Abstract: A wafer includes multiple optical devices. One of the devices includes a waveguide that terminates at a facet that is included in a testing port. Light is injected from a light source into the waveguide through the facet without being reflected between exiting from the light source and entering the facet. The devices are separated from the wafer after the light is injected into the waveguide.

Abstract: A photoelectric conversion assembly is proposed. The photoelectric conversion assembly comprises a photoelectric conversion module having an interposer, at least one optical element and an optical bench. The at least one optical element is configured on the interposer, and the optical bench is used to support for the interposer. A circuit board is used to support for the photoelectric conversion module, having metal pads for coupling the at least one optical element. An optical transmission component is used for transmitting light. An optical ferrule is used for engaging with the photoelectric conversion module and an optical transmission component. A plug is used for electrically connecting the circuit board.

Abstract: Disclosed are optical connectors having lenses along with methods for making the same. In one embodiment, the optical connector includes a fiber body having a front portion with a plurality of fiber guides, and a connector body having a plurality of connector body fiber guides that lead to a plurality of lenses at a front portion of the connector body. The fiber body attaches to the connector body and may align a plurality of optical fibers to the lenses at the front portion of the connector body. One embodiment has the fiber body configured as a crimp body with a barrel at a rear portion for attaching a fiber optic cable.

Abstract: An optical transmitter may include a chip stack that includes an electrical IC that is mounted using solder balls to a photonic chip. These solder connections permit the electrical IC and the photonic chip to communicate. In addition, the transmitter may include a PCB coupled to the stack so that electrical signals in the PCB are transmitted to the IC and photonic chip (and vice versa). Instead of coupling the PCB to the stack using wire bonds attached to pads on a surface of the photonic chip, at least a portion of the PCB is disposed between the photonic chip and electrical IC. The PCB may also include bond pads used to form a direct solder connection to the electrical IC. As such, the electrical IC may include direct solder connections to both the PCB and the photonic chip.

Abstract: An optical interface device for a photonic integrated system includes a plug and a receptacle. The receptacle is operably arranged on a PIC that supports waveguides. The plug operably supports optical fibers. The receptacle and plug are configured to operably engage to establish optical communication between the optical fibers and the waveguides. A tab on the receptacle is configured to constrain longitudinal motion while allowing for lateral motion of the receptacle to adjust its position relative to the PIC to optimize alignment. The plug can include a spacer sized to fit within a recess defined by the tab to further facilitate alignment. The receptacle and plug can be engaged and disengaged in a manner similar to conventional electrical connectors.

Abstract: Modular switchboard terminal block (10,20) for transmission of data signals (2) is provided, comprising a container (10a,20a) having, arranged inside it, a printed circuit (30) for processing the data signals, which has two opposite sides (30a,30b) in a transverse direction (Y-Y); connectors (11;21) for electrical connection to controlled/detection devices; and a rear end face provided with hook and spring means for mounting on a DIN switchboard rail (6).

Abstract: An apparatus can comprise an optical slab comprising a rigid substrate of substantially transmissive material. The apparatus can also comprise a WDM multiplexer to receive and combine a plurality of optical signals at different wavelengths to form a combined optical signal in the optical slab having an aggregate power. The apparatus can further comprise a broadcaster to distribute the combined optical signal from the optical slab to each of a plurality of different optical receivers with a fraction of the aggregate power of the combined optical signal.

Abstract: An optical communication subassembly includes one or more optoelectronic devices, one or more optical elements, and a transceiver light coupling unit. Each optical element is configured to change a divergence of the outgoing light relative to a divergence of the incoming light and is spaced apart from and optically aligned with a corresponding optoelectronic device. The transceiver light coupling unit has a mating surface configured for mating with a connector light coupling unit attached to an optical waveguide. A mating direction of the optical light coupling unit forms an angle with the mating surface of the transceiver light coupling unit such that when the connector light coupling unit mates with the transceiver light coupling unit, the angle between the mating direction of the connector light coupling unit and the mating surface of the transceiver light coupling unit causes the optical waveguide to bend.

Abstract: A control circuit includes a first control unit, a power unit, a driver unit, a second control unit, a power source, a first switch, a pull-up element and a second switch. The first control unit is used to detect whether a configuration channel line has a predetermined divided voltage and generate a control signal accordingly. The power unit is coupled to the configuration channel line and a power line for supplying power to the driver unit. The driver unit is used to enable or disable a light emitting unit according to the control signal. The second control unit is used to detect whether the configuration channel line has the predetermined divided voltage and control the first switch and the second switch accordingly. The first switch is coupled between a power source and the configuration channel line. The second switch is coupled between the pull-up element and the configuration channel line.

Abstract: A base material includes a pair of end regions located on both sides in a first direction, and an intermediate region located between the pair of end regions. The intermediate region includes a pair of side edges on both sides in a second direction orthogonal to the first direction. Both the pair of side edges do not project outward in the second direction from the pair of end regions. At least one of the pair of side edges has a shape recessed inward in the second direction from the pair of end regions. Terminals include end pads and a side pad. The end pads are located in each of the pair of end regions of the base material and arranged in the second direction. The side pad is located at at least one of the pair of side edges of the base material.

Abstract: A fiber optic connector assembly comprising: a fiber optic connector (110) and a fiber optic adapter (120). The fiber optic connector comprises a ferrule assembly (110) and is simplified to not comprise a case and/or an insertion body of a standard fiber optic connector disposed outside the ferrule assembly. The fiber optic adapter comprises a simplified port (121) adapted to receive the ferrule assembly (110) therein and an elastic piece (130) for holding the ferrule assembly (110) in the simplified port. The elastic piece is disposed in a peripheral wall of the simplified port and clamped on the ferrule assembly to exert an axial elastic force on the ferrule assembly. The fiber optic connector and the fiber optic adapter of the present invention both can be shortened in length, and the fiber optic connector assembly has a simpler structure than that of a standard fiber optic connector assembly.

Abstract: An optical device includes a connection pad, which is connected to a conductor pattern on the circuit substrate, at one edge. The connection pad includes one ground pad, and two or more signal pads between which the ground pad is interposed from its both sides. The ground pad includes a concave portion including an opening at the edge. The circuit substrate is provided with a metal columnar member in the conductor pattern to which the ground pad is connected. The conductor pattern and the connection pad are fixed to each other with solder in a state in which the columnar member is fitted into the concave portion. Solder, which gradually rises from the ground pattern to a lateral surface of the columnar member, is formed between the columnar member and the ground pattern that is formed in the flexible printed circuit.

Abstract: A system and an apparatus for connecting a fiber optic or rigid light guide to a light source are provided. The fiber optic or rigid light guide has one end connected to a ferrule with a contact surface. The system includes a connecting element connectable to the light source, into which the ferrule can be inserted. The connecting element has a number of radially movable fastening portions, wherein the fixing portions are radially biased and cooperate with the contact surface, when the ferrule is inserted into the connecting element, whereby a first retention force is applied to the contact surface, and a fixing element is positioned in such a way that it cooperates with the fastening portions so that a second retention force, which is greater than the first retention force, is applied to the contact surface.

Abstract: A light emitting power line plug structure is disclosed, comprising a plug accommodation body, an electric power line communicatively connected to the plug accommodation body, a plug front end assembly, a connection assembly fixedly locked to the plug front end assembly and a light emitting circuit assembly, wherein the light emitting circuit assembly is located between the plug front end assembly and the connection assembly, and is configured with at least a light emitting diode (LED) which faces towards the light guiding line extending from the inside of the electric power line; therefore, when the electric power cords in the electric power line conduct electric power, the LEDs in the light emitting circuit assembly can become conductive and emit light such that the light guiding line integrally illuminates by means of light transfers and glow outwards on the entire electric power line through the translucent cladding.

Abstract: The present invention provides a packaging device of single optical multiplexed parallel optical receiver coupling system component, comprising a housing having a transmission function, an adapter component and collimating lens. The upper surface of the housing is provided with a first groove and a second groove, the lower surface of the housing is provided with a third groove. One end of the housing is provided with a through hole which communicates with the first groove. One end of the collimating lens is connected with the adapter component, and the other end of the collimating lens passes through the through hole to the first groove. A first slope and a second slope are respectively provided on the adjacent side wall between the first groove and the second groove. The second slope is provided with a reflective film. The third groove is provided with a lens array having multiple channels.

Abstract: Optical connectors may include various portions, or structures, to provide a plurality of degrees of movement to optical ferrules. The optical ferrules may be linearly movable along one or more axes and rotationally moveable about one or more axes for alignment and coupling to corresponding optical ferrules. The optical connectors may be integrated with, or in conjunction with, other non-optical connectors such as electrical connectors, e.g., located on a drive carrier.

Abstract: An apparatus and method of assembly are described that provide an improved printed circuit board (PCB) assembly for an electro-optical interface, where more accurate positioning and alignment of electro-optical components can be achieved in an active part of the PCB assembly that is used for the electro-optical interface to meet tighter tolerances in an easier and more cost efficient manner. In particular, a photonic integrated circuit (PIC) is received in a cavity defined in a PCB that includes conductive elements for transmitting electrical signals. An optoelectronic transducer is connected to the PIC to convert between the optical signals and the corresponding electrical signals, and an optical coupler is secured to the optoelectronic transducer and supported by the PIC and/or PCB, where the optical coupler is configured to transmit the optical signals between the optoelectronic transducer and an optical fiber.

Abstract: Novel multilayer composite material vias for biological implants are disclosed. The vias comprise two metals, so that the metal more compatible with biological environments is on one end of the via, and the metal more compatible with fabrication of a hermetic package is on the other end of the via.

Abstract: An external resonator type light-emitting device includes a light source oscillating a semiconductor laser light and a grating element configuring an external resonator together with the light source. The light source includes an active layer oscillating the semiconductor laser light. The grating element includes an optical waveguide and a plurality of Bragg gratings formed in the optical waveguide. The optical waveguide includes an incident face on which the semiconductor laser light is incident and an emitting face from which an emitting light having a desired wavelength is emitted.

Abstract: There is provided an optical-electrical hybrid module including a substrate on which a plurality of optical communication modules are arranged, the plurality of optical communication modules transmitting or receiving an optical signal through an optical fiber cable and performing conversion between the optical signal and an electrical signal. A shield case covering the optical communication modules includes a surface inclined in a direction away from a position in which the optical fiber cable is mounted to each optical communication module.

Abstract: An optical structure includes a substrate including a cavity on a first surface of the substrate, an optical component on the substrate and an adhesive applied to a side of the optical component to fix the optical component to the substrate. The optical component includes a recess on a second surface of the optical component, the second surface is opposed to the first surface of the substrate, and the recess is provided along an edge of the second surface.

Abstract: An external resonator type light-emitting device includes a light source oscillating a semiconductor laser light and a grating element configuring an external resonator together with the light source. The light source includes an active layer oscillating said semiconductor laser light. The grating element includes an optical waveguide and a plurality of Bragg gratings formed in the optical waveguide. The optical waveguide includes an incident face to which the semiconductor laser light is incident and an emitting face from which an emitting light having a desired wavelength is emitted. A half value reflectance R50 is larger than a reflectance R2 at an emitting end of the light source. A half value reflectance R50 is 3% or larger. A combined reflectance is not less than the half value reflectance R50 in a wavelength region ??50.

Abstract: An electric field intensity calculation apparatus specifies, by analyzing a measurement result for a near magnetic field intensity distribution on a component side of a printed circuit, a maximum intensity of an evaluation target frequency component of a near magnetic field of the printed circuit and an area of a range, on the printed circuit, delimited by using, as its boundary, positions where intensity of the evaluation target frequency component of the near magnetic field attenuates by a predetermined factor relative to the maximum intensity, and calculate a far electric field intensity for the evaluation target frequency at a place at a distance from the printed circuit, based on the area, an electronic current value of an electronic current that generates a near magnetic field having the maximum intensity when flowing through the component side of the printed circuit, the evaluation target frequency, the distance, and a proportional coefficient.

Abstract: An optical subassembly includes a thru optical via (104) formed through a semiconductor substrate (102), an optoelectronic component (108) secured to the substrate (102) such that an active region (106) of the optoelectronic component is aligned with the thru optical via (104), and circuitry (110) formed into the substrate (102), the circuitry to connect to and operate in accordance with the optoelectronic component (108).

Abstract: Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

Abstract: A converter module is provided that is configured to provide data connectivity between at least two external devices, where the converter module comprises a pair of first connectors and up to eight second connectors. The pair of first connectors is configured to be plugged into and interfaced with ports on a first external device. The second connectors are configured to receive and interface with cables. The converter module also comprises a demultiplexing and multiplexing unit that is configured to split signals received via the pair of first connectors or combine signals received by plurality of second connectors. The pair of first connectors receive and couple signals at a first data rate, while the second connectors receive and couple signals at a second data rate. The first data rate may be four times the second data rate.

Abstract: A pluggable module includes a pluggable body having a top and channel walls extending above the top defining a cooling channel along the top. The cooling channel allows airflow between a front end and a mating end of the pluggable body. The pluggable module includes a communication circuit board held in the pluggable body. The pluggable module includes an EMI shield coupled to the pluggable body above the top. The EMI shield has a shield plate spanning the cooling channel. The shield plate is metal and provides electrical shielding across the cooling channel. The shield plate has openings allowing airflow therethrough to flow through the cooling channel.

Abstract: Provided is a lens driving device which includes: a lens holder including a coil; a frame for receiving the lens holder; a driving circuit board disposed below the frame; a plurality of first conductive elastic bodies disposed in a manner to keep the lens holder moving in a Z-axis direction; and a plurality of second conductive elastic bodies disposed in a manner to keep the frame moving in a direction perpendicular to the Z-axis direction. The lens driving device further comprises a plurality of electrical contact-oriented Z-axis position sensor. The Z-axis position sensor senses the motion of the lens holder in the Z-axis direction. An electronic circuit between a portion of the plurality of electrical contacts and the coil of the lens holder comprises a Molded Interconnect Device and a portion of the first conductive elastic bodies. The Molded Interconnect Device is disposed on the frame.

Abstract: A novel, hybrid optical fiber stub device comprises a first ferrule transparent to UV light and a second ferrule including a conventional material. An optical fiber is disposed through the first ferrule and second ferrule. The input and output faces of the optical fiber are prepared suitable for optical coupling. A photonic device is coupled to the first optical fiber surface. A UV curable epoxy is disposed between the photonic device and the first optical fiber surface. The UV curable epoxy includes an index of refraction between an index of refraction of the first optical fiber and an index of refraction of the photonic device. A second optical fiber is coupled to the first optical fiber.

Abstract: An example embodiment includes an optoelectronic module. The optoelectronic module may be configured to transmit out-of-band (OOB) data as an average optical power difference between optical signals. The optoelectronic module may include a first optical source, a second optical source, and an optical power control device. The first optical source may be configured to generate a first optical signal including first channel payload data on a first optical channel. The second optical source may be configured to generate a second optical signal including second channel payload data on a second optical channel. The optical power control device may be configured to vary average optical powers of one or more of the first optical signal and the second optical signal to create an average optical power difference between the first optical signal and the second optical signal that is representative of a logical bit of the OOB data.

Abstract: An optical fiber test apparatus includes an optical power meter operable to detect light at a predetermined wavelength, and a laser source operable to generate a visible laser beam. The optical fiber test apparatus further includes an optical fiber extending between a first end and a second end, and a diplexer which includes a first optical connector and is coupled to the optical power meter, the laser source, and the first end of the optical fiber. The optical fiber test apparatus further includes a second optical connector coupled to the second end of the optical fiber and including a test port. The diplexer is operable to transmit light at the predetermined wavelength from the second optical connector to the optical power meter and transmit the visible laser beam from the laser source to the second optical connector.

Abstract: A single hybrid electrical/optical connector simultaneously forms both electrical and optical input/output connections by a single step engagement between elements on a connector and corresponding elements of the opposite gender on a mating connector. The connector can be surface-mounted on a circuit board, and a mating connector can be vertically pluggable onto the connector. The optical elements on the connector and/or the mating connector can be detachable, which can simplify assembly of a system that includes the circuit board. The hybrid electrical/optical connector has applications for optical transceivers. The hybrid electrical/optical connector includes a housing that extends laterally along a housing plane. The housing includes electrical and optical sockets thereon. In some examples, the electrical sockets and the optical sockets are laterally arranged on opposite sides of a division plane perpendicular to the housing plane.

Abstract: A fiber optic cassette includes a body defining a front and an opposite rear. A cable entry location, such as a multi-fiber connector, is defined on the body for a cable to enter the cassette, wherein a plurality of optical fibers from the cable extend into the cassette and form terminations at one or more single or multi-fiber connectors adjacent the front of the body. A flexible substrate is positioned between the cable entry location and the connectors adjacent the front of the body, the flexible substrate rigidly supporting the plurality of optical fibers. Each of the connectors adjacent the front of the body includes a ferrule. Dark fibers can be provided if not all fiber locations are used in the multi-fiber connectors. Multiple flexible substrates can be used with one or more multi-fiber connectors.

Abstract: A process for preparing a subassembly, the process comprising (a) defining the location of one or more grooves for receiving at least one polymer waveguide in a wafer, (b) etching the grooves into the wafer, each groove having sidewalls and a first facet at the terminal end perpendicular to the side walls, the first facet having a first angle relative to the top planar surface, (c) coating the first facet with a reflective material, and (d) disposing a fluid polymer waveguide precursor into each groove, and writing a core into the polymer material by directing at least one laser beam on the first facet by directing the laser beam into the top of the polymer material such that the beam reflects off of the first facet and down the interior of the polymer material to form the core in the polymer waveguide.

Abstract: An optical module includes an optical fiber connector, a transmitter optical component, a receiver optical component and a printed circuit board arranged within an optical module housing; the transmitter optical component and the receiver optical component are optically coupled to the optical fiber connector, and electrically connected to the printed circuit board which is arranged horizontally within the optical module housing. The transmitter optical component and the receiver optical component are stacked in a direction perpendicular to the printed circuit board. Stacking the transmitter optical component and the receiver optical component makes use of the width of the optical module by improving design flexibility of the optical path and the electric circuit, reducing or even substantially eliminating crosstalk between the high-speed devices and high-speed signals, and improving the heat dissipation effect of the optical module.

Abstract: A system may include a substrate and a lens component. The substrate may include pads and solder protuberances. Each solder protuberance may be located on a pad. The lens component may define grooves sized to receive at least a portion of the solder protuberances. The lens component may be positioned relative to the substrate such that at least a portion of each solder protuberance is positioned within the grooves.

Abstract: In order to improve properties, an optical coupling device has a potting resin and an internal mold resin between a light emitting element and a light receiving element. The internal mold resin is a cured product of a composition having an epoxy resin and a curing agent, and is a resin having a light transmission property. Additionally, the internal mold resin MRI contains an aromatic ring and an alicyclic compound. By thus lowering the ratio of an aromatic ring in the epoxy resin, deterioration of the resin can be suppressed. Thereby, a decrease in the light transmission property of the epoxy resin cured product can be suppressed, and degradation of the transmission performance for an optical signal can be reduced.

Abstract: An optical module includes a housing including an internal space that has an opening in a substrate mounting surface, an element mounting surface that forms a portion of an inner surface of the internal space, and a waveguide introduction opening that is formed in a side surface intersecting the substrate mounting surface and is opened to the opening of the substrate mounting surface and communicated with the internal space, an optical element that is mounted on the element mounting surface, and an electronic element that is mounted on the element mounting surface and is connected to the optical element. When the substrate mounting surface is mounted on a circuit substrate, an optical waveguide that protrudes from a surface of the circuit substrate is introduced into the internal space through the waveguide introduction opening.

Abstract: An alignment feature formed in a lens block during manufacturing has a precise spatial relationship to an optical surface of the lens block such that precise alignment of the alignment feature within the lens block ensures precise alignment of the optical surface within the lens block. Precise alignment of the alignment feature within the lens block is readily assessable whereas precise alignment of the optical surface within the lens block is not. A determination is made as to whether the optical surface is aligned within the lens block by determining whether the alignment feature is aligned within the lens block, and if not, the extent of any misalignment. The extent of misalignment may then be used to adjust the manufacturing process to eliminate the alignment error.

Abstract: A hybrid plug connector including an insulative housing defining a cavity to receive an optical fiber assembly therein, and a plurality of passageways to receive a plurality of terminals therein. A printed circuit board is located behind the terminals and connected to the terminals. An electrical cable is mounted to a rear portion of the circuit board. The whole optical fiber assembly is received within the housing and is somewhat back and forth moveable along a front-to-back direction for buffering for compliantly coupling with another optical fiber assembly built within the complementary receptacle connector when the plug connector is inserted into the complementary receptacle connector. An attachment shows the manufacturing process.

Abstract: An optoelectronic module is disclosed. The optoelectronic module comprises an optical connector, a contact, an opto-electric assembly, and a casing. The opto-electric assembly has a carrier optically connected to the optical connector by a flexible optical fiber and electrically connected to the contact by a flexible cable. The casing at least partially encloses the opto-electric assembly, the optical connector, and the contact. An inner surface of a wall of the casing is attached to the carrier in a thermally conductive manner.

Abstract: In a boot B for an optical connector ferrule including a rear opening portion 21b used to insert an optical fiber tape T having an optical fiber at a front end thereinto and a front opening portion 21a used to expose the optical fiber of the front end of the inserted optical fiber tape T to the outward front side, the boot is inserted into an insertion opening portion 14 formed at a rear end side of a ferrule body 10 and a surface of the boot B is provided with protrusions 22a, 22b, and 22c formed so as to be crushable when the protrusions are inserted into the insertion opening portion 14 of the ferrule body 10 in a direction orthogonal to the insertion direction of the boot B.

Abstract: An optical sensor module is provided. The optical sensor module includes a light source, a first lens and a sensor device. The light source is arranged for generating a light signal. The first lens has a first optical center axis. The sensor device is disposed in correspondence with one side of the first lens. The sensor device includes a light sensitive area, and a center of the light sensitive area deviates from the first optical center axis. The sensor device is arranged for receiving a reflected signal reflected from an object in response to the light signal, and accordingly generating a sensing result.

Abstract: An optical receiver comprises a package provided with an input window; a polarization-maintaining optical fiber fixable to the input window; a polarization beam splitter, disposed on the package, for inputting light outputted from the polarization-maintaining optical fiber and outputting first output light and second output light having respective polarization directions different from each other; a beam splitter, disposed on the package, for splitting the first output light; a first light-receiving element, optically coupled to the beam splitter, having two light-receiving parts corresponding to two kinds of the output light split by the beam splitter; and a second light-receiving element, disposed on the package, for receiving the second output light.

Abstract: An optical receiver comprises a package provided with an input window; a polarization-maintaining optical fiber fixable to the input window; a polarization beam splitter, disposed on the package, for inputting light outputted from the polarization-maintaining optical fiber and outputting first output light and second output light having respective polarization directions different from each other; a beam splitter, disposed on the package, for splitting the first output light; a first light-receiving element, optically coupled to the beam splitter, having two light-receiving parts corresponding to two kinds of the output light split by the beam splitter; and a second light-receiving element, disposed on the package, for receiving the second output light.

Abstract: Provided herein is a multi-channel optical module including a plurality of laser diodes emitting light with different wavelengths, a thermoelectric cooling device including the plurality of laser diodes, a TO-can including the thermoelectric cooling device, and a holder combined with the TO-can and including a plurality of optical lenses focusing the light with different wavelengths and a multiplexer gathering focused light into a single optical fiber, wherein the holder has a shape in which the TO-can is cut along an axis of a path of the light with different wavelengths for active alignment of the plurality of optical lenses.

Abstract: An optical modulator may include a lower waveguide, an upper waveguide, and a dielectric layer disposed therebetween. When a voltage potential is created between the lower and upper waveguides, these layers form a silicon-insulator-silicon capacitor (also referred to as SISCAP) guide that provides efficient, high-speed optical modulation of an optical signal passing through the modulator. In one embodiment, at least one of the waveguides includes a respective ridge portion aligned at a charge modulation region which may aid in confining the optical mode laterally (e.g., in the width direction) in the optical modulator. In another embodiment, ridge portions may be formed on both the lower and the upper waveguides. These ridge portions may be aligned in a vertical direction (e.g., a thickness direction) so that ridges overlap which may further improve optical efficiency by centering an optical mode in the charge modulation region.

Abstract: A method for producing an optoelectronic semiconductor chip is disclosed. In some embodiment the method includes arranging a metallic mirror layer on a top side of a semiconductor layer sequence, arranging a mirror protection layer at least on exposed lateral surfaces of the mirror layer in a self-aligning manner, wherein the mirror layer has openings toward the semiconductor layer sequence, and wherein the openings are framed in lateral directions by the mirror protection layer and partially removing the semiconductor layer sequence in a region of the openings of the mirror layer.

Abstract: An optical transmission apparatus includes a substrate and a heatsink. The substrate is a substrate on which multiple light sources and a heat generating part are mounted. The heatsink includes a base portion, a fin portion, and multiple light guiding paths. The base portion is arranged on a surface of the heat generating part on an opposite side to the substrate. The fin portion rises up from a surface of the base portion on an opposite side to the heat generating part. The multiple light guiding paths are formed inside the base portion, and guide lights emitted by the multiple light sources to multiple output destinations corresponding to the multiple light sources.

Abstract: An inter-lens adjusting method includes: fitting a plurality of fitting portions to a plurality of fitted portions, wherein each of the plurality of fitting portions is provided on the side of a first lens for collimating light emitted from a light emitting device and includes at least one of a convex portion and a concave portion and each of the plurality of fitted portions is provided on the side of a second lens for aggregating the light collimated by the first lens and has a shape to be fitted to a corresponding one of the plurality of fitting portions; and adjusting a position between the first lens and the second lens such that the light emitted from the light emitting device is aggregated into an optical fiber ferrule via the first lens and the second lens.