Abstract: A system including a state set module to arrange states of a memory cell in three sets. The memory cell stores three bits when programmed to a state. Each set includes three rows of bits. In a set, a row includes one of the three bits of the states. The first, second, and third rows of the first, second, and third sets include a first number of state transitions. The second, third, and first rows of the first, second, and third sets include a second number of state transitions. The third, first, and second rows of the first, second, and third sets include a third number of state transitions. A write module writes first, second, and third portions of data to a plurality of memory cells, each memory cell storing the three bits when programmed to a state, using states selected respectively from the first, second, and third sets.

Abstract: A global reset generation method for a pulse latch based pre-decoders in memories that comprises generating a pre-decoded memory address output for a pulse latch circuit, generating a reset signal to reset the pulse latch circuit, providing a combined signal of the pre-decoded memory address output and the reset signal, feeding the combined signal into a low voltage threshold device to manipulate resetting the pulse latch circuit, wherein generating a reset signal comprises generating a reset signal from a matched circuit that is configured to mimic the function of the latch circuit to be reset and wherein generating a reset signal comprises configuring the matched circuit to accommodate a worst case hold pulse delay to allow for resetting the pulse latch before a new clock cycle performs the resetting and having the matched circuit provide the reset signal and a pre-decoded memory address output in the same voltage domain.

Abstract: A decoder circuit with reduced leakage configured to decode an address and drive one of a number of word lines may be implemented with two-high logic gates in a pre-decode stage, a decode stage, and a word line driver stage. Such decoder circuits may include, in the word line driver stage, a number of two-high NOR gates configured to drive one of a number of word lines. In some embodiments, the two-high logic gates that share common inputs are implemented with multi-output static logic.

Abstract: A Y-decoder includes a selection unit and a Y-MUX. The selection unit is coupled to the memory array for selecting the column lines. The Y-MUX is coupled to the selection unit for supplying a voltage to the selected column line. The Y-MUX includes a first switch, a second switch, a third switch and a fourth switch coupled in parallel. The first switch and the second switch are respectively for receiving a first shielding voltage and a second shielding voltage. The third switch and the fourth switch are respectively for receiving a first sensing voltage and a second sensing voltage.

Abstract: A data transfer circuit includes a plurality of first lines, a second line suitable for receiving data from a first line selected among the first lines, a third line suitable for transferring data to the first line selected among the first lines, a plurality of driving units, each suitable for driving the second line based on the data from the corresponding first line in a first operation, and a plurality of connection units, each suitable for coupling the third line to the corresponding first line when the corresponding first line is selected in a second operation.

Abstract: An embodiment may include local row and column circuitry that are local to a memory cell of a memory device. Either the local row circuitry or the local column circuitry may be electrically isolated, at least in part, from at least one remaining portion of the memory device during the establishing of a voltage differential between the local row circuitry and the local column circuitry that is to permit the memory cell to be read during a read of the memory cell. The read may occur subsequent to the establishing of the voltage differential. Many variations, modifications, and alternatives are possible without departing from this embodiment.

Abstract: A semiconductor memory device includes a bit line sense amplification unit configured to sense/amplify data loaded on a bit line, and a driving control unit configured to supply a power line of the bit line sense amplification unit with an overdriving voltage in an overdriving period and supply an internal voltage line with a voltage of the power line of the bit line sense amplification unit in a discharge driving period.

Abstract: A memory may comprise a first bank configured to include first to Nth word lines and first to Mth redundancy word lines to replace M number of word lines among the first to Nth word lines, a second bank configured to include first to Nth word lines and first to Mth redundancy word lines to replace M number of word lines among the first to Nth word lines, and a control circuit configured to activate, in the case where a word line corresponding to an inputted address among the first to Nth word lines in a bank selected between the first bank and the second bank is replaced with a Kth (1?K?M) redundancy word line among the first to Mth redundancy word lines during an operation in a first mode, at least one adjacent word line adjacent to the Kth redundancy word line of the selected bank.

Abstract: A write assist driver circuit is provided that assists a memory cell (e.g., volatile memory bit cell) in write operations to keep the voltage at the memory core sufficiently high for correct write operations, even when the supply voltage is lowered. The write assist driver circuit may be configured to provide a memory supply voltage VddM to a bit cell core during a standby mode of operation. In a write mode of operation, the write assist driver circuit may provide a lowered memory supply voltage VddMlower to the bit cell core as well as to at least one of the local write bitline (lwbl) and local write bitline bar (lwblb). Additionally, the write assist driver circuit may also provide a periphery supply voltage VddP to a local write wordline (lwwl), where VddP?VddM>VddMlower.

Abstract: A semiconductor memory apparatus includes a sense amplifier driving control unit configured to be applied with first and second driving voltages, and generate first to third sense amplifier driving signals in response to a mat enable signal, a sense amplifier enable signal and a power-up signal; a sense amplifier driving unit configured to, in response to the first to third sense amplifier driving signals, connect first and second sense amplifier driving nodes to cause the first and second sense amplifier driving nodes to have substantially the same voltage level, or disconnect the first and second sense amplifier driving nodes to apply first and second sense amplifier driving voltages to the first and second sense amplifier driving nodes; and a sense amplifier configured to be applied with the first and second sense amplifier driving voltages, and sense and amplify a voltage difference of a bit line and a bit line bar.

Abstract: A control circuit for a bit-line sense amplifier may include: a bank active signal generator configured to generate an internal active signal and a bank active signal; and a sense amplifier enable signal generator configured to determine a skew in response to the internal active signal, and set an output time of a sense amplifier enable signal by delaying the bank active signal according to the determined skew.

Abstract: A high-voltage word-line driver circuit for a memory device uses cascode devices to prevent any single transistor of the driver circuit from having the full power supply voltage from which the word-line output signal is generated, from being applied across any single transistor of the word-line driver circuit. A pair of cascode devices are connected in series with the pull-down device of the input stage and a pull-up device of the input stage, and biased using reference voltages to control the maximum voltage drop across the pull-down device when the pull-down device is off and the pull-up device is active, and to control the maximum voltage drop across the pull-up device when the pull-down device is active. The output stage also includes cascode devices that protect the output pull-down and pull-up devices, and the reference voltages that bias the input and output cascode pairs may be the same reference voltages.

Abstract: Block-row decoders, memory block-row decoders, memories, methods for deselecting a decoder of a memory and methods of selecting a block of memory are disclosed. An example memory block-row decoder includes a plurality of block-row decoders, each of the block-row decoders having a decoder switch tree. Each block-row decoder is configured to bias a block select switch of the decoder switch tree with a first voltage while the block-row decoder is deselected and further configured to bias decoders switches of the decoder switch tree that are coupled to the block select switch with a second voltage while the block-row decoder is deselected, the second voltage less than the first voltage. An example method of deselecting a decoder of a memory includes providing decoder signals having different voltages to decoder switches from at least two different levels of a decoder switch tree while the decoder is deselected.

Abstract: A circuit arrangement, having a plurality of electronic components; a plurality of first access lines and second access lines, wherein each electronic component is coupled with at least one first access line and at least one second access line; an access controller configured to control an access to at least one electronic component of the plurality of electronic components via the at least one first access line and the at least one second access line; a bias circuit configured to provide a defined potential to at least one of the first access lines, wherein the bias circuit is configured, during an access to an electronic component via one selected first access line of the plurality of first access lines, to provide the defined potential to one or two first access lines of the plurality of first access lines, wherein the one or two first access lines are arranged adjacent to the selected first access line, and, wherein during the access to the electronic component, the potentials of the first access lines of

Abstract: A semiconductor memory device according to an embodiment of the present invention may include a memory cell array having a plurality of memory cells, a pass transistor group having normal pass transistors coupled between global word lines and local word lines to which the plurality of memory cells are coupled, and an address decoder coupled to the global word lines and a block word line to which gates of the normal pass transistors are coupled in common, wherein the address decoder gradually increases a voltage, obtained by subtracting a voltage of the global word lines from a voltage of the block word line, when an erase voltage is provided to a channel of the plurality of memory cells.

Abstract: A layout for simultaneously sub-accessible memory modules is disclosed. In one embodiment, a memory module includes a printed circuit board having a plurality of sectors, each sector being electrically isolated from the other sectors and having a multi-layer structure. At least one memory device is attached to each sector, the memory devices being organized into a plurality of memory ranks. A driver is attached to the printed circuit board and is operatively coupled to the memory ranks. The driver is adapted to be coupled to a memory interface of the computer system. Because the sectors are electrically-isolated from adjacent sectors, the memory ranks are either individually or simultaneously, or both individually and simultaneously accessible by the driver so that one or more memory devices on a particular sector may be accessed at one time.

Abstract: A semiconductor memory device includes a memory cell array, a word line decoder, a time determination signal generation circuit, and a timing circuit. The memory cell array is configured to include a plurality of memory cells, and the word line decoder is configured to control selection and a voltage level of a word line connected to each of the memory cells. The time determination signal generation circuit is configured to generate a time determination signal indicating a determination time, the determination time being a reference by which a change in a command is determined, and the timing circuit is configured to determine the change in the command from the time determination signal and generate a control signal which controls whether or not a selected word line is pre-charged.

Abstract: A column select signal generation circuit includes: a first current controller configured to control the level of a pre-column select signal in response to a bank active signal, a driver configured to generate an amplified column select signal in response to the pre-column select signal, and a second current controller configured to generate an output signal of the driver as a column select signal in response to the bank active signal.

Abstract: A semiconductor memory device includes a memory cell connected to a word line and a bit line, for storing and holding data, a word line driver circuit connected to the word line, a bit line precharge circuit connected to the bit line, and a peripheral control circuit. First power supply VDD is connected to the memory cell and the peripheral control circuit, and first power supply VDD is connected to word line driver circuit and bit line precharge circuit through switching element controlled by first control signal PD.

Abstract: A memory includes first to Nth word lines, first to Mth redundancy word lines configured to replace M number of word lines among the first to Nth word lines, and a control circuit configured to activate at least one adjacent word line adjacent to a Kth redundancy word line (1?K?M) in response to an active signal, in the case where a word line corresponding to an inputted address among the first to Nth word lines is replaced with the Kth redundancy word line among the first to Mth redundancy word lines in a first mode.

Abstract: A semiconductor system includes a controller and a semiconductor device. The controller outputs offset signals whose level combination is controlled according to temperature code signals including information on an internal temperature. The semiconductor device generates the temperature code signals according to a level combination of the offset signals. Further, the semiconductor device controls a refresh cycle time determined by the level combination of the offset signals.

Abstract: A memory architecture for a display device and a control method thereof are provided. The memory architecture includes a display data memory and a memory controller. The display data memory includes N sub-memories and N×M arbiters, wherein N is a positive integer and M is a positive integer equal to or greater than 2. Each sub-memory includes M memory blocks divided by an address. Each M arbiters are coupled to the M memory blocks of each sub-memory. The memory controller, coupled to the N×M arbiters, generates N×M sets of request signals and output address signals according to a set of an input request signal and an input address signal, and transmits to the N×M arbiters to sequentially control the N×M arbiters.

Abstract: The present disclosure relates to a method and system for controlling memory access. In particular, a method for controlling memory access includes, in response to receiving a write request operative to write data to at least one memory cell of a plurality of memory cells, increasing a word line voltage above a nominal level after a predetermined delay following the receipt of the write request. A disclosed system includes a word line driver operative to increase a word line voltage above a nominal level during a write access after a predetermined delay in response to a write request.

Abstract: Word line drivers including a selection signal generator and a word line drive unit are provided. The selection signal generator generates a selection signal which is enabled according to a high-order address signal and a low-order address signal in an active mode. Further, the selection signal generator generates a complementary selection signal which is enabled when an equalization signal is inputted in a pre-charge mode after the active mode. The word line driver receives the main word line signal to drive a word line to have a first level when the selection signal is enabled, to drive the word line to have a second level when the selection signal is disabled, and to drive the word line to have a third level when the complementary selection signal is enabled.

Abstract: Among other things, techniques and systems are provided for activating a memory cell of a memory arrangement in preparation for at least one of a read operation or write operation. The memory arrangement comprises a word-line driver comprising at least a first input terminal and a second input terminal. The first input terminal is operably coupled to a first decoder and the second input terminal is operably coupled to a second decoder. When the word-line driver senses a first voltage at the first input terminal and a second voltage at the second input terminal, the word-line driver outputs a gate voltage signal which activates the memory cell.

Abstract: Disclosed is a semiconductor device which is intended to reduce the total number of storage element blocks that constitute a desired logic circuit. The semiconductor device includes N address lines (N is an integer equal to two or more), N data lines, and a plurality of storage sections. Each of the storage sections includes an address decoder for decoding an address supplied via the N address lines to output a word select signal to word lines; and a plurality of storage elements which are connected to the word lines and the data lines, each store data that constitute a truth table, and input or output the data via the data lines in accordance with the word select signal supplied via the word lines. The semiconductor device is adapted such that the N address lines for the storage sections are connected to the respective data lines of other N ones of the storage sections, while the N data lines for the storage sections are connected to the respective address lines of other N ones of the storage sections.

Abstract: Systems and methods are disclosed for decoding solid-state memory cells. In certain embodiments, a data storage device includes a controller configured to decode a non-volatile memory array by performing a first read of a plurality of code words from the non-volatile memory array using a first reference voltage level and performing a second read of the plurality of code words using a second reference voltage level on a first side of the first reference voltage level. The controller is further configured to generate a soft-decision input value associated with a first code word of the plurality of code words based on the first and second reads and decode the first code word using the soft-decision input value.

Abstract: A wordline tracking circuit and corresponding method are disclosed, and include a tracking wordline having an impedance characteristic associated therewith that models a row of memory cells in a memory device, wherein the tracking wordline row has a near end that receives a wordline pulse signal having a near end rising pulse edge and a near end falling pulse edge. The tracking wordline also has a far end. A tracking cell component is coupled to the far end of the tracking wordline that receives the wordline pulse signal. Lastly, the circuit includes a tracking bitline pre-charge circuit coupled to the tracking cell that is configured to pre-charge a tracking bitline associated with the tracking cell using the near end wordline pulse signal.

Abstract: An object of one embodiment of the present invention is to propose a memory device in which a period in which data is held is ensured and memory capacity per unit area can be increased. In the memory device of one embodiment of the present invention, bit lines are divided into groups, and word lines are also divided into groups. The word lines assigned to one group are connected to the memory cell connected to the bit lines assigned to the one group. Further, the driving of each group of bit lines is controlled by a dedicated bit line driver circuit of a plurality of bit line driver circuits. In addition, cell arrays are formed on a driver circuit including the above plurality of bit line driver circuits and a word line driver circuit. The driver circuit and the cell arrays overlap each other.

Abstract: A word line driver circuit allows for dynamic selection of different word line voltages for selection and deselection of memory cells included in a resistive memory array in a manner that reduces circuit complexity, device count, and leakage currents.

Abstract: Decoding and decoder circuits in memory devices are disclosed. Array lines are biased or floated as memory device operations are performed in the memory device. In at least one embodiment, a decoder circuit includes complementary devices to bias array lines or float array lines in a memory device while particular memory device operations are performed.

Abstract: A counter circuit includes a lower count signal generation unit suitable for generating a lower bit, an upper count signal generation unit suitable for generating an upper bit, and a control unit suitable for determining a counting route in response to a control signal and controlling the lower and upper count signal generation units based on a determined route, wherein in a first route, the upper bit is generated in response to the lower bit, and in a second route, the lower bit is generated in response to the upper bit.

Abstract: Wordline-driver biasing and column-based source-biasing circuitry facilitate reduced current leakage, for example, in SoC device SRAM circuits in a manner that is independent of the read/write/standby operating mode, and without an external trigger. Wordline-driver-biasing circuitry turns off (i.e., decouples from system power) wordline-drivers that are connected to unselected wordlines during read/write operations using one of a decoder-enable signal, which is generated in response to row address values, or based on the activation of a self-timing internal clock, which is generated by the memory circuit when it is activated (i.e., switched from standby to read/write mode). Alternatively, or in addition, source-biasing circuitry applies a relatively high source-biasing voltage to the source terminals of memory cells in unselected columns during read/write operations based on column address values (i.e., a low source voltage is applied only to the selected column being written to or read from).

Abstract: A memory configurable to be used in an RTA mode includes an input latch configured to receive an input address bus and to generate a latched address bus that corresponds to a memory location. An address flop is configured to save the latched address and to generate a flopped address. A first block address pre-decoder stage is configured to generate a pre-decoded latched address to an RTA generation logic in response to the latched address bus; and a second block address pre-decoder configured to generate a pre-decoded flopped address to the RTA generation logic in response to the flopped address. The RTA generation logic generates an RTA enable signal one clock cycle before a memory block access, to activate a memory block corresponding to the memory location, such that an array supply voltage of the memory block starts charging one clock cycle before a memory block access.

Abstract: Disclosed is a novel static random access memory (SRAM) device. The SRAM device comprises a plurality of memory array layers vertically disposed one above another, a layer decoder circuit disposed on each memory array layer, a word line driver circuit disposed on each memory array layer, and a plurality of complementary bit line pairs wherein each complementary bit line pair extends vertically to couple a memory cell in each memory array layer. Each memory array layer comprises a plurality of memory cells and a word line disposed thereon. Each word line is connected to the plurality of memory cells disposed on its memory array layer. The number of memory cells in a layer corresponds to a predetermined memory page size. Each layer decoder circuit is configured to decode a portion of an SRAM address to select its memory array layer if the SRAM address corresponds to memory cells on its memory array layer. Each word line driver circuit is configured to drive the word line disposed on its memory array layer.

Abstract: An integrated circuit that includes an array of memory cells. The integrated circuit also includes a write address row decoder having a plurality of write row outputs and a write address column decoder having a plurality of write column outputs. A write logic array is electrically connected to the write row outputs and the write column outputs and has a separate write word line (WWL) output electrically connected to each cell in the array of memory cells.

Abstract: A first circuit is coupled to a second circuit, which is coupled to a third circuit. A high voltage value of a first input signal and of a first output signal of the first circuit are equal, and are less than a high voltage value of a second output signal of the second circuit. A low voltage value of the first input signal is higher than a low voltage value of the first output signal. A high voltage value of the second output signal and of a third output signal of the third circuit are equal. The low voltage value of the first output signal, the second output signal, and the third output signal are equal.

Abstract: A refresh leveraging driving method is provided which includes deciding a unit of word lines to be driven at a refresh leveraging operation to be the same as a redundancy repair row unit setting a lower row address of an input refresh leveraging address corresponding to the decided refresh leveraging row driving unit to a don't care state; and internally generating the don't care lower row address of the refresh leveraging address to drive word lines according to a combined refresh leveraging address.

Abstract: In a method for boosting a word line signal, the word line signal is transitioned from a first voltage value of the word line signal to a second voltage value of the word line signal, thereby turning on a first transistor. The first transistor and a second transistor turn on a third transistor. The third transistor causes the word line signal at a first terminal of the third transistor to reach a voltage value at a second terminal of the third transistor, thereby causing the word line signal to reach the voltage value faster than without the third transistor. The first transistor and the second transistor are coupled in series.

Abstract: An self-refresh control circuit for controlling a self-refresh operation of a memory device includes a self-refresh control logic block configured to control the memory device to perform the self-refresh operation and an initial refresh control block configured to activate the self-refresh control logic block in an initialization period of the memory device.

Abstract: A semiconductor device includes: a plurality of target lines to be driven; a plurality of target line drivers configured to drive the corresponding target lines in a logic level corresponding to a plurality of target line selection signals; a plurality of booster enable units configured to generate a booster enable signal by sensing whether a group of target lines that is obtained by grouping the target lines by a predetermined number is enabled or not; and a plurality of self-boosters configured to boost corresponding target lines by sensing levels of the corresponding target lines in response to the booster enable signal.

Abstract: A decoding system for a phase change non-volatile memory device having a memory array may include a column decoder that selects at least one column of the memory array during programming operations. The decoding system includes a selection circuit that includes selection switches on a number of hierarchical decoding levels for defining a conductive path between at least one column and a driving stage. A biasing circuit may supply biasing signals to the selection switches for defining the first conductive path and bringing the selected column to a programming voltage value. The programming selection circuit may have protection elements between columns and the selection switches. The selection switches and the protection elements may include metal oxide semiconductor (MOS) transistors having an upper threshold voltage level lower than the programming voltage.

Abstract: The invention discloses a semiconductor memory device and a method for word line decoding and routing. The present invention relates generally to semiconductor memory field, Problems solved by the invention is that, to improve the quality of word line signals results in routing congestion. Embodiments of the invention provide the program as follows: a semiconductor memory device and a method for word line decoding and routing, dividing memory array of the semiconductor memory device into a plurality of smaller memory arrays, on a first metal layer routing first decoded row address, on a second metal layer below the first metal layer routing second decoded row address, and the output word line after decoding drives the plurality of smaller memory arrays. Embodiments of the invention are suitable for various semiconductor memory designs, including: on-chip cache, translation look-aside buffer, content addressable memory, ROM, EEPROM, and SRAM and so on.

Abstract: A chip die including a first input/output (I/O) pad configured to transmit/receive an I/O signal of a memory cell array included in the chip die; a second I/O pad configured to, if a stacked chip die exists on the chip die, transmit/receive a via I/O signal of the stacked chip die, and configured to, if the stacked chip die does not exist on the chip die, transmit/receive a differential I/O signal of the chip die; and an I/O driver configured to receive an operation mode signal including information as to whether the stacked chip die exists on the chip die in such a manner that the second I/O pad is configured to transmit/receive the via I/O signal or the differential I/O signal.

Abstract: Aspects of the disclosure provide an integrated circuit (IC) that includes a processing unit and a signal-terminal matching circuitry. The processing unit is configured to communicate with an external memory device through conductive couplings that electrically couple terminals of an IC external interface respectively with terminals of the external memory device. The external memory device is disposed on a circuit substrate separate from the IC. The signal-terminal matching circuitry is configured to match memory control signals to the terminals of the IC external interface based on the external memory device.

Abstract: Decoded 2n-bit bitcells in memory for storing decoded bits, and related systems and methods are disclosed. In one embodiment, a decoded 2n-bit bitcell containing 2n state nodes is provided. Each state node includes storage node to store decoded bit. Storage node provides bit to read bitline, coupled to decoded word output. Each state node includes active decoded bit input coupled to storage node that receives decoded bit from decoded word to store in storage node in response to write wordline. State node comprised of 2n?1 passive decoded bit inputs, each coupled to one of 2n?1 remaining storage nodes. 2n?1 passive decoded bit inputs receive 2n?1 decoded bits not received by active decoded bit input. State node includes logic that receives 2n?1 decoded bits. Logic retains decoded bit, provides it to passive decoded bit output. Passive decoded word output is coupled to storage node to store decoded bit in storage node.

Abstract: Various aspects of a fast, energy efficient write driver capable of efficient operation in a dual-voltage domain memory architecture are provided herein. Specifically, various aspects of the write driver described herein combine a high speed driver with voltage level shifting capabilities that may be implemented efficiently in reducing use of silicon area while using lower power. The write driver circuit shifts or adjusts voltage levels between a first voltage domain to a second voltage domain. In one example, the write driver circuit is coupled to a global write bitline and a local write bitline that is coupled to one or more bitcells (of SRAM memory). The write driver circuit converts a first voltage level at the global write bitline to a second voltage level at the local write bitline during a write operation.

Abstract: Disclosed herein is a device that includes: a set of address terminals supplied with a set of address signals, each of the address signals being changed in logic level; memory mats to which address ranges are allocated, respectively, the address ranges being different from each other, each of the memory mats including memory cells; and decoder units each provided correspondingly to corresponding memory mat. Each of the decoder units includes a set of first input nodes and a set of second input nodes, the set of first input nodes of each of the decoder units being coupled to the set of address terminals to receive the set of address signals, the set of second input nodes of each of the decoder units being coupled to receive an associated one of sets of control signals, each of the control signals being fixed in logic level.

Abstract: A memory having an array of multi-gate memory cells and a word line driver circuit coupled to a sector of memory cells of the array. In at least one mode of operation, the word line driver circuit is controllable to place an associated control gate word line coupled to the control gate word line driver and coupled to the sector in a floating state during a read operation where the sector is a non selected sector.

Abstract: A first exemplary aspect of the present invention is a word line selection circuit where address decode signals composed of a power supply voltage and a first voltage lower than a ground voltage are input, and that a word line selection signal composed of the first voltage and a second voltage higher than the power supply voltage is output not via a level shift circuit according to the address decode signals.