Abstract: A semiconductor memory apparatus may include a memory bank having a plurality of memory cell arrays. The memory bank may have an open bit line structure. A sense amplifier array may be coupled in common with adjacent memory cell arrays. A sense amplifier coupled in common with a dummy array and a normal array may be coupled with one bit line disposed in the normal array and two bit lines disposed in the dummy array.

Abstract: An object is to provide a semiconductor device capable of accurate data retention even with a memory element including a depletion mode transistor. A gate terminal of a transistor for controlling input of a signal to a signal holding portion is negatively charged in advance. The connection to a power supply is physically broken, whereby negative charge is held at the gate terminal. Further, a capacitor having terminals one of which is electrically connected to the gate terminal of the transistor is provided, and thus switching operation of the transistor is controlled with the capacitor.

Abstract: Multiple photodetectors that photoelectric convert incident light to output a pixel signal; multiple analog/digital (A/D) convertors that A/D convert a plurality of pixel signals that are output by the photodetectors in parallel in a plurality of systems; a retaining unit that retains the pixel signals A/D converted in parallel by the A/D convertors in an aligned manner in one direction, to be arranged in reading order from a first pixel signal to a final pixel signal; and multiple transfer units that transfer the pixel signals arranged and retained by the retaining unit, sequentially from the first pixel signal from a first-pixel-signal retaining position toward a final-pixel signal retaining position of the retaining unit are included.

Abstract: A refresh control circuit of a volatile semiconductor memory device is provided, where the volatile semiconductor memory device includes a plurality of memory cells respectively having a select transistor and a memory element, and the refresh control circuit of the volatile semiconductor memory device includes: a first comparison part, which compares a memory voltage of the memory cell of the volatile semiconductor memory device that is different to a general-memorizing memory cell with a specified threshold voltage, and outputs a comparison result signal, and stops self refresh of the memory cell until the memory voltage is decreased to be smaller than the specified threshold voltage. The memory cell is formed in a region adjacent to an array of the general-memorizing memory cell.

Abstract: Provided is a semiconductor device including first to fifth circuits. The first circuit includes first and second transistors. The second circuit is capable of supplying one of first and second wirings with a gradually changing potential. The third circuit is capable of supplying a predetermined potential to the other of the first and second wirings and is capable of reading data stored in the first circuit. The fourth circuit is capable of comparing first data to be written to the first circuit with second data read by the third circuit. When a comparison result obtained by the fourth circuit concludes that the first data is consistent with the second data, the fifth circuit disconnects the second circuit from the first circuit, and a potential of the one of the first and second wirings is supplied to a gate of the second transistor.

Abstract: Memory systems and memory programming methods are described. According to one aspect, a memory system includes program circuitry configured to provide a program signal to a memory cell to program the memory cell from a first memory state to a second memory state, detection circuitry configured to detect the memory cell changing from the first memory state to the second memory state during the provision of the program signal to the memory cell to program the memory cell, and wherein the program circuitry is configured to alter the program signal as a result of the detection and to provide the altered program signal to the memory cell to continue to program the memory cell from the first memory state to the second memory state.

Abstract: A highly reliable storage device with small data deterioration is provided. The storage device includes a first circuit, a second circuit, a third circuit, and a memory cell. The first circuit has a function of detecting power-on. The second circuit has a function of specifying the address of the memory cell. The third circuit has a function of refreshing the memory cell at the address specified by the second circuit after the first circuit detects power-on. The memory cell preferably includes an oxide semiconductor transistor.

Abstract: A sense amplifier includes an equalization unit configured to precharge a pair of bit lines to a level of a bit line precharge voltage in response to a bit line equalizing signal; and an amplification unit configured to sense and amplify voltages of the pair of bit lines, supply, during an active operation, a ground voltage to a pull-down node of a latch section, and supply, when a precharge signal is enabled, a first voltage lower than the ground voltage to the pull-down node of the latch section for a predetermined time.

Abstract: A selection operation is performed for individual memory cells. A device includes a first memory cell and a second memory cell provided in the same row as the first memory cell, each of which includes a field-effect transistor having a first gate and a second gate. The field-effect transistor controls at least data writing and data holding in the memory cell by being turned on or off. The device further includes a row selection line electrically connected to the first gates of the field-effect transistors included in the first memory cell and the second memory cell, a first column selection line electrically connected to the second gate of the field-effect transistor included in the first memory cell, and a second column selection line electrically connected to the second gate of the field-effect transistor included in the second memory cell.

Abstract: There is provided a method of detecting offset in a sense amplifier of an SRAM memory unit. The method comprises using a sense amplifier of the SRAM memory unit to implement a read of a first data value stored in a memory cell of the SRAM memory unit, and measuring a first time for the sense amplifier to read the first data value. The method further comprises using the sense amplifier to implement a read of a second data value stored in a memory cell of the SRAM memory unit, and measuring a second time for the sense amplifier to read the second data value. The method then comprises calculating a difference between the first time and the second time, and determining whether an offset adjustment should be applied to the sense amplifier in dependence upon the difference between the first time and the second time.

Abstract: A device for temporarily storing data output from a register or data obtained by processing the output data, a processing method therefor, a program, and the like is provided. A circuit (hereinafter, referred to as a selective memory cell) in which a plurality of switches and a signal storing circuit are connected is provided in a data processing device. The selective memory cell can selectively store necessary data. A result of a frequently performed process is stored in the selective memory cell. A process whose result is stored can be performed by only outputting the stored data instead of performing the whole process; thus, input data does not need to be transferred, which can result in a reduction in processing time.

Abstract: To provide a semiconductor device with excellent charge retention characteristics, an OS transistor is used as a transistor whose gate is connected to a node for retaining charge. Charge is stored in a first capacitor, and data at the node for retaining charge is read based on whether the stored charge is transferred to a second capacitor. Since a Si transistor, in which leakage current through a gate insulating film occurs, is not used as a transistor connected to the node for retaining charge, charge retention characteristics of the node are improved. In addition, the semiconductor device operates in data reading without requiring transistor performance equivalent to that of a Si transistor.

Abstract: A semiconductor device and a method of fabricating the same, the semiconductor device includes a substrate, an interconnect structure, and an oxide semiconductor structure. The substrate has a first region and a second region. The interconnect structure is disposed on the substrate, in the first region. The oxide semiconductor structure is disposed over a hydrogen blocking layer, in the second region of the substrate.

Abstract: To provide a memory device which operates at high speed or a memory device in which the frequency of refresh operations is reduced. In a cell array, a potential is supplied from a driver circuit to a wiring connected to a memory cell. The cell array is provided over the driver circuit. Each of memory cells included in the cell array includes a switching element, and a capacitor in which supply, holding, and discharge of electric charge are controlled by the switching element. Further, a channel formation region of the transistor used as the switching element includes a semiconductor whose band gap is wider than that of silicon and whose intrinsic carrier density is lower than that of silicon.

Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.

Abstract: An object is to increase the retention characteristics of a memory device formed using a wide bandgap semiconductor. A bit line controlling transistor is inserted in a bit line in series. The minimum potential of a gate of the transistor is set to a sufficiently negative value. The gate of the transistor is connected to a bit line controlling circuit connected to a battery. The minimum potential of the bit line is set higher than that of a word line. When power from an external power supply is interrupted, the bit line is cut off by the transistor, ensuring prevention of outflow of charge in the bit line. The potential of a source or a drain (bit line) of a cell transistor is sufficiently higher than that of a gate of the cell transistor, resulting in an absolute off-state; thus, data can be retained. Other embodiments are disclosed.

Abstract: A column driver includes an amplifier circuit for amplifying data of a read bit line and a latch circuit for retaining the amplified data. The latch circuit includes a pair of nodes Q and QB for retaining complementary data. Data is read from a memory cell in each write target row to a read bit line, and amplified by the amplifier circuit. The amplified data is written to the node Q (or QB) of the latch circuit. In a write target column, write data is input to the latch circuit through the node Q (or QB) to update data of the latch circuit. Then, in each column, data of the latch circuit is written to a write bit line, and the data of the write bit line is written to the memory cell.

Abstract: A memory device may include the following elements: a first memory cell; a first word line for transmitting a first control signal to control an electrical connection in the first memory cell; a first bit line connected to the first memory cell; a first transistor, wherein a first terminal of the first transistor is connected to the first bit line; a second memory cell; a second word line for transmitting a second control signal to control an electrical connection in the second memory cell; a second bit line connected to the second memory cell; a second transistor, wherein a first terminal of the second transistor is connected to the second bit line; and a sense amplifier having a first input terminal connected to a second terminal of the first transistor and having a second input terminal connected to a second terminal of the second transistor.

Abstract: A circuit utilizing memcapacitive elements for mixed memory storage and polymorphic computing is introduced. The circuit includes a plurality of memory cells each selectively or fixedly connected to a word line, bit line and dual bit line. Each memory cell includes a memcapacitive element. Voltage pulse generators can selectively applying voltage pulses to the memory cells. A method for mixed memory storage and polymorphic computing in at least two memory cells is provided. Data is stored by selectively applying voltage pulses to an individual memory cell to set an internal charge level of the memcapacitive element. Logic functions are conducted by applying voltage pulses having independent amplitudes to at least two memory cells to achieve internal charges in the memcapacitive elements of the cells to store an output bit according to a logic map that depends upon applied independent voltage pulse amplitudes.

Abstract: To provide a highly reliable semiconductor device using an oxide semiconductor. The semiconductor device includes a first electrode layer; a second electrode layer positioned over the first electrode layer and including a stacked-layer structure of a first conductive layer and a second conductive layer; and an oxide semiconductor film and an insulating film positioned between the first electrode layer and the second electrode layer in a thickness direction. The first conductive layer and the insulating film have a first opening portion in a region overlapping with the first electrode layer. The oxide semiconductor film has a second opening portion in a region overlapping with the first opening portion. The second conductive layer is in contact with the first electrode layer exposed in the first opening portion and the second opening portion.

Abstract: A semiconductor memory device includes: a plurality of memory areas; a target area setting unit suitable for designating a target area according to a number of accesses to the respective memory areas; a random address generation unit suitable for generating a random address within the respective memory areas in a random manner; a target address generation unit suitable for generating a target address based on the target area and the random address; and a driving unit suitable for performing a smart refresh operation according to the target address.

Abstract: The present disclosure describes DRAM architectures and refresh controllers that allow for scheduling of an opportunistic refresh of a DRAM device concurrently with normal row activate command directed toward the DRAM device. Each activate command affords an “opportunity” to refresh another independent row (i.e., a wordline) within a memory device with no scheduling conflict.

Abstract: Techniques described herein generally include methods and systems related to designing and operating a DRAM device that has significantly reduced refresh energy use. A method for designing a DRAM optimizes or otherwise improves the DRAM for energy efficiency based on a measured or predicted failure probability of memory cells in the DRAM. The DRAM may be configured to operate at an increased refresh interval, thereby reducing DRAM refresh energy but causing a predictable portion of the memory cells in the DRAM to leak electrical energy too quickly to retain data. The DRAM is further configured with a selected number of spare memory cells for replacing the “leaky” memory cells, so that operation of the DRAM at the increased refresh interval may result in little or no reduction in capacity of the DRAM.

Abstract: A semiconductor memory device includes a semiconductor substrate having a main surface, at least a first dielectric layer on the main surface of the semiconductor substrate, a first OS FET device and a second OS FET device disposed on the first dielectric layer, at least a second dielectric layer covering the first dielectric layer, the first OS FET device, and the second OS FET device, a first MIM capacitor on the second dielectric layer and electrically coupled to the first OS FET device, and a second MIM capacitor on the second dielectric layer and electrically coupled to the second OS FET device.

Abstract: Embodiments include apparatuses, methods, and systems including a circuit which may increase a speed of removal of data stored in a memory cell. In embodiments, the circuit may include a control logic to detect a signal and a boost circuit coupled to the control logic to allow the control logic to disable an operation of the boost circuit in response to detection of the signal. A discharge device may be coupled to the boost circuit to accelerate leakage of a leakage current in response to the detection of the signal. In the embodiment, the leakage current is a leakage current of a memory cell coupled to the discharge device and acceleration of the leakage of the leakage current and the disablement of the operation of the boost circuit may increase a speed of erasure of data in the memory cell. Other embodiments may also be described and claimed.

Abstract: Embodiments herein describe DRAM that includes storage circuitry coupled between complementary bit lines which are in turn coupled to the same sense amplifier. The storage circuitry includes a transistor and a storage capacitor coupled in series. The gate of the transistor is coupled to a word line which selectively couples the storage capacitor to one of the complementary bit lines. Because the capacitor is coupled to both of the bit lines, when reading the data stored on the capacitor, the charge on the capacitor causes current to flow from one of the bit lines into the other bit line which causes a voltage difference between the complementary bit lines. Put differently, both ends of the capacitor are electrically coupled to bit lines thereby generating a larger voltage difference between the bit lines when reading data from the storage capacitors.

Abstract: Methods and apparatuses for memory power reduction are provided. The apparatus determines whether to store data into a DRAM or an NVRAM during an idle state of a processor based on power consumption by the DRAM in association with refreshing the data in the DRAM and use of the data stored in the DRAM by the processor, based on power consumption by the NVRAM in association with use of the data stored in the NVRAM by the processor, and based on a duty cycle associated with current drawn in a first power state and a second power state in association with the data. The NVRAM is a type of non-volatile random-access memory other than flash memory. The processor stores the data into one of the DRAM or the NVRAM based on the determination whether to store the data in the DRAM or the NVRAM.

Abstract: A method and an apparatus for identifying non-intrinsic defect bits from a population of failing bits for failure analysis to characterize the extrinsic failure mechanisms is provided. Embodiments include performing a failure mode test on a bank of a memory array at different low VDD; determining optimal bank size to observe plateaus of fail counts; determining fail counts of the bank at each different low VDD; determining a plateau of the fail counts; determining whether the plateau represents extrinsic bits of the bank; and submitting the extrinsic bits for root cause analysis.

Abstract: A transceiver architecture for wireless base stations wherein a broadband radio frequency signal is carried between at least one tower-mounted unit and a ground-based unit via optical fibers, or other non-distortive media, in either digital or analog format. Each tower-mounted unit (for both reception and transmission) has an antenna, analog amplifier and an electro-optical converter. The ground unit has ultrafast data converters and digital frequency translators, as well as signal linearizers, to compensate for nonlinear distortion in the amplifiers and optical links in both directions. In one embodiment of the invention, at least one of the digital data converters, frequency translators, and linearizers includes superconducting elements mounted on a cryocooler.

Abstract: A system includes a memory block. The memory block includes a local control circuit that is operable to control a memory operation of the memory block. The local control circuit includes a local sense amplifier. The system also includes a global memory control circuit separate from the memory block, and the global memory control circuit is operable to communicate with the local control circuit. The global memory control circuit includes a global data latch operable to receive a sensed data state from the local sense amplifier.

Abstract: The semiconductor device includes a bit line, a transistor, a retention node, and a capacitor. The transistor has a function of charging or discharging the retention node. The capacitor has a function of retaining a potential of the retention node. A voltage greater than the sum of a writing voltage and a threshold voltage is applied to a gate of the transistor. When the transistor is turned on, a first potential is supplied to the bit line with a reference potential in a floating state. A voltage less than the sum of the writing voltage and the threshold voltage is applied to the gate of the transistor. When the transistor is turned on, a second potential is supplied to the bit line with a reference potential in a floating state. With use of the first and second potentials, the threshold voltage of the transistor is calculated without being influenced by parasitic capacitance and variations in the storage capacitance of the capacitor.

Abstract: A memory device includes a first memory circuit including a silicon transistor, a selection circuit including a silicon transistor, and a second memory circuit including oxide semiconductor transistors and a storage capacitor, in which one terminal of the storage capacitor is connected to a portion where two oxide semiconductor transistors are connected in series, an output of the second memory circuit is connected to a second input terminal of the selection circuit, and an input of the second memory circuit is connected to a first input terminal of the selection circuit or an output terminal of the first memory circuit.

Abstract: Techniques and mechanisms for exchanging information between a memory controller and a memory device. In an embodiment, a memory controller receives information indicating for a memory device a threshold number of pending consolidated activation commands to access that memory device. The threshold number indicated by the information is less than a theoretical maximum number of pending consolidated activation commands, the theoretical maximum number defined based on timing parameters of the memory device. In another embodiment, the memory controller limits communication of consolidated activation commands to the memory device based on the information indicating the threshold number.

Abstract: A semiconductor device including a nonvolatile memory cell in which a writing transistor which includes an oxide semiconductor, a reading transistor which includes a semiconductor material different from that of the writing transistor, and a capacitor are included is provided. Data is written to the memory cell by turning on the writing transistor and applying a potential to a node where a source electrode (or a drain electrode) of the writing transistor, one electrode of the capacitor, and a gate electrode of the reading transistor are electrically connected, and then turning off the writing transistor, so that the predetermined amount of charge is held in the node. Further, when a p-channel transistor is used as the reading transistor, a reading potential is a positive potential.

Abstract: A semiconductor memory device includes: a memory cell array including a plurality of word lines; a word line driving unit suitable for activating a first word line among the plurality of word lines corresponding to an input address signal; an activation time detection unit suitable for enabling a detection signal by detecting an activation time of the first word line; an address latch unit suitable for latching an address information for a second word line corresponding to the first word line in response to the detection signal; and an address output unit suitable for providing the word line driving unit with the latched address information for the second word line during a refresh operation.

Abstract: A process for producing a semiconductor device includes: forming an SiC epitaxial layer on an SiC substrate; implanting the epitaxial layer with ions; forming a gettering layer having a higher defect density than a defect density of the SiC substrate; and carrying out a heat treatment on the epitaxial layer. The semiconductor device includes an SiC substrate, an SiC epitaxial layer formed on the SiC substrate, and a gettering layer having a higher defect density than a defect density of the SiC substrate.

Abstract: Provided is a semiconductor storage device including: first memory cells; first word lines; first bit lines; a first common bit line; second memory cells; second word lines; second bit lines; a second common bit line; a first selection circuit that connects the first common bit line to a first bit line selected from the first bit lines; a second selection circuit that connects the second common bit line to a second bit line selected from the second bit lines; a word line driver that activates any one of the first and second word lines; a reference current supply unit that supplies a reference current to a common bit line among the first and second common bit lines, the common bit line not being electrically connected to a data read target memory cell; and a sense amplifier that amplifies a potential difference between the first and second common bit lines.

Abstract: A memory cell (101) includes a memory transistor (10A) having channel length L1 and channel width W1, and a plurality of select transistors (10B) each electrically being connected in series with the memory transistor and independently having channel length L2 and channel width W2, wherein each of the memory transistor and the plurality of select transistors includes an active layer (7A) formed from a common oxide semiconductor film, the memory transistor is a transistor which is capable of being irreversibly changed from a semiconductor state where drain current Ids depends on gate voltage Vg to a resistor state where drain current Ids does not depend on gate voltage Vg, and channel length L2 is greater than channel length L1.

Abstract: A memory device includes a first inverter, a second inverter cross-coupled with the first inverter, an accessing unit, and a switching unit. The accessing unit is configured to discharge an output of the first inverter and charge an output of the second inverter according to signals provided by a first word line and a second word line. The switching unit is configured to disconnect a power from the first inverter and the second inverter according to a signal provided by the first word line.

Abstract: Systems and methods of data inversion, circuitry, detection and/or schemes are disclosed. According to illustrative implementations, exemplary circuitry may include static detection or detection circuitry such as those involving static current sources to detect a threshold for data inversion, pre-conditioning of detection circuitry, and/or active detection circuitry or schemes. In some implementations, exemplary memory or data inversion circuitry may comprise a transistor array, a bias generator, and a sense amplifier, wherein the transistor array may comprise at least one pair of transistor circuits arranged so that an output of the transistor array is provided as a sum or function of signal/current outputs of at least some of the transistor circuits in the array. As set forth, various systems, methods and circuitry herein may posses only a 3 static gate delay, such that very high speed and/or fast flow-through is achieved.

Abstract: To provide a memory device where multiple pieces of multilevel data can be written and read. The memory device includes first to fifth transistors, first to fourth capacitors, first to fourth nodes, and first and second wirings. The first node is connected to the first capacitor and a gate of the first transistor, the second node is connected to the second capacitor and a gate of the second transistor, the third node is connected to the third capacitor and a gate of the third transistor, and the fourth node is connected to the fourth capacitor and a gate of the fourth transistor. Multiple pieces of multilevel data is written to the first to fourth nodes through the second to fifth transistors. The second to fifth transistors each preferably include an oxide semiconductor in a channel formation region.

Abstract: The semiconductor device according to the present invention includes a semiconductor layer, an interlayer dielectric film formed on the semiconductor layer, a wire formed on the interlayer dielectric film with a metallic material to have a width of not more than 0.4 ?m, and a broad portion integrally formed on the wire to extend from the wire in the width direction thereof.

Abstract: An apparatus comprises an amplifier comprising at least one metal oxide semiconductor (MOS) transistor having a parasitic gate-to-drain capacitance, and at least one MOS neutralization device having a neutralization capacitance configured to compensate for the parasitic gate-to-drain capacitance of the at least one MOS transistor.

Abstract: A semiconductor device includes a two-input NAND circuit including four MOS transistors arranged in a line. Each of the MOS transistors is disposed on a planar silicon layer disposed on a substrate. The drain, gate, and source of the MOS transistor are arranged in the vertical direction. The gate surrounds a silicon pillar. The planar silicon layer is constituted by a first activation region of a first conductivity type and a second activation region of a second conductivity type. The first and second activation regions are connected to each other via a silicon layer disposed on a surface of the planar silicon layer, so as to form a NAND circuit having a small area.

Abstract: Semiconductor device capable of preventing off-leakage of the transistor may include a pulse voltage generator configured to generate a pulse voltage, and a transistor configured to have a gate provided with the pulse voltage. The transistor is in an off state in response to the pulse voltage.

Abstract: A memory macro includes a plurality of segments corresponding to a plurality of tracking circuits. Each segment of the plurality of segments thereby corresponds to one tracking circuit of the plurality of tracking circuits. In response to a read operation of a memory cell of a segment, a tracking circuit corresponding to the segment is configured to generate an edge of a tracking signal based on which a first edge of a cell signal associated with the memory cell is generated.

Abstract: Provided is a semiconductor device including a sequential circuit including a first transistor and a capacitor. The first transistor includes a semiconductor layer including indium, zinc, and oxygen to form a channel formation region. A node electrically connected to a source or a drain of the first transistor and a capacitor becomes a floating state when the first transistor turns off, so that a potential of the node can be maintained for a long period. A power-gating control circuit may be provided to control supply of power supply potential to the sequential circuit. The potential of the node still can be maintained while supply of the power supply potential is stopped.

Abstract: The present disclosure includes apparatuses and methods related to performing logical operations using sensing circuitry. An example apparatus comprises an array of memory cells and sensing circuitry coupled to the array. The sensing circuitry is configured to perform a logical operation using a data value stored in a first memory cell coupled to a sense line as a first input and a data value stored in a second memory cell coupled to the sense line as a second input. The sensing circuitry is configured to perform the logical operation without transferring data via a sense line address access.

Abstract: The present disclosure includes apparatuses and methods related to performing compare and/or report operations using sensing circuitry. An example method can include charging an input/output (IO) line of a memory array to a voltage. The method can include determining whether data stored in the memory array matches a compare value. The determination of whether data stored matches a compare value can include activating a number of access lines of the memory array. The determination can include sensing a number of memory cells coupled to the number of access lines. The determination can include sensing whether the voltage of the IO line changes in response to activation of selected decode lines corresponding to the number of memory cells.

Abstract: A semiconductor memory cell includes a floating body region configured to be charged to a level indicative of a state of the memory cell; a first region in electrical contact with said floating body region; a second region in electrical contact with said floating body region and spaced apart from said first region; and a gate positioned between said first and second regions. The cell may be a multi-level cell. Arrays of memory cells are disclosed for making a memory device. Methods of operating memory cells are also provided.