Specific Chassis Or Ground Patents (Class 361/753)
  • Patent number: 7554811
    Abstract: Various arrangements of carrier trays and carriers for data storage devices, such as disk drives, are disclosed. The arrangements of carrier trays and carriers are arranged to be rigid, and therefore more resistant to vibration arising from operation of the data storage device in the tray and neighboring data storage devices, and/or easier to use.
    Type: Grant
    Filed: December 1, 2005
    Date of Patent: June 30, 2009
    Assignee: Xyratex Technology Limited
    Inventors: Mark Scicluna, Adam Wade
  • Publication number: 20090154117
    Abstract: An elastic grounding clip, set between a PCB and a housing of an electronic device, includes two first main pieces, a first connection piece connected between the two first main pieces, a second main piece adjacent one of the first main pieces, and a second connection piece connected between the one of the first main pieces and the second main piece. The two first main pieces and the first connection piece bound a first clamping part configured for clamping the PCB, and the corresponding first main piece, the second connection piece, and the second main piece bound a second clamping part configured for clamping a protruding portion of the housing of the electronic device.
    Type: Application
    Filed: February 27, 2008
    Publication date: June 18, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: MING-CHIH HSIEH, TSUNG-HSI LI
  • Publication number: 20090122507
    Abstract: A conductive elastomeric shielding device (400) for use with an electronic device includes a raised surface (401) and a sidewall (405) formed with the raised surface (401). A turret section (406) is formed with the sidewall (405) where an engagement member (407) projects from the turret section (406) for frictional engagement with an aperture (408) in a printed circuit (PC) board (410). The raised surface and sidewall are manufactured of an elastomeric shielding material for shielding radio frequency (RF) radiation for electronic components used therewith.
    Type: Application
    Filed: November 8, 2007
    Publication date: May 14, 2009
    Inventor: Chris R. Snider
  • Patent number: 7525818
    Abstract: A memory card connector assembly for use within a chassis includes a conductive shell that has a forward perimeter. A connector including a dielectric housing holding contacts is positioned within the shell. An EMI shielding member is disposed on the forward perimeter of the shell. The EMI shielding member is configured to engage a panel of the chassis to suppress the escape of EMI energy from the chassis.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: April 28, 2009
    Assignee: Tyco Electronics Corporation
    Inventors: Matthew Richard McAlonis, Lynn Robert Sipe, James Lee Fedder
  • Patent number: 7518880
    Abstract: A shielding arrangement for an electronic component mounted on a circuit board includes a shield formed by a frame sidewall arranged to be oriented upstanding from the circuit board and surrounding the electronic component mounted on the circuit board. A first cover portion substantially closes the surrounding sidewall, enclosing the electronic component on the circuit board. A conductive layer, formed by vacuum deposition covers an inside surface of the surrounding sidewall and an inside surface of the first cover portion, continuously. As an alternative to the conductive layer, the frame can be composed of an electrically conductive plastic. The first cover portion can be a stamped metal plate integrated with the frame by overmolding.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: April 14, 2009
    Assignee: Bi-Link
    Inventor: Frank J. Ziberna
  • Publication number: 20090086448
    Abstract: The present invention discloses a solid state drive with a coverless casing, which comprises: a printed circuit board assembly and a coverless casing. In the resent invention, the coverless casing is free of a top cover; thereby, air circulation can be enhanced to cool down the electronic components on a printed circuit board assembly more efficiently. Further, in the present invention, the coverless casing is designed to have the printed circuit board assembly electrically connected to the chassis ground of the host system via the coverless casings; thereby, unwanted electrostatic charges can be dissipated to the chassis ground of the host system before it can damage the electronic components on the printed circuit board assembly; thus, the ESD resistance thereof is promoted.
    Type: Application
    Filed: September 27, 2007
    Publication date: April 2, 2009
    Inventors: Siew S. HIEW, Jim NI, Abraham Chih Keng Ma, Qi Jin Li
  • Publication number: 20090067141
    Abstract: This invention is directed to several mechanical features of an electronic device. The electronic device may include a spring for simultaneously grounding several components. The electronic device may include several interlocking fences for protecting electronic device components from RF radiation. The electronic device may include an antenna assembly that includes distinct components for functional and aesthetic purposes. The electronic device may include a window for permitting RF transmissions. The electronic device may include a metal frame for stiffening the electronic device. The electronic device may include a bezel used for aesthetic purposes and to support numerous electronic device components. The electronic device may include a flexible housing operative to elastically deform to assemble the electronic device. The electronic device may include an unsupported button.
    Type: Application
    Filed: September 4, 2008
    Publication date: March 12, 2009
    Applicant: Apple Inc.
    Inventors: Teodor Dabov, Fletcher R. Rothkopf, Philippe Manoux
  • Publication number: 20090052149
    Abstract: A highly reliable covered multilayer module includes a plurality of side electrodes extending in a lamination direction of ceramic layers are provided at least at one of side surfaces of a multilayer module body. At least one of inner conductor layers is exposed at the side surface provided with the side electrodes, in a region interposed between an adjacently arranged pair of the side electrodes. A claw portion of a metal case is soldered to the side electrodes and the inner conductor layer. The plurality of inner conductor layers may be exposed at the side surface of the multilayer module body in the region interposed between the adjacently arranged pair of side electrodes such that at least a part of the inner conductor layer is superposed on the other inner conductor layer when seen in the lamination direction of the ceramic layers.
    Type: Application
    Filed: November 6, 2008
    Publication date: February 26, 2009
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Koji TANAKA
  • Patent number: 7492603
    Abstract: Provided is a structure for reducing an impedance-discontinuity in a flexible printed circuit of a hard disk drive. The structure includes an actuator arm, a bracket, a flexible printed circuit having one end installed at the actuator arm and an other end installed at the bracket and including various circuits, and a metal member facing the flexible printed circuit and having one end installed at the actuator arm and an other end installed at the bracket.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: February 17, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byong-su Seol, Hark-byeong Park, Hyung-geun Kim
  • Publication number: 20090021635
    Abstract: A camera module includes a circuit board (11), a lens module (10) mounted on the circuit board, an electromagnetic interference shielding casing (12) surrounding the lens module and the circuit board, and a electrically conductive sheet (13) being electrically connected to the electromagnetic interference shielding casing. The circuit board forms at least one grounding tab (111) thereon. The electrically conductive sheet extends from a lateral edge of the circuit board and electrically connects the at least one grounding tab with the electromagnetic interference shielding casing. The electrically conductive sheet includes a basewall (131) connected to the circuit board and at least one sidewall (133) bending from the basewall. The at least one sidewall extends into a gap defined between the electromagnetic interference shielding casing and the lens module and electrically connected to the electromagnetic interference shielding casing.
    Type: Application
    Filed: December 18, 2007
    Publication date: January 22, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: SU-JEN CHENG
  • Patent number: 7477528
    Abstract: A frame bracket for a printed board assembly including a pair of long side parts having wall parts contacting a lower surface of a printed board assembly, a pair of short side parts forming a gap with the lower surface of the printed board assembly and extending substantially perpendicular to the long side parts, a first stud groove connecting a first long side part with a first short side part and accommodating a stud fixed on the chassis base, and a protrusion part protruding from an outer, lower surface of a long side part or a short side part to be inserted into an inserting part formed on the chassis base.
    Type: Grant
    Filed: October 20, 2005
    Date of Patent: January 13, 2009
    Assignee: Samsung SDI Co., Ltd.
    Inventor: Jae-Gyoung Kim
  • Patent number: 7473931
    Abstract: An improved device and method for mounting an avionic system is shown. The design provides varying locations of key components, which allows a single mounting system to be used with several varieties and configurations of aircraft within the crowded confines of an instrument panel. Ranges of flexibility with this system include the ability to arrange modules horizontally, and the ability to locate the display unit vertically. The multi-dimensional mounting flexibility of the mounting system shown allows electronic modules to be mounted in close proximity to a display unit, which greatly increases accessibility of the modules over prior configurations where modules were housed in the nose of the aircraft, the rear of the aircraft, or other remote locations. Installation, repair, and replacement are all greatly simplified with this configuration.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: January 6, 2009
    Assignee: Garmin International, Inc.
    Inventors: Jeffrey L. Beseth, Sheldon T. Wheaton, Walter J. Rolston, Jared S. Klein
  • Patent number: 7466564
    Abstract: The invention provides a radio frequency unit including a box-shaped chassis into which an insulating board loaded with electronic components is housed, and two connectors attached to a front plate of the chassis with a space therebetween. A supporting member protruding into the chassis is provided in a position between the two connectors in the front plate. The supporting member has a flat plate portion that is bent at right angles from an end face of the front plate, and extends parallel to the insulating board, and a pair of tongue pieces that are formed so as to be bent towards the inside of the chassis from both side ends of the flat plate portion. The pair of tongue pieces are located in a cutout portion provided in the insulating board, and the tongue pieces are soldered to a grounding pattern provided in the insulating board.
    Type: Grant
    Filed: October 9, 2007
    Date of Patent: December 16, 2008
    Assignee: Alps Electric Co., Ltd.
    Inventors: Keiko Harada, Satoshi Yotsuguri
  • Patent number: 7466529
    Abstract: A communication-circuit line protector capable of maintaining reliable connection to a port unit of a communication system, easily checking a disorder or failure of the communication-circuit line protector, and effectively releasing heat generated from an inner portion of the communication-circuit line protector is provided. The communication-circuit line protector include: a housing having a plurality of openings disposed on a side thereof; a ground pin provided to an inner side of the housing, the ground pin having an elastic end portion which cooperates with a lower-side inner wall of the housing opposite thereto to be in close contact with a ground portion, thereby maintain reliable ground contact; and a PCB having the ground pin attached to one side thereof and a conduction member provided to a lower end portion thereof, thereby maintaining good connection at a time of connection to a port.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: December 16, 2008
    Inventor: Jae-Han Joung
  • Patent number: 7462776
    Abstract: An all stainless steel grounding electrode uses a coating of stainless steel for an upper collar which has a dual purpose cable connector. The cable connector can accommodate a cable lug and bolt connection or a cad weld connection. A cap for the collar has a one quarter turn dual heavy duty thread set to prevent corrosion from locking up the cap. An osmotic material is placed and replaced in the grounding electrode via the cap.
    Type: Grant
    Filed: June 1, 2007
    Date of Patent: December 9, 2008
    Assignee: Lightning Eliminators & Consultants, Inc.
    Inventors: Peter Carpenter, legal representative, Nathan M. Mascarenas, Darwin N. Sletten, Roy B. Carpenter, Jr.
  • Patent number: 7453701
    Abstract: A computer system includes a chassis, a first printed circuit board having a surface facing the cavity and at least one component extending from the surface. The printed circuit board linearly moves between a first position in which the at least one component is at least partially received within the cavity and a second position in which the at least one component is removed from the cavity.
    Type: Grant
    Filed: August 17, 2005
    Date of Patent: November 18, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Stephan K. Barsun, Robert W. Dobbs
  • Patent number: 7449978
    Abstract: In a fitting region for a SAW filter which includes langasite as its piezoelectric element, there are included an input side terminal electrode and an output side terminal electrode which are connected to an input terminal and to an output terminal of the SAW filter. To each of the terminal electrodes, at a position which is separated by just a predetermined distance from the fitting region of the SAW filter, there is connected a micro strip line which extends in mutually opposite directions along a direction which is parallel to the transmission direction of a frequency signal within the SAW filter. A slit is provided in the fitting region of the SAW filter and extends in a direction which intersects the transmission direction of the frequency signal within the SAW filter. A plurality of through holes are provided in the printed substrate and electrically connect together its surface and its rear surface which is grounded.
    Type: Grant
    Filed: August 28, 2007
    Date of Patent: November 11, 2008
    Assignees: Mitsubishi Materials Corporation, Matsushita Electric Industrial Co., Ltd.
    Inventors: Kunio Yamaguchi, Ryouhei Kimura, Atsushi Tanaka, Kenyu Morozumi
  • Publication number: 20080266820
    Abstract: A system for supporting and electrically grounding metallic covers for electronic control modules includes a housing having wall portions defining a cavity with an opening, a circuit board located within the cavity, the circuit board having a ground plane formed within the circuit board, the circuit board having a top surface substantially facing the opening and supports for proving structural support for the cover, the supports being located on the top surface of the circuit board. The system shields emissions radiating from the module.
    Type: Application
    Filed: April 25, 2007
    Publication date: October 30, 2008
    Inventors: Vivek Amir Jairazbhoy, Diane Marie Jett, Bertrand Robert Mohr, Robert Edward Belke, Michael Timothy Dwyer
  • Patent number: 7436639
    Abstract: A compact module with a pair of transformers and a double pole single throw relay (DPST) mounted onto a housing to create a self contained assembly for installation in a ground fault circuit interrupter (GFCI) as a unit. The first transformer has a core and is electrically coupled to a first set of terminals for connection to a printed circuit board (PCB). The second transformer is located adjacent to and magnetically coupled to the core of the first transformer and is electrically coupled to a second set of terminals for connection to the PCB. The DPST relay has a pair of stationary contacts and a pair of movable contacts for selectively connecting line phase and neutral conductive paths to a load.
    Type: Grant
    Filed: March 15, 2005
    Date of Patent: October 14, 2008
    Inventors: John J. Power, Armando Calixto, Roger M. Bradley
  • Patent number: 7433203
    Abstract: A circuit board includes a first circuit board section which is configured to support a set of light emitting diodes, a second circuit board section which is configured to support high-speed electronic circuitry, and a boundary section which defines an EMI boundary between the first circuit board section and the second circuit board section. The boundary section includes a set of outer surface elongated ground strips configured to form an EMI seal onto which a set of EMI shields is capable of mounting. In some arrangements, the set of outer surface elongated ground strips take the form of metallic bands (e.g., layers of copper). Such bands can be integrated into the circuit board itself (e.g., during PCB fabrication), or added onto one or more of the circuit board surfaces (e.g., after PCB fabrication).
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: October 7, 2008
    Assignee: Cisco Technology, Inc.
    Inventors: George Youzhi Yi, William Jeffrey Lewis, Hung-Ting Lin, Kuang Hsin Hsu
  • Publication number: 20080232812
    Abstract: An optical communication device includes a top cover, a bottom cover, a circuit board and an electrostatic discharge element. The bottom cover is disposed opposite to the top cover, and an accommodating space is formed between the top and bottom covers. The circuit board is disposed in the accommodating space. The electrostatic discharge element is disposed on the circuit board and electrically connected to the circuit board.
    Type: Application
    Filed: January 9, 2008
    Publication date: September 25, 2008
    Inventors: San-Ching Kuo, Chiung-Hung Wang, Chia-Wen Lin, Ming-Chia Wu
  • Patent number: 7420803
    Abstract: A universal serial bus (USB) flash drive pen device for deploying and retracting a USB plug connector having a pusher assembly including a USB flash drive and a USB plug connector, in accordance with an embodiment of the present invention. The USB flash drive pen device further includes a housing assembly at least partially enclosing said pusher assembly for deploying said USB plug connector, said USB flash drive being coupled to said USB plug connector, said pusher assembly retracting said USB plug connector into said housing assembly, said USB flash drive pen device for deploying said USB plug connector to couple said USB flash drive to a USB port.
    Type: Grant
    Filed: March 5, 2007
    Date of Patent: September 2, 2008
    Assignee: Super Talent Electronics, Inc.
    Inventors: Paul Hsueh, Jin Kyu Kim, Nan Nan, David Nguyen, Ming-Shiang Shen
  • Patent number: 7411796
    Abstract: A display apparatus having a display module to display images includes a first printed circuit board arranged on a rear side of the display module, a shielding cover to shield a rear side of the first printed circuit board to accommodate the first printed circuit board therein, a first connection port mounted on the first printed circuit board at an edge portion thereof and projected from a surface of the first printed circuit board, at least one second connection port mounted on the first printed circuit board adjacent to the first connection port and projected from the surface of the first printed circuit board by a second height different from the first height of the first connection port, a grounding bracket combined with the first printed circuit board and disposed over the first and second connection ports to be in contact with the first connection port, a second grounding plate arranged between the grounding bracket and the second connection port to be in contact with the grounding bracket and the seco
    Type: Grant
    Filed: March 14, 2006
    Date of Patent: August 12, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jang-woo Lee, Ki-young Jang
  • Publication number: 20080186666
    Abstract: A motherboard suitable for a desktop host is provided. The motherboard includes a circuit carrier that has a work area and an expanded area adjacent to the work area. The motherboard further includes a plurality of first power input connectors mounted on the circuit carrier and located in the expanded area for connecting to a plurality of first power output connectors of a power supply of the desktop host respectively. The motherboard further includes a plurality of second power output connectors mounted on the circuit carrier and located in the expanded area for connecting to a plurality of second power input connectors of disk drives of the desktop host respectively. The second power output connectors are electrically connected to the first power input connectors through an inner circuits of the expanded area.
    Type: Application
    Filed: June 4, 2007
    Publication date: August 7, 2008
    Applicant: DFI, INC.
    Inventor: Chih-Wei Wu
  • Publication number: 20080165511
    Abstract: A module comprises a metallic terminal pins for connection and a circuit board with electronic components mounted thereon, a circuit board connecting side of the connector. The electronic components and the circuit board with the electronic components mounted thereon are encapsulated with the same resin. A metallic base is united to the module to obtain an electric conduction between the metallic base and the circuit board.
    Type: Application
    Filed: February 28, 2008
    Publication date: July 10, 2008
    Applicant: Hitachi, Ltd.
    Inventors: Takuya Mayuzumi, Shuji Eguchi, Masahiro Sasaki, Kiyoomi Kadoya
  • Patent number: 7382631
    Abstract: The present invention relates to a circuit board mounting panel for electrical appliance, comprising: a base panel disposing a first printed circuit board and a second printed circuit board thereon; a first shield cover disposed on the base panel and mounting the first printed circuit board therein and formed with an opening part in a vertical direction to a surface of the first printed circuit board; and a second shield cover mounting the second printed circuit board therein and inserted into the first shield cover through the opening part and coupled to the base panel. Thus, the present invention provides an improved structure of a shield cover for a circuit board mounting panel for an electrical appliance, thereby minimizing a idle mold that may be produced while developing a circuitry or a PCB.
    Type: Grant
    Filed: February 2, 2006
    Date of Patent: June 3, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-Jun Jung, Kyung-kyun Lee
  • Patent number: 7375975
    Abstract: In accordance with the present invention, there is provided multiple embodiments of a memory card, each embodiment including a case which is cooperatively engaged to a module comprising at least a printed circuit board having an electronic circuit device mounted thereto. In each embodiment of the present invention, the case is reinforced by a stiffener which effectively increases the mechanical strength of the fully fabricated memory card, thus providing the capability to withstand typical bending and twisting tests. The stiffener may be provided in any one of a plurality of different shapes or profiles, and may embedded within one or more of various locations within the case.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: May 20, 2008
    Assignee: Amkor Technology, Inc.
    Inventors: Sang Jae Jang, Chul Woo Park, Choon Heung Lee
  • Patent number: 7375973
    Abstract: A casing for a handheld communication device includes a set of individual parts, each individual part being formed from the same metal. The set of individual parts have a purity of at least a hallmark purity level. The set of individual parts is severable from the casing without reducing the purity of the set of individual parts below the hallmark purity level.
    Type: Grant
    Filed: November 28, 2001
    Date of Patent: May 20, 2008
    Assignee: Vertu Limited
    Inventors: Frank Nuovo, Mark Hutchison, Lisa Hunt
  • Patent number: 7372706
    Abstract: A rack-mountable in-line surge protection system includes a chassis configured to mount to an equipment rack, the chassis including: an electrically-conductive buss, an electrically-conductive ground member coupled to the buss and configured and disposed to be connected to a grounding mechanism, and a plurality of electrically-conductive bias members coupled to the buss.
    Type: Grant
    Filed: January 28, 2004
    Date of Patent: May 13, 2008
    Assignee: American Power Conversion Corporation
    Inventors: Ronnie L. Bell, Conrad J. Baranowski, Newton R. Aquino, Piyush Saxena
  • Patent number: 7369414
    Abstract: An electric device having a first body unit and a second body unit connected through a hinge unit is provided. A Flexible Printed Circuit (FPC) having coil portions wrappable around the shafts of the hinge unit is also provided so that when the second body unit pivots or rotates in relation to the first body unit, the FPC's length is automatically adjusted by way of the coil portions coiling and uncoiling about the shafts.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: May 6, 2008
    Assignee: LG Electronics Inc.
    Inventor: Woo-Jin Kim
  • Publication number: 20080101009
    Abstract: A wiring substrate has a front face and a rear face opposed the front face. An electric component is mounted on the front face and is electrically connected to the wiring substrate at the rear face. A protection cover is comprised of a resin material and includes an upper plate, a lower plate and a connecting plate. The upper plate covers the electric component from above. The lower plate covers an electrical connection between the wiring substrate and the electric component from below. The connecting plate integrally connects the upper plate and the lower plate.
    Type: Application
    Filed: October 11, 2007
    Publication date: May 1, 2008
    Applicant: Funai Electric Co., Ltd.
    Inventor: Hiroaki Iwaasa
  • Patent number: 7365992
    Abstract: An electronic circuit package includes a first electronic module, a second electronic module, and an electric shielding layer. The first electronic module and the second electronic module are bonded in such a way that integrated devices are opposite to each other. The electric shielding layer is inserted between the first electronic module and the second electronic module for ensuring electric insulation between the first electronic module and the second electronic module.
    Type: Grant
    Filed: January 2, 2007
    Date of Patent: April 29, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Young-Min Lee
  • Patent number: 7345892
    Abstract: In a memory module, reference potential connecting patterns are disposed on high frequency signal lines and/or on the extension lines extending from the terminal ends of the signal lines as well as a shield cover for covering semiconductor memory chips is disposed on the substrate, and the reference potential connecting patterns are connected to the shield cover through metal cover contact parts.
    Type: Grant
    Filed: May 20, 2005
    Date of Patent: March 18, 2008
    Assignees: NEC Corporation, Renesas Eastern Japan Semiconductor, Inc., Elpida Memory, Inc.
    Inventors: Masaharu Imazato, Atsushi Nakamura, Takayuki Watanabe, Kensuke Tsuneda, Mitsuaki Katagiri, Hiroya Shimizu, Tatsuya Nagata
  • Patent number: 7339795
    Abstract: A structure for fastening a circuit board on a case includes a strut which has one end coupled on the case and other end coupled on the circuit board, and a coupling member which has two distal ends with surfaces not parallel with each other. One distal end is coupled on the circuit board with the distal end surface in parallel with the other end surface of the strut, and the other distal end surface is parallel with a holding section of a fastening element which fastens the coupling member, the circuit board and the strut in this order, to make the circuit board in parallel with a mounting surface, which an electronic device may be held on, of the case. The circuit board is easy to be fastened even if the circuit board is not vertical to the molding direction of the fastening structure. Assembly costs also are lower.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: March 4, 2008
    Assignee: Lite-On Technology Corporation
    Inventor: Cheng-Hua Hsu
  • Patent number: 7333347
    Abstract: A screwing control device of a computer chassis is composed of a computer chassis, a panel of which is pre-built with a plurality of positioning holes; a screw element, a center of which is provided with a screw hole and which is able to be locked and fixed into one of the positioning holes; and a bolt, which is transfixed into a through-hole of a board element, and is then screwed into the screw hole of the screw element. Therefore, a quantity of the screw elements which are actually used for screwing can be effectively controlled, and pre-built projected bolts which are not necessarily used for screwing can be eliminated.
    Type: Grant
    Filed: December 18, 2006
    Date of Patent: February 19, 2008
    Assignee: Ablecom Computer Inc.
    Inventor: Chien-Kuo Liang
  • Patent number: 7313000
    Abstract: The present invention relates to power supplies, methods of installing power supplies, power distribution systems and methods of installing power distribution systems. More particularly, one embodiment of the present invention relates to a power distribution system for receiving AC current from an AC current source and for distributing DC current inside of a computer case.
    Type: Grant
    Filed: February 23, 2005
    Date of Patent: December 25, 2007
    Assignee: Ultra Products, Inc.
    Inventors: Carl Fiorentino, Chih-Wei Kuo
  • Patent number: 7310243
    Abstract: A method and components are provided for implementing EMC shielded resonance damping of a printed circuit board. The EMC shielded resonance damping component includes a capacitor and resistor formed in series combination and contained within a shielded enclosure. A pair of coaxial pads is provided for connection to the printed circuit board. The series combination of the capacitor and resistor is connected between a first pad of a pair of coaxial pads and an interior wall of the shielded enclosure. The shielded enclosure provides a return current path to a second pad of the pair of coaxial pads through the series components.
    Type: Grant
    Filed: June 10, 2004
    Date of Patent: December 18, 2007
    Assignee: International Business Machines Corporation
    Inventors: Don Alan Gilliland, Dennis James Wurth
  • Patent number: 7310242
    Abstract: A distribution box for enclosing an electrical connection in an electrical wiring system includes a housing that is resistive to penetration by electromagnetic fields and a plurality of electrical conductors that form the electrical connection. A mirror plate is disposed within the housing and generates mirror currents to suppress electromagnetic fields generated by current flowing through the plurality of electrical conductors.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: December 18, 2007
    Inventors: Sergio Ramos, Eugene M. Steele, James P. Souther
  • Patent number: 7310236
    Abstract: A casing that has an electronic component housed therein has a conductive layer made of a mixture of carbon fibers and a thermoplastic resin and an insulating layer where only the thermoplastic resin is exposed on a surface of the conductive layer. The casing prevents leakage of unwanted electromagnetic waves from inside, is not affected by external electromagnetic waves, has small thickness, light weight, high strength and high rigidity, and has excellent contactability with a coating.
    Type: Grant
    Filed: July 9, 2004
    Date of Patent: December 18, 2007
    Assignee: Sony Corporation
    Inventors: Yoshitake Takahashi, Yoshihisa Tsuchida, Masayoshi Morikawa
  • Patent number: 7307851
    Abstract: An integrated modular avionics (IMA) cabinet for housing printed circuit board (PCB) modules includes a chassis configured with slots for receiving the PCB modules. The chassis of the IMA cabinet also includes a rear panel configured for connecting to connectors, wire harnesses, and the like. Additionally, the PCB modules include a front panel configured with screws for securing the PCB modules to the chassis of the IMA cabinet. The PCB modules also include retractable handles for transporting the PCB modules. The chassis of the IMA cabinet is also configured with ventilation holes for cooling the PCB modules. The IMA cabinet is further configured to be EMI/RFI resistant. In an exemplary embodiment, the IMA cabinet is configure such that substantially all of the electronic and/or computer components are disposed on the PCB modules and not in the IMA cabinet, thus reducing the overall cost of the IMA cabinet and facilitating easier and quicker reconfiguration, repair, and replacement of the PCB modules.
    Type: Grant
    Filed: December 31, 1998
    Date of Patent: December 11, 2007
    Assignee: Honeywell International Inc.
    Inventor: Mario Dimarco
  • Patent number: 7304856
    Abstract: An assembly for holding circuit cards may comprise a plurality of slots, each slot being configured to receive a circuit card. At least one slot may be modifiable so as to permit the at least one slot to hold circuit cards having differing depths.
    Type: Grant
    Filed: December 28, 2005
    Date of Patent: December 4, 2007
    Assignee: Honeywell International, Inc.
    Inventor: Philip Andretta
  • Patent number: 7301251
    Abstract: The invention concerns an actuator. In a common housing are a motor contained in a metallic casing and an electronic card adapted to control the motor. The casing is electrically connected to a ground. This connection is made by a deformable element, whose deformation provides, by contact, the electrical connection between the casing and the ground.
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: November 27, 2007
    Assignee: Valeo Vision
    Inventors: Hervé Cara, Stéphane Delabriere
  • Patent number: 7298627
    Abstract: A portable power inverter/converter having a pass through device for simultaneously sourcing A.C. and multiple voltage D.C. power consuming devices through a single D.C. power source connection. Inverter and converter circuitry is provided to invert and convert D.C. voltage to an A.C. voltage source and a lower DC voltage. A.C. electrical outlets are provided to facilitate a connection to an external A.C. power-consuming device and a DC outlet to a lower volt DC power-consuming device. The pass through device provides an independent and simultaneous connection to an additional D.C. outlet that would otherwise be eliminated when occupied by the inverter thus allowing simultaneous connection and operation of both A.C. and multi source D.C power consuming devices through a single external D.C. power outlet of a single D.C. power source.
    Type: Grant
    Filed: November 2, 2006
    Date of Patent: November 20, 2007
    Assignee: Intec, Inc.
    Inventors: Saied Hussaini, Marc Iacovelli
  • Patent number: 7292459
    Abstract: A handheld communication apparatus includes a metallic insert molding member, a circuit board and a shielding frame. The metallic insert molding member includes a metal plate. An electronic component is mounted on the circuit board. The shielding frame defines opposite first and second openings, wherein the shielding frame is bonded to the metal plate of the metallic insert molding member at the first opening, thereby forming a shielding case. The electronic component on the circuit board is inserted into the second opening of the shielding frame to be shielded by the shielding case.
    Type: Grant
    Filed: May 31, 2006
    Date of Patent: November 6, 2007
    Assignee: Arima Communications Corp.
    Inventor: Szu Wei Wang
  • Patent number: 7286372
    Abstract: A PCB is provided that is suitable for use in applications where EMI control is of interest. The PCB includes circuitry that communicates with an edge connector having edge traces located on its surface. Additionally, embedded traces are disposed within the dielectric material of the PCB, and each embedded trace electrically connects an edge trace with a corresponding median trace located on a surface of the PCB. An embedded ground layer substantially disposed within the dielectric material defines an area within the dielectric material through which the embedded traces pass. Finally, one or more vias are provided that extend through the dielectric material of the PCB and are filled with a conductive material. The vias are electrically connected to the embedded ground layer and configured to electrically communicate with an associated module. In this way, a structure is implemented that facilitates control of electromagnetic radiation emitted by the PCB circuitry.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: October 23, 2007
    Assignee: Finisar Corporation
    Inventors: Lewis B. Aronson, Donald A. Ice
  • Patent number: 7280367
    Abstract: A structure of fixing a printed circuit board includes a mold frame coupled with a display panel, a printed circuit board positioned at a rear surface of the display panel and electrically connected to a pad portion of the display panel, and an insulating film covering an outer surface of the printed circuit board.
    Type: Grant
    Filed: October 13, 2004
    Date of Patent: October 9, 2007
    Assignee: LG.Philips LCD Co., Ltd.
    Inventors: Chul Park, Moon Kyo Bae
  • Patent number: 7277301
    Abstract: An electronic device includes a circuit board (20) and a shielding cove (10). The circuit board includes a plurality of mounting holes (26), a first surface (22), a second surface (24) opposite to the first surface, and at least one electronic component (28). The shield includes a top wall (12), a pair of first sidewalls (14) and a pair of second sidewalls (16) opposite to the first sidewalls. The top wall, the first sidewalls and the second sidewalls cooperatively bound a receiving portion (18) for receiving the electronic component. At least one mounting portion (162) extends from each of the second sidewalls, corresponding to the mounting holes of the circuit board.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: October 2, 2007
    Assignee: Hon Hai Precision Industry Co., LTD.
    Inventor: Jen-Yu Liang
  • Patent number: 7277300
    Abstract: A vent grid has parallel first electrically-conductive members and parallel second electrically-conductive members intersecting with the first electrically-conductive members. The intersection between the first and second electrically-conductive members is forced to have a larger cross-sectional area. The characteristic impedance thus increases. The electric current flowing through the first and second electrically-conductive members turns over at the boundary between the intersection and the first and second electrically-conductive members. The flow of the electric current is in this manner interrupted. Accordingly, the vent grid fails to induce electromagnetic wave. Moreover, the electrically-conductive piece is merely located at a corner of the opening. Decrease in the percentage of the opening is thus suppressed to the utmost per a unit area. A sufficient airflow can be established through the vent grid. Decrease in the cooling efficiency and performance can be suppressed.
    Type: Grant
    Filed: July 27, 2005
    Date of Patent: October 2, 2007
    Assignee: Fujitsu Limited
    Inventors: Shigeo Sakamoto, Kenji Nagase, Kazuaki Taya
  • Patent number: 7265989
    Abstract: A PC card is provided which can be used to add multiple capabilities to an information processing apparatus in cooperation with a conventional card only by the use of a single card slot. The PC card 1 comprises a card main body 10 which is provided with a connection plug 11 for connecting with the information processing apparatus 20 and a card connector 12 through which an additional card 30 can be connected, and which is connected to the information processing apparatus 20 to add multiple capabilities to the information processing apparatus; a pair of parallel rail members 13 serving to guide the additional card 30 for insertion; and a bridge member 14 connected between said pair of parallel rail members in order not to block the insertion path.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: September 4, 2007
    Assignees: Softbank BB Corp., Suncorporation
    Inventors: Masayoshi Son, Satoru Yoshikawa
  • Patent number: 7254042
    Abstract: An Electro Magnetic Interference (EMI) shielding device (20) includes a body (201), at least a first engaging portion (203) extending from the body, and a pair of second engaging portions (205) formed on the body. A liquid crystal display device adopting the above mentioned EMI shielding device includes a TFT LCD panel, a power supply (12), an inverter (14) and an interface board (13). The power supply, the inverter and the interface board are formed on a printed circuit board (10). The EMI shielding device is positioned between the power supply and the inverter, with the first engaging portion inserted into the printed circuit board and the second engaging portions engaging with the printed circuit board. The EMI shielding device can reduce or potentially avoid the occurrence of EMI that would otherwise be produced by the printed circuit board.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: August 7, 2007
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Lan Huang