Abstract: A method for aligning optical components comprised in an optical component assembly and optical waveguides comprised in an optical waveguide assembly according to a common optical axis and by using an adapter includes providing the optical component assembly with a first alignment structure comprising a cavity designed according to the position of the optical components within the optical component assembly; providing an adapter presenting a base surface comprising a first step structure; providing the optical waveguide assembly with a second alignment structure comprising a distinct step structure designed according to the position of the waveguides within the waveguides assembly; and positioning the optical component assembly, the optical waveguide assembly and the adapter, so that a sidewall of the cavity and the distinct step structure are put in contact with a sidewall of the first step structure.

Abstract: A method for aligning optical components comprised in an optical component assembly and optical waveguides comprised in an optical waveguide assembly according to a common optical axis and by using an adapter includes providing the optical component assembly with a first alignment structure comprising a cavity designed according to the position of the optical components within the optical component assembly; providing an adapter presenting a base surface comprising a first step structure; providing the optical waveguide assembly with a second alignment structure comprising a distinct step structure designed according to the position of the waveguides within the waveguides assembly; and positioning the optical component assembly, the optical waveguide assembly and the adapter, so that a sidewall of the cavity and the distinct step structure are put in contact with a sidewall of the first step structure.

Abstract: An optical connector package includes a substrate and a casing positioned on the substrate and comprising a positioning pin. The casing and the substrate cooperatively define a receiving space. The positioning pin defines a vent functioning as a sole channel communicating the receiving space with the outside of the casing. The vent is sealed after the optical connector package subjects to all required heating processes.

Abstract: Embodiments of a barrel for use with fiber optic connections and method of manufacturing are disclose herein. In one embodiment, a barrel comprises a first portion. The first portion having a wedge protruding from a distal end of the first portion at an angle and a component cavity for receiving an opto-electric component therein. The barrel further comprises a second portion having a fiber cavity for receiving one or more fiber cables therein, wherein the second portion is moldably coupled onto the distal end of the first portion around the wedge. The second portion may further comprise a panel interface for mounting the barrel within a panel.

Abstract: An optical module is provided in which at least one of a surface light emitting device and a surface light receiving device is mounted on a positioning component on which optical fibers are positioned and mounted. The positioning component is made of an insulating resin and a plurality of lead frames that provide electrical connection are molded integrally with the positioning component. Each of the lead frames is flat plate and the plate surface of each of the lead frames serves as a first electrical connection surface and an edge face of each of the lead frames serves as a second electrical connection surface. The interconnection structure is simple and linear and is advantageous in high-frequency signal transmission.

Abstract: A system and method for distribution of media signals. Wireless communications are established between a set-top box and a wireless adapter in communication with a television. The wireless adapter is powered by the television. A signal is received from the set-top box at the wireless adapter. The signal is formatted for wireless communication. The signal is converted to a format displayable by the television. The formatted signal is communicated from the wireless adapter to the television.

Abstract: An optical data communication module, such as a transceiver, transmitter or receiver, has two parallel substrates with metal layers. An opto-electronic device between the substrates is shielded against electromagnetic interference by the metal layers and conductors, such as vias, which are distributed around a periphery of the opto-electronic device and connect the metal layers.

Abstract: High accuracy positioning relative to an absolute reference position (guide pin holes in ferrules, etc.) is provided for a plurality of cores constituting a polymer waveguide array for connection to ferrules at ends of a plurality of these assemblies to form a single-mode polymer waveguide array assembly. A method for forming a single-mode polymer waveguide array assembly enables a plurality of cores constituting a polymer waveguide array to be positioned with high accuracy. Also provided is a combination of process molds (an initial process mold and intermediate process mold) used in the processes unique to the present methods.

Abstract: In an arrangement of a rack (1) and a medical device (2) to be attached to the rack (1), the rack (1) comprises a first connection element (111) and the medical device (2) comprises a second connection element (211) which in an attached state of the rack (1) and the medical device (2) is releasably connected to the first connection element (111) of the rack (1) to establish an electrical connection between the medical device (2) and the rack (1). The first connection element (111) and the second connection element (211) each comprise at least two electrical contacts (111.1, 211.1), wherein in the attached state of the rack (1) and the medical device (2) via the at least two electrical contacts (111.1, 211.1) both a low speed data connection (15, 25) and a high speed data connection (14, 24) between the medical device (2) and the rack (1) is established.

Abstract: An optical fiber connector includes an optical cable and a connector body connected to the optical cable. The connector body includes a shell, a PCB, photoelectric elements, and a coupler. The shell includes a receiving portion and a plug portion connected to the receiving portion. The receiving portion defines a receiving space therein, and the plug portion defines an opening communicating with the receiving space. The receiving portion includes a bottom plate and an opposite top plate. The receiving portion defines a connecting hole in the top plate and communicating with the receiving space, and an end of the optical cable is received and fixed in the connecting hole. The PCB includes a mounting end positioned in the receiving portion and an insertion end extending to the plug portion through the opening. The photoelectric elements are positioned on the mounting end and faces toward the top plate.

Abstract: An optical connector includes a circuit board, at least one light emitter, at least one light receiver, a shell, and at least two enhancing pins. The circuit board includes a mounting surface. The at least one light emitter and at least one light receiver are mounted on the mounting surface. The shell covers the at least one light emitter and the at least one light receiver. The at least two enhancing pins passes through the shell and are received in the circuit board to fix the shell on the mounting surface.

Abstract: A small form-factor pluggable (SFP) optical transceiver includes a casing configured to accommodate optical and electrical devices. During normal operation, the casing is connected to a switchboard via a connector in the switchboard, and the optical devices are outside the switchboard, thereby exposing optical devices sensitive to high temperature to the outside air, reducing the operational temperature of the optical device portion relative to the heated portion inside the switchboard. Thus, the present SFP optical transceiver advantageously improves operational performance and extends the life of the device. Also, the present SFP optical transceiver having the optical device portion outside the switchboard advantageously improves the cooling performance for the optical device portion.

Abstract: High accuracy positioning relative to an absolute reference position (guide pin holes in ferrules, etc.) is provided for a plurality of cores constituting a polymer waveguide array for connection to ferrules at ends of a plurality of these assemblies to form a single-mode polymer waveguide array assembly. A method for forming a single-mode polymer waveguide array assembly enables a plurality of cores constituting a polymer waveguide array to be positioned with high accuracy. Also provided is a combination of process molds (an initial process mold and intermediate process mold) used in the processes unique to the present methods.

Abstract: An electromagnetic interference (EMI) shielding device and method are provided for use with an optical communications module (OCM) that is configured to be plugged into a front panel of a box or housing of an optical communications system. The EMI shielding device is mechanically coupled to an end of a housing of the OCM such that when the OCM is fully inserted through an opening formed in the front panel, the EMI shielding device comes into abutment with the front panel to form an EMI seal around the opening that prevents, or at least helps prevent, EMI from escaping from the system housing through the opening formed in the front panel.

Abstract: A wafer-level packaged optical subassembly includes: a substrate element, the substrate element including a top layer and a base layer being bonded with the top layer; a top window cover being bonded with the top layer of the substrate element; and a plurality of active optoelectronic elements disposed within the substrate element. At least one primary cavity is defined in the substrate element by the top layer and the base layer, and configured for accommodating the active optoelectronic elements. A plurality of peripheral cavities are defined around the at least one primary cavity as alignment features for external opto-mechanical parts.

Abstract: An optical memory system according to example embodiments includes a plurality of memory modules, each memory module including a plurality of memory devices; a light source; a light distribution unit connected to the light source through a first optical transmission line; a plurality of second optical transmission lines connected between the light distribution unit and the plurality of memory modules; a plurality of electrical to optical converters, each connected to at least one of the second optical transmission lines; and a plurality of output optical transmission lines connected to the plurality of electrical to optical converters, each output optical transmission line for outputting an electrical to optical converted signal.

Abstract: An optical module and a fabrication method thereof, the optical module includes a sub-substrate which includes a support layer, an active layer, a BOX layer interposed between the support layer and the active layer, and a height adjusting layer, an optical fiber, and an optical device which is fixed to a silicon substrate, wherein the sub-substrate includes a fixing groove formed by the active layer and the BOX layer, the optical fiber is fixed to the fixing groove, and the optical fiber is optically coupled to the optical device by positioning the sub-substrate via the height adjusting layer with respect to the silicon substrate.

Abstract: An optical fiber fixing device includes a base, first fixing block and a second fixing block. The base includes an upper surface has a receiving groove and a groove which is connected with the receiving groove. The receiving groove receives an optical fiber connector, the optical fiber connector receives a plurality of optical fibers, and two ends of the optical fibers separately protrude out of the optical fiber connector. The groove has an optical detecting device, the detecting device defines a plurality of light apertures. The first fixing block is set on the upper surface, which is configured to fix the optical fiber connector into the receiving groove. The second fixing block is received in the groove, in order to fix the detecting device in the groove, the plurality of light apertures are aligned with the plurality of optical fibers.

Abstract: An optical-electric converting module includes a printed circuit board (PCB) and an optical-electric coupling element. The PCB includes a supporting surface, laser diodes and photo diodes. The laser diodes and the photo diodes are positioned on the supporting surface. The optical-electric coupling element includes a lower surface. The lower surface defines a cavity. A bottom portion of the first cavity forms light-receiving coupling lenses and light-emitting coupling lenses. The optical-electric coupling element is positioned on the supporting surface, with each light-receiving coupling lens being aligned with a laser diode, and each light-emitting coupling lens being aligned with a photo diode. A distance between the light-receiving coupling lenses and the laser diodes is equal to a distance between the light-emitting coupling lenses and the photo diodes in a direction perpendicular to the support surface.

Abstract: A connection port provides electrical and/or optical interface capability. The combined electrical and optical interface port may include an optical communication light engine within the connection port itself. The connection port includes a connector housing, an electrical interface assembly, and an optical interface assembly incorporated together. One implementation of the optical communication light engine includes a laser diode to generate optical signals, a photo diode to receive optical signals, and an optical integrated circuit (IC) to control optical interface.

Abstract: An optical fiber connector includes a main body and a fixing element. The main body includes a front surface and a rear surface opposite to the front surface. An extending portion extends from the rear surface. The main body defines at least one receiving hole and at least one receiving recess aligned with the at least one receiving hole. The extending portion defines a first receiving space communicating with the at least one receiving recess. The fixing element is located on the extending portion and defines a second receiving space corresponding to the first receiving space.

Abstract: A fiber coupled semiconductor device and a method of manufacturing of such a device are disclosed. The method provides an improved stability of optical coupling during assembly of the device, whereby a higher optical power levels and higher overall efficiency of the fiber coupled device can be achieved. The improvement is achieved by attaching the optical fiber to a vertical mounting surface of a fiber mount. The platform holding the semiconductor chip and the optical fiber can be mounted onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Optionally, attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

Abstract: An optical interposer comprising: (a) a substrate having a planar surface: (b) at least one groove defined in the planar surface and extending from an edge of the substrate to a terminal end, the groove having side walls and a first facet at the terminal end perpendicular to side walls, the facet having a first angle relative to the planar surface, the first angle being about 45 degrees; and (c) a reflective coating on the first facet.

Abstract: A connector assembly of a first connector and a second connector. The connector assembly includes at least one latch biased to a locking position to lock the assembly in cooperation with a complementary locking section. The connector assembly includes a release member movable in a direction towards a top face of one of the connectors from a rest position to a release position.

Abstract: An optical communication connector having a connector housing that includes opposite mating and loading sides and a housing cavity that extends therebetween. The optical communication connector also includes an optical module that is positioned within the housing cavity and a biasing element that is positioned between the optical module and the loading side in the housing cavity. The biasing element has a module end, a back end, and a resilient spring portion that extends between the module and back ends. The spring portion includes an elongated body having a plurality of flexible bend segments that wrap back-and-forth within a spring plane. The spring portion is compressible between first and second states during a mating operation between the optical module and an optical connector.

Abstract: An interposer for an optical module includes a first substrate having an optical device mounting part on which an optical device is mounted, and a second substrate including a connection via electrically connected to a terminal pattern of the optical device mounting part. The first and second substrates are coupled with each other while forming a predetermined inclination angle therebetween.

Abstract: A telecommunication distribution box includes a housing and an electrical component mounted in the housing. A cover plate is movably connected to the housing and is movable between open and closed positions. A lip extends outwardly from the cover plate. The lip covers the electrical component when the cover plate is in the closed position to prevent accessing and removing the electrical component.

Abstract: An optoelectronic transmission module is applied in an optoelectronic connector for data transmission. In the present invention, one flexible circuit board and two hard circuit boards are in electrical connection, among which the first circuit board is electrically connected with an optoelectronic module for connecting with an optical fiber. With this structure, the second and the third circuit boards can transmit or receive data through the optical fiber of the first circuit board. In this manner, this invention can conduct bidirectional data transmission so as to save significantly the consumption of manufacturing cost of the optoelectronic module.

Abstract: A plug for connecting to an electronic device includes a housing having an aperture, a magnetic element positioned in the aperture and having a second aperture, at least one contact within the aperture and the second aperture, a cord connected to the housing, and a mechanism configured to reduce a moment arm on the housing when a force is applied to the cord. The plug may be used as part of a connection that further includes a receptacle having a magnetic element with a recess, wherein the recess comprises an aperture, and at least one contact extending through the third aperture and into the recess.

Abstract: The present invention relates to an improved installation for conveying electrical signals carried by a first triaxial cable (2) to a second triaxial cable (6) and vice versa. It comprises: a first interface (3) between the first triaxial cable (2) and a fiber optic cable (4) and a second interface (5) between the fiber optic cable (4) and the second triaxial cable (6). A television camera (7) is connected to a remote camera control unit (1) via this installation. The first triaxial cable (2) connects the camera control unit (1) with the first interface (3). The first interface (3) comprises a first adapter converting electrical signals, conveyed by the first triaxial cable (2), to optical signals. The fiber optic cable (4) transmits optical signals to the second interface (5). The second interface (5) comprises a second adapter converting optical signals to electrical signals. The second triaxial cable (6) transmits the electrical signals to the television camera (7).

Abstract: A connection port provides electrical and/or optical interface capability. The combined electrical and optical interface port may include an optical communication light engine within the connection port itself. The connection port includes a connector housing, an electrical interface assembly, and an optical interface assembly incorporated together. One implementation of the optical communication light engine includes a laser diode to generate optical signals, a photo diode to receive optical signals, and an optical integrated circuit (IC) to control optical interface.

Abstract: An optoelectronic interface includes an optically transparent substrate; and an alignment layer comprising a pattern of alignment features disposed on said optically transparent substrate.

Abstract: An identification assembly for use with a fiber-optic connector includes a non-conducting over-nut, an electrical assembly disposed at the proximal end of the over-nut, and an RFID tag supported by the distal end of the over-nut. The over-nut is configured to surround and couple with the fiber-optic connector. The electrical assembly includes a first electrical contact configured to electrically connect to the fiber-optic connector, a second electrical contact configured for electrical engagement with a contact portion of a light source assembly, and one or more electrical components coupled between the first and second contacts and providing a defined electrical characteristic. The identification assembly enables identification using either electrical-characteristic based or RFID-based identification approaches.

Abstract: An optical communication module has an attachment feature for attachment to a chip package having an electrical-optical converter, the optical communication module to pass light communicated with an electrical-optical converter of the chip package. The optical communication module has an alignment feature to achieve a level of alignment with a system-side optical connector.

Abstract: In one embodiment, a device comprises at least one ferrule having a bore, the bore extending from a rear of the ferrule toward a front of the ferrule, wherein the bore is sized to receive an optical fiber with a buffer at a rear end face of the ferrule, wherein the front end of the ferrule includes an optical component.

Abstract: An interconnect module for communicating electrical signals and optical signals is described. In particular, an integrated circuit in the interconnect module receives and transmits the electrical signals with other components in a system that includes the interconnect module via an electrical connector. In addition, the integrated circuit receives and transmits electrical signals to a hybrid silicon-photonic bridge chip that performs electrical-to-optical and optical-to-electrical conversion. In turn, this bridge chip receives and transmits optical signals via an optical fiber. The interconnect module can be remateably connected to a backplane in the system, and can be arranged in a stacked configuration with other instances of the interconnect module. In these ways, the interconnect module facilitates dense, modular or scalable, and compact electrical and optical communication in the system.

Abstract: A microwave transmit/receive enclosure comprises an enclosure housing and one or more I/O connection ports that are mounted on one side of the enclosure housing. The enclosure housing contains a removable communication connector and a removable memory card. Both the removable communication connector and the removable memory card can be inserted into or removed from the enclosure housing via the same I/O connection port.

Abstract: An optical module package is provided, the optical module package including a housing main body, a cover body, first and second holding members, and a fiber unit. The first and second holding members may form, inside thereof, a unit accommodating part according to the outer size of a fiber unit in a direct opposing state. The housing main body has locking projections set an arrangement interval between two opposing surfaces of outer surface of the first and second holding members arranged to oppose each other, and a space sandwiched between locking projections is set as an accommodating space for the first and second holding members.

Abstract: There is provided a bi-directional optical transmitting and receiving apparatus. The bi-directional optical transmitting and receiving apparatus includes: a package having a cavity and allowing a plurality of lead wires to pass therethrough; a platform mounted on the package and including a through hole formed above the cavity and having sloped surfaces; a reception unit mounted within the cavity and generating an electrical signal corresponding to input light made incident to the cavity through the through hole and outputting the generated electrical signal to at least one of the plurality of lead wires; a transmission unit mounted on the platform and generating output light according to an electrical signal transmitted through at least one of the plurality of lead wires; and a wavelength division multiplexing (WDM) filter mounted on the platform to transfer the output light toward an optical fiber and the input light toward the through hole.

Abstract: Optical interface cards, assemblies, and related methods, which may be suited for installation and use in antenna system equipment, are disclosed. In certain embodiments, an optical interface card (OIC) comprising a printed circuit board (PCB) having at least one optical sub-assembly (OSA) mounted to at least one first opening end of the PCB and extending into at least one opening and related methods are disclosed. In other embodiments, optical interface assemblies comprised of two OICs mounted together are disclosed. In other embodiments, a communications equipment enclosure including at least one fan configured to draw in air from a first side of the communications equipment enclosure into a lower plenum and across a plurality of communications components into an upper plenum to provide air cooling are disclosed. In another embodiment, a modular distributed antenna system assembly is disclosed.

Abstract: Described embodiments include optical connections for electronic-photonic devices, such as optical waveguides and photonic detectors for receiving optical waves from the optical waveguides and directing the optical waves to a common point. Methods of fabricating such connections are also described.

Abstract: A semiconductor laser module includes a laser diode array, an optical fiber array, a fiber array fitting for fixing the optical fiber array, a casing, and a support fitting for fixing the fiber array fitting and casing. The fiber array fitting and support fitting have a first contact section that is in line-contact or surface-contact with the plane section parallel with the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the first contact section. The support fitting and casing have a second contact section that is in line-contact or surface-contact with the plane section vertical to the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the second contact section.

Abstract: A method of forming a fiber optic device includes securing one or more optical fibers to a support. The support is coupled to a base that includes one or more optoelectronic devices. After one or more of the fibers are secured to the support, and the support is secured to the base, one or more of the fibers are cleaved. This method, and fiber optic devices made using this method are more easily aligned and may be produced at lower costs than existing manufacturing processes.

Abstract: Designs of pluggable optical passive devices are described. Such a pluggable optical passive device can be inserted into an existing configuration. According to one embodiment, the pluggable optical passive device is formed as an elongated enclosure with one or two first connectors on one side thereof and one or two second connectors on the other side thereof. The first connectors are provided to be coupled to female pluggers while the second connectors are provided to be coupled to male pluggers. Depending on implementation, the first and second connectors may be glued onto or skewed into the enclosure through holes, and may be further extended by a flexible pigtailed dual LC connector.

Abstract: This invention relates to an optoelectronic transceiver which has the following: an optical transmitter, an optical receiver, coupling means consisting of a first and second optical lens made with optically active interfaces for changing/deflecting optical paths of on the one hand optical output signals A of the optical transmitter to a connectable optical light guide and on the other hand of input signals E of the same light guide to the receiver, characterized in that the first lens has a concave reflection surface which lies inside in the coupling means for signals of the optical transmitter and the second lens has a convex transmission surface which lies outside for outgoing signals of the optical transmitter and a concave reflection surface which lies inside for incoming signals.

Abstract: An optical fiber connection system includes a first and a second optical fiber, each with end portions that are terminated by a first and a second fiber optic connector, respectively. A fiber optic adapter connects the first and the second fiber optic connectors. A fiber alignment apparatus includes V-blocks and gel blocks. Each of the fiber optic connectors includes a connector housing and a sheath. The end portions of the optical fibers are positioned beyond distal ends of the respective connector housings. The sheath is slidably connected to the connector housing and slides between an extended configuration and a retracted configuration. The sheath covers the end portion of the respective optical fiber when the sheath is at the extended configuration and exposes the end portion when at the retracted configuration. The end portions of the optical fibers are cleaned when slid between the V-blocks and the gel blocks.

Abstract: Topology-defining card units are used to provide optical interconnections between multiple slots of an equipment subrack. An example card unit is adapted for installation in a slot of an equipment subrack having a plurality of slots and having a backplane. The card unit includes one or more back-side optical connectors configured so as to mate with corresponding optical connector receptacles on the backplane of the equipment subrack when the card unit is installed in the equipment subrack. These one or more back-side optical connectors include a plurality of card-unit optical interfaces. The card unit further includes an optical interconnection network that optically couples each one of the plurality of card-unit optical interfaces to another one of the plurality of card-unit optical interfaces.

Abstract: Disclosed are optical connectors having lenses along with methods for making the same. In one embodiment, the optical connector includes a fiber body having a front portion with a plurality of fiber guides, and a connector body having a plurality of connector body fiber guides that lead to a plurality of lenses at a front portion of the connector body. The fiber body attaches to the connector body and may align a plurality of optical fibers to the lenses at the front portion of the connector body. One embodiment has the fiber body configured as a crimp body with a barrel at a rear portion for attaching a fiber optic cable.

Abstract: An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate.

Abstract: An optical interposer for optically coupling light between an OED supported on a substrate and an optical fiber, the interposer comprising: (a) an interposer of an optically-clear moldable material comprising at least the following features: (b) a port for receiving a ferrule containing at least one optical fiber, the port comprising an interface surface positioned to optically couple with an end face of the optical fiber; (c) an active lens adapted to optically couple with an OED, the active lens and the interface surface optically coupled along an optical path in the interposer; (d) a protrusion extending backward from the port, the protrusion defining a first register surface, the first register surface being a certain distance from the optical path such that, when a second register surface of a ferrule containing the optical fiber contacts the first register surface, the ferrule is aligned with the port such that the port can receive a front portion of the ferrule if the ferrule is pushed forward.