Abstract: Provided herein are a semiconductor memory device and a method of operating the same. The semiconductor memory device may include a memory cell array, a peripheral circuit, and a control logic. The memory cell array may include a plurality of memory cells. The peripheral circuit may perform a program operation on selected memory cells coupled to a selected word line among the plurality of memory cells. The control logic may control the program operation of the peripheral circuit. The program operation may include a plurality of program loops. Each of the program loops may include a program phase and a verify phase. The verify phase may include one or more verify operations. The control logic may be further configured to count a number of the verify operations performed by the peripheral circuit in the verify phase included in one of the plurality of program loops during the program operation.

Abstract: A memory device includes a first pillar coupled with a first data line, a second pillar coupled with a second data line, wordlines coupled with first and second pillars. Control logic is to cause: wordlines to be discharged after a program pulse is applied to selected wordline; a supply voltage be applied to second data line to cause a voltage of second pillar to float; a ground voltage be applied to first data line to inhibit soft erase via first pillar; unselected wordlines be charged to boost channel voltages in memory cells coupled with the second pillar; and one of the ground voltage or a negative voltage be applied to the selected wordline to increase soft erase voltage between a channel of a memory cell coupled with the second pillar and the selected wordline, causing a threshold voltage stored in the memory cell to be erased.

Abstract: Some embodiments include an assembly having a stack of alternating dielectric levels and conductive levels. Channel material pillars extend through the stack. Some of the channel material pillars are associated with a first sub-block, and others of the channel material pillars are associated with a second sub-block. Memory cells are along the channel material pillars. An insulative level is over the stack. A select gate configuration is over the insulative level. The select gate configuration includes a first conductive gate structure associated with the first sub-block, and includes a second conductive gate structure associated with the second sub-block. The first and second conductive gate structures are laterally spaced from one another by an intervening insulative region. The first and second conductive gate structures have vertically-spaced conductive regions, and have vertically-extending conductive structures which electrically couple the vertically-spaced conductive regions to one another.

Abstract: Disclosed is a system including a memory device having a plurality of physical memory blocks and associated with a logical address space that comprises a plurality of zones, wherein each zone comprises a plurality of logical block addresses (LBAs), and a processing device, operatively coupled with the memory device, to perform operations of receiving a request to store data referenced by an LBA associated with a first zone of the plurality of zones, obtaining a version identifier of the first zone, obtaining erase values for a plurality of available physical memory blocks of the memory device, selecting, in view of the version identifier of the first zone and the erase values, a first physical memory block of the plurality of available physical memory blocks, mapping a next available LBA within the first zone to the first physical memory block, and storing the data in the first physical memory block.

Abstract: A resistive memory device includes a first bit line group including a first edge bit line, a second bit line group including a second edge bit line, and a first boundary transistor configured to apply a non-selection voltage to the second edge bit line according to a selection of the first edge bit line. The first edge bit line of the first bit line group is disposed closest to the second bit line group, and the second edge bit line of the second bit line group is disposed closest to the first bit line group.

Abstract: In response to a request to store new data at a memory location of a bitwise programmable non-volatile memory, data stored at the memory location of the bitwise programmable memory is sensed. The bits of the sensed data are compared with bits of the new data. An indication of a cost difference is determined between a first burst of bitwise programming operations associated with programming bits of the new data which are different from bits of the sensed data, and a second burst of bitwise programming operations associated with programming bits of a complementary inversion of the new data which are different from bits of the sensed data. One of the first burst of bitwise programming operations or the second burst of bitwise programming operations is executed based on the generated indication of the cost difference.

Abstract: The present technology relates to an electronic device. According to the present technology, a memory device having improved verify accuracy may include a memory block including memory cells, a read and write circuit including a plurality of page buffers, a current sensing circuit configured to perform a verify operation of comparing sensing voltages with a reference voltage, and a control logic configured to control the current sensing circuit to perform the verify operation. The control logic controls performing a first verify operation on each of page buffer groups having a same logical group number, and performing a second verify operation on each of page buffer groups having a same physical group number, and the current sensing circuit outputs a verify pass signal in response to both results of the first verify operation and the second verify operation satisfying a pass criterion.

Abstract: To program in a nonvolatile memory device including a cell region including first metal pads and a peripheral region including second metal pads and vertically connected to the cell region by the first metal pads and the second metal pads, a memory block is provided with a plurality of sub blocks disposed in a vertical direction where the memory block includes a plurality of cell strings each including a plurality of memory cells connected in series and disposed in the vertical direction. A plurality of intermediate switching transistors are disposed in a boundary portion between two adjacent sub blocks in the vertical direction. Each of the plurality of intermediate switching transistors is selectively activated based on a program address during a program operation. The selectively activating each of the plurality of intermediate switching transistors includes selectively turning on one or more intermediate switching transistors in a selected cell string based on the program address.

Abstract: A memory device includes a memory block, a peripheral circuit, and a control logic. The memory block includes a plurality of string groups respectively connected to a corresponding select line, among a plurality of select lines. The peripheral circuit performs a program operation of data on the memory block. The control logic controls the program operation of the peripheral circuit. The memory block is connected to first to n-th word lines. The control logic is configured to control the peripheral circuit to perform a first program operation on a physical page, among physical pages that are included in a first string group, connected to an i-th word line, performs a second program operation on a physical page that is connected to an (i?1)-th word line, and perform a dummy program operation on a physical page that is connected to an (i+1)-th word line. Here, n is a natural number equal to or greater than 3, and i is a natural number greater than 0 and less than n?1.

Abstract: A 3-dimensional flash memory device and methods of fabricating and driving the same are provided. The device includes: a channel layer extending over a substrate in a first direction perpendicular to a surface of the substrate; an information storing layer extending along a sidewall of the channel layer in the first direction; control gates each surrounding the channel layer, with the information storing layer between the channel layer and the control gates; an insulating layer being between the control gates in the first direction and separating the control gates from each other; a fixed charge region disposed at an interface of the insulating layer and the information storing layer or in a portion of the information storing layer between the control gates in the first direction; and a doped region induced by the fixed charge region and disposed at a surface of the channel layer facing the fixed charge region.

Abstract: A memory management method configured for a rewritable non-volatile memory module, a memory storage device, and a memory control circuit unit are provided. The rewritable non-volatile memory module includes a plurality of dies, wherein each of the dies includes a plurality of planes, each of the planes includes a plurality of physical erasing units, and a sum of a number of the planes included in the rewritable non-volatile memory module is a first number. The method includes: grouping the plurality of physical erasing units into a plurality of management units. Each of the plurality of physical erasing units included in each of the management units belongs to a different plane, and each of the management units has a second number of the physical erasing units, wherein the second number is less than the first number.

Abstract: A system includes a memory device and a processing device, operatively coupled with the memory device, to perform operations including: receiving a request to perform a read operation on a segment of the memory device; determining a program erase cycle count associated with the segment of the memory device; determining a temperature offset value for the segment of the memory device based on a write temperature and a read temperature, determining whether the temperature offset value satisfies a threshold criterion associated with the program erase cycle count of the segment; and responsive to determining that the temperature offset value satisfies the threshold criterion, performing a corrective read operation on the segment of the memory device, wherein a sense time parameter of the corrective read operation is modified according to the temperature offset value and the program erase cycle count.

Abstract: The present disclosure relates to a logic operation circuit for computation in memory, which comprises an equivalent circuit input terminal, a reference circuit input terminal, a reset input terminal and an output terminal; wherein the equivalent circuit input terminal is configured to input the equivalent voltage of a memory computing array, the reset input terminal is configured to input a reset voltage, and the reference circuit input terminal is configured to input a reference voltage; the logic operation circuit for computation in memory outputs different output voltages according to the difference between the equivalent voltage and the reference voltage, and the output voltage is output through the output terminal; the logic operation circuit of the present disclosure has a simple structure, reduced complexity and effectively saved resources.

Abstract: A nonvolatile memory device includes a first semiconductor layer and a second semiconductor layer. The first semiconductor layer includes word-lines, at least one string selection line, at least one ground selection line, and a memory cell array including at least one memory block. The second semiconductor includes a first address decoder and a second address decoder. The first address decoder is disposed under a first extension region adjacent to a first side of a cell region and includes a plurality of first pass transistors driving the word-lines, the at least one string selection line, and the at least one ground selection line. The second address decoder is disposed under a second extension region adjacent to a second side of the cell region and includes a plurality of second pass transistors driving the at least one string selection line and the at least one ground selection line.

Abstract: According to one embodiment, a semiconductor memory device includes a first string unit including a first memory string including a first selection transistor and a first memory cell coupled to the first selection transistor, a second string unit including a second memory string including a second selection transistor and a second memory cell coupled to the second selection transistor, a first select gate line, a second select gate line, a first bit line, a second bit line, and a first word line. Both of the first select gate line and the second select gate line are selected in a first read operation. The first select gate line is selected and the second select gate line is not selected in a second read operation.

Abstract: A semiconductor memory device and methods of manufacturing and operating the same are set forth. The semiconductor memory device includes a stack structure including a plurality of interlayer insulating layers and a plurality of gate electrodes, which may be alternately stacked on a substrate, and a plurality of channel structures penetrating the stack structure in a vertical direction. Each of the plurality of channel structures includes a channel layer, a tunnel insulating layer, an emission preventing layer, and a charge storage layer, each of which vertically extends toward the substrate.

Abstract: The present disclosure provides buffer circuits of 3D NAND memory device. In some embodiments, the buffer circuit comprises a first bit line segment sensing branch connected to a first bit line segment and including a low-voltage latch, and a second bit line segment sensing branch connected to a second bit line segment and including a sensing latch. The first bit line segment sensing branch and the second bit line segment sensing branch are parallel connected to a sensing node of the page buffer circuit.

Abstract: A memory device includes pages arranged in columns and each constituted by a plurality of memory cells on a substrate, voltages applied to a first gate conductor layer, a second gate conductor layer, a first impurity layer, and a second impurity layer in each memory cell included in each of the pages are controlled to perform a page write operation of retaining, inside a channel semiconductor layer, a group of positive holes generated by an impact ionization phenomenon or by a gate-induced drain leakage current, and the voltages applied to the first gate conductor layer, the second gate conductor layer, the first impurity layer, and the second impurity layer are controlled to perform a page erase operation of discharging the group of positive holes from inside the channel semiconductor layer.

Abstract: A circuit system includes a memory block and first and second processing circuits. The first and second processing circuits store a matrix in the memory block by concurrently writing elements in first and second rows or columns of the matrix to first and second regions of storage in the memory block, respectively. The first and second processing circuits transpose the matrix to generate a transposed matrix by concurrently reading elements in first and second rows or columns of the transposed matrix from third and fourth regions of storage in the memory block, respectively.

Abstract: A data item is programmed to a first set of management units (MUs) associated with a first portion of one or more memory devices. The first portion includes memory cells of a first type. The first set of MUs is associated with a first physical address. A mapping is generated in a virtual MU data structure that associates the first physical address with a set of virtual MUs associated with the one or more memory devices. An entry associated with the data item is added to a logical-to-physical (L2P) table associated with the one or more memory devices. The entry includes an identifier associated with the set of virtual MUs associated with the one or more memory devices. A detection is made that the data item is programmed to a second set of MUs associated with a second portion of the one or more memory devices. The second portion includes memory cells of a second type. The second set of MUs is associated with a second physical address.

Abstract: A memory device includes a memory cell array, a row address decoder configured to generate a plurality of main word line driving signals and a plurality of sub word line driving signals, based on an odd signal representing that a main word line driving signal driving an odd word line is activated, generate a plurality of encoded sub word line driving signals used for driving a target word line by outputting the plurality of sub word line driving signals in a first order, and, based on an even signal representing that a main word line driving signal driving an even word line is activated, generate the plurality of encoded sub word line driving signals by outputting the plurality of sub word line driving signals in a second order, and a word line driving circuit configured to drive the target word line at a first voltage level or a second voltage level.

Abstract: A semiconductor storage device includes memory cells, select transistors, memory strings, first and second blocks, word lines, and select gate lines. In the memory string, the current paths of plural memory cells are connected in series. When data are written in a first block, after a select gate line connected to the gate of a select transistor of one of the memory strings in the first block is selected, the data are sequentially written in the memory cells in the memory string connected to the selected select gate line. When data are written in the second block, after a word line connected to the control gates of memory cells of different memory strings in the second block is selected, the data are sequentially written in the memory cells of the different memory strings in the second block which have their control gates connected to the selected word line.

Abstract: A Zoned Namespace data storage device configured to perform logical-to-physical (L2P) address translation using a compacted L2P having an erase-block granularity. For a host logical address, the compacted L2P table only has the physical address of the corresponding erase block, which provides a first part of the pertinent physical address. A controller of the data storage device calculates a second part of the pertinent physical address based on the superblock layout employed in the device and further based on the sequential write requirement to the superblocks. The controller then obtains the full physical address corresponding to the host logical address by combining the first and second parts. The erase-block granularity of the compacted L2P table enables the full L2P table of the device to have a relatively small size, which can beneficially be used to make more space available in the same amount of RAM for other operations.

Abstract: A data storage system may connect a non-volatile memory to a quarantine module that generates a quarantine strategy in response to a pending data access request to the non-volatile memory. The quarantine strategy can proactively prescribing a plurality of status levels for physical data addresses of the non-volatile memory. A comparison of a volume of errors for the non-volatile memory to a first threshold of the quarantine strategy with the quarantine module may prompt the alteration of a first status level of the plurality of status levels for a first physical data address of the non-volatile memory, as directed by the quarantine strategy.

Abstract: The occurrence of an asynchronous power loss (APL) event is detected in a memory sub-system. In response, an APL handling operation is performed. The APL handing operation includes identifying a last written page at a first page location in a block of the memory device, wherein the last written page is associated with a memory cell of the memory device, copying data from the last written page and from a related page associated with the memory cell to a temporary storage area in the memory device, copying the data from the temporary storage area to a second page location in the block of the memory device, and providing a notification that the memory device has recovered from the APL event.

Abstract: A block storing corrupt data is detected. Based on detecting the block storing corrupt data, threshold voltage (VT) distribution data corresponding to the block is accessed. The VT distribution data comprises one or more VT distribution measurements corresponding to the block. The VT distribution data corresponding to the block is compared with reference VT distribution data. The reference VT distribution data comprises one or more reference VT distributions. Based on a result of the comparison, it is determined whether to perform one or more heroic data recovery processes on the block.

Abstract: In certain aspects, a memory device includes a memory string including a drain select gate (DSG) transistor, a plurality of memory cells, and a source select gate (SSG) transistor, and a peripheral circuit coupled to the memory string. The peripheral circuit is configured to in response to an interrupt during a program operation on a select memory cell of the plurality of memory cells, turn on at least one of the DSG transistor or the SSG transistor. The peripheral circuit is also configured to suspend the program operation after turning on the at least one of the DSG transistor or the SSG transistor.

Abstract: According to one embodiment, a memory system includes a semiconductor memory and a controller. The semiconductor memory includes: first memory cells, first word lines, a first row decoder, and a driver circuit. The first row decoder includes first transistors capable of coupling the first word lines to first signal lines, and a first block decoder supplying a first block selection signal to the first transistors. When the controller issues a data read command, the first block decoder asserts the first block selection signal to allow the first transistors to transfer a first voltage to a selected first word line, and a second voltage to unselected other first word lines. After data is read, the first block decoder continues asserting the first block selection signal, and the driver circuit transfers a third voltage.

Abstract: When selectively erasing one sub-block, a control circuit applies, in a first sub-block, a first voltage to bit lines and a source line, and applies a second voltage smaller than the first voltage to the word lines. Then, the control circuit applies a third voltage lower than the first voltage by a certain value to a drain-side select gate line and a source-side select gate line, thereby performing the erase operation in the first sub-block. The control circuit applies, in a second sub-block existing in an identical memory block to the selected sub-block, a fourth voltage substantially identical to the first voltage to the drain side select gate line and the source side select gate line, thereby not performing the erase operation in the second sub-block.

Abstract: An integrated circuit includes a first substrate. A MOS transistor has a first polysilicon region electrically isolated from the first substrate and including a gate region. A second polysilicon region is electrically isolated from the first polysilicon region and from the first substrate. The second polysilicon region includes a source region, a substrate region and a drain region of the MOS transistor. The first polysilicon region is located between an area of the first substrate and the second polysilicon region.

Abstract: A method for performing an erase operation of a partially programmed memory block of a non-volatile memory structure. The method comprises: (1) applying an erase voltage bias level to a channel region of the memory block, (2) applying a word line voltage level to all programmed word line(s) of the memory block, (3) applying a “float” condition to all unprogrammed word line(s) of the memory block, and (4) applying an erase verify operation to all word line(s) of the memory block, wherein the “float” condition comprises omitting application of the word line voltage to the unprogrammed word line(s).

Abstract: A three-dimensional flash memory is disclosed. According to one embodiment, the three-dimensional flash memory has a structure in which a boosting area is reduced, a structure to which a small block is applied, a structure to which a COP is applied and in which a wiring process is simplified, or a structure to which symmetrical U-shaped BiCS are applied.

Abstract: The embodiments of the present disclosure relate to a memory system for managing data corresponding to a plurality of zones and operating method thereof. According to embodiments of the present disclosure, the memory system may include i) a memory device including a plurality of memory blocks each including a plurality of pages, and ii) a memory controller configured to write data corresponding to a plurality of zones to a first area including two or more of the plurality of memory blocks, flush the data corresponding to a first zone among the plurality of zones to a second area including two or more of the plurality of memory blocks on determination that a flush condition set for the first zone is satisfied.

Abstract: A method for programming a target memory cell of a memory array of a non-volatile memory system, the method comprises determining a total number of erase/programming (EP) cycles that were applied previously to the memory cell and, (1) if the determined total number of cycles does not exceed a threshold value, applying an asymmetric programming scheme, and, (2) if the determined total number of cycles exceeds the threshold value, applying a symmetric programming scheme. Further, a magnitude of a boosting voltage bias (VPASS) that is to be applied to an unselected word line may be determined according to the determined total number of erase/programming (EP) cycles.

Abstract: Provided are a three-dimensional semiconductor memory device, a method for manufacturing the same, a method for operating the same, and an electronic system including the same. The three-dimensional semiconductor memory device includes a substrate, a stack structure on the substrate, and vertical channel structures, which are provided in channel holes penetrating the stack structure, wherein each of the vertical channel structures includes a data storage pattern, a vertical channel pattern, a conductive pad, and a vertical semiconductor pattern, wherein the vertical channel pattern includes a first portion contacting the upper surface of the substrate and a second portion provided between the data storage pattern and the vertical semiconductor pattern, and wherein the vertical semiconductor pattern is spaced apart from the substrate with the first portion of the vertical channel pattern therebetween.

Abstract: Various embodiments described herein provide for copying (e.g., to cache) a portion of defect management data for a block of a memory device, such as a non-volatile memory device of a memory sub-system, based on activity of the memory device. For instance, the portion of defect management data can be copied from a first-type memory device of the memory sub-system to a second-type memory device of the memory sub-system, where the first-type memory device stores defect management data for a working set of blocks of the non-volatile memory device being operated upon by the memory sub-system, where the second-type memory device is used to store defect management data for an active block of the working set of blocks, and where the second-type memory device has a faster access (e.g., read or write access) than the first-type memory device.

Abstract: A device and a method for integrated circuit assistance design, and a method for constructing an electrical performance gradient model are provided. The device includes a database and a processor. The database has an electrical performance gradient model. The electrical performance gradient model represents a gradient distribution of an electrical performance in a wafer. The processor is coupled to the database. The processor analyzes a designed circuit by using the electrical performance gradient model.

Abstract: A semiconductor device includes a memory cell array including a plurality of memory cells coupled between a multiplicity of word lines and one or more bit lines; and an operation circuit configured to perform a multiplication and accumulation (MAC) operation with one or more first multi-bit data provided from the one or more bit lines and one or more second multi-bit data, wherein a plurality of memory cells coupled to a bit line store a plurality of bits included in a corresponding one of the one or more first multi-bit data, and wherein the memory cell array sequentially provides the plurality of bits included in the corresponding first multi-bit data to the operation circuit.

Abstract: A method includes determining a programmed threshold voltage for a select gate of a memory string and assigning the select gate a programmed reliability rank based upon the programmed threshold voltage. The programmed reliability rank indicates that hot data, warm data, and/or or cold data are programmable to the memory string. The method further includes incrementing a quality characteristic count to a first check voltage value, determining a first checked threshold voltage for the select gate at the first check voltage value, and assigning the select gate a first reliability rank based upon the first checked threshold voltage. The first reliability rank indicates that the warm data or the cold data, or both, are programmable to the memory string.

Abstract: A memory device with one or more planes having sub-blocks is disclosed. The memory device may further include a voltage switch transistor for each of sub-blocks. Additionally, the memory device may further include a row decoder for each of sub-blocks. As a result, an operation to two sub-blocks can be performed at different times. For example, using a row decoder and voltage switch transistor, a sub-block can be initially read, followed by a subsequent read of another sub-block using a separate row decoder and voltage switch transistor. By staggering the read operations through a time delay, the peak current Icc associated with the supply voltage can be reduced.

Abstract: A page buffer circuit includes a plurality of page buffers connected to a plurality of bitlines. Each of the plurality of page buffers includes a bitline selection transistor configured to connect a corresponding bitline of the plurality of bitlines to a sensing node, a precharge circuit configured to precharge the sensing node, and a dynamic latch circuit configured to store data in a storage node. Each of the plurality of page buffers is configured to refresh the data stored in the storage node through charge sharing between the storage node and the sensing node.

Abstract: The present disclosure relates to a non-volatile memory device including at least an array of memory cells and with associated decoding and sensing circuitry and a memory controller, and a method for checking the erasing phase of the non-volatile device; the method comprises: performing a dynamic erase operation of at least a memory block; storing in a dummy row at least internal block variables of said dynamic erase operation and/or a known pattern.

Abstract: A storage system with privacy-centric multi-partitions and method for use therewith are provided. In one embodiment, a storage system comprises a memory configured to be partitioned into a plurality of partitions, wherein each partition is associated with its own boot block, and wherein each boot block is configured to boot any of the plurality of partitions. The storage system also comprises a controller configured to communicate with the memory and to: in response to a failure to boot one of the plurality of partitions with that partition's boot block, use a boot block of another one of the plurality of partitions to boot the one of the plurality of partitions; and restrict access to each of the plurality of partitions only to authenticated entities. Other embodiments are provided.

Abstract: Disclosed is a system including a memory device having a plurality of physical cells and a processing device, operatively coupled with the memory device. The processing device maintains association of block families with a first (second, etc.) bin of a plurality of bins, each of the plurality of bins associated with one or more read voltage offsets. The read voltage offsets are used to compensate for a temporal read voltage shift caused by a charge loss by memory cells of the block families. Responsive to an occurrence of a power event, the processing device performs diagnostics of one or more blocks of various block families and determines whether to maintain association of the block families with current bins of the respective block families or to associate the block families with different bins.

Abstract: A method for storing data comprises maintaining an address table for a memory space containing volatile memory and nonvolatile memory space. The nonvolatile memory space includes both multi-level cell (MLC) space and single level cell (SLC) space and the volatile memory includes a random access volatile memory element. An address table maps logical and physical addresses adaptable to the system by the address table. The mapping is performed as necessitated by the system to maximize lifetime maps data in at least one of volatile or nonvolatile memories. Storing received data within a controller memory associated with the at least one controller. Controlling access of the MLC and SLC nonvolatile memory elements and the random access volatile memory element for storage of the received data.

Abstract: A data storage device including, in one implementation, a memory device and a controller configured to configured to retrieve a plurality of physical memory addresses from a first lookup table in the non-volatile memory. Each physical memory address is a combination of a word line and a string number of the non-volatile memory and the each physical memory address has a first number of bits. The controller is further configured to generate a plurality of encoded values by encoding the plurality of physical memory addresses. Each of the plurality of encoded values has a second number of bits that is smaller than the first number of bits. The controller is further configured to store the plurality of encoded values in the first lookup table, generate a logical to encoded value look-up table with the plurality of encoded values, and store the logical to encoded value look-up table in the memory.

Abstract: A memory system includes a non-volatile memory in which data is stored in a plurality of pages including a first page and a second page and a memory controller. The controller is configured to perform a first write operation on the first page at a first time, perform a second write operation on the second page at a second time after the first time, perform a first read operation on the first page at a time after the first time using a first parameter and store a first index value in association with the first page and the first parameter, and determine a second parameter for a second read operation to be performed on the second page using a time difference between the first time and the second time and the first index value stored in association with the first page.

Abstract: A method of erasing memory cells in a memory device is provided. The method includes grouping a plurality of word lines into a first group, which does not include edge word lines, and a second group, which does include edge word lines. An erase operation is performed on the memory cells of the first and second groups until erase-verify of the memory cells of the first group passes. It is then determined if further erase of the memory cells of the second group is necessary. In response to it being determined that the additional erase operation is necessary, an additional erase operation is performed on at least some of the memory cells of the second group until erase-verify of the memory cells of the second group passes.

Abstract: A ferroelectric memory chiplet in a multi-dimensional packaging. The multi-dimensional packaging includes a first die comprising a switch and a first plurality of input-output transceivers. The multi-dimensional packaging includes a second die comprising a processor, wherein the second die includes a second plurality of input-output transceivers coupled to the first plurality of input-output transceivers. The multi-dimensional packaging includes a third die comprising a coherent cache or memory-side buffer, wherein the coherent cache or memory-side buffer comprises ferroelectric memory cells, wherein the coherent cache or memory-side buffer is coupled to the second die via I/Os. The dies are wafer-to-wafer bonded or coupled via micro-bumps, copper-to-copper hybrid bond, or wire bond, Flip-chip ball grid array routing, chip-on-wafer substrate, or embedded multi-die interconnect bridge.

Abstract: A memory card 100 having a NAND type flash memory connectable to a host device 200, capable of transmitting/receiving a signal to/from the host device 200 at a first voltage (3.3 V) or a second voltage (1.8 V) and safely changing a signal voltage of a transmission/reception signal that mutually checks a signal voltage through handshake processing with the host device 200 when the signal voltage is switched.