Abstract: A system and method to select a reference cell is disclosed. In a particular embodiment, a method is disclosed that includes receiving an address corresponding to a bit cell within a first bank of a memory. The method also includes accessing a second reference cell of a second bank of the memory in response to a first reference cell in the first bank being indicated as bypassed.

Abstract: An array configuration capable of supplying a necessary and sufficient current in a small area is achieved and a reference cell configuration suitable to temperature characteristics of a TMR element is achieved. In a memory using inversion of spin transfer switching, a plurality of program drivers are arranged separately along one global bit line, and one sense amplifier is provided to one global bit line. A reference cell to which “1” and “0” are programmed is shared by two arrays and a sense amplifier.

Abstract: A semiconductor memory device includes a sense amplifier that compares intensities of currents flowing through a first node and a second node with each other, a first MOSFET having a drain terminal connected with the first node, a second MOSFET having a drain terminal connected with the second node, a memory cell connected with a source terminal of the first MOSFET, and a reference cell. The semiconductor memory device further includes a connection control circuit that connects a source terminal of the second MOSFET with the reference cell at the time of a regular operation and connects the source terminal of the second MOSFET with a reference voltage terminal at the time of a test operation.

Abstract: An analog-to-digital conversion window is defined by reference voltages stored in reference memory cells of a memory device. A first reference voltage is read to define an upper limit of the conversion window and a second reference voltage is read to define a lower limit of the conversion window. An analog voltage representing a digital bit pattern is read from a memory cell and converted to the digital bit pattern by an analog-to-digital conversion process using the conversion window as the limits for the sampling process. This scheme helps in real time tracking of the ADC window with changes in the program window of the memory array.

Abstract: Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to generate access signals to facilitate memory operations in scaled arrays of memory elements, such as memory implemented in third dimensional memory technology formed BEOL directly on top of a FEOL substrate that includes data access circuitry. In at least some embodiments, a non-volatile memory device can include a cross-point array having resistive memory elements disposed among word lines and subsets of bit lines, and an access signal generator. The access signal generator can be configured to modify a magnitude of a signal to generate a modified magnitude for the signal to access a resistive memory element associated with a word line and a subset of bit lines. The modified magnitude can be a function of the position of the resistive memory element in the cross-point array.

Abstract: An array of SMT MRAM cells has a read reference circuit that provides a reference current that is the sum of a minimum current through a reference SMT MRAM cell programmed with a maximum resistance and a maximum current through an reference SMT MRAM cell programmed with a minimum resistance. The reference current forms an average reference voltage at the reference input of a sense amplifier for reading a data state from selected SMT MRAM cells of the array such that the reference SMT MRAM cells will not be disturbed during a read operation. The read reference circuit compensates for current mismatching in the reference current caused by a second order non matching effect.

Abstract: A control clock generating unit outputs a clock as a control clock when a column address strobe pulse is input and fixes the control clock to a specific level when an all bank precharge signal or a refresh signal is enabled. An internal pulse generating unit outputs an external write pulse or an external read pulse as an internal write pulse or an internal read pulse in response to the control clock.

Abstract: During first portion of a first read cycle determining that a first input of a sense amplifier is to receive information based upon a state of a storage cell during a first portion of a read cycle, and determining that a conductance at the first input is substantially equal to a conductance at a second input of the sense amplifier during the first portion. A plurality of NAND string modules are connected to a global bit line of a memory device that includes a memory column where a plurality of NAND strings and a buffer are formed.

Abstract: A phase change memory apparatus is presented. The phase change memory apparatus includes a phase change memory cell, a sense amplifier, and a voltage selecting unit. The sense amplifier is configured to differentially amplify a current that through the memory cell and a comparison voltage. The voltage selecting unit is configured to provide a reference voltage as the comparison voltage when performing a normal read function and to selectively provide either a first voltage level or a second voltage level as the comparison voltage in accordance with data when performing a verify read function.

Abstract: Dummy memory cells are disposed on an outside of real memory cells positioned on a peripheral part of a matrix. First contacts coupling between two wiring layers laminated on a semiconductor substrate are disposed around each of the real and dummy memory cells, and are shared by an adjacent real or dummy memory cell. Number of the first contacts disposed in each of the dummy memory cells is set to be smaller than number of the first contacts disposed in each of the real memory cells. Accordingly, even when a well region is not formed normally due to a variation in manufacturing conditions, it is possible to prevent an abnormal power supply current from being flown into the dummy memory cells, and an occurrence of latch up can be prevented.

Abstract: A dummy cell includes a plurality of first memory cells MC for storing “1” or “0”, arranged at points of intersection between a plurality of word lines WR0 to WR7 and a plurality of first data lines D0 to D7, a plurality of first dummy cells MCH for storing “1” or “0”, arranged at points of intersection between the word lines WR0 to WR7 and a first dummy data line, and a plurality of second dummy cells MCL for storing “0”, arranged at points of intersection between the word lines WR0 to WR7 and a second dummy data line DD1.

Abstract: A semiconductor memory device includes a plurality of word lines, a plurality of pairs of bit lines and complementary bit lines, and a plurality of memory cells, each memory cell being disposed at a region where a respective word line and a pair of a bit line and a complementary bit line cross each other. A voltage control unit controls a power voltage to obtain a controlled voltage appliable to the memory cells in response to a control signal that controls an operation of the memory cells. At least one dummy cell is disposed between the voltage control unit and the memory cells and is configured to reduce the controlled voltage to a predetermined level.

Abstract: A dummy memory cell for detection of write completion timing is provided as a replica of a memory cell. When assisting a write operation by power supply control and substrate potential control of the memory cell, the timing of ending the write assist operation is determined by a voltage control circuit based on information about the dummy memory cell. For example, the voltage control circuit performs, in a data write operation in the memory cell, the write assist operation of decreasing the voltage of a source power supply allocated to P-channel MOS load transistors using a pull-down transistor. Thereafter, at the time when completion of the data write operation in the dummy memory cell is detected, the voltage control circuit ends the write assist operation and restores the voltage of the source power supply to the original level using a pull-up transistor.

Abstract: A semiconductor memory device includes a plurality of word lines, a plurality of pairs of bit lines and complementary bit lines that cross the word lines, and a plurality of memory cells, each memory cell being disposed at a region where a respective word line and a pair of a bit line and a complementary bit line cross each other. A voltage control unit includes a plurality of elements connected in series between a power voltage source and the memory cells and are switched on/off in response to a control signal that controls an operation of the plurality of memory cells. The voltage control unit controls the voltage of the power voltage source to a predetermined level, thereby obtaining a controlled voltage to be supplied to the memory cells.

Abstract: The present invention provides a semiconductor memory and a control method therefore, the semiconductor device including a first current-voltage conversion circuit (16) connected to a core cell (12) provided in a nonvolatile memory cell array (10), a second current-voltage conversion circuit (26) connected to a reference cell (22) through a reference cell data line (24), a sense amplifier (18) sensing an output from the first current-voltage conversion circuit and an output from the second current-voltage conversion circuit, a compare circuit (28) comparing a voltage level at the reference cell data line with a predefined voltage level, and a charging circuit (30) charging the reference cell data line, if the voltage level at the reference cell data line is lower than the predefined voltage level during pre-charging the reference cell data line. According to the present invention, the pre-charging period of the reference cell data line can be shortened, and the data read time can be shortened.

Abstract: A sensing enable signal control circuit determines a driving timing of an I/O sense amplifier based on a read-out result of data, which is stored in a dummy cell of a semiconductor memory apparatus. The sensing enable signal control circuit in a semiconductor memory apparatus includes a detection code generating unit configured to output a detection code according to a voltage level of dummy cell data, which are read out from a dummy cell through at least one read operation, in response to a column select enable signal, and a multiplexer configured to receive the detection code and a default code and output a delay code to delay a sensing enable signal.

Abstract: A system and method, including software implemented techniques, can be used to adjust for sag in stored data values. Charge is applied to multiple memory cells, and each memory cell is charged to a target voltage corresponding to a data value. The memory cells include a reference cell that is charged to a predetermined voltage. A voltage level in the reference cell is detected, and voltage levels from a group of memory cells are also detected. An adjustment is performed based upon the difference between the detected voltage level in the reference cell and the predetermined voltage.

Abstract: A semiconductor memory device includes a selector line selection circuit for selecting, in a read operation, a selector line for connecting a first main bit line connected to the sense amplifier with a sub-bit line to which the memory cell being read is connected, a selector line for connecting the first main bit line with a sub-bit line of at least one sector different from the sector to which the memory cell being read belongs, a selector line for connecting a second main bit line connected to the sense amplifier with a sub-bit line to which the reference cell is connected, and a selector line for connecting the second main bit line with a sub-bit line of at least one sector different from the sector to which the memory cell being read belongs.

Abstract: A semiconductor memory device comprises a comparing unit that comprises a potential of a memory cell with a reference potential supplied by a reference cell to read data of the memory cell; first and second bit lines connected to inputs of the comparing unit; a first memory cell connected to the first bit line; a second memory cell connected to the second bit line; a first reference cell acting as the reference cell; a second reference cell acting as another reference cell; a potential line that supplies the reference potential to the first and second reference cells; and a dummy cell comprising a coupling capacitor that stabilizes potential of the potential line.

Abstract: A spin transfer torque magnetic random access memory (STT-MRAM) and includes: a memory cell and a reference cell configured to operate as a reference when data stored in the memory cell is read. The memory cell includes: a first magnetic tunneling junction (MTJ) element and a first transistor connected to the first MTJ element. The reference cell includes: second and third MTJ elements connected in parallel; and second and third transistors that are connected to the second and third MTJ elements, respectively. The STT-MRAM further includes a control circuit having a write circuit configured to supply write currents having opposite directions to the second and third MTJ elements.

Abstract: A one-transistor type DRAM including a floating body storage element connected between a bit line and a source line and controlled by a word line comprises a plurality of source lines and word lines arranged in a row direction, a plurality of bit lines arranged in a column direction, a plurality of clamp bit lines and reference bit lines arranged in a column direction, a cell array including the floating body storage element and formed in a region where the source line, the word line and the bit line are crossed, a clamp cell array including the floating body storage element and formed in a region where the source line, the word line and the bit line are crossed, a reference cell array including the floating body storage element and formed in a region where the source line, the word line and the bit line are crossed, and a sense amplifier and a write driving unit connected to the bit line and configured to receive a clamp voltage and a reference voltage.

Abstract: The present invention provides a semiconductor memory and a control method therefor, the semiconductor device including a first current-voltage conversion circuit (16) connected to a core cell (12) provided in a nonvolatile memory cell array (10), a second current-voltage conversion circuit (26) connected to a reference cell (22) through a reference cell data line (24), a sense amplifier (18) sensing an output from the first current-voltage conversion circuit and an output from the second current-voltage conversion circuit, a compare circuit (28) comparing a voltage level at the reference cell data line with a predefined voltage level, and a charging circuit (30) charging the reference cell data line, if the voltage level at the reference cell data line is lower than the predefined voltage level during pre-charging the reference cell data line. According to the present invention, the pre-charging period of the reference cell data line can be shortened, and the data read time can be shortened.

Abstract: A data sensing method for sensing storage data stored in a memory cell includes the steps of: biasing a sensing node and a reference node to a first voltage in response to a first control signal; discharging the sensing node and the reference node via the memory cell and a reference memory cell, respectively; enabling a latch circuit to amplify a voltage difference between the sensing node and the reference node.

Abstract: A method and apparatus for reading data from a non-volatile memory cell. In some embodiments, a cross-point array of non-volatile memory cells is arranged into rows and columns that are each controlled by a line driver. A read circuit is provided that is capable of reading a logical state of a predetermined memory cell by differentiating a non-integrated first reference value from a non-integrated second reference value. Further, each reference value is measured immediately after configuring the column corresponding to the predetermined memory cell to produce a first and second amount of current.

Abstract: A memory that employs separate Dref areas that are independently accessed to provide a threshold voltage reference signal. The memory includes the separate Dref areas, a data area positioned between the Dref areas, one or more sense amplifiers, and a switch component. The switch component is arranged to receive addressing data and to independently couple one of the separate Dref areas to the sense amplifiers based, at least in part, on a physical proximity of individual memory cells along a word line.

Abstract: Disclosed are methods, circuits, devices and systems for operating one or more non-volatile memory (NVM) cells within an array of NVM cells. According to embodiments, there may be provided a nonvolatile memory (NVM) device comprising an array of NVM data cells including one or more border/periphery data cells and one or more non-periphery cells. Array control circuitry may be adapted to gauge a state of the one or more periphery data cells differently than non-periphery data cells.

Abstract: A memory device includes a memory array, sense circuitry coupled to the memory array, and timing circuitry coupled to the sense circuitry. The timing circuitry generates a sense trigger signal to enable the sense circuitry. A strap region is formed adjacent the memory array. A reference word line is coupled to the timing circuitry. The reference word line formed in the strap region.

Abstract: A resistance-change memory includes first and second bit lines running in the same direction, a third bit line running parallel to the first and second bit lines, fourth and fifth bit lines running in the same direction, a sixth bit line running parallel to the fourth and fifth bit lines, a first memory element which has one and the other terminals connected to the first and third bit lines, and changes to one of first and second resistance states, a first reference element having one and the other terminals connected to the fourth and sixth bit lines, and set in the first resistance state, a second reference element having one and the other terminals connected to the fifth and sixth bit lines, and set in the second resistance state, and a sense amplifier having first and second input terminals connected to the first and fourth bit lines.

Abstract: A memory system includes a content addressable memory (CAM) including a plurality of match lines, each match line having a plurality of memory cells coupled thereto. The system also includes a match detector coupled to the CAM and a reference match line having a plurality of reference memory cells coupled thereto, the reference memory cells being of the same type and the memory cells. The system also includes a match line sensor coupled to the reference match line and the match detector that determines a characteristic of the reference match line and provides a timing signal to the match detector based on the characteristic.

Abstract: A phase change memory device includes a cell array. The cell array includes a phase change resistance cell formed at an intersection of a word line and a bit line and a dummy cell configured to discharge the bit line in response to a bit line discharge signal in a precharge mode. A column switching unit is configured to selectively control a connection between the bit line and a global bit line in response to a column selecting signal.

Abstract: A system and method for self-tracking data in a read operation of a SRAM are disclosed. The self-tracking data selection SRAM comprises: a plurality of memory cell arrays, comprising: a plurality of memory cells each generating a first signal and outputting a first read data; a plurality of first buffers each receiving the first signal outputting a second signal; a first multiplexer receiving the plurality of first read data and the first signals; a plurality of second buffers each receiving the second signals and outputting a third signal; and a second multiplexer receiving a plurality of second read data from the plurality of memory cell arrays and outputting a third signals.

Abstract: A high speed voltage mode sensing is provided for a digital multibit non-volatile memory integrated system. An embodiment has a local source follower stage followed by a high speed common source stage. Another embodiment has a local source follower stage followed by a high speed source follower stage. Another embodiment has a common source stage followed by a source follower. An auto zeroing scheme is used. A capacitor sensing scheme is used. Multilevel parallel operation is described.

Abstract: A reference current generator for a resistance type memory and a method thereof is disclosed. The reference current generator comprises N parallel circuit sets. Each of the N parallel circuit sets is formed with at least one first reference element and second reference elements connected in parallel. The number of the first reference elements plus the number of the second reference elements is N. The resistance value of first reference elements (a first resistance value) is not equal to the resistance value of the second reference elements (a second resistance value). An equivalent resistance provided with a equivalent resistance value between the first and second resistance value is formed by connecting the N parallel circuit sets in series between an input terminal and output terminal. A reference current is outputted from the output terminal by applying an operation voltage to the input terminal.

Abstract: The semiconductor integrated circuit device includes a voltage control circuit that generates a control voltage for deactivating a field effect transistor by a gate voltage. The voltage control circuit controls a voltage so as to substantially minimize the leakage current which flows when the field effect transistor is inactive with respect to a device temperature.

Abstract: A ROM includes a ROM array, an address decoder, a control circuit, a precharge tracker, a precharge circuit, a reference word line, a reference bit line and a reference sense generator. The control circuit generates control signals for reading the ROM. The address decoder enables a bit line and a word line. The precharge tracker generates a programmable precharge signal, which is provided to the precharge circuit for precharging the enabled bit line. A reference word line is enabled based on the programmable precharge signal and the control signals for tracking the enabled word line. A reference bit line is enabled based on the reference word line for tracking the enabled bit line. The reference sense generator generates a programmable sense signal based on the reference bit line, the programmable precharge signal and the control signals for reading a bit cell corresponding to the enabled bit line and word line.

Abstract: A memory that employs separate Dynamic reference (Dref) areas to provide a threshold voltage reference signal. The memory includes the separate Dref areas, a data area positioned between the Dref areas, a reference array, and one or more sense amplifiers. The data area is arranged to provide an output signal, the reference cell and the separate Dref areas are arranged to provide the threshold voltage reference signal, and the sense amplifiers are arranged to receive the output signal and the threshold voltage reference signal.

Abstract: The present invention relates to a method and circuit for verifying the state of a gated fuse element used with a one-time programmable CMOS memory device. A first expected state is set and a state of a first gate-ox fuse is sensed. The state of the first gate-ox fuse is compared to the first expected state to determine if they are equal, and a first signal is generated. A second expected state is set and a state of a second gate-ox fuse is sensed. The state of the second gate-ox fuse is compared to the second expected state to determine if they are equal, and a second signal is generated. A valid output is generated if both the first and second signals are in a correct state, both signals are high for example.

Abstract: Embodiments of the present invention provide channel estimation for multi-level memories using pilot signals. A memory apparatus includes a memory block comprising a plurality of memory cells and adapted to operate with at least two levels of signals for writing data into and reading data from the memory cells. At least two memory cells are employed as reference cells to output a plurality of pilot signals. The memory apparatus also includes a channel block operatively coupled to the memory block, and adapted to facilitate the writing and reading of data into and from the memory cells. The channel block is also adapted to receive the pilot signals and determine one or more disturbance parameters based at least in part on the pilot signals and to compensate the read back signals based at least in part on the determined one or more disturbance parameters during said reading of data from the memory cells. Other embodiments may be described and claimed.

Abstract: Method and apparatus for reading data from a non-volatile memory cell, such as a modified STRAM cell. In some embodiments, at least a first and second memory cell are read for a plurality of resistance values that are used to select and store a voltage reference for each memory cell.

Abstract: A sensing circuit of a phase change memory. The sensing circuit comprises a data current source and a reference current source, a storage memory device and a reference memory device, a storage switch and a reference switch, an auxiliary current source and a comparator. First terminals of the storage memory device and the reference memory device are respectively coupled to the data current source and the reference current source. The storage switch and the reference switch are respectively coupled to second terminals of the storage memory device and the reference memory device. The auxiliary current source is dynamically coupled to the first terminals of the storage memory device and the reference memory device. The comparator is coupled to the first terminals of the storage memory device and the reference memory device.

Abstract: An SRAM delay circuit that tracks bitcell characteristics. A circuit is disclosed that includes an input node for receiving an input signal; a reference node for capturing a reference current from a plurality of reference cells; a capacitance network having a discharge that is controlled by the reference current; and an output circuit that outputs the input signal with a delay, wherein the delay is controlled by the discharge of the capacitance network.

Abstract: This document discusses among other things, a system comprising a host controller, an Input/Output buffer, and a memory device. The memory device is coupled to the host controller and is configured to receive a read command from the host controller. The non-volatile includes an interface control logic, which is in communication with a non-volatile memory. The interface control logic includes a latency programming circuit coupled to the non-volatile memory and the Input/Output buffer. The latency programming circuit stores at least one value corresponding to dummy byte delays to be provided at the non-volatile memory prior to transferring data from the non-volatile memory during a read operation.

Abstract: A static random access memory is disclosed.

Abstract: A nonvolatile memory device includes a memory cell array including a plurality of nonvolatile memory cells each having a resistance corresponding to one of a plurality of first resistance distributions, a temperature compensation circuit including one or more reference cells each having a resistance corresponding to one among one or more second resistance distributions, and a data read circuit including a compensation unit and a sense amplifier, the compensation unit being adapted to supply compensation current to a sensing node, an amount of the compensation current varying based on the resistance of each reference cell, and the sense amplifier being adapted to compare the level of the sensing node with a reference level and to output a comparison result.

Abstract: Circuitry and methods for restoring data values in non-volatile memory are disclosed. An integrated circuit includes a memory access circuit and a sensing circuit configured to sense a data signal during a read operation to at least one two-terminal non-volatile cross-point memory array. Each memory array includes a plurality of two-terminal memory cells. A plurality of the memory arrays can be fabricated over the substrate and vertically stacked on one another. Further, the integrated circuit can include a margin manager circuit configured to manage a read margin for the two-terminal memory cells substantially during the read operation, thereby providing for contemporaneous read and margin determination operations. Stored data read from the two-terminal memory cells may have a value of the stored data restored (e.g., re-written to the same cell or another cell) if the value is not associated with a read margin (e.g., a hard programmed or hard erased state).

Abstract: An SRAM circuit operates at a reduced operation margin, especially at a low operating voltage by increasing or optimizing the operation margin of the SRAM circuit. The threshold voltage of the produced transistor in the SRAM circuit is detected to compare the operating voltage of a memory cell with the operating voltage of a peripheral circuit in order to adjust it to the optimum value, and the substrate bias voltage is further controlled.

Abstract: A semiconductor memory cell includes a plurality of memory cells configured to store data having polarity corresponding to a direction of current flowing in first and second driving lines, a current generator configured to generate a predetermined read current, apply the predetermined read current to the plurality of memory cells, and generate a data current corresponding variation of the read current according to the data and a current controller connected to a current path of the read current and configured to control a current amount of the read current.

Abstract: A circuit for generating a reference voltage includes at least one reference cell, a reference cell write driver, a reference cell sense amplifier, and a voltage compensation unit. The reference cell is a variable resistance memory cell. The reference cell write driver writes data to the reference cell. The reference cell sense amplifier reads out the data stored in the reference cell on the basis of a predetermined reference voltage. A voltage compensation unit outputs a compensation reference voltage by controlling the reference voltage in accordance with the output value of the sense amplifier.

Abstract: A dual-port static random access memory (SRAM) includes a multitude of programmable delay elements disposed along the paths of a number signals used to carry out read, write or read-then-write operations. At least one of the programmable delay elements controls the timing margin between a pair of clock signals that trigger a read/write enable signal. A second programmable delay element coarsely adjusts the delay of a first signal associated with a dummy bitline. A third programmable delay element finely adjusts the delay of a second signal associated with the dummy bitline. A fourth programmable delay element controls the delay of a signal used to reset the read/write enable signal. During a read operation, the voltage level of the second signal is used as an indicator to activate the sense amplifiers. During a write operation, the voltage level of the second signal is used to control the write cycle.

Abstract: Embodiments of the disclosure include multilevel memory cell devices that utilize reference point cells to determine the states of other cells. Embodiments of the disclosure also include methods of storing data to and retrieving data from multilevel memory cell devices utilizing reference point cells. In one embodiment, a multilevel memory cell device includes user data cells, a reference point cell, and a controller. The user data cells each has one of a plurality of states. The reference point cell has a first state. The controller determines the states of the user data cells based at least in part on the first state of the reference point cell.