Abstract: A conductive paint electromagnetic interference (EMI) shield for an electronic module or device. The conductive paint is composed of metal particles suspended in a fluidic carrier. In one embodiment, the conductive paint is sprayed onto exterior surfaces of an electronic module or device from a spray gun. The sprayed conductive paint is cured to remove the fluidic carrier, leaving a metal film coated to the outside of the module or device. In one embodiment used with electronic packages in array form, grooves are cut into an encapsulation material of a module so that the shield protection includes sidewalls of the package. In another embodiment used with camera modules, masking is used to selectively shield portions of the module. In a further embodiment, the shield is electrically connected to a ground conductor of a circuit of the electronic module.

Abstract: A semiconductor device includes a first printed circuit board, a flat cable having electrical wires and a coating film which covers the electrical wires except for both ends, one end of each of the electrical wires is connected to the first printed circuit board, and a second printed circuit board connected to other end of each of the electrical wires. The flat cable is bent in such a manner that the first printed circuit board and the second printed circuit board face each other. A flat surface is formed in a portion of the coating film.

Abstract: Provided is a method for manufacturing a touch panel. In the method, a substrate is prepared, a transparent electrode is formed on the substrate, an interconnection electrode material is applied to the substrate by printing, an interconnection electrode is formed by drying the interconnection electrode material, and a circuit board is disposed on the interconnection electrode.

Abstract: A riser card is used for connecting at least one power supply to a motherboard in an electronic device. The riser card includes a first printed circuit board (PCB) and a second PCB. The first PCB includes at least one power connector for laterally receiving the at least one power supply. The second PCB is located parallel to the first PCB. The second PCB includes an insert terminal for connecting to the motherboard. The first PCB is spaced from the second PCB, and the first PCB and the second PCB are electrically connected.

Abstract: Methods and apparatus for memory systems with memory chips are described. In an embodiment, a system includes a memory controller chip, memory chips, and a module connector each on a first substrate and at least two groups of conductors to provide read data signals from at least some of the memory chips to the memory controller chip and to provide read data signals from the connector to the memory controller chip. Furthermore, a memory module is inserted in the module connector and including memory chips on a second substrate at least some of which are to receive signals from at least some for the memory chips on the first substrate and at least some of which are to provide the read data signals to be provided to the second group of conductors. Other embodiments are described.

Abstract: This invention provides an electronic device including a casing and a circuit board. The casing has an opening. The circuit board is located in the casing and at least includes a conductive layer and a surface insulating layer. The conductive layer includes a signal transmission portion and a static induction portion. The static induction portion is electrically disconnected with the signal transmission portion at the conductive layer, and the static induction portion is closer to the opening than the signal transmission portion. The surface insulating layer covers the signal transmission portion on the circuit board and exposes the static induction portion.

Abstract: A display card assembly includes a display card with a first circuit board, a straight through connector, and an expansion card with a second circuit board. A first edge connector is arranged on a bottom edge of the first circuit board and includes first power pins connected to a control chip and first storage chips, first ground pins, and first signal pins. A second edge connector connected to the straight through connector is arranged on an end edge of the first circuit board adjoining the bottom edge and includes second power pins connected to the first power pins, second ground pins, and second signal pins connected to the control chip. A third edge connector engaged in the straight through connector is arranged on an end edge of the second circuit board and includes third power pins and third signal pins connected to the second storage chips, and third ground pins.

Abstract: A microelectronic assembly includes a dielectric element having oppositely-facing first and second surfaces and one or more apertures extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element having a rear surface and a front surface facing the first surface of the dielectric element, the first microelectronic element having a first edge and a plurality of contacts exposed at the front surface thereof; a second microelectronic element including having a rear surface and a front surface facing the rear surface of the first microelectronic element, a projecting portion of the front surface of the second microelectronic element extending beyond the first edge of the first microelectronic element, the projecting portion being spaced from the first surface of the dielectric element, the second microelectronic element having a plurality of contacts exposed at the projecting portion of the front surface; leads extending from contacts of the mic

Abstract: A motherboard includes a first circuit board, a second circuit board, and wiring. The first circuit board includes at least a programmable chip, a programming interface, a first data interface, and at least one jumper corresponding to the programmable chip. The second circuit board includes a CPU (central processing unit), a RAM unit, and at least a second data interface corresponding to the programmable chip. The motherboard of the present disclosure concentrates programmable chips on the first circuit board, thereby providing a unified programming interface to enhance the convenience of programming multiple programmable chips.

Abstract: A joining sheet includes a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles and a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin.

Abstract: A latching apparatus for a memory card includes a socket and a pair of latching members assembled on opposite ends of the socket. A cutout is defined in each end of the memory card. Each latching member includes a main body, two pivoting portions extending from opposite ends of the main body for pivotably attaching the latch member to one end of the socket, and a C-shaped locking portion extending down from a middle portion of the main body. The insertion of the memory card in the socket causes the bottom edge of the memory card to engage with distal ends of the locking portions and so rotate the latch member, until the main bodies of the latching members engage in the cutouts of the memory card.

Abstract: A system in some embodiments includes a system having a memory module having a first board comprising a first plurality of memory receptacles configured to support a first plurality of in-line memory modules in an overlapping relationship with a second plurality of in-line memory modules disposed on a second board. Further, a system in some embodiments includes rotating first and second memory boards into a parallel configuration via a hinge coupling the first and second memory boards, and inserting the first and second memory boards into first and second board connectors simultaneously.

Abstract: In accordance with an embodiment of the present invention, a device includes a circuit board with a thermally conductive core layer and a chip disposed over the circuit board. The device further includes a heat sink disposed over the chip. The thermal conductivity of the heat sink along a first direction is larger than a thermal conductivity along a second direction. The first direction is perpendicular to the second direction. The heat sink is thermally coupled to the thermally conductive core layer.

Abstract: In accordance with the teaching of the present invention, a system and method for securing a ball grid array to a printed wire board is provided. In a particular embodiment, a ball grid array comprises one or more balls configured to attach to a spring comprising one or more turns. In addition, there is a spacer plate configured to align and separate the springs, a soldering aid configured to align solder on the printed wire board and a printed wire board configured with conductive pads to attach to the ball grid array via the springs.

Abstract: A structure of an anti tamper case for the solid state disk includes an upper housing and a lower housing. The upper housing has an extending portion formed respectively on the two sides of the flange. The extending portion has at least one opening. The lower housing corresponds to the upper housing and a space is formed there-between for receiving the solid state disk. The lower housing has a hook formed at the flange corresponding to the opening. The hook and the opening are buckled to each other. The hook will be broken by the flange in the opening when the upper and lower housings are separated, thus prevent the user from forcefully opening the case for self maintenance or internal component replacement.

Abstract: A display module includes a display panel, a unit disposed on an outer side of the display panel, and an adhesive sheet with which the display panel and the unit are stuck together. The adhesive sheet has a first adhesive surface adhering to the display panel and a second adhesive surface adhering to the unit. The edge of the first adhesive surface and the edge of the second adhesive surface are displaced from each other in the adhesive surface direction.

Abstract: Decoupling capacitor circuit assembly is described. In one example, a circuit assembly includes a passive substrate, a plurality of terminals, and at least one capacitor. The passive substrate includes a top surface and a bottom surface. The plurality of terminals is formed on the top surface and is configured for electrical communication with a respective plurality of lands on a printed circuit board (PCB). The at least one capacitor is mounted to the bottom surface of the passive substrate and is configured to provide decoupling capacitance for an integrated circuit (IC) on the PCB. Each capacitor is coupled to a pair of the plurality of terminals. In another example, a circuit assembly includes a PCB, and IC mounted to the PCB, a passive substrate mounted to the PCB, and at least one capacitor mounted to the passive substrate for providing decoupling capacitance for the IC.

Abstract: A motherboard assembly includes a motherboard and a serial advanced technology attachment dual-in-line memory module (SATA DIMM) module with a circuit board. The motherboard includes an expansion slot and a storage device interface. An edge connector is set on a bottom edge of the circuit board to be detachably engaged in the expansion slot, and a notch is set on a bottom edge of the circuit board to engage in a protrusion of the expansion slot. A SATA connector of the circuit board is connected to the storage device interface of the motherboard.

Abstract: The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane(meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.

Abstract: A multi-layer semiconductor element package structure with surge protection function includes a substrate unit, an insulated unit, a one-way conduction unit and a protection unit. The substrate unit has at least one top substrate, at least one middle substrate and at least one bottom substrate. The insulated unit has at least one first insulated layer filled between the top substrate and the middle substrate and at least one second insulated layer filled between the middle substrate and the bottom substrate. The one-way conduction unit has a plurality of one-way conduction elements electrically disposed between the top substrate and the middle substrate and enclosed by the first insulated layer. The protection unit has at least one protection element with anti surge current or anti surge voltage function electrically disposed between the middle substrate and the bottom substrate and enclosed by the second insulated layer.

Abstract: A fixing member for fixing a blindfold plate to a support post where a fixing hole is formed, the fixing member includes: a deformation portion that is attached to the blindfold plate, and is inserted in to the fixing hole while being deformed and stays in the fixing hole in a deformed condition when the blindfold plate is fixed to the support post.

Abstract: A monitoring system includes a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a circuit board, a motherboard having a monitoring unit, and a monitoring device. An edge connector is set on a bottom edge of the circuit board to engage in a memory slot of the motherboard. A SATA connector is arranged on the circuit board and connected to a storage device interface of the motherboard. The monitoring unit receives a working state signal and a data transfer rate signal of the SATA DIMM module and outputs the received signals to the monitoring device.

Abstract: The invention relates to a power semiconductor module including a module underside, a module housing, and at least two substrates spaced from each other. Each substrate has a topside facing an interior of the module housing and an underside facing away from the interior of the module housing. The underside of each substrate includes at least one portion simultaneously forming a portion of the module underside. At least one mounting means disposed between two adjacent substrates enables the power semiconductor module to be secured to a heatsink.

Abstract: The present disclosure relates to a conductive structure. The conductive structure includes a first conductive layer, a conductive unit, a circuit board and a conductive material. The conductive unit is disposed on the first conductive layer. The circuit board having a first through hole is disposed on the first conductive layer. The conductive unit is exposed to the first through hole. The first through hole is filled with a conductive material, such that the conductive material is electrically connected to the conductive unit.

Abstract: A communication apparatus includes first and second housings connected to each other by a hinge mechanism. The first housing includes a first substrate having electronic components electrically connected to an antenna, a first hinge portion configuring a portion of the hinge mechanism, and a first conductive member provided in the first hinge portion. The second housing includes a second substrate having electronic components, a waterproofing partition wall surrounding the second substrate, a second hinge portion configuring a portion of the hinge mechanism, a second conductive member provided in the second hinge portion to be capacitively-coupled with the first conductive member, and a third conductive member insertion-molded therein. The third conductive member includes an inner portion positioned on an inner side of the partition wall, and an outer portion extending from the inner portion toward an outer side of the partition wall and capacitively-coupled with the second conductive member.

Abstract: An electrical device that is electrically and mechanically connectable to another electrical device includes a face equipped with contact pads. An adhesive layer is on the face equipped with the contact pads. The adhesive layer is composed of a substance with adhesive properties. A plurality of openings through the adhesive are layer over each contact pad, and small metal sticks which have been grown electrolessly or electrochemically are in the areas where the openings have been created to form a plurality of conductive paths over each contact pad, the volume of which is defined by the openings.

Abstract: A method for laying out a printed circuit board for use in a gigabit-capable passive optical network includes the steps of providing a printed circuit board and laying out an analog circuit module, an analog-to-digital conversion module, a signal processing module, an optoelectronic transmitting and receiving module, and a power module on the printed circuit board. The printed circuit board has a first periphery and an opposing second periphery. The analog circuit module and the optoelectronic transmitting and receiving module are laid out at the first periphery of the printed circuit board. The power module is laid out at the second periphery of the printed circuit board. Electromagnectic wave generated by a power IC inserted in the power module does not interfere with data transmission taking place at the optoelectronic transmitting and receiving module. Furthermore, a printed circuit board for use with the method is proposed.

Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

Abstract: The instant disclosure provides a self-sealed stacked structure which includes a substrate unit, a first frame, a conductive unit and a blocker unit. The substrate unit includes a first and a second substrate, and a first frame sandwiched there-between. The conductive unit includes a plurality of first conductors and second conductors electrically connecting the first substrate, the first frame and the second substrate. The first and the second conductors are in electrical connection. A blocker unit including at least two first and at least two second blockers are surroundingly arranged around the plurality of first and second conductors, respectively. The first substrate and the first frame are connected in a sealed manner through the first blockers combined by the solder, where the first frame and the second substrate are connected in a sealed manner through the second blockers combined by the solder.

Abstract: A first backplane for being electrically coupled to a second backplane, a system monitoring module, and at least one transducer monitoring module includes a system interface bus configured to be coupled to the system monitoring module and the second backplane. The intermediate backplane also includes at least one monitor interface bus configured to be coupled to the at least one transducer monitoring module and the second backplane and an intermediate backplane bus configured to be coupled to the at least one transducer monitoring module and the system monitoring module.

Abstract: A magnetic component provides both electrical interconnectivity and mechanical support between stacked circuit boards. The magnetic component includes a bobbin structure and a magnetically permeable core. The bobbin structure includes an upper bobbin pin rail and a lower bobbin pin rail. The upper bobbin pin rail includes one or more upper bobbin pins extending from the upper bobbin pin rail. Each upper bobbin pin may be adapted for soldering onto a first circuit board. At least one lower bobbin pin extends from the lower bobbin pin rail. Each lower bobbin pin may also be adapted for soldering onto a second circuit board, forming a circuit board assembly. Each soldered connection between a bobbin pin and a circuit board may provide an electrical connection between the circuit board and the magnetic component. Each soldered connection may also provide a mechanical attachment between a printed circuit board and the magnetic component.

Abstract: A downhole tool string component has a through-bore intermediate first and second tool joints adapted for connection to adjacent tool string components. An instrumentation package is disposed within an outer diameter of the component. The instrumentation package comprises a circuit board assembly. The circuit board assembly comprises alternating rigid and elastomeric layers. The rigid layers are in electrical communication with each other.

Abstract: A component retention mechanism facilitates improved installation, retention and removal of hardware components (e.g., PCI cards) on a personal computer. The retention mechanism includes a locking component, support member, and release mechanism coupled to each other. The locking component can be a steel bar or other stiff item positioned proximate to multiple socket connectors on a circuit board. The locking component moves between unlocked and locked positions that mechanically and simultaneously unlock or lock in place multiple add-in cards inserted into the socket connectors. The support member moves and thereby facilitates movement of the locking component between locked and unlocked positions. The release mechanism facilitates movement of the support member and is actuated when a force is exerted by a user thereto. An associated slider housing coupled to the release mechanism and support member includes a fan, support shelves and a door that provides additional support to oversized PCI cards.

Abstract: Electrical components, such as packaged integrated circuit devices that are mountable on a substrate surface, are provided with at least one exposed electrical contact on a side surface of the component that will be substantially perpendicular to the substrate surface when the component is mounted. Two such components can be mounted side-by-side on the substrate surface with the above-mentioned contacts close to one another between the above-mentioned side surfaces. An electrical connection between the contacts can be made (or perfected) by depositing an electrically conductive connector material in contact with both of the contacts between the above-mentioned side surfaces.

Abstract: A function expansion device is electrically connected to an electronic apparatus by being inserted in a socket included in the electronic apparatus and expands a function of the electronic apparatus. The function expansion device includes a substrate on which a component is mounted, a first connecting terminal that is formed at an end portion of the substrate and is electrically connected to a first signal line that connects the electronic apparatus and the component in a one-to-one fashion, a second connecting terminal that is formed at the end portion of the substrate and is electrically connected to a second signal line that connects the electronic apparatus and the component redundantly, and a protection member that is formed to cover only the second connecting terminal.

Abstract: An electrical signal connection, an electrical signaling system, and a method of connecting printed circuit boards. The electrical signal connection having a first conductive via and a second conductive via disposed in a first printed circuit board. A first conductive trace with a first end and a second end has the first end electrically coupled to the first conductive via at a first distance from the top surface of the first printed circuit board. The second end of the first conductive via is electrically coupled to the second printed circuit board. A second conductive trace with a first end and a second end has the first end being electrically coupled to the second conductive via at a second distance from the top surface of the first printed circuit board. The second end being is electrically coupled to the second printed circuit board.

Abstract: An optical element module according to the present invention includes a plurality of optical elements laminated therein, each optical element including: an optical surface at a center portion thereof; and a spacer section having a predetermined thickness on an outer circumference side of the optical surface, wherein an adhesive is positioned on a further outer circumference side of the spacer section, and the upper optical element and the lower optical element are adhered to each other such that an inside and an outside of the adhesive are ventable through a ventilating section of the adhesive.

Abstract: A blade for a chassis-based system includes a printed circuit board (PCB) mounted at a tilt angle within the blade. The tilt angle provides space above or below the PCB at the front end of the blade, such that media interface modules can be flexibly positioned within the blade. A tilt angle that positions the PCB higher near the front end of the blade may enable media interface modules mounted in a belly-to-belly configuration on the PCB to be fitted within the front end of the blade. A tilt angle that positions the PCB lower near the front end of the blade may enable media interface modules mounted on the upper surface of the PCB to be fitted within the first end of the blade. The tilt angle also positions a backplane connector mounted on the PCB to properly engage a backplane when the blade is inserted into a slot.

Abstract: Provided is an adhesive composition containing an organoaluminum complex (A), a silane coupling agent (B), and a curable component (C).

Abstract: A mounting assembly includes a mounting bracket, a riser card, a shield plate attached to an expansion card, a mounting frame, and a latch member. The riser card is attached to the mounting bracket and has at least one expansion card socket. The expansion card is received in the at least one expansion card socket. The mounting frame has at least one slot configured to fix the shield plate and an accommodating space beside the at least one slot. The latch member is mounted in the accommodating space and abuts the shield plate for preventing the expansion card from moving away from the at least one expansion card socket. The latch member is capable of being taken out from the accommodating space to release the shield plate, thereby allowing the expansion card to disengage from the at least one expansion card socket.

Abstract: Non-rectangular or rectangular interposers for space efficient, reliable to manufacture, high speed interconnections between two printed circuit boards, such as a motherboard and a mating board. One example provides space efficiency with a non-rectangular interposer, where the interposer may be at least approximately circular. Reliable manufacturing may be provided by the inclusion of one or more openings to accept one or more alignment features. In one example, a first opening is provided to accept a threaded boss, which may be used to fasten the two printed circuit boards and interposer together. In another example, a second opening may be provided to accept an alignment post, wherein the post aligns the interposer to the two printed circuit boards. Contacts may be provided on each side to mate with contacts on each of the two printed circuit boards.

Abstract: First and second housings of a metal sheet are superposed over each other and fixed to each other by bolts to form an element receiving space. An antenna is fixed to the second housing by a bolt so as to be adjacent to the first housing. A hook section is fixed to the first housing. The hook section is inserted in a hole of the antenna, a step-shaped forward lower step section of the hook section is engaged with the peripheral edge of the hole in the antenna, and thus the first housing and the antenna are fixed to each other. The antenna is embedded in resin and covered by the resin.

Abstract: A hybrid service device, which can be embedded in a wall, includes a control module disposed on a first circuit board, a transmission functional module disposed on a second circuit board, and a service module disposed on a third circuit board. The control module includes a first circuit board connector and a socket, wherein the second circuit board is pluggable disposed on the socket, such that the first circuit board and the second circuit board are substantially parallel and the control module is electrically connected with the transmission functional module. The service module includes a second circuit board connector, wherein the third circuit board is pluggable connected with the first circuit board connector.

Abstract: A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a circuit board and a cable member. A first edge connector is set on a bottom edge of the circuit board to be connected to a memory slot of a motherboard. A second edge connector is arranged on an end of the circuit board. The cable member includes a cable, a first storage device interface extending from a first end of the cable to be connected to a second storage device interface of the motherboard, and a third edge connector formed on a second end of the cable and soldered to the second edge connector.

Abstract: A locking retainer for retaining an electronic module or printed circuit card in slots of a chassis. The retainer includes at least three wedge members movably linked to each other and disposed in longitudinal sequence along a longitudinal axis. The retainer can be made relatively larger in height by moving the wedge members longitudinally such that a longitudinal distance between a first wedge member and a last wedge member of the sequence becomes smaller without the wedge members being longitudinally displaced along a common internal longitudinal element. All portions of the locking retainer that the middle wedge member is longitudinally moveable relative to do not extend through a theoretical plane disposed at a longitudinal midpoint of the middle wedge member and oriented normal to the longitudinal axis. The elimination of a central rail permits the wedge segments to have much greater contact area for greater thermal energy flow.

Abstract: A first printed circuit board (PCB) assembly can include an embedded electrical connector configured to be mechanically coupled to a corresponding tab-shaped portion of a second PCB assembly, such as to permit insertion of the tab-shaped portion of the second PCB assembly into the embedded electrical connector when the second PCB assembly is aligned in a specified orientation. In an example, the second PCB assembly can include an approximately planar conductive antenna.

Abstract: A portable electronic device includes a casing, an electronic module, at least one flexible arm, and at least one latch. The casing has a containing portion, at least one sliding slot, and at least one positioning structure. The electronic module is configured in the containing portion and has at least one locking slot. The flexible arm is connected to the casing and located between the sliding slot and the electronic module. Besides, the flexible arm has a position-limiting protrusion. The latch has a first bump and at least one second bump. When the latch slides into the sliding slot, the first bump interferes with the positioning structure, so that the latch is positioned, and the second bump pushes the position-limiting protrusion into the locking slot, so that the electronic module is restricted within the containing portion.

Abstract: A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component includes stacked semiconductor die. In accordance with embodiments, the semiconductor component includes a substrate having a component receiving area and a plurality of bond pads. A semiconductor chip is attached to the component receiving area. An electrical connector is coupled to the semiconductor chip and the substrate. A second semiconductor chip is mounted or attached to one of the ends of the electrical connector such that this end is positioned between the semiconductor chips. A second electrical connector is coupled between the second semiconductor chip and the substrate. A third semiconductor chip is mounted over or attached to the second electrical connector such that a portion is between the second and third semiconductor chips.

Abstract: A riser card for connecting at least one high-speed signal card to a mainboard is provided. The high-speed signal card includes a first connecting portion and a second connecting portion. The riser card includes a circuit board, a plurality of slots, a connection terminal, a power supply module, and a supporting board. The slots include a first slot and a second slot disposed spaced apart on a first surface of the circuit board and connected to the first connecting portion and the second connecting portion respectively of the high-speed signal card. The connection terminal connects to the mainboard. The power supply module is fixed to a second surface of the circuit board by using the supporting board and supplies power to the high-speed signal card via the circuit board, so that the high-speed signal card is able to exchange data with the mainboard via the riser card.

Abstract: A system, method, and motherboard assembly are described for interconnecting and distributing signals and power between co-planar boards that function as a single motherboard. The motherboard assembly includes a multilayered first printed circuit board having opposed parallel first and second surfaces, each having at least one land grid array (LGA) disposed thereon. The assembly further includes at least one wiring layer (Y) designed to only electrically interconnect components on or within the first PCB, and at least one wiring layer (X) designed to only electrically connect the components on the first PCB to a multilayered second PCB. The multilayered second PCB has opposed parallel first and second surfaces, the first surface having at least one LGA disposed thereon.