Abstract: A storage system with privacy-centric multi-partitions and method for use therewith are provided. In one embodiment, a storage system comprises a memory configured to be partitioned into a plurality of partitions, wherein each partition is associated with its own boot block, and wherein each boot block is configured to boot any of the plurality of partitions. The storage system also comprises a controller configured to communicate with the memory and to: in response to a failure to boot one of the plurality of partitions with that partition's boot block, use a boot block of another one of the plurality of partitions to boot the one of the plurality of partitions; and restrict access to each of the plurality of partitions only to authenticated entities. Other embodiments are provided.

Abstract: Disclosed is a system including a memory device having a plurality of physical cells and a processing device, operatively coupled with the memory device. The processing device maintains association of block families with a first (second, etc.) bin of a plurality of bins, each of the plurality of bins associated with one or more read voltage offsets. The read voltage offsets are used to compensate for a temporal read voltage shift caused by a charge loss by memory cells of the block families. Responsive to an occurrence of a power event, the processing device performs diagnostics of one or more blocks of various block families and determines whether to maintain association of the block families with current bins of the respective block families or to associate the block families with different bins.

Abstract: A method for storing data comprises maintaining an address table for a memory space containing volatile memory and nonvolatile memory space. The nonvolatile memory space includes both multi-level cell (MLC) space and single level cell (SLC) space and the volatile memory includes a random access volatile memory element. An address table maps logical and physical addresses adaptable to the system by the address table. The mapping is performed as necessitated by the system to maximize lifetime maps data in at least one of volatile or nonvolatile memories. Storing received data within a controller memory associated with the at least one controller. Controlling access of the MLC and SLC nonvolatile memory elements and the random access volatile memory element for storage of the received data.

Abstract: A data storage device including, in one implementation, a memory device and a controller configured to configured to retrieve a plurality of physical memory addresses from a first lookup table in the non-volatile memory. Each physical memory address is a combination of a word line and a string number of the non-volatile memory and the each physical memory address has a first number of bits. The controller is further configured to generate a plurality of encoded values by encoding the plurality of physical memory addresses. Each of the plurality of encoded values has a second number of bits that is smaller than the first number of bits. The controller is further configured to store the plurality of encoded values in the first lookup table, generate a logical to encoded value look-up table with the plurality of encoded values, and store the logical to encoded value look-up table in the memory.

Abstract: A memory system includes a non-volatile memory in which data is stored in a plurality of pages including a first page and a second page and a memory controller. The controller is configured to perform a first write operation on the first page at a first time, perform a second write operation on the second page at a second time after the first time, perform a first read operation on the first page at a time after the first time using a first parameter and store a first index value in association with the first page and the first parameter, and determine a second parameter for a second read operation to be performed on the second page using a time difference between the first time and the second time and the first index value stored in association with the first page.

Abstract: A method of erasing memory cells in a memory device is provided. The method includes grouping a plurality of word lines into a first group, which does not include edge word lines, and a second group, which does include edge word lines. An erase operation is performed on the memory cells of the first and second groups until erase-verify of the memory cells of the first group passes. It is then determined if further erase of the memory cells of the second group is necessary. In response to it being determined that the additional erase operation is necessary, an additional erase operation is performed on at least some of the memory cells of the second group until erase-verify of the memory cells of the second group passes.

Abstract: A ferroelectric memory chiplet in a multi-dimensional packaging. The multi-dimensional packaging includes a first die comprising a switch and a first plurality of input-output transceivers. The multi-dimensional packaging includes a second die comprising a processor, wherein the second die includes a second plurality of input-output transceivers coupled to the first plurality of input-output transceivers. The multi-dimensional packaging includes a third die comprising a coherent cache or memory-side buffer, wherein the coherent cache or memory-side buffer comprises ferroelectric memory cells, wherein the coherent cache or memory-side buffer is coupled to the second die via I/Os. The dies are wafer-to-wafer bonded or coupled via micro-bumps, copper-to-copper hybrid bond, or wire bond, Flip-chip ball grid array routing, chip-on-wafer substrate, or embedded multi-die interconnect bridge.

Abstract: A method is for ensuring data integrity in memory pages includes: dividing the memory pages into a predetermined number of refresh groups; and for each write operation to be performed on a selected memory page: (a) selecting one of the refresh groups; (b) reading data from the memory pages of the selected refresh group; and (d) concurrently (i) performing the write operation on the selected memory page, and (ii) writing back the data read into the memory pages of the selected refresh group.

Abstract: A processing device in a memory sub-system identifies a plurality of word lines at a first portion of a memory device, determines a respective error rate for each of the plurality of word lines, and determines that a first error rate of a first word line of the plurality of word lines and a second error rate of a second word line of the plurality of word lines satisfy a first threshold condition pertaining to an error rate threshold. The processing device further identifies a third word line of the plurality of word lines that is proximate to the first word line and the second word line and relocates data stored at the third word line to a second portion of the memory device, wherein the second portion of the memory device is associated with a lower read latency than the first portion of the memory device.

Abstract: An operation method of a nonvolatile memory device includes receiving a first DQ signal representing a first data bit from an external device through a first DQ line and receiving a second DQ signal representing a second data bit from the external device through a second DQ line, and programming a first memory cell corresponding to the first DQ line and a second memory cell corresponding to the second DQ line such that the first memory cell has any one of an erase state and a first program state based on the first DQ signal and the second memory cell has any one of the erase state and a second program state based on the second DQ signal. A lower limit value of a threshold voltage distribution corresponding to the second program state is higher than a lower limit value of a threshold voltage distribution corresponding to the first program state.

Abstract: A method for dynamically adjusting an erase voltage level to be applied in a subsequent erase cycle, comprising: in a current erase cycle, initiating a current erase/verify loop by applying an initial stored erase voltage level according to an erase sequence in which each successive erase/verify loop is incremented by a pre-determined voltage amount, storing an erase/verify loop count, and determining whether the current erase cycle is complete according to a pass criterion. If the erase cycle is complete, a determination is made as to whether the stored erase/verify loop count equals a pre-defined threshold count. Further, if the stored count does not equal the pre-defined threshold count, the initial stored erase voltage level is adjusted such that, upon applying the adjusted erase voltage level in a subsequent erase cycle, an erase/verify loop count will now equal the pre-defined threshold count.

Abstract: A memory device includes; a memory cell array including a first memory block and a second memory block adjacently disposed in a first direction, driving signal lines respectively corresponding to vertically stacked word lines, and a pass transistor circuit including an odd number of pass transistor groups and connected between the driving signal lines and the memory cell array. One of the odd number of pass transistor groups includes a first pass transistor connected between a first word line of the first memory block and a first driving signal line among the driving signal lines, and a second pass transistor connected between a first word line of the second memory block and the first driving signal line adjacently disposed to the first pass transistor in a second direction.

Abstract: The present disclosure includes apparatuses and methods related to determining trim settings on a memory device. An example apparatus can determine a set of trim settings for the array of memory cells based on the operational characteristics of the array of memory cells, wherein the set of trim settings are associated with desired operational characteristics for the array of memory cells.

Abstract: A non-volatile memory device includes: a memory cell array including a plurality of memory cells connected to a plurality of word lines and a plurality of bit lines, a row decoder configured to selectively control the plurality of word lines, a page buffer including a plurality of latches corresponding to the plurality of bit lines, respectively, and a control circuit configured to control the non-volatile memory device to enter a suspend state after terminating a verify operation of a program loop of a program operation of the plurality of memory cells in response to a suspend request being generated during an execution operation of the program loop.

Abstract: A memory control method, a memory storage device, and a memory control circuit unit are provided. The memory control method includes: receiving a read command from a host system; in response to a first physical erasing unit being a first type physical unit, sending a first operation command sequence to instruct a rewritable non-volatile memory module to read a first physical programming unit based on a first electronic configuration; and in response to the first physical erasing unit being a second type physical unit, sending a second operation command sequence to instruct the rewritable non-volatile memory module to read the first physical programming unit based on a second electronic configuration. The first electronic configuration is different from the second electronic configuration.

Abstract: A processing device of a memory sub-system is configured to identify a read level of a plurality of read levels associated with a voltage bin of a plurality of voltage bins of a memory device; assign a first threshold voltage offset to the read level of the voltage bin; assign a second threshold voltage offset to the read level of the voltage bin; perform, on block associated with the read level, a first operation of a first operation type using the first threshold voltage offset; and perform, on the blocks associated with the read level, a second operation of a second operation type using the second threshold voltage offset.

Abstract: Methods, systems, and devices are described for wireless communications. A request for data located in a memory page of a memory array may be received at a device, and a value of a prefetch counter associated with the memory page may be identified. A portion of the memory page that includes the requested data may then be communicated between a memory array and memory bank of the device based on the value of the prefetch counter. For instance, the portion of the memory page may be selected based on the value of the prefetch counter. A second portion of the memory page may be communicated to a buffer of the device, and the value of the prefetch counter may be modified based on a relationship between the first portion of the memory page and the second portion of the memory page.

Abstract: A method of operating a memory device. The method includes the step of preparing a memory device that includes a first group of the memory holes with full SGD transistors and a second group of the memory holes with partial SGD transistors. The second group includes both a set of selected partial SGD transistors and a set of unselected partial SGD transistors. The method proceeds with electrically floating a first unselected partial SGD transistor of the set of unselected partial SGD transistors. With the at least one first unselected partial SGD transistor electrically floating, the method continues with reducing a voltage applied to at least one transistor or memory cell adjacent the first unselected partial SGD transistor such that a voltage of the first unselected partial SGD transistor is decreased through a capacitance coupling effect.

Abstract: A memory system includes a nonvolatile memory, and a memory controller configured to control the nonvolatile memory. The nonvolatile memory stores a busy table. The memory controller loads the busy table and controls a chip enable signal for the nonvolatile memory based on the busy table.

Abstract: A memory device can include a memory block operatively connected to a common source line and a plurality of bit lines, wherein the memory block includes first and second sub-blocks each having a respective position in the memory block relative to the common source line and the plurality of bit lines. The memory device can be operated by receiving a command and an address from outside the memory device and performing a precharge operation on the memory block in response to the command, using a first precharge path through the memory block or a second precharge path through the memory block based on the respective position of the first or second sub-block that includes a word line that is configured to activate responsive to the address.

Abstract: Memory devices, controllers and associated methods are disclosed. In one embodiment, a memory device is disclosed. The memory device includes storage cells that are each formed with a metal-oxide-semiconductor (MOS) transistor having a floating body. Data is stored as charge in the floating body. A transfer interface receives a read command to access data stored in a first group of the storage cells. Sensing circuitry detects the data stored in the first group of storage cells. The transfer interface selectively performs a writeback operation of the sensed data associated with the read command.

Abstract: Approaches are provided for implementing hardware-software collaborative address mapping schemes that enable mapping data elements which are accessed together in the same row of one bank or over the same rows of different banks to achieve higher performance by reducing row conflicts. Using an intra-bank frame striping policy (IBFS), corresponding subsets of data elements are interleaved into a single row of a bank. Using an intra-channel frame striping policy (ICFS), corresponding subsets of data elements are interleaved into a single channel row of a channel. A memory controller utilizes ICFS and/or IBFS to efficiently store and access data elements in memory, such as processing-in-memory (PIM) enabled memory.

Abstract: In a method of forming a pattern, a photo resist layer is formed over an underlying layer, the photo resist layer is exposed to an actinic radiation carrying pattern information, the exposed photo resist layer is developed to form a developed resist pattern, a directional etching operation is applied to the developed resist pattern to form a trimmed resist pattern, and the underlying layer is patterned using the trimmed resist pattern as an etching mask.

Abstract: A total estimated occupancy value of a first data on a first data block of a plurality of data blocks is determined. To determine the total estimated occupancy value of the first data block, a total block power-on-time (POT) value of the first data block is determined. Then, a scaling factor is applied to the total block POT value to determine the total estimated occupancy value of the first data block. Whether the total estimated occupancy value of the first data block satisfies a threshold criterion is determined. Responsive to determining that the total estimated occupancy value of the first data block satisfies the threshold criterion, data stored at the first data block is relocated to a second data block of the plurality of data blocks.

Abstract: The present disclosure advantageously provides a matrix expansion unit that includes an input data selector, a first register set, a second register set, and an output data selector. The input data selector is configured to receive first matrix data in a columnwise format. The first register set is coupled to the input data selector, and includes a plurality of data selectors and a plurality of registers arranged in a first shift loop. The second register set is coupled to the data selector, and includes a plurality of data selectors and a plurality of registers arranged in a second shift loop. The output data selector is coupled to the first register set and the second register set, and is configured to output second matrix data in a rowwise format.

Abstract: Various embodiments of the present application are directed towards an integrated memory chip comprising a memory array with a strap-cell architecture that reduces the number of distinct strap-cell types and that reduces strap-line density. In some embodiments, the memory array is limited to three distinct types of strap cells: a source line/erase gate (SLEG) strap cell; a control gate/word line (CGWL) strap cell; and a word-line strap cell. The small number of distinct strap-cell types simplifies design of the memory array and further simplifies design of a corresponding interconnect structure. Further, in some embodiments, the three distinct strap-cell types electrically couple word lines, erase gates, and control gates to corresponding strap lines in different metallization layers of an interconnect structure. By spreading the strap lines amongst different metallization layers, strap-line density is reduced.

Abstract: A non-volatile memory device includes a memory cell array including a plurality of cell strings, each of the plurality of cell strings includes a gate-induced drain leakage (GIDL) transistor and a memory cell group, and a control logic to apply a voltage to each of the plurality of cell strings. The control logic performs a first erase operation of erasing the memory cell groups of each of the plurality of cell strings, a first verification operation of detecting erase results of the memory cell groups of each of the plurality of cell strings, and a program operation of programming the GIDL transistors of some of the plurality of cell strings.

Abstract: A method includes, in one non-limiting embodiment, sending a request from a mass memory storage device to a host device, the request being one to allocate memory in the host device; writing data from the mass memory storage device to allocated memory of the host device; and subsequently reading the data from the allocated memory to the mass memory storage device. The memory may be embodied as flash memory, and the data may be related to a file system stored in the flash memory. The method enables the mass memory storage device to extend its internal volatile RAM to include RAM of the host device, enabling the internal RAM to be powered off while preserving data and context stored in the internal RAM.

Abstract: A semiconductor memory device includes a first wiring, a first memory transistor connected to the first wiring, a first transistor connected between the first wiring and the first memory transistor, a second transistor connected between the first wiring and the first transistor, and second to fourth wirings respectively connected to gate electrodes of the first memory transistor, the first transistor, and the second transistor. From a first timing to a second timing, a voltage difference between the first wiring and the third wiring is maintained at a predetermined value, a voltage difference between the third wiring and the fourth wiring is maintained at a predetermined value, a voltage of the first wiring becomes larger than a voltage of the third wiring, and the voltage of the third wiring becomes larger than a voltage of the fourth wiring.

Abstract: A memory device includes a peripheral circuit area including a first substrate and circuit elements on the first substrate, at least a portion of the circuit elements providing a source driver, and a cell area including a second substrate stacked with the peripheral circuit area in a first direction, perpendicular to an upper surface of the first substrate, and cell blocks and dummy blocks arranged in a second direction, parallel to an upper surface of the second substrate.

Abstract: An example non-transitory machine-readable storage medium storing machine-readable instructions which when executed cause a processor to obtain stored bits stored on a flash memory, each of the stored bits in a set state or an unset state. The processor further obtains target bits, each of the target bits in the set state or the unset state, wherein each target bit corresponds to a stored bit to update the stored bit. The processor further determines whether, for one stored bit in the set state, the corresponding target bit is in the unset state. When the determination is positive, the processor sets the stored bits to the unset state and, after setting the stored bits to the unset state, updates the stored bits to match the corresponding target bits. When the determination is negative, the processor updates the stored bits to match the corresponding target bits.

Abstract: Disclosed in some examples are methods, systems, memory devices, machine readable mediums configured to intentionally degrade NAND performance when a value of a NAND health metric indicates a potential for failure to encourage users to replace or backup their devices before data loss occurs. For example, the system may track a NAND health metric and when that metric reaches a predetermined threshold or state, the system may intentionally degrade performance. This performance degradation may be more effective than a warning to effect device backup or replacement.

Abstract: A semiconductor memory device includes a first conductor extending in a first direction, bit lines, sense amplifiers, and a second conductor extending in the first direction. A plurality of first memory cells being connected to the first conductor. The bit lines respectively connected to the first memory cells. The first sense amplifiers are respectively connected to a plurality of first bit lines included in the bit lines, each of the first sense amplifiers including a first sense node, and a first transistor connected between the first sense node and a corresponding one of the first bit lines. The second conductor function as gate electrodes of the first transistors included in the first sense amplifiers.

Abstract: A memory device includes: a first substrate; a peripheral circuit provided on the first substrate; a first metal bonding layer provided on the peripheral circuit; a second metal bonding layer directly bonded to the first metal bonding layer; a memory cell array provided on the second metal bonding layer; and a second substrate provided on the memory cell array. A page buffer circuit in the peripheral circuit receives a verification result through the metal bonding layers, divides the verification result into stages, and sequentially outputs the verification result for the division into the stages, and a pass/failure checker in the peripheral circuit sequentially performs a counting operation about each of the stages to generate accumulated values, and compares the accumulated values and a reference value which increases from an initial value as the counting operation is performed, and the initial value is set by an external memory controller.

Abstract: The present disclosure includes apparatuses and methods to transfer data between banks of memory cells. An example includes a plurality of banks of memory cells and a controller coupled to the plurality of subarrays configured to cause transfer of data between the plurality of banks of memory cells via internal data path operations.

Abstract: Methods, systems, and devices for charge leakage detection for memory system reliability are described. In accordance with examples as disclosed herein, a memory system may employ memory management techniques configured to identify precursors of charge leakage in a memory device, and take preventative action based on such identified precursors. For example, a memory system may be configured to perform a leakage detection evaluation for a memory array, which may include various biasing and evaluation operations to identify whether a leakage condition of the memory array may affect operational reliability. Based on such an evaluation, the memory device, or a host device in communication with the memory device, may take various preventative measures to avoid operational failures of the memory device or host device that may result from ongoing operation of a memory array associated with charge leakage, thereby improving reliability of the memory system.

Abstract: According to one embodiment, a memory system includes a semiconductor memory and a controller. The semiconductor memory includes first blocks including a memory cell capable of storing data of one bit, a second block including a memory cell capable of storing data of two or more bits. The semiconductor memory stores first data in a first latch circuit, and second data in a second latch circuit, and writes the first data into one of the first blocks in page units, and the second data into one of the first blocks in page units. The semiconductor memory writes data of at least two pages into the second block, using the first data stored in the first latch circuit and the second data stored in the second latch circuit.

Abstract: A circuit module with improved line load, may comprise a first line, a first switch, a second line, a second switch and a second driver. The first switch may be on and off to conduct and stop conducting between the first line and a first node. The second switch may be on and off to conduct and stop conducting between the second line and the first node. The second driver, coupled to the second line, may be enabled to drive the second line according to a voltage of a second node, and may be disabled to stop driving the second line. The voltage of the second node may be controlled by a voltage of the first node. When the first switch is on, the second switch may be off. When the second switch is off, the second driver may be enabled.

Abstract: Disclosed is a nonvolatile memory device, which includes a memory cell array including cell strings, a row decoder connected with a ground selection transistor of each of the cell strings through a ground selection line, connected with memory cells of each of the cell strings through word lines, and connected with a string selection transistor of each of the cell strings through a string selection line, and a page buffer connected with the cell strings through bit lines. In a first period of a check operation, the page buffer applies a first bias voltage to the bit lines, and the row decoder applies a turn-off voltage to the ground selection line, a turn-on voltage to the string selection line, and a first check voltage to the word lines. In a second period of the check operation, the page buffer senses first changes of voltages of the bit lines.

Abstract: A voltage power switch includes circuitry configured to output a known voltage. The voltage power switch includes a lock circuit configured to output a known state and a voltage level shifter configured to receive an input, the input being based on the known state output by the lock circuit. The voltage power switch, using an output circuit, is configured to output a known voltage level based on an output of the voltage level shifter, wherein the known voltage is one of a high voltage VHI for a fuse programing period or a first non-zero intermediate voltage VMID1 for a non-fuse programming period.

Abstract: A memory system is provided to include a storage device including memory cells for storing data, and a controller in communication with an external device and configured to control the storage device based on a request from the external device. The controller is configured to receive a request from the external device to perform a refresh operation of re-writing stored data in the memory cells, read data from the memory cells included in the storage device, set a refresh period based on a number of fail bits included in the read data and a temperature of the controller or the storage device, and perform the refresh operation of the storage device based on the refresh period.

Abstract: Memory devices might include an array of memory cells and a controller configured to access the array of memory cells. The controller might be further configured to receive a command to perform an erase operation; and in response to the command to perform the erase operation, begin execution of the erase operation. The controller might be further configured to while executing the erase operation, receive a command to perform a program operation; in response to the command to perform the program operation, suspend the execution of the erase operation; and with the execution of the erase operation suspended, execute the program operation.

Abstract: A replacement block pool for a memory device is established. The replacement block pool comprises one or more valid blocks from a set of valid blocks in the memory device determined based on a constraint defining a minimum number of valid blocks for the memory device. A grown bad block is detected in the memory device. The grown bad block is replaced with a replacement block from the replacement block pool in response to detecting the grown bad block.

Abstract: Techniques are described for accessing data from a storage device. In one example, the storage device may include a storage medium comprising non-volatile memory, a network connection, and one or more processing entities. The one or more processors may be configured to receive a request from the network connection at the non-volatile memory storage device for accessing data associated with a file system object, the request comprising a virtual address offset, a file object identifier and a size of the data access, perform, at a flash translation layer of a storage device software stack executing on the one or more processing entities of the storage device, a translation from the virtual address offset to a physical address for the data stored on the non-volatile memory, using the virtual address offset and the file object identifier, and access the data from the physical address from the storage medium.

Abstract: A system captures errors and stores an obsolete line bit qualifier per cache entry that can be used to dynamically mark a specific cache entry as obsolete. For example, the cache entry can be marked as obsolete after detecting repetitive single-bit errors on a same cache entry within a predetermined period of time. For cache lines marked as obsolete, a cache controller can ensure that the cache line entry remains unused. The detection of a repetitive single-bit error can be accomplished by implementing a counter per cache entry and a timer. The counter counts errors within a timer window, and a repetitive error is reported if the counter reaches a threshold level. By catching repetitive single-bit errors before such errors spread to multi-bit errors, the system can increase the life span of the server computer.

Abstract: A 3D semiconductor memory device includes a peripheral circuit structure on a first substrate, a second substrate on the peripheral circuit structure, an electrode structure on the second substrate, the electrode structure comprising stacked electrodes, and a vertical channel structure penetrating the electrode structure. The peripheral circuit structure includes a dummy interconnection structure under the second substrate. The dummy interconnection structure includes stacked interconnection lines, and a via connecting a top surface of an uppermost one of the interconnection lines to a bottom surface of the second substrate.

Abstract: The present disclosure relates to a memory component for a System-on-Chip (SoC) structure including at least a memory array and at least a logic portion for interacting with the memory array and with the SoC structure wherein the memory component is a structurally independent semiconductor device coupled to and partially overlapping the SoC structure.

Abstract: A semiconductor storage device includes a semiconductor pillar, a first string having first memory cells connected in series, first word lines connected to the first memory cells, a second string having second memory cells connected in series, and second word lines connected to the second memory cells. Each of the first memory cells faces, and shares a channel in the semiconductor pillar with, one of the second memory cells. When reading data of the k-th first memory cell, a voltage of the first word line connected to the k-th first memory cell reaches a first voltage at a first timing, and a voltage of the second word line connected to at least one of the second memory cells other than the k-th second memory cell in the second string facing the k-th first memory cell reaches the first voltage at a second timing that is later than the first timing.

Abstract: A system includes a memory device and a processing device, operatively coupled with the memory device, to perform operations including identifying an amount of storage charge loss (SCL) that has occurred on an open block of the memory device, the open block having one or more erased pages, determining that the amount of SCL satisfies a threshold criterion corresponding to an acceptable amount of SCL to occur on the open block, and responsive to determining that the amount of SCL satisfies the threshold criterion, keeping the open block open for programming the one or more erased pages.

Abstract: Embodiments of the present application provide a semiconductor structure and a manufacturing method thereof. The semiconductor structure manufacturing method includes: providing a base substrate and an array region, the array region being composed of strip structures arranged in parallel, the base substrate being made of a same material as the array region, and a thickness of the base substrate being greater than a thickness of the array region; etching the strip structure to form discrete first strip structures; base substrate providing a second mask layer, an opening pattern of the second mask layer exposing the to-be-etched region and the side plane, and a right angle being formed between an orthographic projection of the side plane and the opening pattern; form a first active region, the first active region having a mapping right angle corresponding to the right angle.