Abstract: A system and method include determining, by a memory controller associated with a memory device, a value of a parameter of a write pulse for a plurality of bits of a B-bit word to be stored in the memory device. The value of the parameter is based upon a relative importance of a bit position of the plurality of bits in the B-bit word to a performance of a machine learning or signal processing task involving the B-bit word, a fidelity metric, and a resource metric. The system and method also include writing each of the plurality of bits of the B-bit word in a different sub-array of the memory device using the write pulse generated based on the value of the parameter determined for a particular one of the plurality of bits.

Abstract: According to one embodiment, a magnetic memory device includes a stacked body and a controller. The stacked body includes a first conductive layer, a second conductive layer, a first magnetic layer provided between the first conductive layer and the second conductive layer, a second magnetic layer provided between the first magnetic layer and the second conductive layer, and a nonmagnetic layer provided between the first magnetic layer and the second magnetic layer. A resistance value per unit area of the nonmagnetic layer exceeds 20 ??m2. The controller is electrically connected to the first conductive layer and the second conductive layer, and supplies a write pulse to the stacked body in a first operation.

Abstract: A spin-transfer torque (STT) magnetoresistive memory device includes a first electrode, a second electrode, and a magnetic tunnel junction located between the first electrode and the second electrode. The magnetic tunnel junpction includes a reference layer having a fixed magnetization direction, a free layer stack, and a nonmagnetic tunnel barrier layer located between the reference layer and the free layer stack. The free layer stack has a total thickness of less than 2 nm, and contains in order, a proximal ferromagnetic layer located proximal to the nonmagnetic tunnel barrier layer, a first non-magnetic metal sub-monolayer, an intermediate ferromagnetic layer, a second non-magnetic metal sub-monolayer, and a distal ferromagnetic layer.

Abstract: A magnetic recording array includes: a plurality of domain wall moving elements; a first wiring which is electrically connected to a reference potential and is electrically connected to at least one domain wall moving element of the plurality of domain wall moving elements; a second wiring which is electrically connected to at least two or more domain wall moving elements of the plurality of domain wall moving elements; a first switching element which is connected between each of the domain wall moving elements and the first wiring; and a second switching element which is connected between each of the domain wall moving elements and the second wiring, wherein an OFF resistance of the first switching element is smaller than an OFF resistance of the second switching element.

Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a first magnetic tunneling junction (MTJ) pattern on a substrate, a second MTJ pattern adjacent to the first MTJ pattern, and a third MTJ pattern between the first MTJ pattern and the second MTJ pattern. Preferably, the first MTJ pattern, the second MTJ pattern, and the third MTJ pattern constitute a staggered arrangement.

Abstract: A device for generating a random electric signal, including an input duct, an output duct, a generator of magnetic particles generating magnetic particles in the input duct, a diffusion chamber connected to the input duct and the output duct, wherein the diffusion chamber is designed to diffuse the generated magnetic particles, a displacement unit for displacement of the generated magnetic particles towards the diffusion chamber, and a converter that is designed to generate an electrical signal proportional to a characteristic, wherein the characteristic is the particle density in the diffusion chamber or the passage of magnetic particles at a predetermined location of an output duct connected to the diffusion chamber.

Abstract: A magnetic tunnel junction (MTJ) structure having faceted sidewalls is formed on a conductive landing pad that is present on a surface of an electrically conductive structure embedded in a dielectric material layer. No metal ions are re-sputtered onto the sidewalls of the MTJ structure during the patterning of the MTJ material stack that provides the MTJ structure. The absence of re-sputtered metal on the MTJ structure sidewalls reduces the risk of shorts.

Abstract: A storage device is provided which shares a host memory with a host. The storage device includes an interface that exchanges data with the host and implements a protocol to use a partial area of the host memory as a buffer of the storage device. A storage controller of the storage device monitors deterioration information of a first area of the buffer and transmits a corruption prediction notification associated with the first area to the host based on a result of the monitoring.

Abstract: The disclosed technology relates generally to magnetic random access memory, and more particularly to spin-orbit-torque (SOT) magnetoresistive random access memory (MRAM). According to an aspect, a MRAM device comprises a first transistor, a second transistor, and a resistive memory element. The resistive memory element comprises a magnetic tunnel junction (MTJ) pillar arranged between a top electrode and bottom electrode having a first terminal and a second terminal. According to another aspect, a method of using the MRAM device is disclosed.

Abstract: Some embodiments relate to a method for manufacturing a magnetoresistive random-access memory (MRAM) cell. The method includes forming a spacer layer surrounding at least a magnetic tunnel junction (MTJ) layer and a top electrode of the MRAM cell; etching the spacer layer to expose a top surface of the top electrode and a top surface of a spacer formed by the spacer layer; forming an upper etch stop layer over the top electrode top surface and the spacer top surface; and forming an upper metal layer in contact with the top electrode top surface of the MRAM cell. A width of the upper etch stop layer is greater than a width of a bottom surface of the upper metal layer.

Abstract: A recording head that includes a reader having a front end at a bearing surface of the recording head and a rear end behind the bearing surface. The reader has a non-rectangular shape with a front-end width that is less than an average width of the reader. A first bias element is positioned proximate to a first side of the reader, and a second bias element is positioned proximate to a second side of the reader. Each of the first and second bias elements has a bias level that is a function of a ratio of the front-end width to the average width of the reader.

Abstract: A magnetic tunnel junction memory device is disclosed. In one aspect, the memory device comprises a substrate, a first memory element, and a second memory element, wherein the first memory element and the second memory element are formed of a stack comprising at least a first layer and a second layer, the first layer being arranged between the substrate and the second layer. The memory device further comprises a first selector device arranged to contact the first memory element, and a second selector device arranged to contact the second memory element, wherein the first selector device and the second selector device are arranged in or above the second layer. The first memory element and the second memory element are interconnected via the first layer, and are separated from each other by a trench formed in the second layer.

Abstract: The present disclosure relates to a structure including a differential memory array circuit which is configured to perform a binary convolution of two input word operands by accumulating a summation of currents through a plurality of bits which are each arranged between a wordline and a sourceline in a horizontal direction and bitlines in a vertical direction.

Abstract: Structures and methods for a multi-bit phase change memory are provided herein. A method includes establishing a write-reference voltage that incrementally ramps over a write period. The increments of the write-reference voltage correspond to discrete resistance states of a storage cell of the multi-bit phase change memory.

Abstract: A spin-orbit-torque magnetoresistance effect element of the present invention includes: a functional unit, a first ferromagnetic layer whose magnetization direction is configured to be fixed, a second ferromagnetic layer whose magnetization direction is configured to change, and a non-magnetic layer located between the first ferromagnetic layer and the second ferromagnetic layer being laminated therein; a spin-orbit torque wiring which extends in a first direction which intersects a lamination direction of the functional unit and is joined to the second ferromagnetic layer; a heat sink layer which extends in the first direction, is disposed so that the heat sink layer and the spin-orbit torque wiring at least partially overlap when viewed in a plan view from the lamination direction, and is provided spaced from the spin-orbit torque wiring in the lamination direction by a distance of twice a thickness of the functional unit or less in the lamination direction thereof.

Abstract: Disclosed are techniques for forming and operating magnetic memory devices.

Abstract: A memory device can include a plurality of memory cells formed in a substrate, each having a resistive element programmable between at least two different resistance states, including memory cells configured to store data received by the memory device, and reference cells; a reference circuit formed in the substrate configured to generate at least a first reference resistance from resistances of a plurality of reference cells; a sense circuit formed in the substrate coupled to the memory cells and at least the first reference resistance and configured to compare a resistance of a selected memory cell to at least the first reference resistance to determine the data stored by the selected memory cell.

Abstract: Methods of forming a MTJ dummy fill gradient across near-active-MRAM-cell periphery and far-outside-MRAM logic regions and the resulting device are provided. Embodiments include providing an embedded MRAM layout with near-active-MRAM-cell periphery logic and far-outside-MRAM logic regions; forming a MTJ structure within the layout based on minimum space and distance rules relative to a first metal layer, a second metal layer, and/or both the first and second metal layers; forming a high-density MTJ dummy structure in the near-active-MRAM-cell periphery logic region based on second minimum space and distance rules relative to a first metal layer, a second metal layer, and/or both the first metal layer and the second metal layer; and forming a low-density MTJ dummy structure in the far-outside-MRAM logic region based on third minimum space and distance rules relative to a first metal layer, a second metal layer, and/or both the first metal layer and the second metal layer.

Abstract: A voltage controlled magnetic random memory unit, a memory, and a logic device thereof. The memory unit includes: a ferroelectric layer applied with a first positive or negative voltage to control a directional switching of magnetization; a spin-orbit coupling layer located above the ferroelectric layer and applied with a second voltage to produce a spin current in a direction perpendicular to the spin-orbit coupling layer; a first magnetic layer located above the spin-orbit coupling layer, wherein, the spin current induces a random up and down magnetic switching of the first magnetic layer. The spin current may induce a directional switching of the first magnetic layer in conjunction with the first voltage applied to the ferroelectric layer.

Abstract: A memory includes (n?1) non-volatile cells, (n?1) bit lines and a current driving circuit. Each of the (n?1) non-volatile cells includes a first terminal and a second terminal. An ith bit line of the (n?1) bit lines is coupled to a first terminal of an ith non-volatile cell of the (n?1) non-volatile cells. The current driving circuit includes n first transistors coupled to the (n?1) non-volatile cells.

Abstract: A magnetoresistive device may include multiple magnetic tunnel junction (MTJ) stacks separated from each other by one or more dielectric material layers and electrically conductive vias extending through the one more dielectric material layers. Each MTJ stack may include multiple MTJ bits arranged one on top of another and the electrically conductive vias may be configured to electrically access each MTJ bit of the multiple MTJ stacks.

Abstract: A device according to examples of the present disclosure includes a crossbar array including a cell. The cell includes a first resistance switch and a second resistance switch connected in series with the first resistance switch. The first and second resistance switches have different switching characteristics. One of the first and second resistance switches may act as a switch, while the other of the first and second resistance switches may weight the switching behavior of the one that acts as the switch.

Abstract: To provide a control circuit capable of reliably generating a reference potential while suppressing increase in power consumption and cost. Provided is a control circuit that performs control to separate from a sense amplifier a second reference element set to a predetermined resistance state, which is different from a first reference element set to a predetermined resistance state and connected to the sense amplifier in generating a reference potential used for data read through the sense amplifier from a memory cell.

Abstract: There is provided a magnetic memory that can suppress the increase in manufacturing costs while recording multivalued information in one memory cell, the memory including first and second tunnel junction elements each having a laminated structure including a reference layer with a fixed magnetization direction, a recording layer with a reversible magnetization direction, and an insulating layer sandwiched between the reference layer and the recording layer, a first selection transistor electrically connected to first ends of the first and second tunnel junction elements, a first wire electrically connected to a second end of the first tunnel junction element, and a second wire electrically connected to a second end of the second tunnel junction element.

Abstract: One illustrative MRAM device disclosed herein includes a first bit cell and a second bit cell. The first bit cell comprises a first access transistor and a first MTJ stack. The first MTJ stack comprises a first pinned layer and a first free layer, wherein the first pinned layer is connected to the first access transistor. The second bit cell comprises a second access transistor and a second MTJ stack. The second MTJ stack comprises a second pinned layer and a second free layer, wherein the second free layer is connected to the second access transistor.

Abstract: A semiconductor storage device comprises first and second memory cells each including a variable-resistance element, a write driver, and a control circuit that concurrently performs an operation to read first data in the first memory cell and second data in the second memory cell, the operation to read the first data including a first write operation for a first time length and the operation to read the second data including a second write operation for a second time length. In the first write operation, the write driver applies, to the first memory cell, a first voltage for a third time length and a second voltage different from the first voltage for a fourth time length. In the second write operation, the write driver applies the first voltage to the second memory cell for a fifth time length longer than the third time length and longer than the fourth time length.

Abstract: A perpendicular spin transfer torque memory (pSTTM) device incorporates a magnetic tunnel junction (MTJ) device having a free magnetic stack and a fixed magnetic stack separated by a dielectric tunneling layer. The free magnetic stack includes an uppermost magnetic layer that is at least partially covered by a cap layer. The cap layer is at least partially covered by a protective layer containing at least one of: ruthenium (Ru); cobalt/iron/boron (CoFeB); molybdenum (Mo); cobalt (Co); tungsten (W); or platinum (Pt). The protective layer is at least partially covered by a cap metal layer which may form a portion of MTJ electrode. The protective layer minimizes the occurrence of physical and/or chemical attack of the cap layer by the materials used in the cap metal layer, beneficially improving the interface anisotropy of the MTJ free magnetic layer.

Abstract: Structures and methods for a multi-bit phase change memory, are provided herein. A method includes establishing a write-reference voltage that incrementally ramps over a write period. The increments of the write-reference voltage correspond to discrete resistance states of a storage cell of the multi-bit phase change memory.

Abstract: A semiconductor device includes a first electrode disposed on a substrate, a magnetic tunnel junction (MTJ) on the first electrode, a capping layer on the MTJ, a stress-inducing layer on the capping layer, and a second electrode on the stress-inducing layer. The stress-inducing layer may have tensile stress.

Abstract: Spin-orbit-torque (SOT) segments are provided along the sides of free layers in magnetoresistive devices that include magnetic tunnel junctions. Current flowing through such SOT segments injects spin current into the free layers such that spin torque is applied to the free layers. The spin torque can be used as an assist to spin-transfer torque generated by current flowing vertically through the magnetic tunnel junction in order to improve the efficiency of the switching current applied to the magnetoresistive device.

Abstract: A resistive memory with a self-termination control function and a self-termination control method for a resistive memory are provided. At least one memory cell comprises a cell transistor and a resistive element. A termination switch coupled to a source line terminates a write operation according to a comparison result. The comparator compares a voltage of a source line node with a reference voltage to output the comparison result, wherein the source line node is between the at least one memory cell and the termination switch, and the voltage of the source line node responses to the resistance of the resistive element. The variable resistance circuit provides an effective resistance according to a target resistance of the resistive element and outputs a reference current. The reference voltage node is coupled to the variable resistance circuit and the comparator and receives the reference current to provide the reference voltage to the comparator.

Abstract: An apparatus. The apparatus includes a macro storage cell having a first storage device and a second storage device. The first and second storage devices each able to store more than two states. The macro storage cell to store multiple values resulting from a combination of the respectively stored states of the first and second storage devices.

Abstract: Techniques and circuits for testing and configuring bias voltage or bias current for write operations in memory devices are presented. Registers and nonvolatile storage is included on the memory devices for storing values used to control testing of the memory devices as well as for configuring parameters related to both testing and normal operation.

Abstract: In one embodiment, a SOT device is provided that replaces a traditional NM layer adjacent to a magnetic layer with a NM layer that is compatible with CMOS technology. The NM layer may include a CMOS-compatible composite (e.g., CuPt) alloy, a TI (e.g., Bi2Se3, BixSe1-x, Bi1-xSbx, etc.) or a TI/non-magnetic metal (e.g., Bi2Se3/Ag, BixSe1-x/Ag, Bi1-xSbx/Ag, etc.) interface, that provides efficient spin current generation. Spin current may be generated in various manners, including extrinsic SHE, TSS or Rashba effect.

Abstract: A magnetic recording array includes: a plurality of domain wall moving elements; a first wiring which is electrically connected to a reference potential and is electrically connected to at least one domain wall moving element of the plurality of domain wall moving elements; a second wiring which is electrically connected to at least two or more domain wall moving elements of the plurality of domain wall moving elements; a first switching element which is connected between each of the domain wall moving elements and the first wiring; and a second switching element which is connected between each of the domain wall moving elements and the second wiring, wherein an OFF resistance of the first switching element is smaller than an OFF resistance of the second switching element.

Abstract: Circuits are described that use metallization on both sides techniques to integrate two different types of non-volatile embedded memory devices within a single monolithic integrated circuit device. In an embodiment, a monolithic integrated circuit structure is provided that includes a device layer having one or more logic transistors. A front side interconnect layer is provided above the device layer, as seen in a vertical cross-section taken through the monolithic integrated circuit from top to bottom. A back side interconnect layer is provided below the device layer, as seen in the vertical cross-section. A first type of non-volatile memory device is provided in the front side interconnect layer, and a second type of non-volatile memory device different from the first type of non-volatile memory device is provided in the back side interconnect layer. A back side contact may be used to connect the device layer to a back side interconnect layer.

Abstract: A MRAM device includes a spin valve containing a reference layer having a fixed magnetization direction, a free layer, and a nonmagnetic metallic barrier layer located between the reference layer and the free layer, a metallic assist structure configured to provide rotating spin transfer torque to the free layer to assist the free layer switching during programming, and a first nonmagnetic metallic spacer layer located between the free layer and the metallic assist structure.

Abstract: An example apparatus includes a memory comprising a plurality of managed units corresponding to respective groups of resistance variable memory cells and a controller coupled to the memory. The controller is configured to cause performance of a cleaning operation on a selected group of the memory cells and generation of error correction code (ECC) parity data. The controller may be further configured to cause performance of a write operation on the selected group of cells to write an inverted state of at least one data value to the selected group of cells and write an inverted state of at least one of the ECC parity data to the selected group of cells.

Abstract: Methods, systems, and devices for memory arrays having graded memory stack resistances are described. An apparatus may include a first subset of memory stacks having a first resistance based on a physical and/or electrical distance of the first subset of memory stacks from at least one of a first driver component or a second driver component. The apparatus may include a second subset of memory stacks having a second resistance that is less than the first resistance based on a physical and/or electrical distance of the second subset of memory from at least one of the first driver component or the second driver component.

Abstract: A memory device includes a magnetoresistive element including first and second magnetic layers and a non-magnetic layer provided between the first and second magnetic layers. The memory device also includes a write circuit which controls a first writing setting magnetization of the first and second magnetic layers in a parallel state and a second writing setting the magnetization of the first and second magnetic layers in an antiparallel state, and applies a write current to the magnetoresistive element. A first write current in the first writing includes a first pulse and a second pulse added to the first pulse. A width of the second pulse is smaller than a width of the first pulse, and a current level of the second pulse is different from a current level of the first pulse.

Abstract: A magnetic memory device, a method for manufacturing a magnetic memory device, and a substrate treating apparatus, the device including a substrate including a first memory region and a second memory region; a first magnetic tunnel junction pattern on the first memory region, the first magnetic tunnel junction pattern including a first free pattern and a first oxide pattern on the first free pattern; and a second magnetic tunnel junction pattern on the second memory region, the second magnetic tunnel junction pattern including a second free pattern and a second oxide pattern on the second free pattern, wherein a ratio of a thickness of the first oxide pattern to a thickness of the first free pattern is different from a ratio of a thickness of the second oxide pattern to a thickness of the second free pattern.

Abstract: An output driver is disclosed. An output driver may include a pre-driver and a main driver coupled to the pre-driver. The main driver may include at least one switch, and a first transistor coupled between a first supply voltage and the at least one switch. The main driver may also include a second transistor coupled between a second, different supply voltage and the at least one switch. The at least one switch is configured to couple an output node of the output driver to one of the first transistor and the second transistor in response to receipt of a control signal. The main driver may also include a third transistor coupled between a reference voltage and the output node. An electronic system including at least one output driver, and methods of operating an output driver are also described.

Abstract: According to one embodiment, a magnetic memory device includes a conductive member, a first element portion, and a controller. The conductive member includes a first portion, a second portion, and a third portion between the first portion and the second portion. The first element portion includes a first element, a first interconnect, and a first circuit. The first element includes a first magnetic layer, a first counter magnetic layer, and a first nonmagnetic layer. The first counter magnetic layer is provided between the third portion and the first magnetic layer. The first nonmagnetic layer is provided between the first counter magnetic layer and the first magnetic layer. The first interconnect is electrically connected to the first magnetic layer. The first circuit is electrically connected to the first interconnect. The first circuit includes a first switch, a first capacitance element, a first parallel switch, and a first parallel capacitance element.

Abstract: A data write circuit of a resistive memory element is provided, the device being capable of writing with low writing energy using a simple circuit. The data write circuit of the resistive memory element, includes: a complementary resistive memory element; writing means for making the complementary resistive memory element cause a resistance change; detection means for detecting a writing state in the complementary resistive memory element; and control means for controlling writing by the writing means, based on a detected signal of the detection means.

Abstract: A memory device includes a memory cell connected to a bit line and a source line, a read and write circuit configured to read data of the memory cell and/or write data in the memory cell, and a switch circuit configured to receive a selection signal based on a power supply voltage. The switch circuit includes a first switch connected between the bit line and the read and write circuit, a second switch connected between the source line and the read and write circuit, and a switch controller configured to turn on or turn off the first and the second switches based on the selection signal using one of a read voltage and a write voltage that are different from the power supply voltage.

Abstract: A magnetic memory device includes a buffer layer on a substrate, a magnetic tunnel junction structure including a fixed layer structure, a tunnel barrier, and a free layer that are sequentially arranged on the buffer layer, and a spin-orbit torque (SOT) structure on the magnetic tunnel junction structure and including a topological insulator material, wherein the free layer includes a Heusler material.

Abstract: A magnetic wall utilization-analog memory element includes a magnetic wall driving layer including a magnetic wall, a first region, a second region, and a third region located between the first region and the second region, a magnetization fixed layer provided at a the third region through a nonmagnetic layer, and a lower electrode layer provided at a position in the third region that overlaps the magnetization fixed layer in plan view on a second surface opposite to a first surface on which the magnetization fixed layer is provided.

Abstract: A bistable device allows supercurrent to flow when functioning in one regime, wherein magnetization directions of different magnetic layers are antiparallel, but restricts supercurrent when switched to function in a resistive regime, wherein the magnetization directions are parallel. In the first regime, the device acts as a Josephson junction, which allows it to be used in superconducting quantum interference devices (SQUIDs) and other circuits in which quantization of magnetic flux in a superconducting loop is desired. In the second, resistive regime, flux quantization is effectively eliminated in loops containing the device, and current is diverted to parallel superconducting components. The bistable device thereby acts as a superconducting switch, useful for a variety of circuit applications, including to steer current for memory or logic circuits, adjust logical circuit functionality at runtime, or to burn off stray flux during cooldown.

Abstract: A memory device includes a memory cell array including a plurality of memory cells and a control logic to control a write operation on the memory cell array. When operating in a first data comparison write (DCW) mode, data is written to first memory cells in which data values are changed, in a first region, data is written to second memory cells in which data values are not changed, and, in a second region, data write is skipped for second memory cells in which data values are not changed.

Abstract: An initialization process is disclosed for a perpendicular magnetic tunnel junction (p-MTJ) wherein the switching error rate is reduced from a typical range of 30-100 ppm to less than 10 ppm. In one embodiment, an in-plane magnetic field is applied after a final anneal step is performed during memory device fabrication such that all magnetizations in the free layer, and AP1 and AP2 pinned layers are temporarily aligned “in-plane”. After the applied field is removed, interfacial perpendicular magnetic anisotropy (PMA) at a tunnel barrier/AP1 interface induces a single AP1 magnetic domain with a magnetization in a first vertical direction. Interfacial PMA at a FL/tunnel barrier interface affords a single FL domain with magnetization in the first direction or opposite thereto. AP2 magnetization is opposite to the first direction as a result of antiferromagnetic coupling with the AP1 layer. Alternatively, a perpendicular-to-plane magnetic field may be applied for initialization.