Abstract: The present disclosure describes an adjustment circuit that can be used, for example, in a memory system with partitioned memory blocks. The adjustment circuit can include a controller circuit, a timer circuit, and a temperature adaptive reference (TAR) generator. The controller circuit can be configured to output a control signal that indicates a memory type (e.g., code memory or data memory) associated with a partitioned memory block. The timer circuit can be configured to output a timing signal for a read memory operation based on the control signal. And, the TAR generator can be configured to adjust a verify reference current for a verify memory operation based on temperature, where the verify reference current is set based on the control signal.

Abstract: The present disclosure relates to a non-volatile memory and operating method thereof. The non-volatile memory includes multiple memory strings, multiple bit switch units, a memory operation circuit and multiple source switch units. The bit switch units are electrically connected to the memory strings. The memory operation circuit is electrically connected to the bit switch units to transmit a write signal to the memory unit strings. The source switch units are electrically connected to the memory string so that the memory strings receive a bias signal via the source switch unit. In a program mode, when a first bit switch unit of the bit switch units is turned on and a first memory strings receives the write signal through the first bit switch unit, the source switch units electrically connected to the other memory strings will be turned on.

Abstract: A memory controller having improved read performance controls a memory device including a plurality of memory cells. The memory controller includes a read operation controller, a history bias storage, and a read voltage setting circuit. The read operation controller read data stored selected memory cells among the plurality of memory cells. The history bias storage stores a plurality of history mean biases, which are mean biases of a plurality of threshold voltage distributions that the plurality of memory cells have, and a plurality of reference cell count values respectively corresponding to the plurality of threshold voltage distributions.

Abstract: A memory system is provided that includes a first memory array including a first memory cell, a second memory array including a second memory cell, and a memory controller configured to determine a threshold voltage of the second memory cell to compensate a drift of a threshold voltage of the first memory cell and/or determine an offset voltage of the second memory cell to compensate an offset voltage of the first memory cell.

Abstract: The present disclosure describes an adjustment circuit that can be used, for example, in a memory system with partitioned memory blocks. The adjustment circuit can include a controller circuit, a timer circuit, and a temperature adaptive reference (TAR) generator. The controller circuit can be configured to output a control signal that indicates a memory type (e.g., code memory or data memory) associated with a partitioned memory block. The timer circuit can be configured to output a timing signal for a read memory operation based on the control signal. And, the TAR generator can be configured to adjust a verify reference current for a verify memory operation based on temperature, where the verify reference current is set based on the control signal.

Abstract: A memory includes an upper deck and a lower deck. The upper deck includes a first upper dummy word line. The lower deck includes a first lower dummy word line. A method for reducing program disturbance of the memory includes adjusting a first upper bias voltage applied to the first upper dummy word line and/or a first upper threshold voltage of the first upper dummy word line to adjust a first difference between the first upper bias voltage and the first upper threshold voltage; and adjusting a first lower bias voltage applied to the first lower dummy word line and/or a first lower threshold voltage of the first lower dummy word line to adjust a second difference between the first lower bias voltage and the first lower threshold voltage.

Abstract: A system includes a memory circuitry configured to receive a command, and in response to the command: generate a first read result based on reading a set of memory cells using a first read voltage; and generate a second read result based on reading the set of memory cells using a second read voltage, wherein: the first read voltage and the second read voltage are separately associated with a read level voltage initially assigned to read the set of memory cells, and the first read result and the second read result are for calibrating the read level voltage.

Abstract: Various communication systems may benefit from an improved signaling protocol. For example, communication systems may benefit from an improved network support for a narrowband internet of things in a hosting long term evolution carrier. A method, in certain embodiments, includes shifting a frequency of a downlink long term evolution channel by a pre-determined amount. The shift causes a duplex distance between the downlink long term evolution channel and an uplink long term evolution channel to change. The method includes blanking at least one overlapping radio resource in at least one of the uplink long term evolution channel or an uplink narrowband internet of things channel. The uplink narrowband internet of things channel and the uplink long term evolution channel at least partially overlap. In addition, the method includes receiving data on the uplink narrowband internet of things channel and an additional uplink narrowband internet of things channel at a network entity from a user equipment.

Abstract: A one-time programmable (OTP) memory device including: a cell array circuit including an OTP cell array and dummy cell block, the OTP cell array includes OTP memory cells coupled to bit-lines, read word-lines and voltage word-lines and the dummy cell block is coupled to the read word-lines and voltage word-lines; a row decoder coupled to the dummy cell block and the OTP cell array through the read word-lines and voltage word-lines; a column decoder coupled to the OTP cell array through the bit-lines; a write-sensing circuit coupled to the column decoder; and a control circuit to control the cell array circuit, row decoder and write-sensing circuit based on a command and address, the cell array circuit further includes an isolation circuit to cut off first and second voltages which are transferred to the OTP cell array from the row decoder, in response to control codes in a test mode.

Abstract: A resistive memory device according to an example embodiment of the inventive concepts includes: a cell array including a first section and a second section; a first column switch circuit connected to a memory cell and a reference cell of the first section through first bit lines; a second column switch circuit connected to a memory cell and a reference cell of the second section through second bit lines; and a column decoder configured to control the first and second column switch circuits such that one of the first bit lines connected to the memory cell and one of the second bit lines connected to the reference cell are selected according to a first column address, and one of the first bit lines connected to the reference cell and one of the second bit lines connected to the memory cell are selected according to a second column address.

Abstract: A memory device includes a memory cell array including a plurality of strings, a peripheral circuit coupled to the memory cell array and configured for sequentially performing a program voltage apply operation, a program verify operation, and a hole injection operation on the plurality of strings, and a control logic configured for controlling an operation of the peripheral circuit, wherein the control logic controls the operation of peripheral circuit to generate Gate Induced Drain Leakage (GIDL) at a channel under a select transistor of each of the plurality of strings during the hole injection operation.

Abstract: A memory device includes a plurality of word lines spaced from one another in a first direction, a first insulating film provided between adjacent word lines, a plurality of select gates located above the plurality of word lines in the first direction, a first intermediate electrode provided between the plurality of word lines and the select gates, a second insulating film provided between the first intermediate electrode and the select gates, a semiconductor pillar extending through the plurality of word lines, the first insulating film, the first intermediate electrode, the second insulating film, and the select gates, and extending in the first direction, and a charge retention film located between each of the plurality of word lines and the semiconductor pillar, wherein the second insulating film has a second thickness in the first direction that is greater than a first thickness of the first insulating film in the first direction.

Abstract: A memory device including a normal memory cell array including a first magneto-resistance memory cell that is connected to a first bit line, a first source line, and a first word line, and configured to receive a selection voltage through the first word line, a monitor memory cell array including a second magneto-resistance memory cell that is connected to a first signal line and a second signal line, a gate of a cell transistor of which is configured to receive a non-selection voltage, and a body bias generator configured to sense a leakage current flowing through the first signal line and control a body voltage provided to each of a body of a cell transistor of the first magneto-resistance memory cell and a body of the cell transistor of the second magneto-resistance memory cell based on the leakage current may be provided.

Abstract: A method of generating soft decision detection parameters for a plurality of received signals. The method comprises defining a hard decision boundary and a plurality of quantisation intervals wherein each quantisation interval extends from the hard decision boundary by an interval distance, selecting a log likelihood value from a set of log likelihood values for each received signal based on the quantisation interval in which the received signal is detected, performing a soft decoding using a plurality of log likelihood values, adjusting the set of log likelihood values based on a result of the soft decoding, determining an error probability for a quantisation interval, comparing the error probability against a target error probability and adjusting the interval distance in order to obtain the target error probability.

Abstract: A memory device includes: a set of input pads configured to receive from a source external to the memory device one or more input signals and a chip select signal; an operation circuit electrically coupled to the input pads, operation circuit configured to perform operations corresponding to the one or more input signals when the chip select signal is enabled; and an input management circuit electrically coupled to and between the input pads and the operation circuit, the input management circuit configured to control propagation of the one or more input signals based on the chip select signal.

Abstract: A semiconductor device includes: a memory string including a plurality of memory cells, a plurality of select transistors, and one or more dummy transistors coupled between the plurality of memory cells and the plurality of select transistors; one or more dummy word lines coupled to the one or more dummy transistors; and a plurality of select lines respectively coupled to the plurality of select transistors. When a program voltage is applied to a selected dummy word line among the one or more dummy word lines, a first dummy word line voltage may be applied to a select line adjacent to the one or more dummy word lines, among the plurality of select lines.

Abstract: A memory circuit and a data bit status detector thereof are provided. The data bit status detector includes a sense amplifying circuit, a data receiving circuit, and a reference circuit. The sense amplifying circuit has a first sense input end and a second sense input end. The sense amplifying circuit senses and amplifies a difference between a first impedance on the first sense input end and a second impedance on the second sense input end to generate a sensing output signal. The data receiving circuit receives a plurality of bits of a data signal and provides the first impedance between the first sense input end and a reference grounding end according to the bits of the data signal. The reference circuit receives a plurality of bias voltages and provides the second impedance between the second sense input end and the reference grounding end according to the bias voltages.

Abstract: Methods of operating a memory, and memory configured to perform similar methods, might include sensing a state of each data line of a plurality of data lines while increasing a voltage level applied to each access line of a plurality of access lines commonly connected to a plurality of strings of series-connected memory cells, ceasing increasing the voltage level applied to each access line of the plurality of access lines in response to the state of each data line of the plurality of data lines having a particular condition, changing a voltage level applied to a particular access line of the plurality of access lines to a particular voltage level, and sensing a state of each data line of a subset of the plurality of data lines while applying the particular voltage level to the particular access line.

Abstract: Methods for sensing ferroelectric memory devices and apparatuses using the same have been disclosed. One such apparatus includes a ferroelectric memory cell coupled to a data line, a reference capacitance, and a common node coupled between the data line and the reference capacitance. A current mirror circuit is coupled to the data line and the reference capacitance. During a sense operation, the common node is configured to be at a fixed voltage and the current mirror circuit is configured to mirror displacement current from the reference capacitance to the ferroelectric memory cell.

Abstract: Generally discussed herein are apparatuses and methods. One such apparatus includes a data line, a first memory cell and a first select transistor. The first transistor has a gate and is coupled between the data line and the first memory cell. The apparatus can include a second memory cell and a second select transistor having a gate. The apparatus can include a third select transistor having a gate. The second select transistor is coupled between the second memory cell and the third select transistor. The third select transistor is coupled between the second select transistor and a source. The apparatus can include a drive transistor coupled to both the gate of the first select transistor and the gate of the second select transistor or the gate of the third select transistor.

Abstract: An apparatus includes memory cells programmed to one of a plurality of data states, wherein the memory cells are configured such that the plurality of data states comprise an error-prone data state. Sense circuitry of the apparatus is configured to sense first memory cells programmed to the error-prone data state, determine a bit encoding for the first memory cells, sense other memory cells programmed to other data states, and determine a bit encoding for the other memory cells. A communication circuit of the apparatus is configured to communicate the bit encoding for the other memory cells, the bit encoding for the first memory cells, and an indication that the first memory cells are programmed to the error-prone data state, in response to a single read command from a controller.

Abstract: In a particular implementation, an apparatus including first and second bias circuits and an inner amplifier provides sense amplifier offset cancellation. The inner amplifier includes: first and second current generators configured to replicate respective first and second currents from the first and second bias circuits, first and second transistors configured to transform the first and second currents into voltage samples, and first and second capacitors configured to store the voltage samples. In a sampling phase, a sampling of the first and second currents may be performed in the inner amplifier, and further, in an amplification phase, an amplification of the stored voltage samples may also be performed in the inner amplifier.

Abstract: A counter can have a number of sensing components. Each respective sensing component can be configured to sense a respective event and can include a respective first capacitor configured to be selectively coupled to a second capacitor in response to the respective sensing component sensing the respective event. The second capacitor can be configured to be charged to a voltage by each respective first capacitor that is selectively coupled to the second capacitor. The counter can have a comparator with a first input coupled to the second capacitor and a second input coupled to a reference voltage corresponding to a threshold quantity of events. The comparator can be configured to output a signal indicative of the threshold quantity of events being sensed in response to the voltage of the second capacitor being greater than or equal to the reference voltage.

Abstract: Apparatuses and methods for read threshold voltage selection are provided. One example method can include setting a first soft read threshold voltage and a second soft read threshold voltage based on a difference between a first number of memory cells that are read as being programmed to a first state when read using a first threshold voltage and a second number of memory that are read as being programmed to the first state when read using another threshold voltage.

Abstract: Systems, devices, and methods related to reset read are described. A reset read may be employed to initiate a transition of a portion of memory array into a first state or maintain a portion of memory array in a first state, such as a transient state. A reset read may provide a highly-parallelized, energy-efficient option to ensure memory blocks are in the first state. Various modes of reset read may be configured according to different input.

Abstract: According to one embodiment, a semiconductor memory device includes: a first memory cell; a second memory cell; a first word line; a second word line; and a first bit line. The device is configured to execute a first operation, a second operation, and a third operation to write data into the first memory cell. In the first operation, a first voltage is applied to the second word line. In the second operation, after the first operation, a second voltage higher than the first voltage is applied to the second word line. In the third operation, after the second operation, a third voltage higher than the second voltage is applied to the first word line, and a fourth voltage lower than both the second voltage and the third voltage is applied to the second word line.

Abstract: An electronic device includes a controller, a non-transitory computer-readable storage medium including memory cells having a plurality of threshold voltage distributions and storing operation codes executable by the controller.

Abstract: A memory device comprising: a memory cell array and a memory controller configured to program data to memory cells during a programming cycle using operations comprising: during a setup stage, providing a first voltage level to word lines, a second voltage level to a first dummy word line, and a fourth voltage level to second dummy word lines being different from the first dummy word line, wherein the first voltage level is lower than a threshold voltage of a first transistor coupled to the first dummy word line and the second voltage level and the fourth voltage are higher than the threshold voltage, during a program stage, providing a third voltage level to first word lines to program data to memory cells coupled to the first word lines, the second voltage level to the first dummy word line, and the fourth voltage level to the second dummy word lines.

Abstract: Apparatuses, systems, and methods are disclosed for read threshold adjustment using reference data for non-volatile memory. An apparatus may include an array of non-volatile memory cells and a controller. A controller may be configured to write a predetermined reference data pattern to a region of an array. A controller may be configured to read reference data from a region. A controller may be configured to set one or more read thresholds based on identifying differences between reference data and a predetermined reference data pattern.

Abstract: Disclosed is a system and method for adjusting read levels in a storage device based on bias functions. The method includes receiving a request to perform a memory access operation on a wordline of non-volatile memory. The method also includes selecting a bias function corresponding to the wordline of the non-volatile memory from a group of bias functions. The method also includes determining a bias value based on the selected bias function and the wordline. The method also includes adjusting a read level in the non-volatile memory based on the bias value. The method also includes performing the memory access operation on the wordline of the non-volatile memory using the adjusted read level. The bias functions may be linear functions and adjusted in response to detecting a recalibration condition.

Abstract: In a method for operating a semiconductor memory device including a plurality of memory blocks, the method includes: receiving a read command for a first memory block among the plurality of memory blocks; referring to a block read count value corresponding to the first memory block; determining whether the block read count value has reached a first threshold value; and performing a read operation on the first memory block, based on the determined result.

Abstract: To reduce a time required for verify processing of a semiconductor storage device, a semiconductor storage device according to one embodiment includes a plurality of unit memory arrays each including a plurality of memory blocks, a sense amplifier, and a verify circuit. When the semiconductor storage device performs verify processing, a pulse corresponding to verify data is applied to each memory cell of each memory block, and an expectation value corresponding to the verify data is set to each verify circuit. Each verify circuit performs the verify processing by comparing data stored read by the sense amplifier with the expectation value.

Abstract: A 3D NAND array with divided string architecture. In one aspect, an apparatus includes a plurality of charge storing devices connected to form a cell string. The apparatus also includes one or more internal select gates connected between selected charge storing devices in the cell string. The one or more internal select gates divide the cell string into two or more segments of charge storing devices. Selectively enabling and disabling the one or more internal select gates during programming operates to isolate one or more selected segments to reduce program-disturb to remaining segments. In another embodiment, a method is provided for programming a memory cell of a cell string having internal select gates that isolate the memory cell to reduce the effects of program-disturb. In another embodiment, multiple memory cells of a cell string having internal select gates are programmed with reduced program-disturb.

Abstract: A circuit includes a resistive memory cell in a memory array to store a memory state for the resistive memory cell. A reference cell in the memory array stores a reference memory state for the resistive memory cell. A function generator concurrently applies a read voltage to the resistive memory cell and the reference cell via a memory row address. A sensing circuit enables the function generator and monitors a target current received from the resistive memory cell when selected via a memory column address and monitors a reference current received when selected via a reference column address in response to the read voltage applied to the memory row address. A current comparator circuit in the sensing circuit compares a difference between the target current and the reference current to determine the memory state of the resistive memory cell.

Abstract: A memory device can include: a memory cell array including a memory cell and a word line that is connected to the memory cell; a clock generator configured to generate a first pumping clock signal from a system clock signal; a charge pump configured to provide a pumping voltage signal using a power supply voltage and the first pumping clock signal; a compensation circuit configured to compensate for variations in a first reference clock signal in accordance with variations in the power supply voltage, and provide a compensated first reference clock signal; and a pass/fail (P/F) determining circuit configured to determine whether the word line is defective by comparing the first pumping clock signal and the compensated first reference clock signal while the pumping voltage signal is provided to the word line.

Abstract: An improved method and apparatus for programming advanced nanometer flash memory cells is disclosed.

Abstract: Methods and devices for increasing error detection rate while avoiding excessive power distribution network noise are provided. In one method, memory reads of configuration memory of a first group of sectors of a programmable logic device are performed. The memory reads start at a first start time within a first memory read period. The first memory read period includes an amount of time involved to perform one of the memory reads. The method also includes performing memory reads of configuration memory of a second group of sectors of the programmable logic device. The memory reads of the configuration memory of the second group of sectors start at a second start time within the first memory read period. The second start time is different from the first start time. By offsetting the start times of memory reads, power distribution noise may be reduced.

Abstract: A power supply management device includes a first input terminal that receives an input voltage, and a first power supply circuit that outputs a voltage obtained by converting the input voltage. The first power supply circuit further outputs a first voltage responsive to a first signal being received by the first input terminal. The first power supply circuit yet further outputs a second voltage responsive to a second signal different from the first signal being received by the first input terminal.

Abstract: Read reference levels are used to distinguish different data states for information stored in non-volatile memory. A storage system recalibrates its read reference levels, to maintain accuracy of the read process, by sensing samples of data for different test read reference levels and using those samples to determine an improved set of read reference levels. At least a subset of the test read reference levels used for the samples are dynamically and adaptively chosen based on indications of error for previous samples.

Abstract: A non-volatile semiconductor storage device including a first potential retention line configured to retain a potential corresponding to data read from the memory cell, a second potential retention line configured to retain a reference potential read from the memory cell in which the reference potential is written after the data is read out, a sense amplifier configured to amplify a difference between the potential retained by the first potential retention line and the reference potential for reading out the data from the memory cell, a first offset adjustment circuit connected to the first potential retention line, for adjusting an offset for the potential, a second offset adjustment circuit connected to the second potential retention line, and an offset command signal supply circuit configured to supply a first offset command signal to the first offset adjustment circuit so as to control the offset.

Abstract: The present disclosure describes an adjustment circuit that can be used, for example, in a memory system with partitioned memory blocks. The adjustment circuit can include a controller circuit, a timer circuit, and a temperature adaptive reference (TAR) generator. The controller circuit can be configured to output a control signal that indicates a memory type (e.g., code memory or data memory) associated with a partitioned memory block. The timer circuit can be configured to output a timing signal for a read memory operation based on the control signal. And, the TAR generator can be configured to adjust a verify reference current for a verify memory operation based on temperature, where the verify reference current is set based on the control signal.

Abstract: An MTP (Many Times Programmable) memory cell for integrated circuit memory arrays is described. The cell includes an MTP device and a thyristor interconnected so that the MTP device triggers the thyristor to turn on during a Read or Verify operation. The difference in threshold voltages between a data memory cell and a reference memory cell is used to determine the information in the data memory cell. Different memory cell structures may be constructed for different memory array requirements.

Abstract: Provided herein may be a control logic, semiconductor memory device, method of operating the control logic, and or method of operating the semiconductor memory device. The semiconductor memory device may include a control logic. The control logic may be configured to control a program voltage to be applied to the selected word line. The control logic may be configured to control a pass voltage to be applied to an unselected word line.

Abstract: Generally discussed herein are apparatuses and methods. One such apparatus includes a data line, a first memory cell and a first select transistor. The first transistor has a gate and is coupled between the data line and the first memory cell. The apparatus can include a second memory cell and a second select transistor having a gate. The apparatus can include a third select transistor having a gate. The second select transistor is coupled between the second memory cell and the third select transistor. The third select transistor is coupled between the second select transistor and a source. The apparatus can include a drive transistor coupled to both the gate of the first select transistor and the gate of the second select transistor or the gate of the third select transistor.

Abstract: Provided herein is a semiconductor memory device and a method for operating the same. The semiconductor memory device may include a memory cell array including a plurality of memory blocks, each including dummy cells coupled to dummy word lines and normal memory cells coupled to normal word lines, a peripheral circuit configured to perform an erase operation on a memory block selected from among the plurality of memory blocks and control logic configured to control the peripheral circuit, during the erase operation, to apply a pre-program voltage pulse to the dummy word lines and the normal word lines, and to control application of dummy word line voltages to the dummy word lines based on Erase-Write (EW) cycling information while applying an erase voltage to a common source line of the selected memory block, wherein the EW cycling information indicates a number of erase-write cycles of the selected memory block.

Abstract: A reference-current generation method for flash includes first and second memory arrays separated by a word-line switching circuit. A reference-current generation circuit includes rows of reference cells, the first row parallel with the other rows of the first memory array and having the same number of columns as the other rows thereof, and the second row parallel with the other rows of the second memory array and having the same number of columns as the other rows thereof. The first reference word line of the first row is disconnected with the second reference word line of the second row. After programming, the first row enables the first memory array to create the first reference current used while performing read operation for the second memory array, and the second row enables the second memory array to create the second reference current used while performing read operation for the first memory array.

Abstract: Improved flash memory sensing circuits are disclosed. In one embodiment, a sensing circuit comprises a memory data read block, a memory reference block, a differential amplifier, and a precharge circuit. The precharge circuit compensates for parasitic capacitance between a bit line coupled to a selected memory cell and adjacent bit lines.

Abstract: A device may include a first analog memory device to sample an analog input during a first time window of a sampling window, store a first analog signal based on sampling the analog input, and provide a first analog output after storing the first analog signal. The device may include a second analog memory device to sample the analog input during a second time window of the sampling window, store a second analog signal based on sampling the analog input, and provide a second analog output after storing the second analog signal. An output rate may be different from a sampling rate associated with sampling the analog input. An output order may be different from a sampling order associated with sampling the analog input. A time at which a read-out phase is performed, may be significantly different from a time at which a write phase is performed.

Abstract: A circuit for reading a memory cell of a non-volatile memory device provided with a memory array with cells arranged in wordlines and bitlines, among which a first bitline, associated to the memory cell, and a second bitline, has: a first circuit branch associated to the first bitline and a second circuit branch associated to the second bitline, each with a local node, coupled to which is a first dividing capacitor, and a global node, coupled to which is a second dividing capacitor; a decoder stage for coupling the local node to the first or second bitlines and coupling the global node to the local node; and a differential comparator stage supplies an output signal indicative of the datum stored; and a control unit for controlling the decoder stage, the coupling stage, and the differential comparator stage for generation of the output signal.

Abstract: An integrated circuit may include a plurality of configuration random access memory (CRAM) sectors that configure logic sectors to perform user-defined functions. The logic circuits configured by the CRAM sectors may vary in their criticality to the operation of the integrated circuit. A prioritized error detection schedule may be provided to error detection circuitry, allowing a more frequent check of sectors that are used to configure logical circuitry that is critical to the operation of the integrated circuit. Upon detecting an error in a given CRAM sector, a sensitivity map may be used to determine the logical location corresponding to the errant CRAM sector. A sensitivity processor may assign a criticality level to the logical location, and appropriate corrective action for the errant CRAM sector may be determined based on the criticality level and the logical location corresponding to the sector.