Abstract: Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The package includes a ESD shield attached to the substrate. The ESD shield configured to increase the ESD hardness of the package. The ESD shield can further serve to stiffen the package to prevent warping and operate as a heat spreader.

Abstract: A hand-held game machine (10) includes a horizontally-long rectangular housing (12), and the housing is covered with a cover (14) almost entirely. A main surface of the housing is curved so as to become higher at the center of the housing in a horizontal direction and become lower toward right and left end portions. The cover to be attached on the housing is also curved according to the curve. At a center of the cover, a transparent window (34) is formed, and a display (36) is placed below it on the housing.

Abstract: An electronic device includes a first printed circuit board including electronic components, a second printed circuit board including electronic components, and a shielding midframe. The shielding midframe is adapted to provide electromagnetic isolation between the first printed circuit board and the second printed circuit board. The shielding midframe is further adapted to provide electromagnetic isolation of electronic components on at least one of the first printed circuit or the second printed circuit.

Abstract: Methods and apparatus for interfacing a memory device with a host device are disclosed. According to one aspect of the present invention, an apparatus which enables a non-volatile memory device to communicate with a host device includes a body and an element. The body has a boundary, and the element is arranged to move at least partially within the body. The element includes an interface which may be coupled to the host device when the element is in a first position with respect to the body. The element is also arranged to receive the non-volatile memory device and to move the non-volatile memory device and the interface with respect to the body. In one embodiment, when the element is in the first position with respect to the body, the interface at least partially extends past the boundary associated with the body.

Abstract: An electronic module (2) comprises casing 4, and header 6 with a printed circuit board 10 positioned within a cavity 26 of casing 4. Connector 6 includes terminals 8, which allow for electrical connection for a mating connector, but also include compliant portions 54 which form the mechanical and electrical connector to printed circuit board 10. Compliant portions 54 together with an adhesive 62 provide for the bonded connection between header 6 and printed circuit board 10. Gasket 60 further provides a peripheral seal between casing 4 and header 6.

Abstract: Provided is a structure for reducing an impedance-discontinuity in a flexible printed circuit of a hard disk drive. The structure includes an actuator arm, a bracket, a flexible printed circuit having one end installed at the actuator arm and an other end installed at the bracket and including various circuits, and a metal member facing the flexible printed circuit and having one end installed at the actuator arm and an other end installed at the bracket.

Abstract: Disclosed is an apparatus for improving server electromagnetic shielding at high and low frequencies, including a metallic plate in fixed association with a surface of a server casing, the metallic plate defining a plurality of openings, and a substantially plastic shield including conductive metal fibers and defining a plurality of bosses extending from a boss surface of the plastic shield, the bosses configured to be insertable within the plurality of openings to allow the boss surface to be disposed adjacent to the metallic plate, each of the plurality of bosses defining a boss cavity that extends entirely through the plurality of bosses and the plastic shield.

Abstract: A transceiver cage includes at least one first shield housing, at least one second shield housing, a top cover, and a bottom cover. The first shield housing includes a first upper wall, a first lower wall, and a pair of first sidewalls. The first upper wall, the first sidewalls, and the first lower wall cooperatively surround a first receiving space. The second shield housing stacked to the first shield housing, includes a second upper wall, a second lower wall, and a pair of second sidewalls. The top cover includes a top board, a rear board, and a pair of outer sideboards extending along the first sidewalls from the top board. The bottom cover includes a bottom board and a pair of inner sideboards lapping over the outer sideboards. The bottom cover is electronically connected with the top cover to receive the first shield housing and the second shield housing.

Abstract: A method of installing an electronic board is provided. The method includes inserting the board into a guide in a first direction. The board is then translated in a second direction different from the first direction. Upon inserting the board a gasket is sealed to prevent light, dust, or electromagnetic interference from passing through the gasket. A lock is then engaged to maintain the electronic board in a substantially fixed position.

Abstract: An exemplary Electromagnetic Interference (EMI) shielding package (1) includes a substrate (10), a metal cap (15), and a potting compound (18). The substrate has a plurality of electronic components (11a, 11b, 12) fixed thereon. The metal cap includes a horizontal base panel (152) and a plurality of peripheral walls (151) vertical to the base panel. A related method for making the EMI shielding package includes: providing a substrate with a plurality of electronic components fixed thereon; providing a metal cap including a horizontal base panel and a plurality of peripheral walls vertical to the base panel; attaching the walls to the substrate, thereby covering selected one or more of the electronic components that need to be shielded with the metal cap; sealing the electronic components and the metal cap with a potting compound; and curing the potting compound to form an encapsulation.

Abstract: A shielded circuit assembly includes first and second circuit support structure, e.g. circuit boards having electrical or electronic components thereon, flexible connection between the circuit support structures, e.g., a flexible printed circuit (FPC), flat flexible cable (FFC), or other connection, the first and second circuit support structures adapted for positioning in generally overlying spaced apart relation with the flexible connection providing electrical connection therebetween while having floor plans that tend to efficiently conserve space between the circuit support structures, and electromagnetic energy shielding adapted to provide shielding of space between the circuit support structures in such generally overlying spaced apart relation. A method of making a shielded circuit assembly includes folding one printed circuit board that is flexibly attached to another printed circuit board to a generally parallel spaced apart relation and providing shielding of space between the circuit boards.

Abstract: Provided is a portable electronic device which employs a simple structure to prevent a waterproof cap fitted in a through hole for a flexible wiring board from coming off outward. The through hole is formed in a side face of an upper housing. The flexible wiring board is inserted into the through hole. The flexible wiring board has the waterproof cap formed therein and fitted in the through hole. A hinge cover member is attached to the upper housing in such a way as to cover the flexible wiring board. A pull-stop claw formed on the hinge cover member covers a flange of the waterproof cap from outside the upper housing.

Abstract: The invention provides a radio frequency unit including a box-shaped chassis into which an insulating board loaded with electronic components is housed, and two connectors attached to a front plate of the chassis with a space therebetween. A supporting member protruding into the chassis is provided in a position between the two connectors in the front plate. The supporting member has a flat plate portion that is bent at right angles from an end face of the front plate, and extends parallel to the insulating board, and a pair of tongue pieces that are formed so as to be bent towards the inside of the chassis from both side ends of the flat plate portion. The pair of tongue pieces are located in a cutout portion provided in the insulating board, and the tongue pieces are soldered to a grounding pattern provided in the insulating board.

Abstract: A cubical computer housing assembly comprises first and second ends and four sides, which define an interior compartment for housing the various computer components. The first and second ends are rigidly connected to one another and are slidingly detachable from four sides of the assembly. The interior compartment comprises three parallelepiped portions, one for accommodating a plurality of circuit boards, one for accommodating a heat sink and hard disk drive, and one for accommodating other memory device such as a CD ROM or DVD player. A hard disk drive is slidingly mounted in a frame which is rigidly mounted relative to the first and second ends. A hinged door on which is mounted a printed circuit board can be moved to an open position to provide access to the disk drive for removal and replacement of same.

Abstract: An assembly for securing plates includes a first plate having two pairs of protruding portions, and a second plate having two tongue pieces at opposite ends thereof. Each of the protruding portions has a first guiding surface and a second guiding surface intersecting with the first guiding surface for the tongue piece sliding thereon. The tongue pieces firstly slide downwardly along the first guiding surfaces of the pair of protruding portions and are then clamped between the corresponding protruding portions, thereby detachably securing the second plate to the first plate.

Abstract: According to embodiments of the present invention, an optical transponder module generates heat when operating and a heat pipe disposed in the module body performs active heat transfer from a hot end of the optical transponder module to a cooler end of the optical transponder module. A heat pipe disposed in an external clip-in heat sink may remove heat from the optical transponder body.

Abstract: An electronic apparatus with natural convection structure is disclosed. The electronic apparatus with natural convection structure includes a main body to be placed on a surface, a hole piercing through the main body from a top surface to a bottom surface of the main body, and a supporting device disposed on the bottom surface of the main body. Via the specific height of the supporting device, the air under and near the bottom surface of the main body can flow through the hole for improving heat-dissipation of the electronic apparatus.

Abstract: An electronic apparatus includes a main body housing having a corner portion in its rear, a display section, and a hinge device which rotatively movably connects the display section to the main body housing. The corner portion projects outward more than a side wall of the display section placed in a closed position with respect to the main body housing.

Abstract: An electromagnetic radiation containment system is provided for use in connection with functional modules and an associated card cage disposed in the chassis of an electronic equipment enclosure. The electromagnetic radiation containment system includes conductive elements uniformly distributed about the perimeter of a functional module configured to be received within the card cage, and further includes grounding elements in electrical communication with the chassis so that when the functional module is positioned within a slot of the card cage, at least some of the conductive elements are in electrical communication with the grounding elements. The uniform distribution of the conductive elements on the functional module(s) enables the functional modules to be arranged above and below each other, as well as side by side, without compromising the electromagnetic radiation containment functionality that is afforded when each of the slots of the card cage is occupied.

Abstract: There is provided an electromagnetic wave shielding sheet which can effectively prevent an adhesive layer from being colored at the time of etching. The electromagnetic wave shielding sheet comprises a laminate of at least a transparent substrate film, an adhesive layer, and an electromagnetic wave shielding layer. The electromagnetic wave shielding layer is formed of a mesh metal foil with densely arranged openings and being transparent. The adhesive layer is substantially colorless and transparent.

Abstract: A circuit board design is disclosed that is useful in high-speed differential signal applications uses either a via arrangement or a circuit trace exit structure. A pair of differential signal vias in a circuit board are surrounded by an opening that is formed within a ground plane disposed on another layer of the circuit board. The vias are connected to traces on the circuit board by way of an exit structure that includes two flag portions and associated angled portions that connect the flag portions to circuit board traces. In an alternate embodiment, the circuit board traces that leave the differential signal vias are disposed in one layer of the circuit board above a wide ground strip disposed on another layer of the circuit board.

Abstract: A data management device and library are provided for organizing, holding, and providing electrical connectivity to multiple memory cards. The data management device can comprise a device body, a plurality of sockets to accommodate the data storage media, an electrical connector, and a power management circuit. Data can be retrieved from or transferred to the selected memory cards utilizing the device. The data management library can be utilized to interconnect multiple devices and can be daisy chained to other libraries.

Abstract: The present invention provides shielded printed circuit boards and electronic devices. The printed circuit board may comprise an internal network of grounded conductive elements that are coupleable to an EMI shield that is mounted on the printed circuit board. The network of grounded conductive elements are coupleable to a grounded layer and to the EMI shield and provides improved EMI shielding through the volume of the printed circuit board below an electronic component mounted on the printed circuit board.

Abstract: A transfer mold type power module (“TPM”) is provided with a projection at each of the four corners on its front main surface. The TPM is also provided a first screw hole at its center. A shielding plate is provided with a second crew hole in a position that corresponds to the first screw hole. A control substrate is provided with third screw holes in positions that correspond to the projections. The shielding plate and the TPM are joined by putting a first screw through the first and second screw holes and temporarily fastening the tip of the first screw by a temporary fastening member at the rear main surface of the TPM. The control substrate and the TPM are joined by second screws via the third screw holes.

Abstract: A portable electronic device in which microswitches (12) controlled by operation buttons (11) are mounted on one side of a printed circuit board (13), and circuit elements accommodated in BGA packages (14), (15) and (16) are soldered on the other side of the printed circuit board. In the portable electronic device, a shield wall (22) for surrounding the BGA packages (14), (15) and (16) is mounted on the printed circuit board (13), a first protrusion portion (18b) for holding down the shield wall (22) on the printed circuit board (13) is protruded from a case (18) of the portable electronic device (10), and second protrusion portion (18c) for holding down surfaces of the BGA packages (14); (15) and (16) on the printed circuit board (13) is protruded from the case (18) of the portable electronic device (10). With such a construction, the BGA packages are prevented from being peeled off from the printed circuit board (13).

Abstract: A circuit board includes a first circuit board section which is configured to support a set of light emitting diodes, a second circuit board section which is configured to support high-speed electronic circuitry, and a boundary section which defines an EMI boundary between the first circuit board section and the second circuit board section. The boundary section includes a set of outer surface elongated ground strips configured to form an EMI seal onto which a set of EMI shields is capable of mounting. In some arrangements, the set of outer surface elongated ground strips take the form of metallic bands (e.g., layers of copper). Such bands can be integrated into the circuit board itself (e.g., during PCB fabrication), or added onto one or more of the circuit board surfaces (e.g., after PCB fabrication).

Abstract: A card-type electronic apparatus such as an SD card, a CF card, a Memory Stick card, or a USB flash drive is formed from an upper and lower cover that are bonded together at an interior seam formed using ultrasonic joining. Lower sidewalls on the lower cover create an installation pocket for the upper cover. The installation pocket not only simplifies alignment between the upper and lower covers, but also contains any bonder material overflow that might otherwise affect the external dimensions of the apparatus housing. The lower sidewalls can completely surround the upper cover, for drop in installation. Alternatively, the lower sidewalls can partially surround the upper cover, so that the upper cover can be slid into place during assembly.

Abstract: An apparatus and method for flexibly mounting variously sized devices in a computer chassis. A front panel includes a first portion that is reserved for a plurality of contiguous openings supporting a plurality of vertically stacked 3-½ inch bays. At least one opening is protected by a corresponding knock-out plate. The front panel also includes a second portion that is adjacent to the first portion. The second portion is reserved for a plurality of module acceptors. At least one module acceptor is located adjacent to a corresponding opening and adapted to receive a corresponding module. Additionally, at least one module acceptor includes a first attaching mechanism capable of mating with a second attaching mechanism located on the corresponding module for attaching the corresponding module to the computer chassis. Further, at least one pair of adjacent opening and module acceptor in combination is adapted to receive a front connector panel bracket.

Abstract: In resin-molded engine control unit, a coil, an electrolytic capacitor, a microprocessor, electronic parts and a connector terminal are mounted on a board. Inside a cover fixed on the board, a resin-free region is formed. The coil, the electrolytic capacitor and the microprocessor, which should not be sealed with resin, are mounted in the resin-free region, while the board and the electronic parts which are not capped by the cover are sealed with a resin.

Abstract: A battery-backed cache system with a pluggable battery module. The system includes a RAID controller and a cache. A back up power board is provided upon which a second power connector is provided and the two power connectors are connected. A socket assembly is mounted on the board and is connected to the second power connector. The socket assembly is a standard socket for use with PC Cards and includes a bulkhead adapter for mounting to a case wall with a slot of the socket assembly accessible through the case wall. A battery module is included having a body with dimensions corresponding to the slot. A battery is positioned within the body and a connection interface is provided in the battery module for mating with the socket assembly. The body and connection interface of the battery module comply with PCMCIA specifications for card bodies and interfaces.

Abstract: A portable communication device has a modular inner chassis containing a main printed circuit board and an outer housing for releasable engagement over the inner chassis so as to substantially completely enclose and conceal the inner chassis. The outer housing has at least two parts. A first part of the outer housing contains a keypad and a separate keypad printed circuit board for connection with a keypad connector on the main printed circuit board when the housing is engaged over the inner chassis. The outer housing and inner chassis have releasable interengaging formations for releasably securing the first and second parts of the outer housing over the inner chassis.

Abstract: Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a substrate core to form multilayer ground grids. Such hybrid ground lines include groups of substantially parallel ground lines configured such that the groups of ground lines are positioned in transverse arrangement with other groups of ground lines formed on the same level. Such implementations have many uses, including, but not limited to, the ability to more efficiently route signal lines and connect electrical components on a circuit board.

Abstract: The present invention provides a flexible storage system through the use of portable, removable canisters holding multiple storage subsystems.

Abstract: Electronic devices can be provided with at least one first circuit component coupled to a first circuit board, at least one second circuit component coupled to a second circuit board, and a mating assembly coupled to the boards for holding them in a vertical stack. The first circuit components can face the second circuit components in the stack. One or more of the first circuit components can be horizontally offset from one or more of the second circuit components in the stack to reduce the thickness of the mated circuit boards. Portions of the circuit boards and the mating assembly can shield the circuit components of the stack from electromagnetic interference.

Abstract: An optical port apparatus includes a housing having oppositely disposed first and second housing surfaces and a housing body extending therebetween. A housing aperture extends about a central axis of the housing body. A groove surrounds the housing aperture. The groove extends partially through the housing body and has a bottom groove surface spaced from the second housing surface by a groove side wall. A shelf is located between the groove and the housing aperture. A gasket is located in the groove adjacent the bottom groove surface. The gasket surrounds the housing aperture. A window is located across the housing aperture in contact with the shelf. An elastomeric adhesive is located in the groove between the groove side wall and at least one of the window and the gasket. A bezel is fastened to the second housing surface adjacent the groove.

Abstract: An electromagnetic interference (EMI) gasket for an electronic module comprises a valley feature formed on one side of an EMI gasket and a crown feature formed on the other side of the EMI gasket in order to complement the valley. One or more EMI gaskets are used to construct a shield across the opening of a module cage or rack. Each gasket forms a link in a series of modules, in order to complete a seal across the opening in the cage. A perpendicular pressure forces the module gaskets to center and align evenly as the crown and valley of the opposite features nest together. The modules can be then pressed together and the overlap of the crown and valley acts to center the alignment and create a pressure for satisfactory EMI grounding and the reduction of EMI leakage.

Abstract: The present invention provides a display module having: a display board on which a display element displaying an image is mounted; and a chassis on which the display board is mounted and which is placed on a circuit board. The chassis has a support board and a frame plate. The support board includes: a support section which supports a portion of the display board except for a corner section of the display board; and a depressed section which continuously expands from the support section and is formed such that a surface on a side supporting the display board is lower than the support section. The frame plate is placed on the circuit board while supporting the support board at a predetermined height with respect to the circuit board.

Abstract: The present invention relates to a circuit board mounting panel for electrical appliance, comprising: a base panel disposing a first printed circuit board and a second printed circuit board thereon; a first shield cover disposed on the base panel and mounting the first printed circuit board therein and formed with an opening part in a vertical direction to a surface of the first printed circuit board; and a second shield cover mounting the second printed circuit board therein and inserted into the first shield cover through the opening part and coupled to the base panel. Thus, the present invention provides an improved structure of a shield cover for a circuit board mounting panel for an electrical appliance, thereby minimizing a idle mold that may be produced while developing a circuitry or a PCB.

Abstract: A computing device module for receipt within a computing device chassis includes an enclosure and a handle movably coupled to the enclosure. The handle moves between an extended position and a retracted position. The handle includes at least one opening configured to permit at least one hand digit to extend through the at least one opening when the handle is in the retracted position.

Abstract: EMI from an operating information handling system is managed by disposing a stirring device in the chassis of the information handling system to mechanically modulate the resonance of predetermined RF signals emitted from processing components within the chassis. For example, a cooling fan disposed in the chassis has a reflective surface formed on its blades so that rotation of the blades mechanically modulates the RF signals. The blades have a depth of at least one-quarter of the wavelength of the RF signal and are coated with a low resistance material, such as steel, aluminum, copper, carbon loaded plastic or a high dielectric ceramic. The fan rotates at the faster of the speed required to provide desired cooling or the speed desired to produce a desired average RF signal amplitude.

Abstract: A communication apparatus includes a housing and an electronic device installed in the housing. The housing has a shell body having a top wall, a front wall and a mounting zone defined by a part of the top wall and a part of the front wall, and a cover coupled to the mounting zone. The mounting zone is provided with a first row of through holes and a second row of through holes. The cover has a row of light-guiding rods at a back side thereof, which are respectively selectively insertable into the first or second row of through holes. The electronic device includes a circuit board and a plurality of lamps electrically connected to and controlled by the circuit board.

Abstract: Electric or electronic modules may be carried by an electrically shielded module carrier that includes a cover element and a base element enclosing at least one mounting region which is divided into a front section and a rear section by an intermediate wall card. Holding elements for inserted flat modules are laterally provided in each section and include guiding gratings which face each other in pairs and are integrated into an electromagnetic shield. The cover element and the base element are connected to the guiding gratings of the front section in a fixed manner and are detachably connected to the guiding gratings of the rear section.

Abstract: An electronic circuit package includes a first electronic module, a second electronic module, and an electric shielding layer. The first electronic module and the second electronic module are bonded in such a way that integrated devices are opposite to each other. The electric shielding layer is inserted between the first electronic module and the second electronic module for ensuring electric insulation between the first electronic module and the second electronic module.

Abstract: Shielding cases each include a pair of opposed first surfaces with catching pieces protruding therefrom and a pair of second surfaces without catching pieces. A motherboard forms substrates each including a pair of opposed first side surfaces with catching grooves and a pair of second side surfaces without catching grooves when it is divided. The shielding cases are mounted on the motherboard such that the intervals A between the second surfaces of two adjacent shielding cases are equal to or less than the widths B of cutting allowances for cutting the motherboard. The motherboard is cut from the opposite side of a surface of the motherboard on which the shielding cases are mounted at predetermined positions where the second side surfaces are formed on each substrate. In this manner, the motherboard is divided into electronic components with shielding cases.

Abstract: A modular electronic device is provided in a tubular form having a male bayonet connector at one end and a female bayonet connector at the other. A power and communications bus interconnects the connectors. An electronic circuit is located within the device in communication with the bus. Modular devices including an electronic timer, a printer module and a digital camera are provided. A number of the devices can be connected end-to-end to share different functionalities by means of the bus.

Abstract: In a memory module, reference potential connecting patterns are disposed on high frequency signal lines and/or on the extension lines extending from the terminal ends of the signal lines as well as a shield cover for covering semiconductor memory chips is disposed on the substrate, and the reference potential connecting patterns are connected to the shield cover through metal cover contact parts.

Abstract: A mounting adapter for inserting one or more electronic modules in a system is disclosed. The mounting adapter includes a sleeve having first and second portions that are each configured to receive an electronic module. The sleeve also includes a dividing member that cooperates with the first and second portions to define at least two volumes for receipt of electronic modules. Additionally, the sleeve is configured for insertion in a slot of a receptacle that is configured to receive an electronic module larger than the electronic modules the sleeve is designed to receive.

Abstract: A combination current sensor and relay has an improved housing. In one aspect, the housing includes light emitting diodes on an upper surface that indicate open circuit and short circuit conditions. In another aspect, the housing includes a securement structure for a circuit board that includes the transformer and switches for device operation, together with aligned openings therein for routing wires to external devices. In another aspect, a multiple position switch is included on the upper surface that indicates multiple modes of operation of the device. In another aspect, the housing may be assembled in multiple parts by affixing a first portion to a support, a circuit board to the first portion, and a second portion to the first portion. In another aspect, the housing is suitable for engagement to alternatively a junction box and a duplex box. In another aspect, the configuration of the upper surface provides usability advantages.

Abstract: This disclosure concerns EMI control in electronics systems. In one example, an electromagnetic radiation containment system is provided for use in connection with functional modules and an associated card cage disposed in the chassis of an electronic equipment enclosure. The electromagnetic radiation containment system includes conductive elements uniformly distributed about the perimeter of a functional module configured to be received within the card cage, and further includes grounding elements in electrical communication with the chassis so that when the functional module is positioned within a slot of the card cage, at least some of the conductive elements are in electrical communication with the grounding elements. Electrical communication between the conductive elements and circuitry of the functional module facilitates EMI control in the electronic equipment enclosure.

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.