it may extend out of the package.

Abstract: A ground terminal mountable to a peripheral portion of a printed board, which includes a ground terminal body having a pick-up portion picked up by a mounter and a first end edge portion formed with a semicircular notch, and which includes a connection portion formed in, for example, a second end edge portion of the ground terminal body. To mount the ground terminal to a printed board having a first side edge portion formed with a mounting hole having a function of a positioning hole, the printed board is positioned at a part mounting position with its first and second side edge portions individually engaged with first and second guide rails, and the mounter is operated to place the ground terminal on the printed board, with the notch directed to the first guide rail and aligned with the mounting hole.

Abstract: A transmitter comprises an oscillator, a phase lock loop, a serializer, and an electrical-to-optical converter. The oscillator is enclosed in a metal shield. The metal shield is soldered to a ground ring of the printed circuit board. In one embodiment, the oscillator is voltage-controlled oscillator.

Abstract: There is described a multi-layer printed circuit board and a method of installing it. The circuit board includes a first signal layer formed on its obverse surface; a ground layer arranged at a position next to the first signal layer; an electronic power source layer arranged at a position next to the ground layer; and a second signal layer formed on its reverse surface. The first and second patterns are formed around peripheral areas of the first and second signal layers, respectively. The first ground pattern and the second ground pattern are electrically coupled to each other by plural through holes, and the multi-layer printed circuit board is installed on an electro-conductive housing in such a manner that a substantially whole area of the second ground pattern electrically contacts a mounting area of the electro-conductive housing, the mounting area being an electro-conductive area continuously coupled to the electro-conductive housing.

Abstract: An electronic device utilizing an electrostatic discharge (ESD) protection structure. The electronic device comprises a housing and a printed circuit board (PCB) with an ESD protection structure disposed thereon. The PCB has at least one metal layer with a ground circuit and a functional circuit. The ground circuit includes at least one device-protecting area near the edge of the PCB and exposed on the surface thereof. The device-protecting area is covered by a thick conductive layer, and electric components are disposed nearby, such that static electricity can be transferred to ground through the ground circuit of the PCB to protect the electronic device from interferences and damages.

Abstract: A television tuner has a bottom chassis, a top cover and a front panel, the bottom chassis having support surfaces provided on an upper portion of a front side of the bottom chassis to extend with a rising slope in a direction from a front side toward a rear side thereof, a plurality of semi-spherical projections formed on the support surfaces, a plurality of substantially U-shaped notches provided on the support surfaces, and the top cover having a convex-shaped portion to abut against the semi-spherical projections on the bottom chassis and to project toward the semi-spherical projections to function as a reinforcement rib, and hook-shaped engagements to engage with an upper portion of an inner surface of the front panel from under.

Abstract: A system and method for providing a mechanical joint supporting a printed circuit board and a solder joint of power module terminals to a printed circuit board, as well as a mechanical joint for facilitating a thermal interface between a power module and a heat sink or cold plate is disclosed. The system provides for both mechanical joints through a common mechanical support including a plurality of standoffs mounted to studs projecting from a heat sink or cold plate, wherein the assembly also provides for an insulating spacer to be clamped to the standoffs via a wing nut or similar fastener to support the printed circuit board.

Abstract: A system is provided for channeling high frequency signals through sheet metal containment within an electronic device. In exemplary embodiments of the invention, an electronic device employing the system includes a midplane circuit board. One or more interface modules may be coupled to the midplane circuit board, for example, for providing a high frequency interconnect with other devices such as Fiber Channel or the like. A midplane chassis shield is disposed within the device's housing adjacent to the midplane circuit board so that the interface modules interconnect with the midplane circuit board through apertures formed in the shield wherein the midplane circuit board, midplane chassis shield and interface module cooperate for providing a low impedance tunnel for channeling high frequency signals to ground.

Abstract: A PCB mounting apparatus includes a supporting plate (20) defining a number of through holes, a number of standoffs (50) engaging in the through holes, and a number of grounding members (60) attached to the standoffs. The standoff each includes a head (52) having a holding portion, a flange (54), a post (56), and a base (58). The grounding member each includes a first ring (62) supported on the flange, a second ring (68) supported on the base, and a band (66) connecting therebetween. The PCB (80) defines a number of fixing apertures (82). The combined standoff and grounding member is disposed in the through hole. The PCB is placed upon the supporting plate with the fixing apertures engaging the holding portions of the standoffs and contacts the first rings of the grounding members. The standoffs and the grounding members are made of conductive materials.

Abstract: A fixing device for a printed circuit board (PCB) is comprised of a shaft, an elastic washer and a fixing pillar for fixing the PCB on a shell. This device has the functions of fixing, vibration buffer, and preventing electromagnetic interference (EMI). According to the invention, the shaft penetrates through the PCB and the elastic washer and connects to the fixing pillar on a shell, thereby fixing the PCB onto the shell. The elastic washer is elastic such that it can absorb external vibrations and reduce damages to the PCB. By putting the elastic washer into contact with the PCB, the electromagnetic wave is guided to the shell, thus avoiding the EMI.

Abstract: A memory module has a two-plate heat sink attached by rivets. A front plate contacts the flat surfaces of memory chips on a front surface of the module printed-circuit board (PCB) substrate, while another back plate contacts chips on the back surface of the substrate. The plates contact the substrate along the top edge opposite the connector edge, and along the upper half of the substrate's side edges. Holes in the substrate allow for rivets or other fasteners to pass through to firmly attach the plates to the substrate, prevent wobble. Four top-edge slots are cut in the plates near the top edge, between the rivets along the top edge. The top-edge slots allow air to flow underneath the plates, in small gaps between memory chips, and between the plate and the substrate. The added air flow underneath the plates helps cool the heat-sink plates, reduce hot spots and failures.

Abstract: A retaining device (1) for expansion cards (56) each having a slot cover (60) includes a plate (18) having an expansion card seat (24), a pair of locking members (76), a fastener (90) pivotably attached to the expansion card seat. Two locking members respectively are fixed on the expansion card seat. Each locking member includes a resilient arm (80) having a locking body (81). The fastener includes a pressing plate (104) for pressing the slot covers. Two locking arms (112) extend from the pressing plate engaging with corresponding locking bodies. The fastener further includes a handle (118) and two pushing arms (120). When the handle is pressed downwardly, the pushing arms push the resilient arms to cause the locking bodies to disengage from the locking arms, and the pressing plate can thereupon be released from the slot covers of the expansion cards by operation of the handle.

Abstract: A subrack (1) for use in industrial electronics includes two parallel sidewalls 10, bottom and top walls (40, 30) cooperatively defining a space therebetween for receiving plug-in units (50) therein. Each of the bottom and top walls includes a first plate (35) defining a number of spaced slide channels, and a second plate (31) fixed to the first plate. After the plug-in units slide into the subrack along the slide channels, mounting panels (52) of the plug-in units engage with fronts of the bottom and top walls thereby securing the plug-in units in the subrack. The first and second plates can be produced from sheet steel having a same thickness, which significantly reduces the manufacturing costs.

Abstract: An optical transceiver module characterized by reduced electromagnetic interference (“EMI”) emissions for improved operation is disclosed. The transceiver includes a housing formed by top and bottom housing portions that are joined to define a cavity. A printed circuit board (“PCB”) is positioned within the cavity and includes an edge connector extending from one housing end. The PCB also includes two holes defined near the edge connector and lined with electrically conductive material. Conductive plates located on both the top and bottom housing portions electrically connect with the conductive holes to electrically interconnect the top and bottom housing portions. Two posts on the top housing portion are received into the conductive holes to align the PCB with the housing portions. A chassis ground from one or both of the housing portions extends through the plates and holes to create a “chassis ground fence,” preventing EMI emission from within the transceiver cavity.

Abstract: An electronic signal filter includes a cylindrical housing and a circuit board positioned therein having a plurality of peripheral edges and at least two circular through-holes formed therein. Each through-hole is inwardly spaced from one of the peripheral edges of the circuit board, defining a first distance between a respective one of the through-holes and a respective peripheral edge of the circuit board and defining a second distance between the through-holes. The filter also includes a ground strap attached to and spaced a distance above the circuit board. The ground strap includes a first portion, an integral second portion residing in and extending through each through-hole, and an integral third portion that contacts a portion of the second surface of the circuit board. At least a portion of the first portion of the ground strap contacts the inner peripheral surface of the cylindrical housing to ground the circuit board.

Abstract: An integrated circuit packages comprises a printed circuit board, a non-metal connector, and a metal casing. The printed circuit board includes a ground ring around the non-metal connector. The metal casing substantially encloses the printed circuit board, and has an opening that allows access to the non-metal connector. The metal casing has a metal lip that makes physical and electrical contact with the ground ring of the printed circuit board. The metal casing may be used to help reduce EMI from a transmitter.

Abstract: A flexible grounding strip includes elongated electrically conductive strip having a base extending between spaced, opposed sidewalls. At least one of the sidewalls has a flange spaced from the base and extending towards the opposed sidewall. Each of the sidewalls has a series of lengthwise-spaced slots extending widthwise across the sidewall into and at least partly across the base towards the opposed sidewall. The slot dimensions and spacing impart flexibility to enable the strip to bend transversely of its length.

Abstract: An enclosure for computer-based telephone switching equipment that suppresses the radiation of electromagnetic interference through the use of multiple overlapping seals and apertures.

Abstract: An insertion delay subassembly includes a support member which is configured to mount to the circuit board, and a lever coupled to the support member. The lever is configured to reside in a first orientation relative to the support member when the circuit board initially engages with a card cage, and pivot from the first orientation to a second orientation relative to the support member when the circuit board subsequently installs fully within the card cage. The insertion delay subassembly further includes an insertion delay latch coupled to one of the support member and the lever. The insertion delay latch is configured to selectively (i) block movement of the lever from the first orientation to the second orientation, and (ii) enable movement of the lever from the first orientation to the second orientation.

Abstract: A computer chassis having tabs extending from the inside of its side panels and springs extending from the bottom panel, for spring-mounting a circuit board, such as a motherboard or other circuit board oriented parallel to the bottom surface of the chassis. The tabs and springs may also be used to ground the circuit board.

Abstract: A power feedforward amplifier uses integral cavities to provide RF isolation between subcircuits of the power amplifier. The chassis includes a main chassis body and a lid structure adapted to couple with the chassis body and define the subcircuit cavities. The inner lid includes an amplifier dividing wall and interstage walls adapted to isolate the main and error amplifier subcircuits of the feedforward power amplifier and further to isolate individual components of the subcircuits. In one embodiment, the amplifier subcircuits are mounted on a single circuit board and isolated from each other by the dividing wall. A delay line subcircuit portion is integral with the main chassis body and is coupled beneath the error amplifier subcircuit to contain and electromagnetically shield a delay line filter subcircuit while providing direct connection with the error amplifier.

Abstract: An electromagnetic shielding plate having high shielding effect is provided. The electromagnetic shielding plate is formed of a conductive plate having elasticity and is provided on the edge thereof with a connecting strip bent in such a manner that the tip thereof projects from the surface of the plate, and with a supporting portion. When the electromagnetic shielding plate and the printed substrate are connected, it is ensured that the ground pattern 201 of the printed board 200 and the connecting strip are brought into contact with respect to each other, thereby a high shielding effect can be obtained.

Abstract: The present invention relates to an assembly comprising an electrical element, such as a coil, and especially to an assembly more easily assembled. Assemblies of this type are used for receivers for hearing aids or sound generators for e.g. mobile telephones.

Abstract: A memory card with a static electricity conducting board has a circuit board, a partitioning board and a conducting board. The circuit board has two contacts. The partitioning board is mounted on the board and has two slots. The conducting board is mounted on the partitioning board and has two conducting tabs located respectively inside the slots and pressing respectively against the contacts on the circuit board. The conducting board attracts static electricity on the circuit board and the chip and keeps the circuit board and the chip from being damaged by the static electricity.

Abstract: A personal digital assistant with static electricity preventing function, comprising: a metallic or electroplated chassis installed in the personal digital assistant serving as the grounding for the personal digital assistant; a touch panel module installed on the chassis; and a metallic shielding piece installed on the touch panel module and is equipped with a grounding section on the side, of which, the grounding section is connected to the chassis dispersing electrostatic charges, meanwhile, fixes the touch panel module firmly to the chassis.

Abstract: An optical data link 20 comprises a mounting member 22, an optical element assembly 24, a circuit board 26, and a spacer 32. The PGA substrate 22 has a substrate 22a and a plurality of electrically conductive pins 22b. The circuit board 26 has a pair of surfaces. Electronic components 34a to 34c are mounted on the pair of surfaces. The optical element assembly 24 includes a semiconductor optical element 24f. The semiconductor optical element 24f is connected to an electrically conductive layer on the circuit board 26. The spacer 32 functions so as to distance the circuit board 26 from the PGA substrate 22. Since the circuit board 26 is distanced from the PGA substrate 22, the electronic components 34a to 34e can be mounted on both surfaces of the circuit board 22.

Abstract: An electronic device and a fastening apparatus in the electronic device. The device includes a main board, a shield and a supporting seat. The shield has a first opening and a second opening. The supporting seat includes a first engaging portion, a second engaging portion and a third engaging portion. The supporting seat connects with the shield by the first and second engaging portion and supports the main board by the third engaging portion. The first engaging portion connects to the first opening to prevent the supporting seat from moving along the X and Z axes and the second engaging portion connects to the second opening to prevent the supporting seat from moving along the Y axis. The X, Y, and Z axes are perpendicular to each other.

Abstract: An adapter using an electrically-conductive wall within the adapter to channel EMI emissions to ground. In a preferred embodiment, the adapter comprises: (a) an elongated housing having a first and second end and defining a first passageway extending axially from the first end toward the second end, and a second passageway extending axially from the second end toward the first end, each passageway configured to receive an optical connector plug; (b) an electrically-conductive wall traversing the adapter between the first and second passageways, the wall being sized to cover a substantial portion of the opening when the adapter is mounted to the chassis; and (c) at least one portion of the wall extending outside of the housing to electrically couple with the chassis of the computer system when the adapter is mounted to the chassis forming an electrically-conductive path between a point on the wall and the chassis.

Abstract: An electrostatic discharge protection cover is described. The electrostatic discharge protection cover enhances the strength of an upper cover of a PC card socket and protects the socket from electrostatic discharge pulse. The electrostatic discharge protection cover has a protection plate assembled on a PC card socket upper side for guiding the pulse of electrostatic discharge to a ground, and a stair-type enhancing edge to enhance the strength of the protection plate. The stair-type enhancing edge further couples with a metal crossbeam of a computer to enhance the strength and electrostatic discharge protection capacity.

Abstract: A semiconductor device package includes a substrate, a semiconductor device formed on the substrate, a ground electrode formed on the substrate, a cover designed for covering the semiconductor device, and a tab unit extending from the cover and for holding the substrate. The cover has an outer surface made of conductive material and an inner surface made of insulation material, where the insulating inner surface faces the semiconductor device. The tab unit has a first contact surface which extends from the conductive outer surface and is contact with the ground electrode.

Abstract: A wireless network adapter for establishing wireless communication links between electronic devices. In one embodiment, the wireless network adapter comprises wireless communication circuitry encased in a shell in the form of a detachable molding element of an electronic device. The wireless network adapter further comprises a bus connector adapted to couple the wireless communication circuitry to an expansion bus when the shell is attached to an outer surface of an electronic device. The wireless network adapter is a fully integrated solution further comprising an RF antenna for communication with a wireless network and a radio modem comprising a radio, a receiver, and modulation circuitry. The RF antenna in the wireless network adapter may take one of several forms. The antenna may be a dedicated unit housed within the shell of the wireless network adapter. Alternatively, the antenna may form a part of the outer shell of the adapter or it may form a part of a company logo located on the shell the adapter.

Abstract: A mounting clip that attaches a circuit component to an electrical device attenuates vibration of the circuit component as the electrical device is operated. The mounting clip is designed for a thermo-protector of an electric motor and removably attaches the thermo-protector to a switch housing of the electric motor. The thermo-protector is connected in the circuit of the electric motor and wiring of the electric motor that communicates with the thermo-protector is attached to the mounting clip. The mounting clip is provided with a spring mechanism that engages an abutment provided on the switch housing and biases the mounting clip and the attached thermo-protector and thermo-protector wiring away from the switch housing and thereby attenuates vibration of the thermo-protector and its wiring.

Abstract: Embodiments of a communication panel are disclosed that include structures that facilitate maintaining and assembling the communication panel, protect the keypad buttons, and/or protect the integrated circuits of the communication panel. Embodiments include structures such as perpendicular circuit board configurations, multi-sided removable cover surfaces, and multi-layered front panels with keypad holes. Elastomeric keypads may be included and buttons of the keypad protrude through holes in the multi-layered front panels.

Abstract: A grounding assembly includes a shaft bearing connected to an associated shaft. The bearing includes a cylindrical portion and an annular head portion. A structure having a first surface with an aperture defined therein receives the cylindrical portion of the shaft bearing. The annular head portion of the bearing has a shoulder for seating against the first surface of the structure. A grounding member includes an annular portion positioned between the first surface of the structure and the annular head portion of the shaft bearing. The grounding member further includes fingers positioned between the cylindrical portion of the shaft bearing and an inner cylindrical surface of the structure that defines a length of the aperture. At least one of the fingers includes (1) a first bend for allowing the at least one of the fingers to enter the aperture and (2) a second bend for allowing the at least one of the fingers to contact the cylindrical portion of the shaft bearing.

Abstract: A PCB is provided that is suitable for use in applications where EMI control is of interest. The PCB includes circuitry that communicates with an edge connector having edge traces located on its surface. Additionally, embedded traces are disposed within the dielectric material of the PCB, and each embedded trace electrically connects an edge trace with a corresponding median trace located on a surface of the PCB. An embedded ground layer substantially disposed within the dielectric material defines an area within the dielectric material through which the embedded traces pass. Finally, one or more vias are provided that extend through the dielectric material of the PCB and are filled with a conductive material. The vias are electrically connected to the embedded ground layer and configured to electrically communicate with an associated module. In this way, a structure is implemented that facilitates control of electromagnetic radiation emitted by the PCB circuitry.

Abstract: An adapter or housing for a module, such as a single in-line memory module (SIMM) or the like, and method of using the same are herein disclosed where the SIMM and attached housing fit a predetermined shape SIMM socket. The housing replaces SIMM board material that would otherwise be used to help secure the SIMM to a predetermined shape SIMM socket or connector. The configuration of the housing allows a SIMM or the like to be snapped or slid and secured into the housing. If desired, an adhesive, potting material and other bonding material can be used to secure the SIMM board to the housing and/or pot the SIMM within the housing.

Abstract: A fixture assembly for holding printed circuit boards (PCBAs) during processing such as wave soldering. The fixture assembly consists of multiple plates which are assembled to define protective cavities and recesses for masking components such as surface mount devices and define apertures so that pass-through leads are exposed at the bottom or secondary side of the bottom plate. An optional weighting member may be used to firmly secure the PCBA during processing. The multi-plate structure is cost effective reducing milling and machining operations normally attendant to the fabrication of a fixture assembly.

Abstract: A circuit board is provided with extending portions having terminal patterns formed thereon. A housing contains the circuit board while permitting the extending portions to protrude. A mother board has, formed therein, through holes in which the extending portions are to be inserted, having, formed thereon, wiring pattern that is to be electrically connected to the terminal patterns, and permitting the extending portions to be inserted in the through holes so that the housing is placed thereon. The circuit board is provided with a protruded portion which extends separately from the extending portions and pushes the terminal patterns onto the wiring pattern of the mother board. The mother board is provided with an insertion hole in which the protruded portion is to be inserted being slightly deviated from the positions of the through holes in which the extending portions are to be inserted.

Abstract: The present invention discloses methods and apparatus for installing printed circuit boards within an electronic assembly. One embodiment is a riser card bracket assembly for an electronic system. The riser card bracket comprises an adjustable card retainer disposed within the riser card bracket assembly; the retainer is capable of movement within the riser card bracket assembly to secure cards of various lengths. Another embodiment of the invention is a method for installing cards within a computer housing having a motherboard. The method comprises providing a riser card bracket assembly having an adjustable card retainer. At least one card is inserted within the riser card bracket assembly. The riser card bracket assembly is inserted within the computer housing whereby the at least one card is positioned parallel to the motherboard.

Abstract: A latching apparatus has a guide member, a circuit board attachment member which is configured to attach to a circuit board, and a control assembly. The control assembly is configured to (i) retain the circuit board attachment member within a retaining range of the guide member when the guide member is unlocked from a receptacle member, and (ii) un-restrict the circuit board attachment member such that the circuit board attachment member is movable outside of the retaining range of the guide member when the guide member is locked with the receptacle member.

Abstract: A form factor card compatible for use with a host electronic device that is capable of communicating a status of the form factor card to a user of the host electronic device. The form factor card comprises an adapter region for interfacing the card with the host electronic device, an on-card electronic device for performing a task for the host electronic device, an on-card intelligent controller, and an indicator in communication with the on-card intelligent controller to communicate an operational status of the form factor card.

Abstract: A power feedforward amplifier uses integral cavities to provide RF isolation between subcircuits of the power amplifier. The chassis includes a main chassis body and a lid structure adapted to couple with the chassis body and define the subcircuit cavities. The inner lid includes an amplifier dividing wall and interstage walls adapted to isolate the main and error amplifier subcircuits of the feedforward power amplifier and further to isolate individual components of the subcircuits. In one embodiment, the amplifier subcircuits are mounted on a single circuit board and isolated from each other by the dividing wall. A delay line subcircuit portion is integral with the main chassis body and is coupled beneath the error amplifier subcircuit to contain and electromagnetically shield a delay line filter subcircuit while providing direct connection with the error amplifier.

Abstract: A double-sided oscillator package having an open-top oscillator housing adapted to receive electronic components and a hermetically sealed resonator housing containing a piezoelectric element is described. The electronic components and piezoelectric element are electrically connected. The respective housing can be manufactured separately and the components thereof assembled thereafter to form the package.