Abstract: One or more source locations in a group of solid state storage cells on which garbage collection is to be performed are stored in a garbage collection queue. A garbage collection speed is determined, including by: analyzing one or more source locations stored in the garbage collection queue; determining a look-ahead metric, wherein the look-ahead metric comprises an anticipated amount of freed up storage associated with the analyzed source locations; and determining the garbage collection speed based at least in part on the look-ahead metric. One or more garbage collection operations are performed interleaved with one or more host operations, wherein the ratio of garbage collection operations to host operations is based at least in part on the garbage collection speed.

Abstract: A data storage device includes a nonvolatile memory device including a nonvolatile memory device including a plurality of memory blocks each having a plurality of memory cells and a controller suitable for determining whether a target memory block for a read operation among the memory blocks is an open block, adjusting a pass bias to be applied to unselected memory cells during the read operation for the target memory block, according to a result of the determination, and controlling the nonvolatile memory device to perform the read operation using the adjusted pass bias.

Abstract: According to one embodiment, a semiconductor memory device includes a first memory cell, a second memory cell, and a third memory cell, a first word line coupled to the first memory cell, the second memory cell, and the third memory cell, a first bit line coupled to the first memory cell, a second bit line coupled to the second memory cell, and a third bit line coupled to the third memory cell. A first voltage, a second voltage, and a third voltage are sequentially applied to the first word line, and a fourth voltage is applied to the first bit line when the first voltage is applied to the first word line, applied to the second bit line when the second voltage is applied to the first word line, and applied to the third bit line when the third voltage is applied to the first word line.

Abstract: In an embodiment of a memory device including a matrix of memory cells wherein the memory cells are arranged in a plurality of memory cells strings each one including at least two serially-connected memory cells, groups of at least two memory cells strings being connected to a respective bit line, and wherein said memory cells are adapted to be programmed into at least a first programming state and a second programming state, a method of storing data comprising exploiting a single memory cell for each of the memory cells string for writing the data, wherein said exploiting includes bringing the single memory cell to the second programming state, the remaining memory cells of the string being left in the first programming state.

Abstract: A storage system includes a controller that is configured to make host data inaccessible. To do so, the controller may control power control circuitry to supply pulses to storage locations storing host data. The pulses may include flash write pulses but no erase pulses, or a combination of flash write pulses and erase pulses. If erase pulses are supplied, the number of the erase pulses may be less than the number supplied for performance of a default erase operation.

Abstract: According to one embodiment, a first well of the first conductivity type which is formed in a substrate. a second well of a second conductivity type which is formed in the first well. The plurality of memory cells, the plurality of first bit line select transistors, and the plurality of second bit line select transistors are formed in the second well, and the plurality of first bit line select transistors and the plurality of second bit line select transistors are arranged on a side of the sense amplifier with respect to the plurality of memory cells of the plurality of bit lines.

Abstract: A semiconductor memory device includes a memory cell array that is capable of storing data in a nonvolatile manner, and a control section that controls data access to the memory cell array. The memory cell array stores the same data redundantly in a plurality of pages. The control section executes a reading operation on the plurality of pages that store the same data redundantly to read the data. The data that is stored redundantly may be management data or user data.

Abstract: A semiconductor memory device has a memory block including memory strings with first and second selection transistors at opposite ends of the memory strings. A bit line is connected to the first selection transistor of each memory string and a sense amplifier is connected to the bit line. The memory block includes word lines connected to each memory cell transistor in the memory strings. The memory device also includes a controller to control an erase operation that includes applying an erase voltage to the word lines, addressing a first memory string by applying a selection voltage to a gate electrode of first and second selection transistors of the first memory string, then applying an erase verify voltage to the word lines and using the sense amplifier to read data of memory cell transistors in the first memory string, then addressing a second memory string without first discharging the word lines.

Abstract: There are provided a storage device, a memory system having the same, and an operating method thereof. A storage device includes a plurality of memory blocks for storing data, a peripheral circuit for selecting multiple memory blocks from among the plurality of memory blocks and simultaneously performing an erase operation on the multiple memory blocks, and a control circuit for controlling the peripheral circuit so that the multiple memory blocks are simultaneously erased, and an erase operation and an erase verification operation of a selected memory block from among the multiple memory bocks are performed.

Abstract: A memory system according to the present embodiment includes a nonvolatile memory part storing an operating parameter required to perform a data read operation or a data write operation. A volatile memory part holds the operating parameter read out from the nonvolatile memory part after turning power on. A controller writes back the operating parameter in the volatile memory part to a first position of the nonvolatile memory part storing the operating parameter, based on number of times of power input to the volatile memory part, number of times of reading the operating parameter, or a read time of the operating parameter.

Abstract: The semiconductor device includes memory strings, word lines, bit lines and a circuit. The memory strings each include memory cells connected in series. The gate electrode surrounds the channel. The word lines are electrically connected to gate electrodes of memory cells. The bit lines are electrically connected to ends of current paths in the memory strings respectively. The circuit controls a program operation of information. The information includes at least three of a first, a second and a third levels or more corresponding to threshold voltages of the memory cells. When starting the program operation, the circuit applies a program selection voltage to channels of memory cells to be programmed at the second level, and a program suppression voltage to channels of memory cells maintaining the first level and channels of memory cells to be programmed at the third level.

Abstract: A magnetic memory device can include a plurality of separately controllable magnetic memory segments configured to store data. A plurality of separately controllable source lines can each be coupled to a respective one of the plurality of separately controllable magnetic memory segments.

Abstract: Systems and methods for performing convolution operations. An example processing system comprises: a processing core; and a convolver unit to apply a convolution filter to a plurality of input data elements represented by a two-dimensional array, the convolver unit comprising a plurality of multipliers coupled to two or more sets of latches, wherein each set of latches is to store a plurality of data elements of a respective one-dimensional section of the two-dimensional array.

Abstract: A user device includes a storage device including a flash memory; and a host connected to the storage device via an interface and adapted to transmit data to the storage device. The host provides the storage device with erase count information of the flash memory using a host flash translation layer (FTL), provides the storage device with reprogram information when the flash memory uses a reprogram method, or provides the storage device with page offset information of an open block of the flash memory.

Abstract: One embodiment provides a magnetic logic device including: a first conductive thin wire; a second conductive thin wire; and a third conductive thin wire that electrically connects the first conductive thin wire and the second conductive thin wire. The first to third conductive thin wires commonly includes: a first non-magnetic metal layer; a second non-magnetic metal layer; and a magnetic metal layer sandwiched between the first non-magnetic metal layer and the second non-magnetic metal layer.

Abstract: A storage device includes first and second nonvolatile memory groups that respectively include first and second nonvolatile memory chips, a memory controller connected to the first and second nonvolatile memory groups in common through input/output lines and at least one control line, and a group select circuit connected to the memory controller through the at least one control line and chip enable lines. The group select circuit is connected to the first and second nonvolatile memory groups through a plurality of first and second chip enable lines, respectively. The group select circuit, in response to receiving a control signal through the at least one control line, is configured to transmit chip enable signals to a selected memory group among the first nonvolatile memory group and the second nonvolatile memory group through selected chip enable lines among the first chip enable lines and the second chip enable lines.

Abstract: Methods and apparatus related to non-volatile memory page sector rotation are described. In one embodiment, logic rotates the order of one or more sectors by a rotation value prior to storage of the one or more sectors in a non-volatile memory device. Logic then rotates the one or more sectors back by the rotation value after reading the one or more sectors from the non-volatile memory device. Furthermore, at least one indirection block (corresponding to the one or more sectors) is stored in at least two different logical memory pages of the non-volatile memory. Other embodiments are also disclosed and claimed.

Abstract: A semiconductor memory device according to an embodiment includes: a memory cell array including a plurality of charge accumulation type memory cells; and a control unit that controls the memory cell array. The control unit, when executing an erase operation on the memory cell array, applies an erase voltage to the memory cells. The erase voltage is a voltage in a pulse form. The control unit performs control that, compared to when the erase operation is in a first stage, increases a voltage value and shortens a pulse width of the erase voltage when the erase operation is in a second stage.

Abstract: A nonvolatile memory device includes a memory cell array including cell strings stacked in a direction orthogonal to a substrate and including a first substring group and a second substring group dividing the cell strings, and an address decoder connected to memory cells of the cell strings via a plurality of word lines and configured to provide operating voltages to the memory cells, wherein the address decoder is disposed between the first substring group and second substring group.

Abstract: A semiconductor memory device and a memory system are disclosed. The semiconductor memory device includes: a memory bank configured to include a first section and a second section, each of which is comprised of a plurality of memory cells; an LIO line switching circuit configured to generate first and second selection signals on the basis of page-size information; and an input/output (I/O) circuit configured to access the first section, the second section, or the first and second sections on the basis of the first and second selection signals, wherein the page-size information includes first and second information. If the page-size information is the first information, the LIO line switching circuit generates the first and second selection signals using a row address, and if the page-size information is the second information, the LIO line switching circuit generates the first and second selection signals using a column address.

Abstract: The semiconductor device includes a memory block including programmed pages and non-programmed pages, a peripheral circuit configured to perform a read operation of the memory block, and a control circuit configured to control the peripheral circuit so that a read voltage is applied to a word line coupled to a selected page among the pages for the read operation, a first pass voltage is applied to word lines coupled to the programmed pages among pages that are not selected for the read operation, and a second pass voltage lower than the first pass voltage is applied to word lines coupled to non-programmed pages among the pages that are not selected for the read operation.

Abstract: To provide a semiconductor memory device capable of writing a checkerboard pattern for interference and investigation by three writings regardless of the magnitude of memory capacity by making a change of a simple circuit configuration free from the need of a data holding circuit and a voltage converting circuit large in circuit area in a memory array in which the order of arrangement of bits is reversedly arranged between data words adjacent in a row direction. A row decoder and a column decoder are respectively configured to enable operation switching to an all selection mode and an even/odd-based selection mode in addition to a single address selection mode of a memory array by a control signal from a control circuit.

Abstract: A non-volatile memory device having a vertical structure includes a NAND string having a vertical structure. The NAND string includes a plurality of memory cells, and at least one pair of first selection transistors arranged to be adjacent to a first end of the plurality of memory cells. A plurality of word lines are coupled to the plurality of memory cells of the NAND string. A first selection line is commonly connected to the at least one pair of first selection transistors of the NAND string.

Abstract: Techniques are provided for reducing current consumption while programming non-volatile storage. A smart verify is performed using a subset of memory cells. By applying the smart verify to just a subset of the memory cells current is saved. The smart verify may be used to characterize programming speed. Results of the smart verify may be used to determine a magnitude of a dummy program pulse to be applied later in the programming process. The dummy program pulse is not followed by a program verify, which reduces current. If the dummy program pulse pushes threshold voltages high enough, then those memory cells will not conduct a current when verifying later in programming. Thus, current is saved during the program verify. Also, bit lines of memory cells that received the dummy pulses do not need to be pre-charged prior to a program pulse, which can save more current.

Abstract: Systems and methods for performing partial block erase operations on a subset of word lines within a memory array prior to performing data refreshing or open-block programming are described. In some cases, data stored in memory cells connected to a word line with a fail bit count above an error threshold (e.g., more than two bit errors per page or more than three bit errors per word line) may be refreshed by performing a read operation on the memory cells, generating corrected data for the memory cells, performing a partial block erase operation on one or more word lines including the word line, and then writing the corrected data into the memory cells. The one or more word lines may include the word line with the fail bit count above the error threshold and an adjacent word line that is adjacent to the word line.

Abstract: Systems and methods of sequentially accessing memory cells in a nonvolatile memory device (NVM) are provided. The NVM has a plurality of strings and a common signal line coupled to the plurality of strings. Each string includes a plurality of memory cells and a selection transistor coupled between the plurality of memory cells and the common signal line. A command that accesses multiple memory cells is received, a voltage is applied to a first selection transistor of a first string to electrically connect the common signal line to the first string, a pulse is applied for a predetermined time period to selection transistors of other strings, and memory cells of the first string are accessed. Advantages such as removal of boosting charges from unselected strings prior to sequentially accessing memory cells from selected strings can improve performance and reliability of NVM-based systems.

Abstract: A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks. The first block has a first cell unit which includes a memory cell to be programmed and a second cell unit which does not include a memory cell to be programmed, and programming is executed by applying a program potential or a transfer potential to word lines in the first block after the initial potential of channels of the memory cells in the first and second cell units is set to a plus potential. In the programming, the program potential and the transfer potential are not applied to word lines in the second block.

Abstract: A semiconductor memory device is provided. The semiconductor memory device includes memory strings including drain-side memory cells connected between a bit line and a pipe transistor, and source-side memory cells connected between the pipe transistor and a source line, and a peripheral circuit suitable for applying a pipe gate voltage to a pipe gate of the pipe transistor before applying pass voltages to turn on non-selected memory cells among the drain-side memory cells and the source-side memory cells during a read operation.

Abstract: Embodiments of the present invention relate generally to electronic components such as semiconductor wafers and more particularly, to a double-sided three-dimensional (3D) hierarchal architecture scheme for multiple semiconductor wafers using an arrangement of through silicon vias (TSVs) and backside wiring. In an embodiment a first word line architecture may be formed on a front side of an IC chip and connected to a second word line architecture formed on a back side of the IC chip through intra-wafer, TSVs, thereby relocating required wiring to the back side of the IC chip.

Abstract: An erase method of a nonvolatile memory includes supplying an erase voltage to a substrate, supplying a selection word line voltage to word lines connected with a selected sub-block within a memory block of the nonvolatile memory, supplying a non-selection word line voltage to word lines connected with an unselected sub-block within the memory block during a first delay time from a point of time when the erase voltage is supplied, and thereafter floating the word lines connected with the unselected sub-block.

Abstract: The present invention provides an EEPROM core structure embedded into BCD process and forming method thereof. The EEPROM core structure embedded into BCD process comprises a selection transistor and a storage transistor connected in series, wherein the selection transistor is an LDNMOS transistor. The present invention may embed the procedure for forming the EEPROM core structure into the BCD process, which is favorable to reduce the complexity of the process.

Abstract: A nonvolatile memory device includes a substrate and a plurality of cell strings provided on the substrate, each cell string including a plurality of memory cells stacked in a direction perpendicular to the substrate. The methods may include applying a word line erase voltage to word lines connected to memory cells of the cell strings; floating ground selection lines connected to ground selection transistors of the cell strings and string selection lines connected to string selection transistors of the plurality of cell strings; applying a ground voltage to at least one lower dummy word line connected to at least one lower dummy memory cell between memory cells and a ground selection transistor in each of the plurality of cell strings; applying an erase voltage to the substrate; and floating the at least one lower dummy word line after applying of the erase voltage.

Abstract: The present disclosure relates to a memory including a memory array with at least two rows of memory cells, a first driver coupled to a control line of the first row of memory cells, and a second driver coupled to a control line of the second row of memory cells. The first driver is made in a first well, the second driver is made in a second well electrically insulated from the first well, and the two rows of memory cells are produced in a memory array well electrically insulated from the first and second wells.

Abstract: A nonvolatile semiconductor memory device includes a control circuit configured to control a soft program operation of setting nonvolatile memory cells to a first threshold voltage distribution state of the nonvolatile memory cells. When a characteristic of the nonvolatile memory cells is in a first state, the control circuit executes the soft program operation by applying a first voltage for setting the nonvolatile memory cells to the first threshold voltage distribution state to first word lines, and applying a second voltage higher than the first voltage to a second word line. When the characteristic of the nonvolatile memory cells is in a second state, the control circuit executes the soft program operation by applying a third voltage equal to or lower than the first voltage to the first word lines and applying a fourth voltage lower than the second voltage to the second word line.

Abstract: A nonvolatile memory device includes a first memory cell group connected to a first word line and a first bit line group, a second memory cell group connected to the first word line and a second bit line groups (BLGs), a control logic that performs first and second program operations on the first and second memory cell groups, respectively, performs a verification operation on the first memory cell group by pre-charging bit lines in the first and second BLGs at a same time to verify the first program operation, and a verification operation on the second memory cell group by pre-charging the bit lines in the first and second BLGs at a same time to verify the second program operation, and performs a read operation on at least one of the first and second memory cell groups by simultaneously pre-charging the bit lines in the first and second BLGs.

Abstract: This invention provides a 2-level BL-hierarchical NAND memory architecture and associated concurrent operations applicable to both 2D and 3D HiNAND2 memory arrays. New Latch designs in Block-decoder and Segment-decoder with one common dedicated metal0 power line per one 2N-bit dynamic page buffer (DPB) formed in corresponding 2N broken-LBL metal1 line capacitors for Program and per one 2N-bit Segment DPB formed in corresponding 2N local LBL metal1 line capacitors for Read are provided for performing concurrent and pipeline operations of multiple-WL Program, Read, Erase-Verify, and Program-Verify in dispersed Blocks in a same or multiple different NAND planes with much enhanced array flexibility and multiple-fold performance improvements.

Abstract: The various implementations described herein include systems, methods and/or devices used to enable adaptive erasure in a storage device. The method includes performing a plurality of memory operations including read operations and respective erase operations on portions of one or more non-volatile memory devices specified by the read operations and respective erase operations, where the respective erase operations are performed using a first set of erase parameters that has been established as a current set of erase parameters prior to performing the respective erase operations. The method includes, in accordance with each erase operation of at least a subset of the respective erase operations, updating one or more erase statistics that correspond to performance of multiple erase operations. The method includes, in accordance with a comparison of the erase statistics with an erasure performance threshold, establishing a second set of erase parameters as the current set of erase parameters.

Abstract: A non-volatile memory including a substrate, a floating gate transistor, a select transistor and a stress-releasing transistor. The floating gate transistor, the select transistor and the stress-releasing transistor are disposed on the substrate and coupled in series with each other. The stress-releasing transistor is located between the floating gate transistor and the select transistor.

Abstract: An operating voltage and reference current are adjusted in a memory device. At least a portion of an array of memory cells is preconditioned to an erased state using an erase verify voltage on word lines coupled to the memory cells and a first reference current in sense amplifiers coupled to bit lines for the array. A test reference current is set for the sense amplifiers. A bitcell gate voltage is set on the word lines to a present overdrive voltage. The at least a portion of the array is read. If any of the memory cells in the at least a portion of the array are read as being programmed, the present overdrive voltage is increased until none of the memory cells in the at least a portion of the array are read as being programmed.

Abstract: Systems, methods, and computer program products are provided for reducing the size of image level backups. An example method receives backup parameters identifying a physical or Virtual Machine (VM) to backup and at least one file system object to include in the backup. The method connects to production storage corresponding to the selected physical or virtual machine and obtains access to data stored in disk corresponding to the selected file system object(s). The method fetches file allocation table (FAT) blocks from the disk and parses contents of the FAT blocks to determine if the disk blocks correspond to the selected file system object(s). The method creates a backup disk image FAT comprising blocks corresponding to the selected file system object(s). The method creates a reconstructed disk image FAT blocks corresponding to the backup FAT and disk image data blocks belonging to the selected file system object(s) and all other disk image data blocks are saved as zero blocks.

Abstract: A data storage device includes memory devices including respective main regions and respective virtual regions, and a processor suitable for forming a super page by selecting main pages from the respective main regions, wherein when a main page of a main region in a memory device is a bad region, the processor forms a virtual super page by selecting a virtual page from a virtual region in the memory device instead of the main page.

Abstract: A memory device comprising a plurality of memory tiles, each tile comprising a local common source line (CSL) plate, a plurality of bitlines and a plurality of wordlines, each coupled to a plurality of memory cells and a masking circuit, coupled to each of the memory tiles, for controlling whether to raise the local CSL plate and the plurality of bitlines based on the a global common source line.

Abstract: Provided is a data processing device with which, when a temporary network congestion occurs, it is possible to avoid a buffer overflow and sustain a process. When a request for retransmission of the same data with respect to a processor element from a buffer occurs continuously a prescribed number of iterations, a data processing device according to the present invention determines that it is possible that a buffer overflow occurs, and suppresses an increase in the volume of data which is accumulated in the buffer (see FIG. 1).

Abstract: A memory device comprises a plurality of sectors and a driving circuit comprising a global word line driver and a first local word line driver. The global word line driver applies an erasing voltage to a selected sector of the sectors via a global word line. The first local word line driver, coupled to the global word line, drives a first local word line of the selected sector with a biasing voltage, so that the first local word line has a first voltage level corresponding to a non-erased state.

Abstract: A solution for reducing erase cycles in an electronic storage device that uses at least one erase-limited memory device is disclosed.

Abstract: A memory device is provided as follows. A memory cell array includes strings including first and second strings. Each string includes a ground selection transistor and cell transistors. First and second ground selection lines are connected to a gate of a first ground selection transistor of the first string and a gate of a second ground selection transistor of the second string, respectively. First and second cell gate lines are connected to a gate of a first cell transistor of the first string and a gate of a second cell transistor of the second string, respectively. A first interconnection unit electrically connects a first portion of the first cell gate line to a first portion of the second cell gate line. A second interconnection unit electrically connects a second portion of the first cell gate line to a second portion of the second cell gate line.

Abstract: A semiconductor memory device includes a memory string and a peripheral circuit. The memory string has a pipe cell, a plurality of memory cells, and at least one channel layer having a three-dimensional U-shaped structure. The peripheral circuit is configured to perform an erase operation on the pipe cell. A method of operating the semiconductor memory device includes selecting the memory string and performing the erase operation on the pipe cell.

Abstract: A semiconductor device and a method of operating the same are provided. The method includes performing a multi-plane erase operation on selected planes; determining that the multi-plane erase operation has failed when a number of erase loops reaches a maximum number without successful completion of the multi-plane erase operation; determining whether there are passed planes amongst the selected planes; and performing a soft program operation on the passed planes.

Abstract: A semiconductor memory device includes a memory cell part including a main memory unit and a redundancy memory unit, a page buffer circuit including a plurality of page buffer groups and reading data stored in the memory cell part, and a sensing circuit including a plurality of sense amplifiers corresponding to the plurality of page buffer groups, respectively, and suitable for sensing the read data, wherein the plurality of sense amplifiers perform data sensing operations in parallel in order to sense the read data.

Abstract: A method of operating a semiconductor device includes performing a program operation on selected memory cells of a selected page, and selectively performing a soft erase operation on memory cells having threshold voltages greater than a reference voltage, among the selected memory cells, to reduce a width of a threshold voltage distribution of the selected memory cells.