Abstract: A vertical cavity surface emitting laser (VCSEL) system and method of fabrication are included. The VCSEL system includes a first portion comprising a first mirror and a gain region to amplify an optical signal in response to a data signal, the first portion being fabricated on a first wafer. The system also includes a second portion comprising a second mirror that is partially-reflective to couple the optical signal to an optical fiber. The second portion can be fabricated on a second wafer. The system further includes a supporting structure to couple the first and second portions such that the first and second mirrors are arranged as a laser cavity having a predetermined length to resonate the optical signal.

Abstract: A communications connection system includes a fiber optic connector including a storage device having memory configured to store physical layer information. The storage device also includes at least one contact member that is electrically connected to the memory. Certain types of fiber optic connectors have the storage device mounted to a key of the fiber optic connector. Certain types of fiber optic connectors have the storage device mounted in a cavity defined in the fiber optic connector.

Abstract: To improve the termination of a fiber optic cable, disclosed is an overboot assembly for a fiber optic terminus that retains a terminal end of the fiber optic cable in a receptacle. The overboot assembly provides strain relief to the fiber optic cable. Also, the overboot includes a removal member that is not separable from a fiber optic assembly of the fiber optic cable, the terminus and the overboot. The removal member may be advanced longitudinally relative to the terminus to manipulate a retaining member in the receptacle that latches the terminus in a connected state with the receptacle. Manipulation of the retaining member unlatches the terminus so that the terminus may be removed from the receptacle.

Abstract: Disclosed are optical connectors having lenses along with methods for making the same. In one embodiment, the optical connector includes a fiber body having a front portion with a plurality of fiber guides, and a connector body having a plurality of connector body fiber guides that lead to a plurality of lenses at a front portion of the connector body. The fiber body attaches to the connector body and may align a plurality of optical fibers to the lenses at the front portion of the connector body. One embodiment has the fiber body configured as a crimp body with a barrel at a rear portion for attaching a fiber optic cable.

Abstract: An optoelectronic device and a method for assembling an optoelectronic device are provided which obviate the need for providing additional structural elements only for aligning purposes, thus reducing the costs and effort for manufacturing the optoelectronic device. An optoelectronic substrate is mounted on a mounting surface of a mounting substrate; a coupling region of the optoelectronic device faces a reflection element. A fiber endpiece is arranged at a mounting distance from the mounting surface, the mounting distance being larger than a distance of the coupling region from the mounting surface. The mounting surface is exposed and free of any further substrates, layers or structures for mechanically connecting or contacting the optical fiber. A fiber portion which is arranged at a distance from the fiber endpiece contacts a glue droplet arranged on or above the mounting surface of the mounting substrate.

Abstract: Disclosed are optical ports and devices having a minimalist footprint. Specifically, the optical ports and devices have a footprint where the optical elements are exposed at a frame of the device. Additionally, a frame of the device provides a portion of the mating surface for engaging a complimentary optical plug during mating with the optical port on the device. This minimalist footprint advantageously allows for a smaller portion of the optical port to be exposed to the environment and subject to damage and/or wear. Further, the optical port provides a clean and sleek optical port on the device with a relatively small surface that may be cleaned or wiped by the user as necessary.

Abstract: Disclosed are optical ports and devices using the optical ports. The optical port includes a mounting body having a first pocket and at least one mounting surface for securing the optical port, one or more optical elements, and a first alignment feature disposed in the pocket, wherein the alignment feature includes a piston that is translatable during mating. The one or more optical elements may be an integral portion of the mounting body or a discrete lens. In other embodiments, the mounting body may include a plurality of pockets and one of the pockets may include a magnet for securing a plug to the optical port. The optical port may optionally have a minimalist optical port footprint so that the complimentary mating optical plug engages a portion of the frame during mating.

Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

Abstract: An optical module includes a housing including an internal space that has an opening in a substrate mounting surface, an element mounting surface that forms a portion of an inner surface of the internal space, and a waveguide introduction opening that is formed in a side surface intersecting the substrate mounting surface and is opened to the opening of the substrate mounting surface and communicated with the internal space, an optical element that is mounted on the element mounting surface, and an electronic element that is mounted on the element mounting surface and is connected to the optical element. When the substrate mounting surface is mounted on a circuit substrate, an optical waveguide that protrudes from a surface of the circuit substrate is introduced into the internal space through the waveguide introduction opening.

Abstract: A transmitter and receiver integrated optical sub-assembly includes a housing including a side wall structure and a bottom wall, a transmitter-side optical receptacle and a receiver-side optical receptacle attached to the side wall structure, a second circuit board inserted into the housing, laser diodes and photo diodes arranged on the bottom wall, a transmitter-side optical system that is disposed on the bottom wall and combines optical signals from the laser diodes, a receiver-side optical system that is disposed on the bottom wall and splits an optical signal from the receiver-side optical receptacle, a driver integrated circuit, and an amplifying integrated circuit. In the transmitter and receiver integrated optical sub-assembly, electrodes formed at the other end portion of the second circuit board are connected to the driver integrated circuit and the amplifying integrated circuit.

Abstract: There is provided an opto-electric hybrid board in which a metal reinforcement layer is in intimate contact with an insulative layer of a flexible circuit board without an adhesive layer interposed therebetween, the metal reinforcement layer allowing the proper mounting of an element while deformation due to pressing load applied during the mounting is suppressed. In the opto-electric hybrid board, a flexible double-sided circuit board in which electrical interconnect lines are formed on the front and back surfaces of an insulative layer having flexibility is used as an electric circuit board. A metal reinforcement layer is formed by plating on at least part of the electrical interconnect line on the back surface side which corresponds to a mounting pad on the front surface side. An optical waveguide is formed in contact with the electrical interconnect line on the back surface side of the flexible double-sided circuit board.

Abstract: The invention is directed to the provision of an optical integrated device wherein provisions are made to be able to mount components on a substrate with high accuracy and high packing density without having to heat the components. The optical integrated device includes a substrate, an optical device optically coupled to a first device, and an electrical device mounted on top of the optical device or on top of a second device, wherein the optical device is bonded to the substrate by surface activated bonding via a first bonding portion formed from a metallic material on the substrate, and the electrical device is bonded to the optical device or the second device by surface activated bonding via a second bonding portion formed from a metallic material on the optical device or the second device.

Abstract: A photoelectric conversion module includes: a substrate having a wiring layer and a through hole; a photoelectric conversion element having a light emitting unit or light receiving unit and mounted on the substrate such that the light emitting unit or light receiving unit faces the through hole; a protruding portion that has a hole portion communicating with the through hole, and protrudes from one of principal surfaces of one of the substrate and the photoelectric conversion element, one of the principal surfaces facing the other one of the substrate and the photoelectric conversion element; and an adhesive that is filled in a part of a region between the substrate and the photoelectric conversion element, the region being a region outside an inner peripheral surface of the hole portion, and that bonds the substrate to the photoelectric conversion element.

Abstract: An arrangement for a motor vehicle includes a master controller and a slave controller that use different reference-earth voltages and respectively comprise a transmission and a reception unit for shared data interchange. The transmission and reception units are connected to one another via a shared communication line. The communication line contains a diode that prevents a flow of current from the slave controller to the master controller. The master controller contains a pull-up resistor via which the shared communication line can be connected to a first reference-earth potential of the reference-earth voltage of the master controller.

Abstract: The present invention provides a flat optical fiber light-streaming cable, wherein a first connection part conforming to the USB specification is installed on one side of the circuit board on which light emitting diodes is installed, and a plurality of junction points are connected to the signal line set and the electric power line set respectively enveloped by a middle cladding layer, optical fibers respectively corresponding to the LEDs and the transparent outer protective layer wrapped on the peripheries thereof are installed between the signal line set and the electric power line set. When the controller drives LEDs to respectively project light sequentially toward the optical fibers, light can pass through the light spots on the surface and present a stream-wise lighting state demonstrating successive and progressive light chasings sequentially per segment, thereby presenting various dynamic lighting effects such as blinking color, colorful water flow or the like.

Abstract: The present invention relates to an illumination system comprising at least one light source and an optical light mixing rod. The illumination system comprises a rod holder holding the optical light mixing rod in a position, where the entrance surface of the optical light mixing rod is arranged above the emitting window of the light source. The optical light mixing rod is from in a flexible and solid transparent material and the rod holder is adapted to provide a pressure force to the optical light mixing rod and the pressure force is adapted to press the entrance surface of the optical light mixing rod and the emitting window of the light source together. The optical light mixing rod comprises a bulge the entrance surface and the pressure force presses the bulge flat against the emitting window of the light source.

Abstract: Devices and methods for visually confirming the positioning of a distal end portion of an illuminating device placed within a patient include inserting a distal end portion of an illuminating device internally into a patient, emitting light from the distal end portion of the illuminating device, observing transillumination resulting from the light emitted from the distal end portion of the illuminating device that occurs on an external surface of the patient, and correlating the location of the observed transillumination on the external surface of the patient with an internal location of the patient that underlies the location of observed transillumination, to confirm positioning of the distal end portion of the illuminating device.

Abstract: A planar lightwave circuit and an optical receiver which reduce degradation in signal quality is provided.

Abstract: The present application relates to high-definition multimedia interface, particularly to a new anti-interference high-definition multimedia interface. The interface comprises a male connector and a female connector. The male connector includes a male outer plastic housing, a shield stretch rear housing and a male plastic cable clamp. The female connector includes a female outer plastic housing, an outer shield grounding housing, an inner shield grounding iron housing, a female insulator, a female signal terminal and a female plastic rear plug. The male outer plastic housing and the shield stretch rear housing together form an inner cavity after connecting to each other, in which the male terminal assembly will be received. The female outer plastic housing and the outer shield grounding housing together form an inner cavity after connecting to each other, in which the female terminal assembly is received.

Abstract: A metal oxide semiconductor structure, the structure including: a substrate; a gate electrode, deposited on the substrate; a gate insulation layer, deposited over the gate electrode and the substrate; an IGZO layer, deposited on the gate insulation layer and functioning as a channel; a source electrode, deposited on the gate insulation layer and being at one side of the IGZO layer; a drain electrode, deposited on the gate insulation layer and being at another side of the IGZO layer; a first passivation layer, deposited over the source electrode, the IGZO layer, and the drain electrode; a second passivation layer, deposited over the first passivation layer; and an opaque resin layer, deposited over the source electrode, the second passivation layer, and the drain electrode.

Abstract: An optical device package includes a metal base body including a cutout portion formed from an outer circumferential surface of the metal base body toward the center portion thereof, and a wiring board connected on a side surface of the cutout portion of the metal base body. The wiring board includes an optical device mounting region provided on a portion of the wiring board located inside the cutout portion of the metal base body, and a pad arranged on a portion of the wiring board located outside the optical device mounting region.

Abstract: The present invention provides an optical coupling member and an optical connector using the optical coupling member, capable of improving the efficiency of an assembly work of the optical connector and positioning optical fibers in the optical connector with high accuracy. The optical coupling member (10) has: holding members (11) for being able to hold optical fibers (21) that are inserted from insertion holes (11a) formed at end parts; lenses housed in housing parts formed at opposite end parts of the holding members (11); and a joining member (13) for connecting the holding members (11) as aligned in parallel to each other, the joining member being formed of an elastic material.

Abstract: An apparatus includes a polymer waveguide element disposed on a circuit board and having a waveguide core between a first outer reference waveguide core and a second reference waveguide core having top and side exposed surfaces and defining opposing outer edges of the polymer waveguide element. A ferrule mount element optically couples the polymer waveguide element to an optical element through the circuit board. The ferrule mount includes two tapered features that mate with and form an interference fit with the exposed side surfaces of the first outer reference waveguide core and second outer reference waveguide core.

Abstract: An optoelectronic semiconductor component and a method for making an optoelectronic semiconductor component are disclosed. In an embodiment the component includes a carrier including at least one conversion-medium body and a potting body, the potting body surrounding the conversion-medium body at least in places, as seen in plan view, electrical contact structures fitted at least indirectly to the carrier and a plurality of optoelectronic semiconductor chips fitted to a main face of the carrier, the optoelectronic semiconductor chips configured to generate radiation, wherein the conversion-medium body is shaped as a plate, wherein the semiconductor chips are directly mechanically connected to the conversion-medium body, and wherein the conversion-medium body is free of cutouts for the electrical contact structures and is not penetrated by the electrical contact structure.

Abstract: A connector includes pins having a pinout including a functional designation cadence. The functional designation cadence includes a first ground pin, a first signal pin, a no-connect pin, a second signal pin, and a second ground pin, where the first signal pin is positioned between the first ground pin and the no-connect pin, the no-connect pin is positioned between the first and second signal pins, and the second signal pin is positioned between the no-connect pin and the second ground pin. Alternately, the functional designation cadence includes a first ground pin, a first signal pin, a third ground pin, a second signal pin, and a second ground pin, where the first signal pin is positioned between the first and third ground pins, the third ground pin is positioned between the first and second signal pins, and the second signal pin is positioned between the third and second ground pins.

Abstract: The invention provides a package structure of optical connector, comprising: an input circuit board, an output circuit board, a flexible circuit board, an optical transceiver module, and an enclosure for packing the above components. The input/output circuit board comprises a connecting terminal and an input/output terminal comprising a plurality of input/output ports, wherein the input circuit board and the output circuit board are fixed by the two opposite sides of the enclosure to create a specific space between the input circuit board and the output circuit board. The flexible circuit board is electrically connected to the connecting terminal of the input circuit board and/or the connecting terminal of the output circuit board. The optical transceiver module is electrically connected to the input circuit board and the output circuit board. The enclosure comprises an electrical connecting opening and an optical connecting opening corresponding to the electrical connecting opening.

Abstract: A latch mechanism for a pluggable optical module includes a slide disposed in the pluggable optical module, wherein the slide includes a front cylinder connected to a rear cylinder with a slide body therebetween and a post connected to the rear cylinder; a bail over a top of a front portion of the pluggable optical module and rotatably connected thereto, wherein the bail includes a first cutout portion on each side in which the front cylinder is moveably positioned therein; a ramp disposed within the pluggable optical module for sliding the rear cylinder thereon; and a notch disposed within the pluggable optical module for translating force from the post thereto responsive to the bail moving the front cylinder, the front cylinder applying force to the rear cylinder via the slide body, and the rear cylinder translating the force to the post.

Abstract: An optical fiber holding device for holding optical fibers includes an assembling member and a base. The assembling member includes a top surface, a bottom surface opposite to the top surface, a front surface, and a rear surface opposite to the front surface. The front surface and the rear surface are interconnected between the top surface and the bottom surface. The front surface defines a number of receiving holes for receiving front portions of the optical fibers. The base includes an assembly portion and a support portion connecting the assembly portion. The assembly member is detachably mounted on the assembly portion. The support portion supports main portions of the optical fibers.

Abstract: An optical module includes: a first circuit board including a first signal terminal part and a first ground terminal part formed on a front surface; and a second circuit board including a second signal terminal part and a second ground terminal part formed on a back surface. The first circuit board further includes: a first dielectric layer; a first signal wire formed on a front surface of the first dielectric layer; a first ground conductor layer formed on a back surface of the first dielectric layer; and a first through ground conductor passing through the first dielectric layer. The first ground terminal part is formed, in a first region and a second region respectively located on both sides of the first signal terminal part in a first direction, and in a third region prescribed at a location beyond the first signal terminal part in a second direction.

Abstract: Disclosure is a biosensor chip having precise count function comprising: a substrate, a plurality of ground wire waveguide layers, a signal waveguide layer and a protective layer. Wherein, the plurality of ground wire waveguide layers are located on two sides of the substrate, the signal waveguide layer is located on the substrate and between the plurality of ground wire waveguide layers, wherein the signal waveguide layer has a recess which forms a cell sensing region; and the protective layer covers a portion of the ground wire waveguide layers and a portion of the signal waveguide layer to expose the recess.

Abstract: A parallel optical module includes a light-emitting or light-receiving element array 101 placed on a substrate 100, an optical connector 103 optically connecting the optical element array 101 and an external optical fiber array 105, the optical connector 103 having a shape of at least an octahedron which is bilaterally symmetrical about the center of the outer shape thereof viewed along the optical axis direction, and an engaging member 104 placed on the same substrate 100 as the substrate on which the optical element array 101 is mounted, the engaging member having a groove onto which the optical connector 103 is fitted. A side wall of the groove of the engaging member 104 has an inclination corresponding to, among each surface of the optical connector 103, a second surface 110 adjacent to a first surface 109 facing the optical element array 101 in the direction perpendicular to the substrate.

Abstract: The present invention relates to an illumination system comprising at least one light source and an optical light mixing rod. The illumination system comprises a rod holder holding the optical light mixing rod in a position, where the entrance surface of the optical light mixing rod is arranged above the emitting window of the light source. The optical light mixing rod is formed in a flexible and solid transparent material and is accommodated in a hollow part of the rod holder. The rod holder is adapted to provide a pressure force to the optical light mixing rod and the pressure force is adapted to press the entrance surface of the optical light mixing rod and the emitting window of the light source together.

Abstract: A mechanism for an optical transceiver to latch with and release from a cage is disclosed. The mechanism includes a bail rotatable around an axis and a slider linearly movable between the latching position and the releasing position. The rotation of bail is independent of the liner motion of the slider.

Abstract: A detector is provided for detecting the interruption of a light path, the detector comprising a light emitter, a light receiver, and a light guiding arrangement disposed opposite the light emitter and receiver. A gap is defined between the light guiding arrangement and at least one of the light emitter and receiver to receive a movable part capable of interrupting the light path there between. Also provided is a light guide for use with such a detector and a utility meter comprising such a detector. In one specific embodiment, an opto electronic detector for detecting rotation of a coding wheel in a utility meter is provided.

Abstract: An optical coupling lens includes three main bodies, the main body further includes a bottom surface, a top surface opposite to the bottom surface, an alignment surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. The alignment surface, the first side surface, the second side surface, the third side surface, and fourth side surface are interconnected between the top surface and the bottom surface, and are connected to each other end to end. The three main bodies connect to each other end to end, and the third side surface of one of the main bodies correctly aligns with the fourth side surface of another of the main bodies.

Abstract: A lens assembly includes lenses and a lens barrel accommodating lenses. At least one of the lenses is a non-contact lens coupled to the lens barrel, in non-contact with the lens barrel.

Abstract: A device socket that includes a wall feedthrough, a printed circuit board and an electronic component attached to the printed circuit board. The device socket has a lock mechanism to connect the printed circuit board to the wall feedthrough. The wall feedthrough has an opening. The device socket has at least one seal with an opening which cooperates with the electronic component to adjust the position of the electronic component relative to the wall feedthrough and wall feedthrough opening.

Abstract: An optical fiber includes a core, a cladding, and a thermally conductive member. The cladding is formed in a surrounding of the core. The thermally conductive member is formed in a surrounding of the cladding and includes a thermal conductivity higher than thermal conductivities of the core and the cladding.

Abstract: A fiber optic distribution cable includes a jacket defining an exterior of the fiber optic distribution cable and a plurality of optical fibers extending through a cavity of the jacket. The jacket has an access location with a single opening formed in the jacket that extends to the cavity. A distribution optical fiber of the plurality of optical fibers extends through and protrudes from the single opening in the jacket at the access location and is secured by a demarcation point.

Abstract: A wiring substrate includes a wiring pattern that is formed on a surface of a conductive board via an insulation layer and an extension part that is extended from the wiring pattern. The extension part is disposed in a portion located immediately below a detachable connector. The detachable connector is connected to a fixed connector mounted on the wiring substrate and connected and fixed to the wiring pattern.

Abstract: A method for fabricating a sealed-sidewall device die may include filling grooves of a deeply-grooved device wafer with a sealant, yielding a sealed grooved device wafer. The method may also include forming grooves in a device wafer to yield the deeply-grooved device wafer. The step of forming grooves may include forming a groove that at least partially penetrates each layer of the device wafer. The method may further include masking each device of the deeply-grooved device wafer. A sealed-sidewall device die may include at least one layer including a device substrate layer, a sidewall including a respective surface of each layer of the at least one layer, a sidewall sealant covering the sidewall, and a device formed on the device substrate layer. The sidewall sealant optionally does not cover a top surface of the device. The top surface of the device may directly adjoin an ambient medium thereabove.

Abstract: A method of manufacturing an optical transmission module includes temporary disposing, measuring, and placing steps. The temporary disposing step includes temporarily disposing a light-emitting-element receptacle over a mounting substrate so that a lens of the light-emitting-element receptacle and a light emitting element array face each other. The measuring step includes measuring the position of a light spot at which light emitted from the light-emitting element array emerges from the emergence surface of the light-emitting-element receptacle. The placing step includes placing the light-emitting-element receptacle over the mounting substrate on the basis of information on the position of a designed intersection point of the optical axis of an optical cable with the emergence surface of the light-emitting-element receptacle, and information on the position of the light spot.

Abstract: An optical transceiver adapted to an optical connector having an angled physical contact (APC) is disclosed. The optical transceiver installs an optical sub-assembly to receive an external connector. The optical sub-assembly provides an index surface that indexes the inclined direction of the end of the stub abutting against the end surface of the external connector of the type of the APC. The housing provides a saddle with a flat surface on which the index surface of the optical sub-assembly is set.

Abstract: A connector mounted on a board. The connector includes one or more elements mounted on the board by means of a cured adhesive, which is at least partly present between the element and at least one anchoring element, E.g., the board mounted element may include one or more holes filled, with the cured adhesive embedding one or more of the at least one anchoring elements. The board mounted element may for instance be an optical coupler.

Abstract: An optical module includes: a transparent substrate through which light can pass; a photoelectric conversion element mounted on the transparent substrate and emitting light toward the transparent substrate or receiving light having passed through the transparent substrate; and a support member supporting an optical fiber for transmitting light, the support member and the transparent substrate forming an optical path between the photoelectric conversion element and the optical fiber. A positioning hole is formed in the transparent substrate. A positioning pin having a tapered surface is formed on the support member. The transparent substrate and the support member are positioned with respect to one another by inserting the positioning pin into the positioning hole along the optical axis direction of light between the transparent substrate and the support member and by making the tapered surface of the positioning pin contact the edge of the positioning hole without leaving any space therebetween.

Abstract: An interposer for optically coupling an optical device (OD) to a fiber, the OD mounted on a substrate, the interposer comprising: (a) a lens component comprising at least one lens for optically coupling with the OD the lens having a first optical axis, a first surface for mating with the substrate, and a second surface for mating with a third surface of a fiber component; (b) the fiber component comprising the third surface and a cavity for receiving at least one fiber and holding the fiber along a second optical axis, the first and second optical axes being perpendicular; and (c) wherein at least one of the lens component or the fiber component comprises a reflective surface for optically coupling the lens to a point along the second optical axis and adjacent the cavity.

Abstract: An optical-electric coupling element includes a lower surface, an upper surface, and a first side surface. The lower surface defines a first cavity. The first cavity includes a bottom portion forming a first photic zone and a second photic zone. The first photic zone includes first coupling lenses. The second photic zone includes second coupling lenses. The upper surface defines a second cavity. The second cavity includes a sloped surface. The first side surface defines a receiving cavity. The receiving cavity includes a vertical surface forming a third photic zone and a fourth photic zone. The third photic zone includes third coupling lenses. The fourth photic zone includes fourth coupling lenses. Each third coupling lens corresponds with a respective one of the first coupling lenses. Each fourth coupling lens corresponds with a respective one of the second coupling lenses.

Abstract: Disclosed are optical ports and devices using the optical ports. The optical port includes a mounting body having a first pocket and at least one mounting surface for securing the optical port, one or more optical elements, and a first alignment feature disposed in the pocket, wherein the alignment feature includes a piston that is translatable during mating. The one or more optical elements may be an integral portion of the mounting body or a discrete lens. In other embodiments, the mounting body may include a plurality of pockets and one of the pockets may include a magnet for securing a plug to the optical port. The optical port may optionally have a minimalist optical port footprint so that the complimentary mating optical plug engages a portion of the frame during mating.

Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. The opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit includes fitting holes for fitting engagement with the aligning protrusion, the fitting holes being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide. The connector and the opto-electric hybrid unit are coupled together.

Abstract: Apparatus and method for optically interfacing optical fibers with photo devices. In one implementation, the optical fiber comprises an end surface configured to produce internal reflection of an incident optical signal propagating within the fiber from a distal end, and a photo device configured to receive the reflected optical signal. In another implementation, the optical fiber comprises an end surface configured to produce internal reflection of an incident optical signal generated by a photo device for propagation within the fiber towards a distal end. In another implementation, the optical fiber comprises an end surface configured to refract an incident optical signal propagating within the fiber from a distal end, and a photo device configured to receive the refracted optical signal. In another implementation, the optical fiber comprises an end surface configured to refract an incident optical signal generated by a photo device for propagation within the fiber towards a distal end.