Abstract: Apparatuses, systems, and methods are disclosed to manage non-volatile media. A method includes determining a configuration parameter for a set of storage cells of a non-volatile recording medium. A method includes reading data from a set of storage cells using a determined configuration parameter. A method includes adjusting a configuration parameter based on read data.

Abstract: An one-transistor-one-bit (1T1b) Flash-based EEPROM cell is provided along with improved key operation schemes including applying a negative word line voltage and a reduced bit line voltage for perform erase operation, which drastically reduces the high voltage stress on each cell for enhancing the Program/Erase cycles while reducing cell size. An array made by the 1T1b Flash-based EEPROM cells can be operated with Half-page or Full-page divided programming and pre-charging period for each program cycle. Utilizing PGM buffer made of Vdd devices in the cell array further save silicon area. Additionally, a two-transistor-two-bit (2T2b) EEPROM cell derived from the 1T1b cell is disclosed with additional cell size reduction but with the operation of program and erase the same as that for the 1T1b cells with benefits of no process change but much enhanced storage density, superior Program/Erase endurance cycle, and capability for operating in high temperature environment.

Abstract: The present disclosure includes systems and techniques relating to implementing fault tolerant data storage in solid state memory. In some implementations, a method includes receiving a data request for a solid state memory; identifying a logical block grouping corresponding to the data request, wherein the logical block grouping indicates physical data storage blocks spanning at least two distinct memory units of the solid state memory; reading stored data and parity information from at least a portion of the physical data storage blocks spanning the at least two distinct memory units; and recovering data of at least one block of the logical block grouping based on the stored data and the parity information.

Abstract: A semiconductor memory device includes a memory block as a code storage memory area which has a large memory capacity and in which the number of bits to be written at once is large, and a memory block as a work memory area which has a small memory capacity and in which the number of bits to be written at once is small, in which in writing to the code storage memory area a first voltage is supplied to a source line of this memory block, and in writing to the work memory area a second voltage higher than the first voltage is supplied to a source line of this memory block.

Abstract: A method is provided for programming a flash memory device including memory cells formed in a direction perpendicular to a substrate, a first sub word line connected to first memory cells and selectable by a first selection line, and a second sub word line connected to second memory cells and selectable by a second selection line, the first and second memory cells being formed at the same level and being supplied with a program voltage at the same time. The method includes performing LSB program operations on the first and second sub word lines by enabling the first and second selection lines, respectively; performing CSB program operations on the first and second sub word lines by enabling the first and second selection lines, respectively; and performing MSB program operations on the first and second sub word lines by enabling the first and second selection lines, respectively.

Abstract: A memory system comprises a nonvolatile memory and a phase change memory. The memory system can be operated by reading operation information of the nonvolatile memory from the phase change memory, adjusting voltage parameters of the nonvolatile memory based on the read operation information, and performing an operation of the nonvolatile memory based on the adjusted voltage parameters.

Abstract: Apparatus, methods, and other embodiments associated with group based read reference voltage management in flash memory are described. According to one embodiment, an apparatus includes a partition logic, a Vref memory, and a Vref logic. The partition logic is configured to assign respective cells in a flash memory device to respective groups of cells. The Vref memory is configured to store respective Vref values mapped to respective groups of cells. The read logic is configured to read a cell in the flash memory by determining a group to which the cell is assigned; determining a Vref mapped to the group; and using the Vref value to read the cell. In one embodiment, the apparatus includes an adaptation logic configured to selectively adapt respective Vref values mapped to the respective groups of cells.

Abstract: According to one embodiment, a memory system includes a memory chip and a controller. The controller is configured to count a first elapsed time from a start of an Erase process when causing the memory chip to execute the Erase process. The controller is configured to cause the memory chip to interrupt the Erase process after the first elapsed time exceeds a threshold value.

Abstract: A non-volatile memory device and a method for programming the same are disclosed. The non-volatile memory device includes first and second memory blocks, each of which includes a plurality of memory cells, each memory cell including a plurality of regions in which data is written, corresponding regions of the plurality of memory cells constituting a page; a data write unit, upon receiving a write signal and an address allocation signal, configured to write first data in a first page of the first memory block, and write second data in a first page of the second memory block; and a copy-back unit, upon receiving a chip idle signal and a copy-back control signal, configured to write the first data written in the first memory block into a second page of the second memory block.

Abstract: An apparatus includes a storage transistor. The storage transistor includes a floating gate configured to store electrical charge and a control gate. The floating gate is coupled to the control gate via capacitive coupling. The floating gate and the control gate are metal. The apparatus also includes an access transistor coupled to the storage transistor. A gate of the access transistor is coupled to a word line. The storage transistor and the access transistor are serially coupled between a bit line and a source line.

Abstract: A non-transitory computer readable medium, a flash controller and a method for state responsive encoding and programming; the method may include encoding an information entity by applying a state responsive encoding process to provide at least one codeword; wherein the state responsive encoding process is responsive to a state of flash memory cells; and programming the at least one codeword to at least one group of flash memory cells by applying a state responsive programming process that is responsive to the state, the state being either an estimated state or an actual state.

Abstract: The present disclosure describes techniques for flash-based soft information generation. In some aspects a flash-memory device includes a soft information generator configured to determine soft information for a data value stored by a flash-memory cell. The soft information includes fewer bits than a number of data bits read from the flash-memory cell from which the soft information is generated. When the flash-memory device transfers the soft information to a memory controller, fewer bits per data value are transferred. By so doing, an efficiency of a data link between the flash memory device and the memory controller may be improved.

Abstract: A semiconductor device includes a memory block coupled to word lines and configured to a memory cell including a floating gate, an inter-poly dielectric and a control gate and a peripheral circuit configured to perform an erase loop operation, a program loop operation an electron injection operation of the memory cell, the electron injection operation trapping electrons in the inter-poly dielectric.

Abstract: Apparatus and method for managing an array of multi-level cell (MLC) memory cells. In accordance with various embodiments, a non-sequential encoding scheme is selected that assigns a different multi-bit logical value to each of a plurality of available physical states of a selected MLC memory cell in relation to write effort associated with each of said plurality of physical states. Data are thereafter written to the selected MLC memory cell in relation to the selected non-sequential encoding scheme. In some embodiments, the MLC memory cell comprises a spin-torque transfer random access memory (STRAM) memory cell. In other embodiments, the MLC memory cell comprises an MLC flash memory cell.

Abstract: A data storage device includes a non-volatile memory and a controller. A method includes programming information to the non-volatile memory. The information includes multiple codewords. The method further includes accessing a sample codeword of the multiple codewords from the non-volatile memory and determining an error rate associated with the sample codeword. The error rate is determined by an error correcting code (ECC) engine. The method further includes programming the information at the non-volatile memory in response to the error rate satisfying an error threshold.

Abstract: This nonvolatile semiconductor memory device comprises: a memory cell array configured having a plurality of blocks arranged therein, each of the blocks configured as an arrangement of NAND cell units, each of the NAND cell units configured having a plurality of electrically rewritable memory cells and a select transistor connected in series; and a row decoder configured to select anyone of the blocks of the memory cell array and supply to any one of said blocks a voltage required in various kinds of operations. The row decoder comprises: a plurality of first transfer transistors each disposed in a first region and connected to any one of the memory cells; and a plurality of second transfer transistors each disposed in a second region and connected to the select transistor, the second region being a residual region of the first region.

Abstract: Memory devices and methods are described such as those that mix data and associated error correction code blocks between multiple memory device locations. Examples include mixing between multiple memory blocks, mixing between memory pages, mixing between memory chips and mixing between memory modules. In selected examples, memory blocks and associated error correction code are mixed between multiple levels of memory device hierarchy.

Abstract: A flash memory device may include two or more flash memory cells organized as a NAND string in a block of flash memory cells, and flash cells, coupled to the NAND string at opposite ends, to function as select gates. The flash memory device may be capable of providing information related to a voltage threshold of the select gates to a flash controller, erasing the flash cells that function as select gates in response to a select gate erase command, and programming the flash cells that function as select gates in response to a select gate program command.

Abstract: In a method of operating a memory circuit, which includes a plurality of memory arrays each coupled with a corresponding input/output (IO) interface and a redundancy memory page a failing address of a failing bit cell is determined. The failing address is located in a memory page of one of the memory arrays. The method further includes repairing the failing bit cell by replacing the memory page with the redundancy memory page.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device, a controller, an extended function section, and an extension register. The controller controls the nonvolatile semiconductor memory device. The extended function section is controlled by the controller. The extension register which is provided with a certain block length capable of defining an extended function of the extended function section. The controller processes a first command to write header data of a command to operate the extended function section to the extended function section through the extension register, and a second command to read header data of a response from the extended function section through the extension register.

Abstract: A method of programming a NAND flash memory cell string. The method includes a pre-boost stage configured to elevate channel voltage of a selected memory cell, and a boost stage is introduced after the pre-boost stage. The pre-boost stage has at least the following steps of biasing a bit line to a first voltage, biasing a string select transistor to a second voltage; and ramping down the string select transistor to the first voltage. In particular, the second voltage is higher than the first voltage.

Abstract: According to one embodiment, a data storage apparatus includes a flash memory and a controller. The controller includes a compaction processor. The compaction processor performs the compaction processing on the flash memory, to dynamically set a range of compaction processing targets based on a number of available blocks and an amount of valid data in each of the blocks, and to search the range of compaction processing targets for blocks each with a relatively small amount of valid data as the target blocks for the compaction processing.

Abstract: Apparatuses, systems, and methods are disclosed to manage non-volatile media. A method includes determining a configuration parameter for a set of storage cells of a non-volatile recording medium. A method includes reading data from a set of storage cells using a determined configuration parameter. A method includes adjusting a configuration parameter based on read data.

Abstract: A user system is provided including a plurality of flash memory devices and a memory controller connected to the flash memory devices through a plurality of channels. The memory controller includes a voltage regulator configured to supply a power of the flash memory devices and a compensation unit configured to supply an additional power to the flash memory devices when a power required by the flash memory devices exceeds a predetermined level. The compensation unit includes a resistor unit connected to an output terminal of the voltage regulator and input terminals of the flash memory devices and a charging unit connected to input terminals of the flash memory devices. The charging unit is configured to supply an additional power to the flash memory devices according to voltages of input terminals of the flash memory devices.

Abstract: A solid state storage device receives a device sleep signal and a power signal from a host. The solid state storage device includes a control chip, a sleep control circuit, and a regulator. If the device sleep signal is activated, the control chip temporarily stores a system parameter into a flash memory module and then generates an acknowledge signal. The sleep control circuit receives the power signal, the device sleep signal and the acknowledge signal. If both of the device sleep signal and the acknowledge signal are activated, the sleep control circuit generates a disable state and a wake-up state. Moreover, if the power signal is received by the regulator and the sleep control circuit generates the disable state, the regulator stops providing a supply voltage to the control chip, so that the solid state storage device enters a sleep mode.

Abstract: Disclosed herein are 3D stacked memory devices having WL select gates. The 3D stacked memory device could have NAND strings. The WL select gates may be located adjacent to a word line hookup area of a word line plate. The word line plate may be driven by a word line plate driver and may have many word lines. The WL select gates may select individual word lines or groups of word lines. Therefore, smaller units that the entire block may be selected. This may reduce capacitive loading. The WL select gates may include thin film transistors. 3D decoding may be provided in a 3D stacked memory device using the WL select gates.

Abstract: A semiconductor device includes cell strings that each include a plurality of memory cells, a page buffer having latches coupled to bit lines and precharge the bit lines in response to page buffer control signals, a page buffer control circuit configured to generate the page buffer control signals using a high voltage source, and a controller configured to generate control signals for controlling the page buffer control circuit.

Abstract: A semiconductor memory device includes a memory cell array including first memory cells and second memory cells connected to at least one word line, a circuit group configured to perform a pre-program operation on the first memory cells using a target voltage and a main program operation on the first memory cells and the second memory cells using a final target voltage, and a control circuit configured to set the target voltage depending on variations in threshold voltages of the first memory cells caused by the main program operation of the second memory cells.

Abstract: A method of writing data includes receiving data pages to be stored in a data storage device and generating codewords corresponding to the received data pages. The codewords are stored to physical pages of a first memory portion of the data storage device. A first portion of a particular codeword that corresponds to a particular data page is stored at a first physical page of the first memory portion. A second portion of the particular codeword is stored at a second physical page of the first memory portion. The codewords are copied from the physical pages of the first memory portion to a physical page of a second memory portion of the data storage device.

Abstract: A NOR flash memory array structure is provided, comprising: a substrate (100); and a two dimensional memory array structure formed on the substrate (100) and comprising: a plurality of memory cell columns arranged in a first direction, and each memory cell column including a plurality of memory cells (300), in which each memory cell (300) comprises: a channel region (308) located on the substrate (100), a gate structure located on the channel region (308) and formed by a tunneling oxide layer (304), a silicon nitride layer (303), a barrier oxide layer (302) and a polysilicon gate layer (301) stacked sequentially, a source region (306) and a drain region (305) located at a first edge and a second edge of the gate structure respectively; a plurality of word lines WL; a source line SL for connecting the source regions of all the memory cells; and a plurality of bit lines BL.

Abstract: An embodiment is a technique to adapt behavior of a solid-state drive (SSD) to extend lifespan of the SSD. Real environmental information is received from an environmental processor. The real environmental information corresponds to an environment of the SSD. A behavior model is selected based on a real environmental model and an internal data usage model. If a new behavior model is selected, the environmental processor is informed about the new behavior model. The environmental processor sends control commands to a power management module to apply new power policy to the SSD. Information on the new behavior model is made available for query. If current behavior model is selected, the current behavior model is maintained.

Abstract: A control circuit for a nonvolatile semiconductor storage device, during a write operation, configures multiple bit lines so that bit lines that are adjacent to select bit lines are nonselect bit lines. The control circuit applies a first voltage to a write bit line that is included in the select bit lines, and also applies a second voltage that is higher than the first voltage, to a write inhibit bit line that is included in the select bit lines. Then, the control circuit applies a third voltage that is higher than the second voltage to the nonselect bit lines. As a result, the control circuit raises the voltage of the write inhibit bit line, while maintaining the write bit line at the first voltage. Next, the control circuit applies a fourth voltage for the write operation to the drain-side select gate line.

Abstract: A method in a non-volatile memory, which includes multiple memory cells that store data using a predefined set of programming levels including an erased level, includes receiving a storage operation indicating a group of the memory cells that are to be retained without programming for a long time period. The memory cells in the group are set to a retention programming level that is different from the erased level. Upon preparing to program the group of memory cells with data, the group of memory cells is erased to the erased level and the data is then programmed in the group of memory cells.

Abstract: A method for programming data is provided for a memory storage device having a rewritable non-volatile memory module and a buffer memory. The method includes receiving a plurality of data including a first-type data and at least one second-type data, and a size of the first-type data is smaller than a data size threshold. The method includes temporarily storing the plurality of data into the buffer memory, and programming the first-type data and at least one part of the at least one second-type data stored in the buffer memory into a physical program unit set if it is determined that the plurality of data are complied with a predetermined condition. The method includes obtaining writing statuses of the first-type data and the at least one part of the at least one second-type data at the same time.

Abstract: Testing methods in a pre-programmed memory device after it has been assembled into a final customer platform include issuing a self-test command to the memory device, the memory device reporting results of a self-test of pre-programmed data executed responsive to receiving the self-test command, and issuing a self-repair command responsive to the results indicating repair of the pre-programmed data is needed.

Abstract: Writing data to a thermally sensitive memory device, including: receiving a physical layout of the thermally sensitive memory device; receiving the direction of airflow across the thermally sensitive memory device; selecting an address for writing data to the thermally sensitive memory device in dependence upon the physical layout of the thermally sensitive memory device and the direction of airflow across the thermally sensitive memory device; and writing data to the selected address of the thermally sensitive memory device.

Abstract: Memory devices and methods are disclosed, such as those facilitating data line shielding by way of capacitive coupling with data lines coupled to a memory string source line. For example, alternating data lines are sensed while adjacent data lines are coupled to a common source line of the data lines being sensed. Data line shielding methods and apparatus disclosed can reduce effects of source line bounce occurring during a sense operation of a memory device.

Abstract: A 3D nonvolatile memory has memory elements arranged in a three-dimensional pattern defined by rectangular coordinates having x, y and z-directions and with a plurality of parallel planes stacked in the z-direction over a semiconductor substrate. It has vertical local bit lines and a plurality of staircase word lines. Each staircase word line has a series of alternating segments and risers elongated respectively in the x-direction and z-direction traversing across the plurality of planes in the z-direction with a segment in each plane. Methods of forming a slab of multi-plane memory with staircase word lines include processes with one masking and with two maskings for forming each plane.

Abstract: A data storage device may comprise an array of flash memory devices and a controller coupled thereto, configured to program and read data from the array responsive to received data access commands. The array may comprise a plurality of blocks, each comprising a plurality of flash pages (F-Pages), each of which comprising an integer number of one or more error correcting code pages (E-Pages), at least some of which comprising a data portion and an error correction code (ECC) portion. The controller may be configured to store a plurality of logical pages (L-Pages) in one or more of the plurality of E-Pages, at least some being unaligned with boundaries of the E-Pages; and to adjust, in at least one of the blocks, the size of the ECC portion and correspondingly adjust the size of the data portion of the E-Pages.

Abstract: Various embodiments include methods, apparatus, and systems for reading an adjacent cell of a memory array in an electronic device to determine a threshold voltage value of the adjacent cell, the adjacent cell being adjacent a target cell, and reading the target cell of the memory array using a wordline voltage value based on the threshold voltage value of the adjacent cell. Additional apparatus, systems, and methods are described.

Abstract: In first and second memories, respectively, data cannot and can be overwritten on prewritten locations without first erasing the prewritten locations. A selection module selects memory blocks of first memory, which are partially written with first data, in response to receiving a write command to write second data to the memory blocks. A control module, prior to erasing the first data from the memory blocks, writes the first data in a portion of second memory instead of writing the first data in first memory. A location description module generates a description table indicating whether data in memory locations in the portion of second memory are valid or invalid. A rate of adding data to the portion becomes equal to a rate at which data in memory locations in the portion becomes invalid so that the first data is written in the portion without first merging the first data.

Abstract: A method is performed in a data storage device that includes a controller coupled to a non-volatile memory. The non-volatile memory includes a group of storage elements. Each storage element is configured to store multiple data bits. Data is sent from the controller to the non-volatile memory and first bits corresponding to a first portion of the data are stored into the group of storage elements during a first write stage. Each storage element of the group of storage elements stores at least one bit of the first bits upon completion of the first write stage. Second bits corresponding to a second portion of the data are sent to a second memory without sending the first bits to the second memory. The second bits are retrieved from the second memory and at least the second bits are stored into the group of storage elements during a second write stage.

Abstract: A non-volatile storage system includes memory cells with floating gates that comprises three layers separated by two dielectric layers (an upper dielectric layer and lower dielectric layer). The dielectric layers may be an oxide layers, nitride layers, combinations of oxide and nitride, or some other suitable dielectric material. The lower dielectric layer is close to the bottom of the floating gate (near interface between floating gate and tunnel dielectric), while the upper dielectric layer is close to top of the floating gate (near interface between floating gate and inter-gate dielectric).

Abstract: A flash memory device. In one embodiment, the flash memory device comprises a flash memory, a diode, a controller, and a capacitor. The flash memory has a voltage source pin. The diode is coupled between a voltage source and the voltage source pin of the flash memory. The controller is coupled to the flash memory via a data bus. The capacitor is coupled between the voltage source pin of the flash memory and a ground, and supplies power to the flash memory to enable the flash memory to complete writing of at least one data page when the level of the voltage source is lowered.

Abstract: The disclosure is directed to a system and method for nominal read voltage variations of a flash device. N reads are performed, each at a selected voltage offset from an initial read voltage. An N bit digital pattern associated with the selected voltage offsets is generated for the N reads. The N bit digital pattern generated by the N reads is mapped to a signed representation. A voltage adjustment based upon the signed representation is applied to at least partially compensate for a variation of the nominal read voltage to reduce bit error rate of the flash device.

Abstract: A memory system according to at least one example embodiment stores meta data in a cache register when the memory system enters a standby mode. Therefore, the memory system may reduce power consumption in the standby mode, and/or rapidly perform a mode switch.

Abstract: An erase operation for a 3D stacked memory device selectively inhibits subsets of memory cells which meet a verify condition as the erase operation progresses. As a result, the faster-erasing memory cells are less likely to be over-erased and degradation is reduced. Each subset of memory cells can be independently erased by controlling a select gate, drain (SGD) transistor line, a bit line or a word line, according to the type of subset. For a SGD line subset or a bit line subset, the SGD line or bit line, respectively, is set at a level which inhibits erase. For a word line subset, the word line voltage is floated to inhibit erase. An inhibit or uninhibit status can be maintained for each subset, and each type of subset can have a different maximum allowable number of fail bits.

Abstract: A data storage device includes a controller coupled to a non-volatile memory having a three-dimensional (3D) configuration. The non-volatile memory includes a group of storage elements. Each storage element is configured to store multiple data bits. Data is sent from the controller to the non-volatile memory and first bits corresponding to a first portion of the data are stored into the group of storage elements during a first write stage. Each storage element of the group of storage elements stores at least one bit of the first bits upon completion of the first write stage. Second bits corresponding to a second portion of the data are sent to a second memory without sending the first bits to the second memory. The second bits are retrieved from the second memory and at least the second bits are stored into the group of storage elements during a second write stage.

Abstract: A flash memory controller, a non-transitory computer readable medium and a method for reading flash memory cells of a flash memory module. The method may include calculating a group of read thresholds to be applied during a reading operation of a set of flash memory cells that belong to a certain row of the flash memory module based upon a compressed representation of reference read thresholds associated with multiple reference rows of the flash memory module; and reading the set of flash memory cells by applying the group of reference read thresholds to provide read results.

Abstract: A non-volatile semiconductor storage device includes: a memory cell array having memory cells arranged therein, the memory cells storing data in a non-volatile manner; and a plurality of transfer transistors transferring a voltage to the memory cells, the voltage to be supplied for data read, write and erase operations with respect to the memory cells. Each of the transfer transistors includes: a gate electrode formed on a semiconductor substrate via a gate insulation film; and diffusion layers formed to sandwich the gate electrode therebetween and functioning as drain/source layers. Upper layer wirings are provided above the diffusion layers and provided with a predetermined voltage to prevent depletion of the diffusion layers at least when the transfer transistors become conductive.