Abstract: The present technology relates to an electronic device. More specifically, the present technology relates to a memory device, a storage device, and a method of operating a memory controller. According to an embodiment, a memory device that outputs read data in response to a read enable signal provided from a memory controller includes a plurality of memory cells configured to store data, a plurality of page buffers configured to sense the data stored in the plurality of memory cells through a plurality of bit lines, and a data output controller configured to select a target page buffer to output data from among the plurality of page buffers according to a page buffer address control signal provided from the memory controller and control the selected target page buffer to output data stored in the selected target page buffer according to the read enable signal, while the read enable signal is input.

Abstract: Apparatuses, methods, and systems for sensing two memory cells to determine one data value are described herein. An embodiment includes a memory having a plurality of memory cells and circuitry configured to sense memory states of each of two memory cells to determine one data value. One data value is determined by sensing the memory state of a first one of the two memory cells using a first sensing voltage in a sense window between a first threshold voltage distribution corresponding to a first memory state and a second threshold voltage distribution corresponding to a second memory state and sensing the memory state of a second one of the two memory cells using a second sensing voltage in the sense window. The first and second sensing voltages are selectably closer in the sense window to the first threshold voltage distribution or the second threshold voltage distribution.

Abstract: Exemplary methods, apparatuses, and systems include determining that data in a group of memory cells of a first memory device is to be moved to a spare group of memory cells. The group of memory cells spans a first dimension and a second dimension that is orthogonal to the first dimension and the spare group of memory cells also spans the first dimension and the second dimension. The data is read from the group of memory cells along the first dimension of the group of memory cells. The data is written to the spare group of memory cells along the second dimension of the spare group of memory cells.

Abstract: An operating method of a memory system that includes a memory device including a plurality of planes and a plurality of page buffers for the plurality of planes, respectively, and a controller suitable for controlling the memory device, the operating method includes: providing, by the controller, the memory device with page read commands for respective target planes among the plurality of planes; simultaneously reading, by the memory device, data from the target planes and buffering the data in target page buffers corresponding to the respective target planes in response to the page read commands; selectively providing, by the controller, the memory device with an all-plane data output command or respective-plane data output commands from which target page addresses are omitted; and sequentially outputting, by the memory device, the data buffered in the target page buffers, in response to the all-plane data output command or the respective-plane data output commands.

Abstract: A memory device having an improved operation speed includes: a memory cell; a page buffer connected to the memory cell through a bit line; and a program operation controller for controlling an operation of the page buffer. The page buffer includes: a bit line voltage supply for providing a precharge voltage to the bit line; a sensing node voltage supply for providing a sensing node precharge voltage to a sensing node connected to the bit line; a first latch for storing first verify data; a sensing node connector for releasing connection between the bit line and the sensing node, after the first verify data is stored; and a second latch for storing second verify data determined according to the voltage of the sensing node, after the connection between the bit line and the sensing node is released.

Abstract: A data storage system includes a storage medium including a plurality of strings of single-level cell (SLC) memory cells connected to a plurality of word lines; and a storage controller in communication with the storage medium, the storage controller including write circuitry configured to write data to the storage medium by: selecting a first word line of the plurality of word lines, the first word line being connected to a first plurality of strings; consecutively programming a first group of memory cells of the first plurality of strings connected to the first word line; and subsequent to programming the first group of memory cells, consecutively verifying respective programming results of the first group of memory cells.

Abstract: Apparatus and methods are described to reduce program disturb for a memory string with a partial select gate drain, which is partially cut by a shallow trench. The memory string with a partial select gate drain is linked with a neighboring full select gate drain that during its programming can cause a program disturb in the memory string with a partial select gate drain. The bias voltage applied to the selected full select gate drain can be controlled from a high state for low memory program states to a lower state for the high memory program states. The high data states may cause program disturb. The reduction in the bias voltage can match a reduction in the bias voltage applied to the bit lines to reduce the program disturb while providing adequate signal to program the high states on the memory string of the full select gate drain.

Abstract: Aspects of the disclosure provide a memory device. For example, the memory device can include a memory array, a bitline and a buffer. The memory array can include a plurality of memory strings. The memory strings can be divided into a first memory string group and a second memory string group. The bitline can include a first bitline segment coupled to the first memory string group and a second bitline segment coupled to the second memory string group. The first bitline segment can be disposed between the first memory string group and the buffer and be connected to the buffer through a first conduction path. The second bitline segment can be disposed between the second memory string group and the buffer and be connected to the buffer through a second conduction path.

Abstract: A memory system includes a nonvolatile memory configured to execute one of a plurality of read operations, including a first read operation and a second read operation, and a memory controller configured to issue a read command to the nonvolatile memory to cause the nonvolatile memory to execute one of the plurality of read operations. The memory controller is configured to receive a read request, estimate a reliability level of a result of a read operation to be executed by the nonvolatile memory to read data from a physical address specified in the read request, select one of the first and second read operations to be executed first in a read sequence corresponding to the read request by the nonvolatile memory based on the estimated reliability level, and instruct the nonvolatile memory to execute the selected read operation.

Abstract: A memory device according to one embodiment includes a memory cell array, bit lines, amplifier units, a controller, and a register. The memory cell array includes a memory cell that stores data nonvolatilely. The bit lines are connected to the memory cell array. The sense amplifier units are connected to the bit lines, respectively. The controller performs a write operation. The register stores status information of the write operation. The memory cell array includes a first storage region specified by a first address. The plurality of sense amplifier modules include a buffer region capable of storing data.

Abstract: A wireless controller (200) is configured to send commands to a mini-split HVAC unit (100) that thermostatically controls a temperature in a space (50) using the temperature sensed and a programmable set point. The wireless controller (212) may include an infrared (IR) transmitter (208), a temperature sensor (210), a user interface (214), a non-volatile memory (202), and a controller (212). The wireless controller (200) may store an IR database in the non-volatile memory (202) for each of a wide variety of mini-split HVAC unit (100). The wireless controller (200) may then allow a user to select a particular mini-split HVAC unit (100), and from the selection may identify a corresponding IR protocol in the IR database. During subsequent use, the wireless controller (200) may use the corresponding IR protocol during subsequent communication with the mini-split HVAC unit (100).

Abstract: Provided herein may be a memory device capable of completing a foggy-fine program operation in one ready/busy period. The memory device may include a plurality of memory cells configured to form a plurality of pages, a peripheral circuit configured to perform a first program operation on a page adjacent to a selected page among the plurality of pages, and perform a second program operation on the selected page and control logic configured to control the peripheral circuit, during the first program operation, to successively receive least significant bit (LSB) page data, center significant bit (CSB) page data, and most significant bit (MSB) page data from a memory controller, and program the LSB page data to the page adjacent to the selected page and during the second program operation, to program the LSB page data programmed to the page adjacent to the selected page, the CSB page data and the MSB page data to the selected page.

Abstract: The present invention relates to a single-layer polysilicon nonvolatile memory cell, a group structure thereof and a memory including the same. The memory cell includes a selection transistor and a storage transistor, wherein the selection transistor is connected in series with the storage transistor; and the selection transistor and the storage transistor are arranged on a substrate in a mutually perpendicular manner. A memory cell group includes four memory cells, arranged in a center-symmetrical array of two rows×two columns. The memory comprises at least one memory cell group. The memory cell and the memory thereof are used as a one-time programming memory cell and memory, and have the advantages of small area, high programming efficiency and capability, and strong data retention capability.

Abstract: A non-volatile memory device, a method of operating the non-volatile memory device, and a memory system including the non-volatile memory device are provided. A non-volatile memory device includes a memory cell array including a plurality of memory cells configured to be each programmed to one state of a plurality of states, a page buffer circuit including a plurality of page buffers configured to each store received data as state data indicating a target state of a corresponding one of the plurality of memory cells, the page buffer circuit being configured to perform a state data reordering operation of changing a first state data order into a second state data order during performance of a program operation on selected memory cells of the plurality of memory cells, and a reordering control circuit configured to control the page buffer circuit to perform the state data reordering operation simultaneously with the program operation.

Abstract: A semiconductor device having a three-dimensional (3D) structure is disclosed. The semiconductor device includes a first substrate layer including a logic circuit, and a plurality of second substrate layers stacked on the first substrate layer, the plurality of second substrate layers including a memory cell array. Each of the plurality of second substrate layers includes, a transfer circuit, coupled to a row line of the memory cell array, that is disposed over the second substrate layer and selectively coupled to a global row line.

Abstract: The present technology relates to an electronic device. A memory device that reduces noise generated during a sensing operation includes a plurality of pages, each including a plurality of memory cells, a peripheral circuit configured to sense a selected page among the plurality of pages, the selected page including a selected memory cell and a sensing node controller configured to control, based on a result of a first sensing operation among a plurality of sensing operations that are performed to sense a logical page among a plurality of logical pages in the selected page, a sensing node in a page buffer coupled to the selected memory cell through a bit line during a second sensing operation.

Abstract: A memory device having improved performance includes: a plurality of memory cells programmed to one of a plurality of program states divided based on a threshold voltage; and a plurality of page buffers coupled to the plurality of memory cells through a plurality of bit lines. Each of the plurality of page buffers includes a latch for storing data sensed from a corresponding bit line among the plurality of bit lines, and discharges the corresponding bit line while performing a latch setting operation including setting data stored in the latch in a verify operation on the plurality of program states.

Abstract: Embodiments herein disclose a method for managing seed value for data scrambling in a NAND memory. The method includes detecting, by a NAND controller, a first scrambling of the data of a word line in the NAND memory. The method further includes caching, by the NAND controller, at least one of a last written data of the word line post the first scrambling for each open block in a Dynamic Random Access Memory (DRAM) for programming the word line, and a super page of the last written data of the word line in the DRAM for programming the super page. The method can be used to manage the seed value which is used for NAND page scrambling, which can reduce retention effect. As a result, the retention recycles for the NAND cells may be reduced, which may improve endurance.

Abstract: The present technology relates to an electronic device. A driver for generating a signal that satisfies a characteristic required according to a type of a signal includes a current controller configured to control total current flowing through the driver based on a selected signal, among a plurality of signals, applied to a page buffer that stores data, a load controller configured to control a magnitude of a load of an output terminal of the driver based on the selected signal and a cap compensator configured to control the magnitude of the load of the output terminal by increasing or decreasing a capacitance of the load of the output terminal based on the selected signal.

Abstract: A negative level shifter includes a shifting circuit and a latch circuit. The shifting circuit shifts levels of a first input signal and a second input signal to provide a first output signal and a second output signal having complementary levels at a first output node and a second output node, respectively, using low voltage transistors and high voltage transistors having different characteristics. The latch circuit, connected to the shifting circuit at the first output node and the second output node, latches the first output signal and the second output signal, receives a negative voltage having a level smaller than a ground voltage, and drives the second output signal and the first output signal complementarily to either a level of a power supply voltage or a level of the negative voltage, based on voltage levels at the first output node and the second output node, respectively.

Abstract: A memory array includes a plurality of memory cells stacked up along a first direction. Each of the memory cells include a memory stack, connecting lines, and insulating layers. The memory stack includes a first dielectric layer, a channel layer disposed on the first dielectric layer, a charge trapping layer disposed on the channel layer, a second dielectric layer disposed on the charge trapping layer, and a gate layer disposed in between the channel layer and the second dielectric layer. The connecting lines are extending along the first direction and covering side surfaces of the memory stack. The insulating layers are extending along the first direction, wherein the insulating layers are located aside the connecting lines and covering the side surfaces of the memory stack.

Abstract: A nonvolatile memory device includes a peripheral circuit including a first active region and a memory block including a second active region on the peripheral circuit. The memory block includes a vertical structure including pairs of a first insulating layer and a first conductive layer, a second insulating layer on the vertical structure, a second conductive layer and a third conductive layer spaced apart from each other on the second insulating layer, first vertical channels and second vertical channels. The second conductive layer and the third conductive layer are connected with a first through via penetrating the vertical structure, the second active region, and a region of the second insulating layer that is exposed between the second conductive layer and the third conductive layer.

Abstract: A storage device having an improved operation speed includes memory blocks and a sudden power-off manager. The memory blocks connected to word lines as part of a super block. The sudden power-off manager in communication with the memory blocks and configured to, in response to a sudden power off, 1) select reference word lines among the word lines to group the word lines into word line zones defined using the reference word lines, 2) perform read operations on pages connected to the reference word lines to determine states of the pages connected to the reference word lines, 3) select a first erase page search zone among the word line zones based on results of the read operations, and 4) determine a first erase page located at a boundary between a program page and an erase page in the first erase page search zone.

Abstract: A semiconductor storage device includes first and second memory strings, a word line, first and second select gate lines, and a control circuit. The first memory string includes a first memory transistor and a first select transistor. The second memory string includes a second memory transistor and a second select transistor. The word line is connected to the first and second memory transistors. The control circuit is connected to the word line and the first and second select gate lines. The control circuit is configured to perform, during a write sequence, a program operation on each of the first and second memory transistors in turn and a verify operation on only one of the first and second memory transistors.

Abstract: Provided herein is a semiconductor memory device and a method of operating the same. The semiconductor memory device includes a memory block, a peripheral circuit, and a control logic. The memory block includes a plurality of sub-blocks coupled to a plurality of source select lines, respectively. The peripheral circuit performs a program operation on the memory block. The control logic is configured to control the peripheral circuit to increase a voltage of a common source line that is coupled to the memory block, increase a voltage of at least one source select line, among the plurality of source select lines, to a first voltage level, and set a voltage of a bit line that is coupled to the memory block and increase the voltage of at least one source select line from the first voltage level to a second voltage level.

Abstract: Systems and methods for reducing the size of sub-blocks within a physical memory block for a three-dimensional non-volatile memory using buried source lines are described. The physical memory block may be fabricated using dual buried source lines such that sub-blocks within the physical memory block may be individually selected in both a horizontal word line direction and a vertical NAND string direction. The physical memory block may include a plurality of sub-blocks that are individually selectable and that share bit lines and/or source-side select gate lines. The plurality of sub-blocks that are individually selectable may correspond with different portions of the same NAND string in which a first sub-block of the plurality of sub-blocks connects to a drain-side select gate for the NAND string and a second sub-block of the plurality of sub-blocks connects to a source-side select gate for the NAND string.

Abstract: There are provided a semiconductor memory and an operating method thereof. The semiconductor memory includes a memory block including a plurality of pages, a peripheral circuit for performing a program operation and an erase operation on a selected page among the plurality of pages, and a control logic for controlling the peripheral circuit to perform the program operation and the erase operation. The control logic decreases threshold voltages of memory cells corresponding to an erase state among a plurality of memory cells included in the selected page in the erase operation.

Abstract: A memory system includes: a memory device; a host interface suitable for receiving write commands and queueing the received write commands in an interface queue; a workload manager suitable for detecting, in a cache program mode, a mixed workload when a read count is greater than a first threshold value, the read count representing a number of read commands queued in the interface queue and the mixed workload representing receipt of a mix of read and write commands; a mode manager suitable for switching from the cache program mode to a normal program mode when the mixed workload is detected; and a processor suitable for processing write commands queued in a command queue in the cache program mode and processing write commands queued in the interface queue in the normal program mode when the mixed workload is detected.

Abstract: A processing device performs a multi-pass programming operation on the memory device resulting in first pass programming distributions and second pass programming distributions. One or more read level thresholds between the second pass programming distributions are changed. Responsive to changing the one or more read level thresholds between the second pass programming distributions, one or more read level thresholds between the first pass programming distributions are adjusted based on the changes to the one or more read level thresholds between the second pass programming distributions.

Abstract: Provided herein may be a semiconductor memory device and a method of operating the semiconductor memory device. The semiconductor memory device may include: a memory block including upper pages, a center page, and lower pages; a peripheral circuit configured to perform a read operation on the memory block; and a control logic configured to control the peripheral circuit to perform the read operation and control the peripheral circuit such that, during the read operation, based on a location of a selected page among the plurality of pages, a pass voltage to be applied to first adjacent pages disposed adjacent to the selected page in a first direction differs from a pass voltage to be applied to second adjacent pages disposed adjacent to the selected page in a second direction.

Abstract: An operation method of a memory device may include performing a program operation on a memory block in response to a program command from a controller, and applying a program voltage to a dummy word line coupled to dummy cells within the memory block such that the dummy cells have an indication threshold voltage higher than a normal pass voltage and providing a program fail signal to the controller when the program operation fails.

Abstract: Provided herein may be a memory device and a method of operating the same. The memory device may include a page buffer group configured to include a plurality of page buffers respectively coupled to a plurality of memory areas through a plurality of bit lines, a row decoder configured to select a memory area, on which an operation corresponding to a command is to be performed, from among the plurality of memory areas, based on a row address included in an address, a column decoder configured to transfer data to a page buffer of the plurality of page buffers according to a column address included in the address and an address controller configured to control the row decoder and the column decoder so that the data is stored in another memory area other than the selected memory area.

Abstract: A semiconductor memory device includes a memory cell array, an error correction circuit, an error log register and a control logic circuit. The memory cell array includes a plurality of memory bank arrays and each of the memory bank arrays includes a plurality of pages. The control logic circuit is configured to control the error correction circuit to perform an ECC decoding sequentially on some of the pages designated at least one access address for detecting at least one bit error, in response to a first command received from a memory controller. The control logic circuit performs an error logging operation to write page error information into the error log register and the page error information includes a number of error occurrence on each of the some pages determined from the detecting.

Abstract: Memory devices are disclosed. A memory device may include multiple pairs of tiles. At least some of the pairs of tiles may include a block select circuit. At least one portion of the block select circuit within a first pair of tiles of the multiple pairs of tiles is offset from at least one other portion of the block select circuit within a second pair of tiles of the multiple pairs of tiles. Also, at least one pair of tiles of the multiple pair of tiles may include an associated vertical string driver offset from each of a first tile and a second tile of an associated pair of tiles.

Abstract: A nonvolatile memory device including: a first semiconductor layer comprising a plurality of first word lines extending in a first direction, a first upper substrate and a first memory cell array, a second semiconductor layer including a plurality of second word lines extending in the first direction, second and third upper substrates adjacent to each other in the first direction and a second memory cell array, wherein the second memory cell array includes a first vertical structure on the first upper substrate and a second vertical structure on the second upper substrate, wherein the first semiconductor layer and the second semiconductor layer share a plurality of bit lines extending in a second direction, and a third semiconductor layer under the second semiconductor layer in a third direction perpendicular to the first and second directions, wherein the third semiconductor layer includes a lower substrate that includes a plurality of row decoder circuits and a plurality of page buffer circuits, wherein the

Abstract: A memory device includes a memory array including memory strings. Each memory string includes a plurality of top memory cells, a plurality of bottom memory cells, and one or more dummy memory cells between the top memory cells and the bottom memory cells. The memory device also includes a plurality of word lines respectively coupled to gate terminals of the top memory cells and the bottom memory cells, and one or more dummy word lines respectively coupled to gate terminals of the one or more dummy memory cells. The memory device further includes a control circuit configured to program a target memory cell coupled to a selected word line of the plurality of word lines. To program the target memory cell, the control circuit is configured to apply a biased dummy word line pre-pulse signal to the one or more dummy word lines in a pre-charge period prior to a programming period.

Abstract: Host data can be written to a first portion of a memory sub-system in a first write mode. An indication can be received that a data block of a second portion of the memory sub-system is available to be written to in a second write mode. In response to receiving the indication, it is determined to write a second portion of the host data to the data block of the second portion. In response to determining to write the second portion of the host data to the data block of the second portion, the second portion of the host data is written to the second available data block in the second write mode prior to closing the first available data block in the first write mode.

Abstract: Devices and techniques for controlling NAND operation latency are described herein. A controlled can receive a write request. The controller can then calculate a number of garbage collection operations to perform on a physical block that is closed. Here, the calculation includes adding a logical-to-physical (L2P) region search ratio to a cadence calculation for garbage collection. Garbage collection operations can be performed on the physical block in accordance with the calculated number of garbage collection operations to perform. Then, the controller can perform the write request in response to completing the calculated number of garbage collection operations.

Abstract: A method of operating a memory device that includes a plurality of stages each having a plurality of page buffers. The method including performing a verify operation of a first program loop from among a plurality of program loops, the verify operation of the first program loop including, performing a first off-cell counting operation on a first stage of the plurality of stages based on a first sampling rate to generate a first off-cell counting result; selectively changing the first sampling rate based on the first off-cell counting result to generate a changed first sampling rate; and performing a second off-cell counting operation on a second stage of the plurality of stages based on one of the first sampling rate and the changed first sampling rate to generate a second off-cell counting result.

Abstract: Apparatuses and methods for segmented SGS lines are described. An example apparatus includes a plurality of memory subblocks, a plurality of first select gate control lines, each first select gate control line of the plurality of first select gate control lines configured to couple a memory subblock of the plurality of memory subblocks to a signal line, and a second select gate control line configured to couple the plurality of memory subblocks to a source line.

Abstract: A memory system includes a nonvolatile memory configured to execute one of a plurality of read operations, including a first read operation and a second read operation, and a memory controller configured to issue a read command to the nonvolatile memory to cause the nonvolatile memory to execute one of the plurality of read operations. The memory controller is configured to receive a read request, estimate a reliability level of a result of a read operation to be executed by the nonvolatile memory to read data from a physical address specified in the read request, select one of the first and second read operations to be executed first in a read sequence corresponding to the read request by the nonvolatile memory based on the estimated reliability level, and instruct the nonvolatile memory to execute the selected read operation.

Abstract: Provided herein may be a memory device and a method of operating the same. The memory device may include memory cells for storing data, page buffers coupled to the memory cells, the page buffers including first latches for temporarily storing original data during a program operation and second latches for storing verification data during a verify operation, and a command execution component for controlling the page buffers, in response to a normal command signal, a suspend command signal, or a resume command signal, to store the original data and the verification data in the first and second latches in response to the normal command signal, to provide the verification data to the first latches in response to the suspend command signal, and to transfer the verification data from the first latches to the second latches in response to the resume command signal.

Abstract: A memory device includes a first page buffer supplying a first bias voltage to a selected bitline in a bitline precharge phase; and a second page buffer supplying a second bias voltage to an unselected bitline, adjacent to the selected bitline, in the bitline precharge phase, wherein the first page buffer includes a first bitline precharge circuit supplying the first bias voltage to the selected bitline, the second page buffer includes a second bitline precharge circuit supplying the second bias voltage to the unselected bitline, wherein the second page buffer floats the unselected bitline in a sensing phase for detecting data of a selected memory cell connected to the selected to bitline.

Abstract: A memory sub-system configured to generate or update a model for reading memory cells in a memory device. For example, in response to a processing device of a memory sub-system transmitting to a memory device read commands that are configured to instruct the memory device to retrieve data from a group of memory cells formed on an integrated circuit die in the memory device, the memory device may measure signal and noise characteristics of the group of memory cells during execution of the read commands. Based on the signal and noise characteristics the memory sub-system can generate or update, measured during the execution of the read commands a model of changes relevant to reading data from the group of memory cells. The changes can be a result of damage, charge loss, read disturb, cross-temperature effect, etc.

Abstract: A memory system includes: a memory device including a three dimensional (3D) cell array, in which memory cells having the same height are coupled to a component word line by units of rows and component word lines having the same height are coupled to a group word line; and a controller suitable for controlling the memory device to perform a program operation with a program data into memory cells coupled to a data component word line selected from a plurality of component word line included in a single group word line and to perform a dummy program operation with dummy data into memory cells coupled to remaining dummy component word lines among the plurality of component word lines.

Abstract: A semiconductor memory device includes a memory transistor, a word line, a peripheral circuit, and electrodes connected to the peripheral circuit. In response to a write command via the electrodes, the peripheral circuit can execute a first program operation of applying a first program voltage to the word line one time when the write command is one of an n1-th write command to an n2-th write command corresponding to the memory transistor; and execute a second program operation of applying a second program voltage to the first word line at least one time when the write command is one of an (n2+1)-th write command to an n3-th write command corresponding to the memory transistor. The second program voltage in a k-th second program operation is less than the first program voltage in a k-th first program operation.

Abstract: An integrated circuit and a computing method thereof are provided. The integrated circuit includes a memory array, word lines, bit lines and a page buffer. The memory array includes memory cells, each configured to be programmed with a weight. The word lines respectively connect a row of the memory cells. The bit lines are respectively connected with a column of the memory cells that are connected in series. More than one of the bit lines in a block of the memory array or more than one of the word lines in multiple blocks of the memory array are configured to receive input voltages. The memory cells receiving the input voltages are configured to multiply the weights stored therein and the received input voltages. The page buffer is coupled to the memory array, and configured to sense products of the weights and the input voltages.

Abstract: Each of memory blocks of a nonvolatile memory device includes first memory cells of a first portion of pillar and second memory cells of a second portion of the pillar. When performing program operations based on consecutive addresses at a memory block selected from the memory blocks, the nonvolatile memory device sequentially completes first program operations of non-adjacent memory cells not adjacent to a boundary of the first portion and the second portion from among the first and second memory cells and then completes a second program operation of an adjacent memory cell adjacent to the boundary.

Abstract: The present disclosure provides a semiconductor structure, including a transistor layer, a memory region over the transistor layer, and a logic region adjacent to the memory region. The memory region includes a first Nth metal line, a magnetic tunneling junction (MTJ) over the first Nth metal line, a cap over the MTJ, a first stop layer on the cap; and a first (N+1)th metal via over the MTJ. The first (N+1)th metal via is laterally surrounded by the cap and the first stop layer. The logic region includes a second Nth metal line, a second stop layer being disposed over an (N+1)th metal line, and a second (N+1)th metal via over the (N+1)th metal line. N is an integer greater than or equal to 1. A method of manufacturing the semiconductor structure is also disclosed.

Abstract: A memory device, in accordance with a method of operation, may include: a plurality of pages coupled to a common word line and configured to be sequentially selected by different select lines; a program operation controller configured to perform a program operation on a first page that is to be programmed first, among the plurality of pages; and a start loop manager configured to generate start loop information about a program loop in which program verification corresponding to each of a plurality of program states to be formed by threshold voltages of memory cells included in the first page starts, during the program operation on the first page. The program operation controller is further configured to perform a program operation on a second page to be programmed subsequent to the first page, among the plurality of pages, based on the start loop information.