Abstract: An composite prepreg ply which can be designed to exhibit desired electrical properties without loss of structural integrity or the addition of parasitic weight, and a method of preparing the composite prepreg ply. The composite prepreg ply includes: (i) a low dielectric cloth substrate having a metal layer adherent on both sides thereon, the metal having been selectively removed from at least one portion of at least one side of the cloth, such that there is at least one area of cloth without any metal adherent thereon; (ii) a layer of encapsulant resin material adherent on the metal layer; (iii) a resistive resin layer containing a filler material dispersed in a carrier resin, the resistive resin layer adherent on desired areas the cloth without any metal adherent thereon, and (iv) an impregnating resin covering one or both outermost surfaces of the encapsulant resin material and the resistive resin layer.

Abstract: Organic inherently conductive polymers, such as those based on polyaniline, polypyrrole and polythiophene, are formed in-situ onto polymeric surfaces that are chemically activated to bond ionically the conductive polymers to the substrates. The polymeric substrate is preferably a preshaped or preformed thermoplastic film, fabric, or tube, although other forms of thermoplastic and thermoset polymers can be used as the substrates for pretreatment using, most preferably, phosphonylation-based processes followed by exposure to an oxidatively polymerizable compound capable of forming an electrically conductive polymer. The resultant conductive surface imparts unique properties to the substrates and allows their use in antistatic clothing, surface conducting films for electronic components and the like, and electromagnetic interference shielding. In an alternative embodiment, metals such as gold or platinum are bonded to the chemically interactive surface of a preshaped thermoplastic or thermoset article.

Abstract: An optimized electroless copper plating technique suitable for plating electroless copper upon ceramics.

Abstract: This invention proposes the use of an activator solution comprising precious metal ions and an oxidizing agent for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed circuit boards without substantial extraneous plating on the soldermask surfaces.

Abstract: A method of selectively fabricating metallization on a dielectric substrate is disclosed. A seed layer is sputtered on a polymer dielectric, a patterned photoresist mask is disposed over the seed layer, exposed portions of the seed layer are etched, the photoresist is stripped, and copper is deposited without a mask by electroless plating on the unetched seed layer to form well-adhering high density copper lines without exposing the photoresist to the electroless bath.

Abstract: A method producing a coating on a substrate by aluminizing, chromizing or siliconizing the substrate, and depositing on the coated substrate by electrolytic or electroless deposition a metal matrix M.sub.1 from a bath containing particles of CrAlM.sub.2 to co-deposit the particles with the matrix as M.sub.1 CrAlM.sub.2, where M.sub.1 is Ni, Co or Fe or two or all of these elements and M.sub.2 is Y, Si, Ti, Hf, Ga, Nb, Mn, Pt, a rare earth element or two or more of these elements. Preferably, the method includes platinum aluminizing of the substrate. Heat treatments may be incorporated before and after deposition of the M.sub.1 CrAlM.sub.2. The deposition of the M.sub.1 CrAlM.sub.2 is carried out at a current density of less than 5 mA per square centimeter. Preferably, the deposition forms a M.sub.1 CrAlM.sub.2 layer less than 50 microns thick, and occurs at a bath loading of less than 40 grams per liter of the particles.

Abstract: A method of selectively metallising an inner, electrically insulating surface S.sub.i of an open body (3), comprising the following steps:(a) providing a roller (2) having a resilient outer surface S.sub.o ;(b) providing a layer of a suitable wet ink on the surface S.sub.o, according to a given pattern;(c) causing the roller (2) to roll along the surface S.sub.i so as to impart a patterned layer of wet ink from the surface S.sub.o to the surface S.sub.i ;(d) allowing the patterned layer of wet ink imparted to the surface S.sub.i to dry;(e) selectively depositing metallic material upon the patterned layer of dry ink thus obtained.Such a method is particularly suited to the manufacture of a scan velocity modulator (1) for use in a cathode ray tube.

Abstract: A process is disclosed for preparing an aramid surface to be metal plated by nonaqueous treatment with a strong base followed by water washing--all in the absence of metal cations.

Abstract: A method for monitoring the constituents present in an electroless plating bath solution. The method involves measuring ac spectra using a working electrode which has a high hydrogen overvoltage. First, a selected dc potential is applied to a working electrode which has been subjected to pretreatment and which is present in the electroless bath being analyzed. The electrode must have a high hydrogen overvoltage and is preferably an alloy of a low hydrogen overvoltage noble metal and a high overvoltage metal. A constant ac signal is superimposed on the dc potential. The dc potential is then swept over a chosen range at a selected sweep rate. The various constituents in the bath are then monitored by measuring the ac current at one or more reference phase angles with respect to the constant ac signal between the working electrode and a reference electrode as the dc potential is varied. The resulting ac spectra provides a useful measurement of the make-up of the constituents in the electroless plating solution.

Abstract: In a process for the electroless plating of nickel onto a substrate made of aluminum or an aluminum alloy, an aqueous acidic solution containing as an essential component a palladium salt is used as an activator of the substrate prior to the nickel plating of the substrate. The activating solution contains a palladium salt, an alkali metal fluoride or hydrofluoric acid, a carboxylic acid complexing agent, an alkali metal salt of gluconic acid, an iron salt, a nickel salt, and deionized water.

Abstract: This invention relates to a process for bonding a vehicle window to a vehicle flange comprising the sequential steps of:a) applying a liquid masking composition to a vehicle flange,b) painting the vehicle, and drying or curing the liquid masking composition sufficiently to form a strippable mask;c) removing the mask from the flange; andd) adhesively bonding the vehicle window to the vehicle flange. Such a masking process advantageously eliminates the need for the use of solvent-based primers normally used to prime a painted vehicle flange, and provides a mask which is more easily applied and removed from the flange than masking means which initially comprise a solid substance.

Abstract: A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed.

Abstract: A metal material characterized in that the material comprises a substrate metal, a film comprising a nickel fluoride layer and formed on the substrate metal, and a film comprising a carbon layer and formed on the film.

Abstract: A composition and method for the removal of ionic salt deposits from a surface using an organic solvent of low polarity and a complexing agent. The complexing agent is chosen from a group which includes podands, cryptands, and coronands. The method provides nearly complete removal of ionic salt deposits with a single washing of the surface with the low polar cleaning mixture.

Abstract: Disclosed is a method for electroless metal deposition, which comprises steps of: forming, on the surface of a non-conductive body to be plated, a coating of a resin composition for the electroless metal deposition containing therein a polymer (A) having a chemical structure of at least one compound selected from the group consisting of the below-listed (a), and at least one compound selected from the group of the below-listed (b)1 and (b)2; applying a negative electrostatic voltage to the film coating of the resin composition at a temperature level above the glass transition point of said resin composition; thereafter removing the applied voltage at a temperature lower than the glass transition temperature; and successively carrying out the metal deposition steps inclusive of the catalyst imparting step and the activating step:(a) a chemical structure, in which a part of hydrogen in the main chain of polymer is substituted with the halogen group or the nitrile group, and a chemical structure having a double

Abstract: A substrate metal such as aluminum or titanium, usually in the form of a web, is anodized to form a porous unsealed oxide coating. An inexpensive core metal such as copper or chromium is then electrodeposited in the pores of the oxide coating to form metal nodules extending above the oxide coating in a bulbous, undercut configuration. A second metal, usually an expensive catalytic metal, is deposited onto the surface of the core metal nodules by electro or chemical deposition. A large surface area of catalyst is formed with the use of a minimum amount of catalyst metal. The nodules may be liberated from the substrate metal surface by dissolving the oxide layer and releasing discrete particles to form a fine catalyst powder.

Abstract: A polymeric resin of adjustable viscosity and pH for depositing catalytic palladium on a substrate, comprising in combination a palladium salt, a complexing agent of the carboxylic acid or chloride type, a water soluble polymer containing hydroxyl and/or carboxyl groups, an alkaline compound and a solvent chosen amongst water, methanol and ethanol, its preparation method and applications.

Abstract: Catheters and other medical devices include plural layers of metals applied to the outer surfaces, which tend to close minuscule cracks through which corrosion may attack the underlying support. In some avatars, the initial layer of material is preferably silver, applied following specific preparation steps. In other embodiments, succeeding layers of metal completely cover the initial layer, and are also of silver. The succeeding layers are deposited after deposition of the prior layer, and tend to reduce the incidence of microscopic pores or cracks and are less prone to delamination. The succeeding layers are preferably of mutually different metals between layers. In a particular avatar, in which the exposed metals are oligodynamic silver and more noble platinum, the exposed silver layer lies over a portion of the platinum layer, to thereby prevent corrosion of the silver layer from disconnecting portions of the silver layer.

Abstract: The present invention provides a method for application of metal coatings, specifically copper and silver, to continuous ceramic fibers, by electroless deposition. The method comprises the steps of: winding the uncoated ceramic fibers over a frame so that the fibers are coiled adjacent to each other; introducing the wound ceramic fibers into a solution of metal with which the fibers are to be coated; circulating the solution through said fibers; and contacting and causing the metal to be deposited on the wound fibers. Coated continuous ceramic fibers produced by the method of the present invention are also included within the scope of this invention.

Abstract: The present invention provides a novel printed wiring board which has an insulating substrate. The printed wiring board also has a metal compound layer formed on a surface of the insulating substrate, wherein the metal compound layer is made of a metal compound having a sufficient insulating property and showing a reduction to a metal. The metal compound layer has a surface formed thereon with a metal wiring pattern which is formed by selective reduction of the above metal compound of the metal compound layer. The printed wiring board also has a palladium-displacement plating layer formed on the metal wiring pattern. The printed wiring board also has an electroless plating layer.

Abstract: A method is provided for creating gated filament structures for a field emission display. A multi-layer structure is provided that includes a substrate, an insulating layer, a metal gate layer positioned on a top surface of the insulating layer and a gate encapsulation layer positioned on a top surface of the metal gate layer. A plurality of gates are provided and define a plurality of apertures on the top of the insulating layer. A plurality of spacers are formed in the apertures at their edges on the top surface of the insulating layer. The spacers are used as masks for etching the insulating layer and form a plurality of pores in the insulating layer. The pores are plated with a filament material to create a plurality of filaments. The pores can be overplated to create the plurality of filaments. The filaments are vertically self-aligned in the pores.

Abstract: There is disclosed a novel process for catalyzation for trapping of a catalyst metal involved with the adhesion of an electroless plating to a substrate. The process is carried out by employing neither the sensitizing-activating method nor the catalyst-accelerator method. Specifically, in forming an electroless plating on the surface of a non-conductive substance as a substrate, the surface of the non-conductive substance is coated with a treatment liquid containing at least chitosan or a chitosan derivative before the steps of catalyzation and electroless plating to form a hydrophilic coating film on the surface of the non-conductive substance.

Abstract: The invention provides a method and structure in which a nucleating species [54] is implanted through apertures [52] of a metal-phobic layer [40] into a support layer [17] and copper or a like metal is selectively grown at the implant site or sites. The implant support layer [17] is preferably composed of a material which inhibits diffusion therethrough of the copper or other like grown metal.

Abstract: A hydrogen-selective membrane comprises a tubular porous ceramic support having a palladium metal layer deposited on an inside surface of the ceramic support. The thickness of the palladium layer is greater than about 10 .mu.m but typically less than about 20 .mu.m. The hydrogen permeation rate of the membrane is greater than about 1.0 moles/m.sup.2. s at a temperature of greater than about 500.degree. C. and a transmembrane pressure difference of about 1,500 kPa. Moreover, the hydrogen-to-nitrogen selectivity is greater than about 600 at a temperature of greater than about 500.degree. C. and a transmembrane pressure of about 700 kPa. Hydrogen can be separated from a mixture of gases using the membrane. The method may include the step of heating the mixture of gases to a temperature of greater than about 400.degree. C. and less than about 1000.degree. C. before the step of flowing the mixture of gases past the membrane. The mixture of gases may include ammonia.

Abstract: A process for efficient modification and metallization of substrates includes the steps of providing a substrate with highly photoefficient chemical functional groups on at least a portion of this substrate, exposing the substrate to actinic radiation to transform, deactivate, or remove these chemical functional groups, to modify their chemical reactivity, and carrying out further chemical reaction steps on these modified chemical functional groups.

Abstract: There is disclosed a process for electroless plating of a conductive metal layer onto the surface of a non-conductive substrate, in which the substrate surface is prepared for receiving a coating of activator using conventional methods, and the coating of activator is applied by contacting the substrate surface with a stabilized sensitizing solution comprising ions of at least one Group VIII and IB transition metal, preferably palladium chloride, stannous ions in a molar concentration in excess of that of the transition metal ions, an acid, and a buffering salt; followed by contacting the sensitized substrate surface with a noble metal activating solution to catalyze the substrate surface for subsequent electroless plating. The sensitized and activated substrate is then contacted with an aqueous dry film photoresist, which is then imaged and developed to form a predetermined electrical circuit pattern, using conventional methods.

Abstract: The present invention relates in one aspect to a method of manufacture of a security thread suitable for use in security articles including security paper such as that used for banknotes. In the method a magnetic metal is deposited on a film of polymeric substrate as the substrate passes through a solution containing the magnetic metal and a preparatory operation is carried out on a surface of the substrate prior to immersion of the substrate in the solution. The preparatory operation ensures that magnetic metal is deposited on the substrate in a pattern such that when the security thread is produced from the film by cutting the film the magnetic metal on the security thread has a specific pattern and provides both a visually discernible security feature and a magnetically detectable security feature.

Abstract: Permanently substituted oxyfluorinated surfaces can be formed on non-fluorinated substrates having a fluorinated surface or fluorocarbon coating applied by gas phase surface fluorination or plasma deposition. The oxyfluorinated surfaces can be refunctionalized by bonding organosilanes, isothiocyanate-containing fluorescent compounds and proteins, such as enzymes, antibodies and peptides directly to such surfaces. Surfaces refunctionalized with such protein based groups are useful in the fabrication of biological sensors, devices for separation of cell lines, filtration applications for selective binding of antigens. Masking techniques can be employed in forming a predetermined pattern of covered and exposed surfaces, for example, prior to oxyfluorination.

Abstract: Process for the preparation of an asbestos-free microporous electroconductive substrate. The process includes (a) providing an aqueous suspension of a mixture of carbon or graphite fibers, polytetrafluoroethylene fibers, inert mineral fibers, at least one fluorinated polymer, a silica porogen, and, optionally, at least one thickening agent; (b) depositing a coating onto a porous support by programmedly vacuum filtering said suspension therethrough, the coating comprising a liquid medium; (c) removing the liquid medium from said coating and then drying same; (d) sintering the coating thus formed; and (e) extracting the silica porogen therefrom. A substrate including intimate admixture of carbon or graphite fibers, polytetrafluoroethylene fibers and inert mineral fibers, and optionally, at least one thickening agent, consolidated by a binding amount of at least one fluorinated polymer is formed. The substrate produced is well suited for the electrolysis of solutions of, e.g., alkali metal halides.

Abstract: A laminated structure (1) comprising a substrate (3) and a polymer layer (5) is provided. The polymer layer consists of conductive areas (7) having a sheet resistance of maximally 1000 .OMEGA./square. The adjacent parts of the polymer layer are substantially non-conductive and have a sheet resistance which is a factor of 10.sup.6 higher. An electrodeposited metal layer (9), for example of copper, is present on the conductive areas (7).A simple method of photochemically generating the conductive pattern (7) which can be reinforced in an aqueous metal-salt solution by electrodeposition of a metal layer (9) is also provided and most preferably the conductive pattern is inter alia, the patterned exposure of a layer of 3,4-ethylene dioxythiophene or polyaniline. The method can very suitably be used for the manufacture of metal patterns on insulating substrates, such as printed circuit boards.

Abstract: A composition and method for the removal of ionic salt deposits from a surface using an organic solvent of low polarity and a complexing agent. The complexing agent is chosen from a group which includes podands, cryptands, and coronands. The method provides nearly complete removal of ionic salt deposits with a single washing of the surface with the low polar cleaning mixture.

Abstract: A chemical metallization process is used for electrically non-conducting porous substrates, in needle felts, nonwovens or open-pored foams which possesses a porosity of from 40 to 97%. The metallization follows activation of the fiber surfaces or of the surfaces of the pore walls with a noble metal-containing solution. The volume of the chemical metallizing solution used is reduced to produce a considerable reduction in the operating costs, not only in respect of the solution itself but also in respect of the disposal of the waste water from the chemical metallization. Since less waste water is produced from the start in the chemical metallization process, a considerable contribution to the protection of the environment results.

Abstract: There is disclosed a method for surface-modifying a fluorocarbonpolymer-molded article and a method for chemical plating the surface. The method for surface-modifying comprises irradiating the fluorocarbonpolymer-molded article with an ultraviolet laser beam having a wavelength of 250 nm or less, in the presence of hydrazine compound, to make a surface of the said fluorocarbonpolymer-molded article hydrophilic. The surface made being hydrophilic is made lipophilic by chemical treating with an organic acid anhydride. The method for chemical plating comprises chemical plating the surface made being hydrophilic by the above method for surface-modifying, to deposit a metal film on a surface of the fluorocarbonpolymer-molded article.

Abstract: Electrodes are formed on an electronic part by an initial step of forming electrodes on a ceramic substrate, dipping the ceramic substrate in a noble metal solution for activating the surface of the electrodes by the use of a noble metal, and forming a solder layer or a tin layer on the activated surface of the electrode by electroless plating using 3-valence titanium ion as a reducing agent. The electrodes to be formed on the ceramic substrate may be a double layer comprised of a first layer containing silver, silver-palladium, silver-platinum or copper and a second electroless nickel plated layer. In the step of forming a solder layer or a tin layer on the activated surface of the electrode by electroless plating using 3-valence titanium ion a reducing agent, it is preferable to add a metal ion except tin and lead in the plating bath. Preferably, the metal ion added in the plating bath may be alkali earth metal element or may be at least one ion selected from the group consisting of Mg.sup.2+, Ca.sup.

Abstract: A method for patterned metallization of the surface of substrates (1), particularly circuit boards, using electromagnetic radiation (5) in which an electrically nonconducting prime coat (2) is applied full-surface to the substrate (circuit board 1); an electrically nonconducting cover coat which is easily ablated by electromagnetic irradiation (5) in the ultraviolet range is applied full-surface to the prime coating (2), the cover coat (4) being applied in a thickness that is at least equal to the thickness of the metal layer that is to be applied; the cover coat is removed from partial areas by the action of electromagnetic irradiation (5) in the ultraviolet range to form patterns (6) with sharp and steep flanks (7) and expose the prime coat (2); and in the area of the exposed patterns (6) on the prime coat (2), a metal layer is applied, guided by the flanks (7), in a reducing bath.

Abstract: A method is provided for preparing the surface of a cured cyanate ester resin or composite for metal plating. The composite may comprise graphite fibers embedded in a cured cyanate ester resin matrix The surface is treated with a preheated solution containing an alkali metal salt of an alkoxide. Preferred alkoxides are methoxide, ethoxide, propoxide, isopropoxide, butoxide, tert-butoxide, sec-tutoxide, 2- methyl-2-butoxide, pentoxide and hexoxide. The method of the invention operates to improve adhesion between the treated surface and a subsequently plated metal, such that the resulting cured cyanate ester resin or composite may replace certain metallic components in such applications as aircraft, spacecraft, and automobiles given its highly conductive metallic coating.

Abstract: A process for simultaneously selectively depositing a high purity nickel containing alloy (i.e. a nickel-boron alloy having a nickel content in excess of 99.5 percent) over a preformed metallurgy pattern (including the individual, electrically isolated contact pads and the seal band area thereon) on the top-side dielectric surface of a multi-layer ceramic module. The metallurgy pattern on such top-side surface of such module is appropriately catalyzed and then immersed in a bath which is essentially lead-free and which includes a source of nickel ions, a borane reducing agent, and an effective amount of an organic divalent sulfur compound, preferably thiodiglycollic acid.

Abstract: Nanoparticle metal powder having a controllable and narrow size distribution are by electrolessly plating a metal on the interior of a vesicle made of at least one polymerized phospholipid. Electroless plating may be accomplished by catalytic reduction of the metal ion or u.v. reduction of the metal ion.

Abstract: A process for the production of metal coated melamine-formaldehyde fibers is disclosed. Prior to coating, the fibers are first activated. Activation consists of applying a metal layer to the fibers by reducing a water soluble cobalt, copper or nickel salt with either: 1) a less noble metal or metal salt or 2) a hydride compound and a complexing agent. The desired metal coating is then applied to the pretreated fibers by reducing a water soluble salt of the metal with a reducing agent in the presence of a complexing agent.

Abstract: An electrodeposited composite coating comprises, as deposited, a matrix of cobalt and particles of chromium carbide, at least 50% and preferably at least 80% or 90% by weight of the particles lying within the size range of 4 .mu.m to 8 .mu.m.

Abstract: A method and an apparatus for coating tanks and pipe systems internally in that, first, a tank (1) is filled with a liquid (3) consisting of water to which is admixed an acid (10). Oxide coating on the internal surface is removed through heating and circulating the liquid (3) through a filter (4). The liquid (3) is neutralized through the admixture of a base (12). Approximately one fifth of the neutralized liquid (3) is drawn off, the tank (1) being refilled with a concentrated metal solution (15). The temperature, acidity and metal concentration of the liquid (3) are maintained close to constant through supplying heat, acid (10) or base or base (12), and concentrated metal solution (15), respectively. Air or vapor is supplied through a blowing pipe (5) and creates stirring, surplus liquid and gas being drained through a pipe (16). When the internal surface of the tank (1) has received a coating having the desired thickness, the process is interrupted in that the liquid (3) is cooled and drained.

Abstract: A bath for pre-treatment of light metals that form oxide layers, before electroless (chemical) metal deposition is an aqueous bath containing phosphorous acid. The bath is used in the following process for electroless deposition of nickel: (1) Degreasing by boiling (2) Rinsing (3) Pickling (4) Rinsing (5) Treatment in aqueous bath containing phosphoric acid (6) Rinsing with water (7) Chemically nickel plating (8) Rinsing. The light metal articles are packed in a drum that is immersed and rotated in the pre-treatment bath. Current and voltage are applied to a light metal bar that is attached to a non-rotating place on the drum.

Abstract: Disclosed herein is process method and articles of plated coating having functions ranging from wear resistance, lubricity, corrosion resistance, and further incorporating therein particulate matter having light emitting properties. Having this codeposited light emitting particles within the functional layer provides a signal for the determination of the presence of the coating and its stage of deterioration.

Abstract: The invention is a method for making a metal containing article, comprising the steps of: providing a layer of a porous ground in a selected area; exposing selected regions of the layer of porous ground to light, thereby metallizing the selected regions; repeating the foregoing steps a selected number of times to produce a selected number of layers; and selectively modifying the metallized regions of the layers. The initial metallization can be by electroless or semiconductor photo deposition plating. The subsequent modification of the metallized regions can be by electroless plating, electroplating or sintering. It is also possible, in some instances, to forego the second phase modification, the initial phase having provided the desired parameters. In a third preferred embodiment, the invention is a method using an initial metallization phase effected by exposure of a metal salt, such as a metal halide, to light, thereby inducing activation of the halide.

Abstract: A method for depositing a conductive metal onto a dielectric substrate is provided. The method includes obtaining a metal sheet having a roughened surface that has the following parameters:R.sub.a =0.05-0.08 mil,R.sub.max =0.20-0.55 mil,S.sub.m =1.00-3.00 mil,R.sub.p =0.20-0.35 mil, andsurface area=0.90-1.20 square milswherein R.sub.a is the average roughness and the arithmetic mean of the departures from horizontal mean line profile;R.sub.max is the maximum peak-to-valley height;S.sub.m is the mean spacing between high spots at the mean line;R.sub.p is the maximum profile height from the mean line; andsurface area is the area under the surface profile from each measurement using a Talysurf S-120 profilometer;The sheet is laminated to the dielectric substrate surface by pressing the roughened surface of the metal sheet against the surface of the substrate and then removed from the substrate.

Abstract: Process for the manufacture of a lithographic printing plate comprising the steps of:(1) information-wise projecting droplets of liquid, onto a receiving material having a hydrophilic surface to form a silver image by bringing into working relationship on said hydrophilic surface a reducible silver compound (A), a reducing agent (B) for said silver compound and physical development nuclei (C) that catalyze the reduction of said silver compound to silver metal, and(2) hydrophobizing the silver image that has been obtained through said step (1) e.g. by overall contacting the printing surface with a hydrophobizing substance for said silver image or hydrophobizing said silver image by imagewise depositing said hydrophobizing substance thereon.

Abstract: Disclosed is a method for testing solder mask material for suitability with an electroless plating process. The Emix potential of the electroless bath is measured. A test substrate including the mask material is then immersed in an electrolyte, and a constant potential at least equal to the Emix potential is applied to a pair of electrodes also immersed in the electrolyte. The test substrate is then inspected to determine adherence of the mask material.

Abstract: Methods and compositions for electroless metallization. In one aspect, the invention is characterized by the use of chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups that are chemically bound to the substrate. In a preferred aspect, the invention provides a means for selective metallization without the use of a conventional photoresist patterning sequence, enabling fabrication of high resolution metal patterns in a direct and convenient manner.

Abstract: The adhesion of metal coatings deposited by electroless deposition on polycarbonate-addition polymer substrates, especially polycarbonate-ABS substrates, is improved by first contacting the substrate with an alkali metal hydroxide solution followed by concentrated nitric acid.

Abstract: A microwave radar antenna that substantially comprises molded or extruded thermoplastic components that are assembled into completed assemblies, are then metallized by either electroless copper or are electroplated with copper to achieve RF conductivity. The finished subassemblies are joined together forming the completed antenna. The molded, metallized, plastic antenna uses a thermoplastic material, such as polyetherimide, or suitable high strength, high temperature thermoplastic that is used to injection mold or extrude detailed microwave components. The molded components are assembled, using epoxy adhesives, solvents or other mechanical method into microwave subassemblies. These subassemblies are then either electroless copper plated or electroplated to provide RF conductivity. The metallized subassemblies are then joined together using mechanical methods to form a completed radar antenna, replacing heavier more costly metal radar antennas.