Abstract: Methods of programming, reading and erasing memory cells are disclosed. In at least one embodiment, program, sense, and erase operations in a memory are performed with back biased operation, such as to improve high voltage device isolation and cutoff in string drivers and bit line drivers, and no nodes of the circuitry are biased at zero volts.

Abstract: A non-volatile memory device includes at least one semiconductor column having a first sidewall and a second sidewall. The device also includes at least one gate electrode is disposed on the first sidewall and at least one control gate electrode disposed on the second sidewall. The device further includes at least one charge storage layer is disposed between the second sidewall and the at least one control gate electrode. The at least one gate electrode and the at least one control gate electrode may be disposed on opposite sides of the at least one semiconductor column such that they commonly control a channel region in the semiconductor column.

Abstract: A nonvolatile semiconductor memory device includes a memory cell array and a control circuit configured to control reading and programming operations for reading data from and inputting data to the memory cell array, respectively. The control circuit includes first and second units. The first unit is configured to count a number of bits having logic 0 or a number of bits having logic 1, to set a logic where the counted number is greater than n/2 as an initial state to regenerate programming data, and to perform a programming operation based on the regenerated data, when simultaneously programming the programming data of n bits input for a designated address. The second unit is configured to program a recognition bit for recognizing which of the logic 0 and the logic 1 the initial state of the memory cell of the designated address is in, when the programming operation is performed.

Abstract: A method of operating a nonvolatile memory device includes performing a reset operation for setting a level of a program voltage to a first level, performing a program operation and a verification operation on memory cells included in a first page of a first memory block while raising the program voltage from the first level, storing a level of the program voltage, supplied to the first page when memory cells programmed to have threshold voltages with at least a verification voltage are detected during the verification operation, as a second level, while raising the program voltage from the second level, performing the program operation and the verification operation on each of second to last pages of the first memory block, and after completing the program operation for the first memory block, performing the reset operation for setting the level of the program voltage to the first level.

Abstract: Methods for programming and sensing in a memory device, a data cache, and a memory device are disclosed. In one such method, all of the bit lines of a memory block are programmed or sensed during the same program or sense operation by alternately multiplexing the odd or even page bit lines to the dynamic data cache. The dynamic data cache is comprised of dual SDC, PDC, DDC1, and DDC2 circuits such that one set of circuits is coupled to the odd page bit lines and the other set of circuits is coupled to the even page bit lines.

Abstract: A method includes programming a non-volatile memory. The memory includes a plurality of cells, wherein each cell is configured to store a plurality of values, wherein each of value is represented by N digits where N is an integer greater than 1, wherein each of the plurality of cells is further configured to store electric charge representing a plurality of voltage levels, and wherein each of the plurality of voltage levels represents one of the plurality of values. Programming comprises providing the plurality of voltage levels into a first group of voltage levels and a second group of voltage levels in one of the plurality of cells, wherein a highest voltage level of the first group is less than or substantially equal to a lowest voltage level of the second group, and storing, in the first group of voltage levels, electric charge representing a value comprising, at most, N-1 digits.

Abstract: Flash memory systems and methods for facilitating a single logical cell erasure in a flash memory device whereby logical cell mapping is changed from using a single physical cell to using pair physical cells, thereby creating a single program and erase entity as a single logical cell. By mapping two adjacent physical cells as a single logical cell, the flash memory device can be programmed and erased on a single bit or variable bit length basis with conventional technologies. Various operations can be performed on a flash device on a basis of the single program and erase entity.

Abstract: Memories and their memory arrays are disclosed. One such memory array has a string of series-coupled memory cells, a non-programmable select gate coupled in series to a first end of the string of series-coupled memory cells, and a programmable select gate coupled in series to a second end of the string of series-coupled memory cells.

Abstract: A method of erasing data in a flash memory device, including erasing data in at least one flash memory cell using a first erase voltage; detecting whether the at least one flash memory cell has a threshold voltage less than a first voltage; programming the at least one flash memory cell by varying the threshold voltage of the at least one flash memory cell using a second voltage that is greater than the first voltage if the detecting step detects the threshold voltage is less than the first voltage; maintaining the threshold voltage of the at least one flash memory cell if the detecting step detects the threshold voltage is greater than the first voltage; and verifying the at least one flash memory cell using a first verification voltage.

Abstract: A semiconductor memory device has a memory cell array, a first transistor of a first conductivity type, a second transistor of a second conductivity type and a third transistor of the first conductivity type. A source or drain of the first transistor is connected to each of word lines. A drain of the second transistor is connected to a gate of the first transistor. A source of the third transistor is connected to the gate of the first transistor. The gates of the second transistor and the third transistor are not connected, a source of the second transistor is not connected to a drain of the third transistor, and the gate of the second transistor and the drain of the third transistor have different voltage levels corresponding to opposite logic levels each other.

Abstract: A semiconductor memory device includes: static memory cells arranged in a matrix; a read bit line for transmitting data read from one of the memory cells; a write bit line for transmitting data to be written to one of the memory cells; an input data line for transmitting data which is received from outside and is to be written in one of the memory cells; and a selector for selectively transmitting data of the read line or the input data line to the write bit line.

Abstract: A method and apparatus of providing a programmable system using non-volatile programmable transistors are disclosed. A programmable logic circuit, in one embodiment, includes a first programmable transistor and a second programmable transistor. The first programmable transistor includes a first gate terminal, a first source terminal, a first drain terminal, and a first programming terminal. The second programmable transistor includes a second gate terminal, a second source terminal, and a second drain terminal, and a second programmable terminal. The first and second programmable transistors include non-volatile memory elements. The first and the second gate terminals are coupled to an input terminal, and the first drain terminal and the second source terminal are coupled to an output terminal to perform a logic function.

Abstract: A method and apparatus for setting trim parameters in a memory device provides multiple trim settings that are assigned to portions of the memory device according to observed or tested programming speed and reliability.

Abstract: A mask ROM is provided with a plurality of memory cells each including first and second nodes, and a transistor having a source and drain connected to the first and second nodes, respectively. A first memory cell out of the plurality of memory cells further includes a first resistive interconnection which provides an electrical connection between the first and second nodes. The resistance of the first resistive interconnection is adjusted depending on data stored onto the first memory cell.

Abstract: A method for driving a nonvolatile semiconductor memory device is provided. The nonvolatile semiconductor memory device has source/drain diffusion layers spaced from each other in a surface portion of a semiconductor substrate, a laminated insulating film formed on a channel between the source/drain diffusion layers and including a charge storage layer, and a gate electrode formed on the laminated insulating film, the nonvolatile semiconductor memory device changing its data memory state by injection of charges into the charge storage layer. The method includes, before injecting charges to change the data memory state into the charge storage layer: injecting charges having a polarity identical to that of the charges to be injected; and further injecting charges having a polarity opposite to that of the injected charges.

Abstract: A memory structure includes a first memory cell and a second memory cell located at an identical bit line and adjacent to the first memory cell. Each memory cell includes a substrate, a source, a drain, a charge storage device, and a gate. A method for programming the memory structure includes respectively providing a first gate biasing voltage and a second gate biasing voltage to the gates of the first memory cell and the second memory cell, boosting an absolute value of a channel voltage of the first memory cell to generate electron and hole pairs at the drain of the second memory cell through gate-induced drain leakage or band-to-band tunneling, and injecting the hole of the generated electron and hole pairs into the charge storage device of the first memory cell to program the first memory cell.

Abstract: A nonvolatile semiconductor memory includes a memory cell, a first gate control circuit that is coupled to the memory cell, and a second gate control circuit that is coupled to the memory cell. The memory cell includes a first gate electrode that is formed above a channel region in a semiconductor substrate, a second gate electrode that is formed beside the first gate electrode, and that is capacitively coupled with the first gate electrode through a first insulating layer, and a charge trapping layer that is formed between the channel region and the second gate electrode, and that includes a second insulating layer for trapping a charge. Data stored in a memory cell transistor including the second gate electrode changes depending on an amount of the charge trapped in the charge trapping layer. The first gate control circuit applies a potential to the first gate electrode, when reading the data stored in the memory cell transistor.

Abstract: Provided are a non-volatile memory device and a method of fabricating the same. The non-volatile memory device comprises: a control gate region formed by doping a semiconductor substrate with second impurities; an electron injection region formed by doping the semiconductor substrate with first impurities, where a top surface of the electron injection region includes a tip portion at an edge; a floating gate electrode covering at least a portion of the control gate region and the tip portion of the electron injection region; a first tunnel oxide layer interposed between the floating gate electrode and the control gate region; a second tunnel oxide layer interposed between the floating gate electrode and the electron injection region; a trench surrounding the electron injection region in the semiconductor substrate; and a device isolation layer pattern filled in the trench.

Abstract: A non-volatile memory (NVM) system includes a plurality of NVM cells fabricated in a dual-well structure. Each NVM cell includes an access transistor and an NVM transistor, wherein the access transistor has a drain region that is continuous with a source region of the NVM transistor. The drain regions of each NVM transistor in a column of the array are commonly connected to a corresponding bit line. The control gates of each NVM transistor in a row of the array are commonly connected to a corresponding word line. The source regions of each of the access transistors in the array are commonly coupled. The NVM cells are programmed and erased without having to apply the high programming voltage VPP across the gate dielectric layers of the access transistors. As a result, the NVM cells can be scaled down to sub-0.35 micron geometries.

Abstract: Disclosed are apparatus, system and methods of programming and readout of a one-time programmable memory device having an array of memory cells, where the cells include an anti-fuse element and an in-cell amplifier transistor. Circuitry configured for programming and correlated double sampling readout of the cells is also disclosed.

Abstract: A method of programming a non-volatile memory device employing program loops. Each program loop comprises a programming operation and a subsequent plurality of verifying operations. The method includes preventing the next program loop based on the results of performing the plurality of verifying operations of a current program loop each verifying operation verifying whether the selected memory cell transistors are program-passed. The decision to re-program may be based on a program pass number of the memory cell transistors obtained as a result of the plurality of verifying operations of the current program loop.

Abstract: A semiconductor memory device includes first to third memory cell units each including a first select transistor, a second select transistor and a plurality of memory cell transistors which are connected in series in a first direction between the first select transistor and the second select transistor, the first and second select transistors of the respective memory cell transistors being disposed to neighbor in a second direction crossing the first direction. Those of the memory cell transistors, which neighbor the first and second select transistors, are used as select memory cell transistors.

Abstract: A method for double programming of multi-level-cell (MLC) programming in a multi-bit-cell (MBC) of a charge trapping memory that includes a plurality of charge trapping memory cells is provided. The double programming method is conducted in two phrases, a pre-program phase and a post-program phase, and applied to a word line (a segment in a word line, a page in a word line, a program unit or a memory unit) of the charge trapping memory. A program unit can be defined by input data in a wide variety of ranges. For example, a program unit can be defined as a portion (such as a page, a group, or a segment) in one word line in which each group is selected for pre-program and pre-program-verify, either sequentially or in parallel with other groups in the same word line.

Abstract: Disclosed is a method for programming a nonvolatile memory device including one time programmable unit cells. The method for programming a nonvolatile memory device including one time programmable (OTP) unit cells, the method comprising applying a pulse type program voltage having a plurality of cycles. The present invention relates to a method for programming a nonvolatile memory device, which can prevent malfunctions by enhancing a data sensing margin in a read operation through the normal dielectric breakdown of an antifuse during a program operation, and thus improve the reliability in the read operation of an OTP unit cell.

Abstract: Flash memory systems and methodologies are provided herein for facilitating single logical cell erasure and quad or more bit storage in a flash device. The single logical cell erasure can be accomplished by employing a single program and erase entity as a single logical cell. The single program and erase entity is a combination of neighboring drain/source regions of two adjacent physical memory cells. By mapping two adjacent physical cells as a single logical cell, the flash memory device can be programmed and erased on a single bit or variable bit length basis. The memory cells can contain four or more data states, and each of the two adjacent memory cells in the single program and erase entity can be programmed independently from each other. As a result, the single program and erase entity can store four or more bits.

Abstract: A semiconductor memory device comprises: a write circuit including a latch circuit configured by two inverters having a positive side power supply terminal supplied with a first voltage and a negative side power supply terminal supplied with a second voltage; and a write state machine controlling the first and second voltages. When writing data to a memory cell, the first voltage is changed to a second value that is lower than a first value. When writing data to a memory cell, the second voltage is changed to a third value that is lower than the second value. The write state machine lowers the second voltage to an intermediate value between the second value and the third value and, while maintaining this intermediate value, lowers the first voltage from the first value to the second value.

Abstract: A semiconductor memory device includes a sense amplifier which senses identical multilevel data, which is stored in a memory cell, a plurality of number of times at a time of read, and a n-channel MOS transistor which has a current path one end of which is connected to the sense amplifier and the other end of which is connected to a bit line. The device further include a control unit which applies a first voltage to a gate electrode of the n-channel MOS transistor, thereby setting the n-channel MOS transistor in an ON state, and applies a second voltage which is higher than the first voltage, to the gate electrode during a period after first sense and before second sense.

Abstract: A memory device and programming and/or reading process is described that programs and/or reads the cells in the memory array with higher threshold voltage resolution than required. In programming non-volatile memory cells, this allows a more accurate threshold voltage placement during programming and enables pre-compensation for program disturb, increasing the accuracy of any subsequent read or verify operation on the cell. In reading/sensing memory cells, the increased threshold voltage resolution allows more accurate interpretations of the programmed state of the memory cell and also enables more effective use of probabilistic data encoding techniques such as convolutional code, partial response maximum likelihood (PRML), low-density parity check (LDPC), Turbo, and Trellis modulation encoding and/or decoding, reducing the overall error rate of the memory.

Abstract: Methods for programming a memory array, memory devices, and memory systems are disclosed. In one such method, the target reliability of the data to be programmed is determined. The relative reliability of different groups of memory cells of the memory array is determined. The data is programmed into the group of memory cells of the array having a relative reliability corresponding to the target reliability.

Abstract: A method of operating a non-volatile memory (NVM) cell structure that utilizes gated diode is provided. The cell architecture, utilizing about 4-10 um2 per bit, includes gated diodes that are used to program the cells while consuming low programming current. The cell architecture also allows a large number of cells to be programmed at the same time, thereby reducing the effective programming time per bit. Erase and read mode bias conditions are also provided.

Abstract: A memory structure includes a first memory cell and a second memory cell located at an identical bit line and adjacent to the first memory cell. Each memory cell includes a substrate, a source, a drain, a charge storage device, and a gate. A method for programming the memory structure includes respectively providing a first gate biasing voltage and a second gate biasing voltage to the first memory cell and the second memory cell, boosting the absolute value of a channel voltage of the first memory cell to generate electron and hole pairs at the drain of the second memory cell through gate-induced drain leakage or band-to-band tunneling, and injecting the electron of the generated electron and hole pairs into the charge storage device of the first memory cell to program the first memory cell.

Abstract: The disclosure concerns a memory including a floating body provided in a semiconductor layer between a source and a drain and storing data; a first gate dielectric provided on a first surface of the body; a first gate electrode provided on the first surface via the first gate dielectric; a second gate dielectric provided on a second surface of the body different from the first surface; a second gate electrode provided on the second surface via the second gate dielectric; a driver driving the first gate electrode and the second gate electrode; and a sense amplifier writing into the memory cells first data showing a sate of a small charge amount in a state that a voltage of the second gate electrode at a data writing time is brought closer to a potential of the source layer than a voltage of the second gate electrode at a data holding time.

Abstract: A memory system includes memory cells arranged in sectors. A decoder corresponding to a sector disables memory cells having a defective top gate. The decoder may include a low voltage or high voltage latch for the disabling. A top gate handling algorithm is included. The memory system may include dynamic top gate coupling. A programming algorithm and waveforms with top gate handling is included.

Abstract: A method for driving a nonvolatile semiconductor memory device is provided. The nonvolatile semiconductor memory device includes a semiconductor layer having a channel, a first insulating film provided on the channel, a floating electrode provided on the first insulating film, a second insulating film provided on the floating electrode, and a gate electrode provided on the second insulating film, and changes its data memory state by injection of charges into the floating electrode.

Abstract: Memory devices, bulk storage devices, and methods of operating memory are disclosed, such as those adapted to process and generate analog data signals representative of data values of two or more bits of information. Programming of such memory devices can include programming to a target threshold voltage within a range representative of the desired bit pattern. Reading such memory devices can include generating an analog data signal indicative of a threshold voltage of a target memory cell. The target memory cell can be sensed against a reference cell includes a dummy string of memory cells connected to a target string of memory cells, and, such as by using a differential amplifier to sense a difference between a reference cell and the target cell. This may allow a wider range of voltages to be used for data states.

Abstract: A flash memory cell includes a p-channel flash transistor having a source, a drain, a floating gate, and a control gate, an n-channel flash transistor having a source, a drain coupled to the drain of the p-channel flash transistor, a floating gate, and a control gate, a switch transistor having a gate coupled to the drains of the p-channel flash transistor and the n-channel flash transistor, a source, and a drain, and an n-channel assist transistor having a drain coupled to the drains of the p-channel flash transistor and the n-channel flash transistor, a source coupled to a fixed potential, and a gate.

Abstract: A memory device including a plurality of memory cells, each with a control gate NMOS transistor sharing a floating gate with a program/erase PMOS transistor which is, in turn, connected in series with an access PMOS transistor. The memory cells are formed in a common N-Well formed in a P-substrate, the NMOS transistor being formed in a p-doped pocket or base. The program/erase PMOS includes a gate, and first and second P+ doped regions formed in the N-Well, wherein the first P+ region is electrically connected to a corresponding bit line. The access PMOS includes a gate, and first and second P+ regions formed within the N-Well, wherein the first P+ region is electrically connected to the second P+ region of the program/erase PMOS, and the gate is electrically connected to a corresponding word line.

Abstract: A device for accounting for changes in characteristics of a transistor is presented. The device includes a transistor and a comparator receiving a feedback signal from the transistor and a reference signal. The comparator provides an output to a bias voltage generator. The bias voltage generator includes an input connected to the output of the comparator and an output connected to the transistor. In some embodiments of the invention the transistor is a double gate transistor and the bias voltage generator is applied to a top gate of the double gate transistor in order to control characteristics of the transistor such as turn on voltage.

Abstract: A memory device including a plurality of memory cells, each with a control gate NMOS transistor sharing a floating gate with a program/erase PMOS transistor which is, in turn, connected in series with an access PMOS transistor. The memory cells are formed in a common N-Well formed in a P-substrate, the NMOS transistor being formed in a p-doped pocket or base. The program/erase PMOS includes a gate, and first and second P+ doped regions formed in the N-Well, wherein the first P+ region is electrically connected to a corresponding bit line. The access PMOS includes a gate, and first and second P+ regions formed within the N-Well, wherein the first P+ region is electrically connected to the second P+ region of the program/erase PMOS, and the gate is electrically connected to a corresponding word line.

Abstract: In one of the disclosed embodiments, a write algorithm is used to remove errors due to back pattern effects, cell-to-cell capacitive coupling, and program disturb in memory cells. Original data to be programmed is adjusted prior to an initial programming operation of the memory cells. The original data is then programmed into the memory cells in another programming operation. In an alternate embodiment, a read adjustment weight data value is associated with each series string of memory cells. The weight data value is used to compensate data read during an initial word line read. The weight data value is updated after each read and read adjustment such that the adjusted weight data value is used on the subsequent read operations.

Abstract: A semiconductor device includes sectors having memory cells connected to local word lines, decoders selecting the sectors, and a circuit generating, in erasing of a selected sector, a control signal that causes a corresponding one of the decoders associated with the selected sector to be temporarily unselected. Each of the sectors includes a pull-up transistor that is driven by a corresponding one of the decoders via a corresponding one of global word lines connecting the sectors and drives one of the local word lines, and the pull-up transistor is kept OFF by the control signal.

Abstract: A memory device, and method of making and operating the same, including a substrate of semiconductor material of a first conductivity type, first and second spaced apart regions in the substrate of a second conductivity type with a channel region therebetween, an electrically conductive floating gate having a first portion disposed over and insulated from the channel region and a second portion disposed over and insulated from the first region and including a sharpened edge, an electrically conductive P/E gate having a first portion disposed over and insulated from the first region and a second portion extending up and over the floating gate second portion and insulated therefrom by a first layer of insulation material, and an electrically conductive select gate having a first portion disposed laterally adjacent to the floating gate and disposed over and insulated from the channel region.

Abstract: A semiconductor memory device includes a plurality of active areas each extending in a first direction and including a memory cell string which includes select transistors and memory cells, current paths of which are connected in series, a first extension portion which is provided between one-side terminal end portions of two active areas neighboring in a second direction that crosses the first direction, and a second extension portion which is provided between other-side terminal end portions of the two active areas neighboring in the second direction, the first and second extension portions connecting the two active areas in a loop configuration.

Abstract: Multi-bit programming apparatuses and methods are provided. A multi-bit programming apparatus includes a page buffer configured to store first data of the page programming operation, an input control unit configured to determine whether to invert the first data based on a number of bits having a first value and a number of bits having a second value. The input control unit is further configured to invert the first data to generate second data if the number of bits having a first value is greater than the number of bits having a second value and store the second data in the page buffer. The multi-bit programming apparatus further includes a page programming unit configured to program the second data stored in the page buffer in at least one multi-bit cell.

Abstract: A nonvolatile semiconductor memory device capable of preventing the disturb phenomenon that could become a serious problem as the nonvolatile memory having a virtual grounding bit line is miniaturized includes a program row voltage application circuit for applying a predetermined program row voltage to the selected word line in programming in the selected memory cell, a program column voltage application circuit for applying a ground voltage to one of a pair of selected bit lines and applying a predetermined program column voltage to the other of the selected bit lines in programming; and a counter voltage application circuit for applying a counter voltage of an intermediate voltage between the ground voltage and program column voltage, to an adjacent unselected bit line not connected to the selected memory cell in the first and second bit lines and adjacent to the selected bit line to which the program column voltage is applied.

Abstract: Data stored in non-volatile storage is read using sense operations and associated pre-conditioning waveforms. The pre-conditioning waveform provides a short term history for a non-volatile element which is analogous to the conditions experienced during programming when a programming pulse is applied prior to a verify operation. The pre-conditioning waveform can cause electrons to enter and exit trap sites, for instance, so that the accuracy of a probabilistic decoding process is improved. In one approach, multiple read operations are performed, some with pre-conditioning waveforms and some without. Pre-conditioning waveforms with different characteristics, such as amplitude, shape, duration and time before the associated read pulse, can also be used. For probabilistic decoding, initial reliability metrics can be developed based on multiple reads. Tables which store the reliability metrics can then be prepared for use in subsequent decoding.

Abstract: Provided are a NAND flash memory device and a method of programming the same. The NAND flash memory device may include a cell array including a plurality of pages; a page buffer storing program data of the pages; a data storage circuit providing program verification data to the page buffer; and a control unit. The control unit may program the pages and verify the pages using the program verification data following the programming of at least two of the pages.

Abstract: A group of memory cells is programmed respectively to their target states in parallel using a multiple-pass programming method in which the programming voltages in the multiple passes are correlated. Each programming pass employs a programming voltage in the form of a staircase pulse train with a common step size, and each successive pass has the staircase pulse train offset from that of the previous pass by a predetermined offset level. The predetermined offset level is less than the common step size and may be less than or equal to the predetermined offset level of the previous pass. Thus, the same programming resolution can be achieved over multiple passes using fewer programming pulses than conventional method where each successive pass uses a programming staircase pulse train with a finer step size. The multiple pass programming serves to tighten the distribution of the programmed thresholds while reducing the overall number of programming pulses.

Abstract: A non-volatile memory device may include a plurality of stacked semiconductor layers, a plurality of NAND strings, a common bit line, a common source line, and/or a plurality of string selection lines. The plurality of NAND strings may be on the plurality of semiconductor layers. Each of the plurality of NAND strings may include a plurality of memory cells and/or at least one string selection transistor arranged in a NAND-cell array. The common bit line may be commonly connected to each of the NAND strings at a first end of the memory cells. The common source line may be commonly connected to each of the NAND strings at a second end of the memory cells. The plurality of string selection lines may be coupled to the at least one string selection transistor included in each of the NAND strings such that a signal applied to the common bit line is selectively applied to the NAND strings.

Abstract: A flash memory device includes a program data buffer configured to buffer program data to be programmed in a memory cell array, and a verify data buffer configured to compare verify data to confirm whether the program data is accurately programmed in the memory cell array, wherein at least a portion of the verify data buffer is selectively enabled as a verify data buffer or a program data buffer responsive to a buffer control signal.