Abstract: According to one embodiment, CONTROLLER includes a phase comparator that receives a data strobe signal outputted from a memory in response to a read enable signal, and a delayed data strobe signal formed by applying a delay to the data strobe signal, and outputs a result of comparison between phases of two signals. The controller also includes a Duty control unit that corrects a Duty of the read enable signal outputted to the memory based upon the comparison result of the phase comparator.

Abstract: The present invention discloses two preferred embodiments of a 12T NVSRAM cell with a flash-based Charger and a pseudo 10T NVSRAM cell with one shared Flash-based Charger. The Flash-based Charger can be made of a 2-poly floating-gate type or a 1-poly charge-trapping SONOS/MONOS flash type, regardless of PMOS type or NMOS type. In an alternative embodiment, the Store operation of above two preferred NVSRAM cell use a DRAM-like charge-sensing scheme with Flash cell configured into a voltage follower associated with Flash Charger and 2-step SRAM amplification technique to amplify the threshold level difference ?Vt stored in the paired Flash transistors. The ?Vt can be detected as low as 1V when the coupled charges through the Flash charger are sufficient by ramping a gate control of the Flash Charger as high as VPP or by increasing the channel length for the Flash Charger.

Abstract: A method is provided for programming a flash memory device including memory cells formed in a direction perpendicular to a substrate, a first sub word line connected to first memory cells and selectable by a first selection line, and a second sub word line connected to second memory cells and selectable by a second selection line, the first and second memory cells being formed at the same level and being supplied with a program voltage at the same time. The method includes performing LSB program operations on the first and second sub word lines by enabling the first and second selection lines, respectively; performing CSB program operations on the first and second sub word lines by enabling the first and second selection lines, respectively; and performing MSB program operations on the first and second sub word lines by enabling the first and second selection lines, respectively.

Abstract: A control circuit is configured to, during an erase operation, set a voltage of a first line connected to a selected cell unit to a voltage larger than a voltage of a gate of a first transistor included in the selected cell unit by an amount of a first voltage. The control circuit is configured to, during the erase operation, set a voltage difference between a voltage of a first line connected to an unselected cell unit and a voltage of a gate of a first transistor included in the unselected cell unit to a second voltage, the second voltage differing from the first voltage. In addition, the control circuit is configured to, during the erase operation, apply in the selected cell unit and the unselected cell unit a third voltage to a gate of at least one of dummy memory transistors in a dummy memory string, and apply a fourth voltage to a gate of another one of the dummy memory transistors in the dummy memory string, the fourth voltage being lower than the third voltage.

Abstract: Non-volatile memory devices and related methods are provided.

Abstract: Apparatus, methods, and other embodiments associated with group based read reference voltage management in flash memory are described. According to one embodiment, an apparatus includes a partition logic, a Vref memory, and a Vref logic. The partition logic is configured to assign respective cells in a flash memory device to respective groups of cells. The Vref memory is configured to store respective Vref values mapped to respective groups of cells. The read logic is configured to read a cell in the flash memory by determining a group to which the cell is assigned; determining a Vref mapped to the group; and using the Vref value to read the cell. In one embodiment, the apparatus includes an adaptation logic configured to selectively adapt respective Vref values mapped to the respective groups of cells.

Abstract: The present invention discloses a 10T NVSRAM cell with a 6T SRAM cell with 4T Flash cell with one dedicated Flash-based Charger. In addition, a Pseudo-8T NVSRAM cell with a shared Flash-based Charger between two adjacent 8T NVSRAM cells at top and bottom in cell layout is also disclosed to further reduce cell size by 20%. As opposed to the prior art of 12T NVSRAM cell, the Store operation of the above two preferred embodiments use a DRAM-like charge-sensing scheme with Flash cell configured into a voltage follower ensured by the Flash-based Charger to obtain the final ?VQ-QB>0.2V at Q and QB nodes of each SRAM cell to cover all the mismatched of parasitic capacitance in flash cell devices and layout for a reliable amplification by ramping up SRAM's VDD line and ramping down SRAM's VSS line.

Abstract: Methods and apparatus for compensating for charge loss in memories include tracking a specific block of the main memory array and determining charge loss compensation by comparing pre-cycled and post-cycled mean threshold voltages for the tracking block; or tracking each block of the main memory and determining charge loss and compensation on a block by block basis.

Abstract: A semiconductor memory device includes a string of memory cell transistors that are connected to each other in series. A selection transistor is connected between one end of the string of the memory cell transistors and one of a source line and a bit line. A line is selectively connected to a gate electrode of the selection transistor, a driver, or a node that supplies an unselected voltage, or is set to be in a floating state.

Abstract: Method of programming a multi-level memory cell may include transferring one or more values between an auxiliary latch of the multi-level memory cell and a most significant bit (MSB) latch of the multi-level memory cell and/or between the auxiliary latch and a least significant bit (LSB) latch of the multi-level memory cell while programming the multi-level memory cell.

Abstract: A system and method for reading memory cells in a multi-level cell memory device. A set of thresholds may be received for reading a current page of the memory cells. The set of threshold may include hard decision thresholds for hard decoding, soft decision thresholds for soft decoding, erase thresholds for erase decoding and/or other combinations of thresholds. The set of thresholds may be divided into a plurality of groups of thresholds. The current page may be simultaneously read using multiple thresholds, where each of the multiple thresholds is divided into a different group of thresholds.

Abstract: A nonvolatile semiconductor memory device is provided which includes: a P-type memory cell transistor having a source, a drain, a gate, and a charge storage layer; and a control circuit which, in a case where the P-type memory cell transistor has its threshold greater than or equal to a first value (Vr) and less than or equal to a second value (Vrd), carries out a program operation of injecting electrons into the charge storage layer.

Abstract: Multiple bits of data are programmed together to each cell of a segment of a word line while other segments of the same word line are unprogrammed. Subsequently, additional segments are similarly programmed. Data is read from a partially programmed word line (with a mix of programmed and unprogrammed segments) using a single reading scheme.

Abstract: A number (Nwl) of programmed word lines in a block of NAND strings is determined by measuring a reference combined current (Iref) in the block when all of the memory cells are in a conductive state. Subsequently, to determine if a word line is a programmed word line, an additional combined current (Iadd) in the block is measured with a demarcation voltage applied to the selected word line. The selected word line is determined to be programmed word lines if Idd is less than Iref by at least a margin. Nwl can be used to adjust an erase-verify test of an erase operation by making the erase-verify test relatively hard to pass when the number is relatively small and relatively easy to pass when the number is relatively large. Or, Nwl can be used to identify a next word line to program in the block.

Abstract: A group classification method includes the following steps. Firstly, a voltage shift parameter table is established. The voltage shift parameter table includes a first positional parameter table corresponding to a first neighboring cell. Then, MN ICI patterns are determined according to N neighboring cells having a significant ICI effect. If the central cell has a first storing state, MN central cell threshold voltage shifts corresponding to the MN ICI patterns are determined according to the voltage shift parameter table, and the first storing state is divided into plural sub-regions. Afterwards, the central cells corresponding to a first number of ICI patterns are classified into a first group of the first storing state. The central cell threshold voltage shifts corresponding to the first number of ICI patterns lie in a first sub-region of the first storing state.

Abstract: A non-volatile memory device having a memory array organized into a plurality of memory blocks, having either planar memory cells or stacks of cells. Row decoding circuitry of the memory device is configured to select a group of the plurality of memory blocks in response to a first row address, and to select a memory block of the group for receiving row signals in response to a second row address. Row decoding circuitry associated with each group of memory blocks can have a row pitch spacing that is greater than a row pitch spacing of a single memory block and less than or equal to a total row pitch spacing corresponding to the group of memory blocks.

Abstract: Methods and solid state drives are disclosed, for example a solid state drive that is adapted to receive and transmit analog data signals representative of bit patterns of three or more levels (such as to facilitate increases in data transfer rates relative to devices communicating data signals indicative of individual bits). Programming of the solid state drive, comprising an array of non-volatile memory cells, might include adjusting the level of each memory cell being programmed in response to a desired performance level of a controller circuit.

Abstract: According to one embodiment, a nonvolatile semiconductor memory apparatus includes a memory cell array, a row decoder, a controller. The memory cell array includes a plurality of memory strings. The memory strings include a first select transistor and a second select transistor, and are connected to each of a plurality of bit lines. The row decoder applies a voltage to the first and second select transistors. The controller detects a defect of the bit lines based on data read from the memory cells.

Abstract: A memory device includes an N-channel transistor and a P-channel transistor. A word line is electrically connected to a drain terminal of the N-channel transistor, and a source terminal of the P-channel transistor. A first bit line is electrically connected to a source terminal of the N-channel transistor. A second bit line is electrically connected to a drain terminal of the P-channel transistor. Gate terminals of the N-channel transistor and the P-channel transistor are electrically connected and floating.

Abstract: Data storage circuits are connected to the bit lines in a one-to-one correspondence. A write circuit writes the data on a first page into a plurality of 5 first memory cells selected simultaneously by a word line. Thereafter, the write circuit writes the data on a second page into the plurality of first memory cell. Then, the write circuit writes the data on the first and second pages into second memory cells adjoining 10 the first memory cells in the bit line direction.

Abstract: An integrated includes a memory cell, a bit line connected to the memory cell, a boosting circuit to boost the bit line up to a boosting voltage during a pre-charge operation pre-charging the bit line, and a regulation circuit connected between the bit line and an output terminal and determines a logic level of the output terminal according to the voltage of the bit line.

Abstract: A method, apparatus, and controller for acquiring and tracking at least one threshold voltage of at least one cell of at least one flash chip. The method can include acquiring the at least one threshold voltage of a particular cell of the at least one flash cell. The method can further include performing at least one threshold voltage adjustment iteration.

Abstract: A data storage device includes a non-volatile memory and a controller. A method includes programming information to the non-volatile memory. The information includes multiple codewords. The method further includes accessing a sample codeword of the multiple codewords from the non-volatile memory and determining an error rate associated with the sample codeword. The error rate is determined by an error correcting code (ECC) engine. The method further includes programming the information at the non-volatile memory in response to the error rate satisfying an error threshold.

Abstract: A semiconductor device includes a memory block coupled to word lines and configured to a memory cell including a floating gate, an inter-poly dielectric and a control gate and a peripheral circuit configured to perform an erase loop operation, a program loop operation an electron injection operation of the memory cell, the electron injection operation trapping electrons in the inter-poly dielectric.

Abstract: The present disclosure includes apparatuses and methods for inferring threshold voltage distributions associated with memory cells via interpolation. A number of embodiments include determining soft data for a group of memory cells each programmed to one of a number of data states, wherein the soft data comprises a number of different soft data values, determining a quantity of memory cells associated with each of the different soft data values, and inferring at least a portion of a threshold voltage distribution associated with the group of memory cells via an interpolation process using the determined quantities of memory cells associated with each of the different soft data values.

Abstract: A apparatus and process for reading data from non-volatile storage includes applying a read compare signal to a selected data memory cell of a NAND string, applying a first set of one or more read pass voltages to unselected data memory cells at both ends of the NAND string and applying a second set of one or more read pass voltages to unselected data memory cells between both ends of the NAND string and on both sides of the selected data memory cell. The second set of one or more read pass voltages are all higher than the first set of one or more read pass voltages.

Abstract: A system for erasing non-volatile storage system that reduces the voltage across the transistor that interfaces between the sense amplifier and the bit line so that the transistor can be made smaller. Additionally, the use of the lower voltage allows for various components to be positioned closer to each other. The use of smaller components and smaller spaces between components allows the non-volatile storage system to include more memory cells, thereby providing the ability to store more data.

Abstract: Memory devices and methods for operating a memory include filtering a histogram of sensed data of the memory, and adjusting a parameter used to sense the memory using the filtered histogram. Filtering can be accomplished by averaging or summing, and may include weighting the sums or averages.

Abstract: A nonvolatile memory device includes a plurality of memory cells and a plurality of monitor cells. The method of operating the device includes erasing the plurality of memory cells and the plurality of monitor cells, programming at least one first memory cell among the plurality of memory cells to a first program state, programming at least one first monitor cell among the plurality of monitor cells to the first program state, and refreshing data stored in the plurality of memory cells according to a result read from the at least one first monitor cell during a read operation of the at least one first monitor cell.

Abstract: A nonvolatile memory device and a method of operating the same are provided. The method includes performing a plurality of program operations on a plurality of memory cells each to be programmed to one of a plurality of program states, performing a program-verify operation on programmed memory cells associated with each of the plurality of program states, the program-verify operation comprises, selecting one of the plurality of offsets based on a noise level of a common source line associated with a programmed memory cell, using the selected offset to select one of a first verify voltage and a second verify voltage higher than the first verify voltage, and verifying a program state of the programmed memory cell using the first verify voltage and the second verify voltage.

Abstract: A multi-level non-volatile memory device programs cells in each row in a manner that takes into account the coupling from the programming of cells that are proximate the row to be programmed. In one example of the invention, after the row has been programmed, the proximate cells are verified by read, comparison, and, if necessary, reprogramming operations to compensate for charge added to proximate memory cells resulting from programming the row. In another example of the invention, a row of memory cells is programmed with charge levels that take into account the charge that will be added to the memory cells when proximate memory cells are subsequently programmed.

Abstract: Methods, apparatuses, and systems for comparing threshold voltages of a plurality of flash memory cells to a plurality of reference voltages. A number of flash memory cells having threshold voltages that fall within each bin of a plurality of bins is determined. The plurality of bins each represent a plurality of threshold voltage ranges. A threshold voltage distribution of the plurality of flash memory cells is calculated based at least in part on the number of flash memory cells that fall into each of the bins.

Abstract: A method to trim a reference voltage source formed on an integrated circuit includes configuring the integrated circuit in a test mode; providing a power supply voltage and a trim code sequence to the integrated circuit where the power supply voltage is provided by a precision reference voltage source; generating a target voltage on the integrated circuit using the power supply voltage; generate a reference voltage using the reference voltage source formed on the integrated circuit; applying one or more trim codes in the trim code sequence to the reference voltage source to adjust the reference voltage; comparing the reference voltage generated based on the trim codes to the target voltage; asserting a latch signal in response to a determination that the reference voltage generated based on a first trim code is equal to the target voltage; and storing the first trim code in response to the latch signal being asserted.

Abstract: An indication of a page type which failed error correction decoding is received. A threshold to adjust is selected from a plurality of thresholds based at least in part on the page type. A third adjusted threshold associated with the page type is generated, including by: determining a first number of flipped bits using a first adjusted threshold associated with the page type, determining a second number of flipped bits using a second adjusted threshold associated with the page type, and generating the third adjusted threshold using the first number of flipped bits and the second number of flipped bits.

Abstract: Techniques are described herein for detecting and recovering over-erased memory cells in a flash memory device. In one embodiment, a flash memory device is described including a memory array including a plurality of blocks of memory cells. The device also includes a controller to perform a leakage-suppression process. The leakage-suppression process includes determining that a given block of memory cells includes one or more over-erased memory cells. Upon the determination, the leakage-suppression process also includes performing a soft program operation to increase the threshold voltage of the over-erased memory cells in the given block.

Abstract: A semiconductor memory device is provided. The semiconductor memory device includes a memory cell array including cell strings coupled between bit lines and a common source line, each of the cell strings comprising a plurality of memory cells stacked above a substrate. The semiconductor memory device also includes a peripheral circuit configured to supply a negative voltage to one or more word lines coupled to the cell strings and supply a positive voltage to the common source line, wherein the peripheral circuit supplies the positive voltage and the negative voltage before a program operation is performed.

Abstract: A method for a low margin read operation that compares CRC codes receives known data and a CRC code generated from the known data. A CRC code is generated from data read from a memory cell at a first low margin reference voltage. The CRC code from the known data and the CRC code from the read data are compared and, if the codes do not match, a failed read operation is indicated. If the CRC codes do match, data is read from the memory cell at a second low margin reference voltage that is greater than the first low margin reference voltage. A CRC is generated from this read operation. If the two CRC codes match, the read operation is indicated as passed.

Abstract: A semiconductor memory device includes a memory cell array including first memory cells and second memory cells connected to at least one word line, a circuit group configured to perform a pre-program operation on the first memory cells using a target voltage and a main program operation on the first memory cells and the second memory cells using a final target voltage, and a control circuit configured to set the target voltage depending on variations in threshold voltages of the first memory cells caused by the main program operation of the second memory cells.

Abstract: A semiconductor memory apparatus includes: a memory block including first and second planes; and a reset signal generator configured to generate a first reset signal by logically combining a first plane selection signal and a control pulse signal which pulses after a first programming setup pulse signal pulses during a first programming command cycle, and generate a second reset signal by logically combining a second plane selection signal and the control pulse signal which again pulses after a second programming setup pulse signal pulses during a second programming command cycle after the first programming command cycle. A plurality of first page buffers allocated to the first plane are reset in response to the first reset signal, and a plurality of second page buffers allocated to the second plane are reset in response to the second reset signal.

Abstract: An error management system for a data storage device can generate soft-decision log-likelihood ratios (LLRs) using multiple reads of memory locations. 0-to-1 and 1-to-0 bit flip count data provided by multiple reads of reference memory locations can be used to generate probability data that is used to generate possible LLR values for decoding target pages. Possible LLR values are stored in one or more look-up tables.

Abstract: A 3D memory with vertical local bit lines global bit lines has an in-line vertical switch in the form of a thin film transistor (TFT) formed as a vertical structure, to switch a local bit line to a global bit line. The TFT is implemented to switch a maximum of current carried by the local bit line by a strongly coupled select gate which must be fitted within the space around the local bit line. Maximum thickness of the select gate is implemented with the select gate exclusively occupying the space along the x-direction from both sides of the local bit line. The switches for odd and even bit lines of the row are staggered and offset in the z-direction so that the select gates of even and odd local bit lines are not coincident along the x-direction. The switching is further enhanced with a wrap-around select gate.

Abstract: According to one embodiment, a one-time programmable (OTP) device comprises a memory FinFET in parallel with a sensing FinFET. The memory FinFET and the sensing FinFET share a common source region, a common drain region, and a common channel region. The memory FinFET is programmed by having a ruptured gate dielectric, resulting in the sensing FinFET having an altered threshold voltage and an altered drain current. A method for utilizing such an OTP device comprises applying a programming voltage for rupturing the gate dielectric of the memory FinFET thereby achieving a programmed state of the memory FinFET, and detecting by the sensing FinFET the altered threshold voltage and the altered drain current due to the programmed state of the memory FinFET.

Abstract: A next read threshold is determined by determining a first number of solid state storage cells having a stored voltage which falls into a first voltage range and determining a second number of solid state storage cells having a stored voltage which falls into a second voltage range. A gradient is determine by taking a difference between the first number of solid state storage cells and the second number of solid state storage cells. The next read threshold is determined based at least in part on the gradient.

Abstract: Apparatus configured to perform a programming operation on a row of memory cells in response to original data, configured to perform a comparison of verified data of the row of memory cells to the original data following success of the programming of the row of memory cells, and further configured to perform a post-programming program operation on the row of memory cells if the verified data is different from the original data.

Abstract: A control circuit for a nonvolatile semiconductor storage device, during a write operation, configures multiple bit lines so that bit lines that are adjacent to select bit lines are nonselect bit lines. The control circuit applies a first voltage to a write bit line that is included in the select bit lines, and also applies a second voltage that is higher than the first voltage, to a write inhibit bit line that is included in the select bit lines. Then, the control circuit applies a third voltage that is higher than the second voltage to the nonselect bit lines. As a result, the control circuit raises the voltage of the write inhibit bit line, while maintaining the write bit line at the first voltage. Next, the control circuit applies a fourth voltage for the write operation to the drain-side select gate line.

Abstract: A method and apparatus for refreshing data in a flash memory device is disclosed. A counter is maintained for each memory block. When a memory block is erased, the counter for that erase block is set to a predetermined value while the remaining counters for other erase blocks are changed. When a memory block counter reaches a predetermined threshold value, the associated memory block is refreshed.

Abstract: A method may be performed by a data storage device and includes writing first data to a group of storage elements. Each particular storage element of the group of storage elements is assigned to a particular state of a first set of states based on a first data value to be stored in the particular storage element. The method also includes overwriting the first data in the group of storage elements with second data. Each particular storage element of the group of storage elements is assigned to a particular state of a second set of states based on a second data value to be stored in the particular storage element. At least one state is included in the first set of states and is excluded from the second set of states.

Abstract: A nonvolatile memory device includes a substrate, a structure including a stack of alternately disposed layers of conductive and insulation materials disposed on the substrate, a plurality of pillars extending through the structure in a direction perpendicular to the substrate and into contact with the substrate, and information storage films interposed between the layers of conductive material and the pillars. In one embodiment, upper portions of the pillars located at the same level as an upper layer of the conductive material have structures that are different from lower portions of the pillars. In another embodiment, or in addition, upper string selection transistors constituted by portions of the pillars at the level of an upper layer of the conductive material are programmed differently from lower string selection transistors.

Abstract: There is disclosed an operating method of a semiconductor device including programming a memory cell by supplying a program voltage to a control gate of the memory cell and a detrap voltage to a well which is formed in a semiconductor substrate, and subsequently removing electrons trapped in a tunnel insulating layer of the memory cell by supplying a voltage lower than the detrap voltage to the control gate while also supplying the detrap voltage to the well before the programmed memory cell is verified.

Abstract: An apparatus comprising a memory configured to store data and a controller. The controller may be configured to process a plurality of input/output requests to read/write to/from the memory. The controller is configured to (i) set a value of a threshold voltage based on an estimate, (ii) determine whether the read is successful, (iii) if the read is not successful, perform a plurality of reads with a varying value of the threshold voltage, (iv) read a calibration value from a look-up table based on the plurality of reads and (v) set the threshold value in response to the calibration value.