Abstract: It has been found that the prior activation of a palladium substrate, such as palladium electrolessly deposited onto nickel, in an aqueous solution of an alkali metal hydroxide, an alkali metal carbonate and a reducing agent, for example, dimethylamine borane, can provide an enhancement in the thickness and uniformity of electrolessly deposited gold when the activated substrate is placed in an electroless gold bath.

Abstract: The present invention relates to an electroless gold plating solution, a method of plating by using the same, and an electronic device plated with gold by using the same.According to the present electroless gold plating solution, the plating solution components contain no cyanide ions, the amount of a reducing agent used is small, and gold plating can be carried out without causing the gold plating on conducting paths having a fine interval between them to short-circuit the conducting paths.Therefore, according to the method of gold plating by using said electroless gold plating solution, a plating method that is safe in the plating work and in the treatment of its waste liquor can be accomplished. The method has a feature that the method can provide an electronic device on which parts can be mounted highly densely, and wherein the joint reliability to the parts is high.

Abstract: An improved process for depositing strongly adhering metallic coatings on substrate surfaces by wet chemical methods by treating the surfaces with a primer before activation.The materials produced by the process are eminently suitable for the shielding of electromagnetic waves.

Abstract: A method of adhering a polyimide to a substrate includes first placing the substrate in a dilute acid solution. The substrate is then placed in a palladium and tin solution followed by a rinse with water. The rinsed substrate is placed in an accelerator solution to substantially remove the tin from the substrate. The palladium which remains on the substrate surface provides nucleation sites for adhesion promotion and enhanced wetting of polyimide which is applied in a liquid form as by spraying or spinning. Adhesion of polyimide to metals such as gold, ceramics, alumina or polyimide is thereby provided.

Abstract: The present invention provides an electroless gold plating solution comprising essentially gold ions, a complexing agent, and a reducing agent, characterized by further containing a reduction promoter which has a function of giving electrons to an oxidant, the oxidant being produced from oxidation of the reducing agent with the gold ions being reduced, to change the oxidant to the original reducing agent. The present invention also provides a process for conducting electroless gold plating by bringing a substrate into contact with the electroless gold plating solution. The plating solution is excellent in the stability for gold plating of high deposition rate. Thus the present invention allows the electroless gold plating to be performed stably at a higher deposition rate.

Abstract: Nickel or cobalt diffusion is suppressed in ceramic articles having a nickel or cobalt underlayer followed by a gold overlayer, by heat-treating the article in a reducing atmosphere at a temperature of at least about 650.degree. C. and subsequently depositing a final gold layer. By suppressing the diffusion of nickel or cobalt, the adhesion of hermetic lids attached thereto by soldering is improved.

Abstract: A method of coating metal on a poly(aryl ether ketone) surface comprises treating the surface with a swelling agent, removing the swelling agent, etchinig the treated surface and then plating the etched surface with a metal using an electroless plating process. The process can be used to metal plate articles of poly(aryl ether ketones) of complex shapes, such as electrical connectors. Exceptional bond strength between the metal and the poly(aryl ether ketone) surface is obtained. Poly(aryl ether ketone) compositions, even those containing little, or no, glass or mineral fillers can be plated with a strongly adherent coating of plated metal using a process of this invention. The poly(aryl ether ketone) may contain additives such as pigments, fillers, stabilizers, reinforcing agents or the like. Blends of poly(aryl ether ketones) with other polymers, such as polyetherimides, fluoroelastomers, or the like, can be treated in accordance with this invention.

Abstract: The invention provides a method by which a transparent defect (3) in a lithographic mask (1) can be effectively restored in a simple manner. For this purpose, the mask (1) is provided with a photosensitive layer (4) and is introduced into a solution of a metal ion (5). Subsequently, the mask is exposed at the area of the defect. The photosensitive layer (4) is capable of depositing the metal ion in the form of metal under the influence of the radiation (6) supplied. According to the invention, the exposure is continued until such a quantity of metal (7) has been deposited that the radiation can no longer penetrate to the photosensitive layer (4). At that instant, the metal deposition is stopped so that overgrowth of the metal deposit (7) is automatically counteracted in a simple manner.

Abstract: A method of improving adhesion of a nickel alloy to the surfaces of diamond particles and articles made therefrom. Diamond particles are electrolessly nickel plating with the nickel alloy formed with a transitional metal, such as molybdenum. Electrolessly plated particles are then gradually heated at a steady rate from room temperature to a desired heat treatment temperature in a non-oxidizing atmosphere formed by argon containing 10% hydrogen. Exemplary articles made by the aforementioned process include a grinding wheel having uniformly dispersed abrasive diamond particles having the Ni/Mo alloy coat thereon.

Abstract: A cyanide-free, ammoniacal silver solution comprising a chelant, e.g. EDTA, and soluble copper, e.g. cupric nitrate, at a level of at least about 1 mole copper/mole silver provides silver replacement coatings on copper-coated articles. Silver coatings have a low surface electrical resistivity, e.g. as low as about 0.02 to 0.05 ohms/square.

Abstract: A process of pretreatment of metal-plating a resin molded article molded from a resin composition containing as main components a polyphenylene sulfide (PPS) resin, a glass-reinforcing agent and optionally one or more other thermoplastic resins comprises(1) treating the resin molded article by immersion in an oxidative acid solution (A treatment),(2) treatng the resulting resin molded article by immersion in an organic polar solvent-containing liquid (B treatment), and then(3) treating the resulting resin molded article by immersion in a solvent which can dissolve one or both of the glass reinforcing agent and one or more of the other thermoplastic resins (C treatment). The PPS resin contains a paraphenylene sulfide unit ##STR1## in an amount of at least 70 mole % of all recurring units. Total amount of PPS resin and the glass-reinforcing agent is at least 60% by weight of the resin composition, and the ratio of the PPS resin to the glass-reinforcing agent is in the range of 2:8 to 9:1 by weight.

Abstract: A method for producing a coating composed of an electroless metal plate, such as a copper plate, tightly bonded to a polyimide layer comprises a multi-step cure of the polyimide layer carried out in combination with a palladium-catalyzed electroless deposition process. A solution of a polyamic acid compound that is the precursor for the desired polyimide resin in a vaporizable solvent is applied to a substrate and heated preferably to temperature below 250.degree. C., to form a soft-cured polyimide film. The film is immersed in an aqueous palladium-tin colloidal suspension to deposit the colloidal particles thereon, which particles are then activated to form palladium nuclei dspersed on the surface. The soft-cured film is then heated, preferably above about 250.degree. C., to vaporize residual solvent and form a hard-cured polyimide layer having the palladium nuclei dispersed on the surface.

Abstract: A planar interconnect using selective, electroless deposition of a metal such as copper into interconnect channels is disclosed. A first dielectric layer is deposited on the surface of a substrate, such as an integrated circuit wafer. Thereafter, a second dielectric layer is formed on the first dielectric layer. Then a photoresist layer is spun on the top surface of the second dielectric layer. Channels are formed in the dielectric layers by patterning and etching the composite dielectric layers. Silicon atoms are implanted in the bottom of the interconnect channels and then the metal layer is selectively, electrolessly deposited to fill the channels in the first dielectric film, thus forming a level of interconnect. This process is repeated to form subsequent levels of interconnect.

Abstract: Activator formulations which contain an aromatic polyurethane as binder are highly suitable for the preparation of non-metallic substrate surfaces for currentless metallization.The metal coatings produced are distinguished by good adhesion.

Abstract: A method for seeding the surface of a polyimide film which has been generated from a precursor polyamic acid film comprising the steps of: generating a film of polyamic acid on a substance (which may be done by conventional spin coating or by other solution coating techniques well known in the art); then either exposing the polyamic acid film to a solution containing palladium cations; heat-treating the palladium-treated film in a time/temperature schedule that causes imidization of the polymer to occur; exposing the seeded film to an electroless plating bath which causes the deposition of blanket metal film on the surface of the polymer film; or curing the film to the polyimide form; mechanically abrading the film surface, exposing the film to a solution containing palladium cations; exposing the seeded film to an electroless plating bath which causes the deposition of blanket metal film on the surface of the polymer film.

Abstract: A process for promoting the adhesion of metal to thermoplastic substrates such as polyimides. The improvement comprises conditioning the substrate by treating with a lactone and aqueous rinse prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of the cohesive integrity of the substrate throughout subsequent processing steps.

Abstract: Formulations containing an organometallic activator, a filler, a special mixture of organic solvents and a PU elastomer are eminently suitable for activating plastic surfaces for their electroless metallization avoiding stress-corrosion cracking.The plastic parts so activated are preferably used for screening from electromagnetic waves after metallization has been carried out.

Abstract: The invention relates to an activating composition for the electroless plating of non-conductive surfaces, in particular electronic printed circuit boards.The composition contains a metal complex in which the ligand consists of a quaternary nitrogen compound, especially a compound in which nitrogen forms part of a heterocyclic system and is quaternarized with a radical comprising an acid residue carrying a negative charge, for example a sulphonated group.The invention also concerns a method for the electroless plating involving the use of such composition, preceded by a preliminary treatment of the substrate and followed by the reduction of activating metal.The activating composition according to the invention allows to fix firmly the activator metal to the substrate.

Abstract: A method is provided for applying a gold ink coating to a thermocouple sheath which includes the steps of electropolishing and oxidizing the surface of the thermocouple sheath, then dipping the sheath into liquid gold ink, and finally heat curing the coating. The gold coating applied in this manner is highly reflective and does not degrade when used for an extended period of time in an environment having a temperature over 1000.degree. F. Depending on the application, a portion of the gold coating covering the tip of the thermocouple sheath is removed by abrasion.

Abstract: A process for selective metallization comprising the steps of providing a substrate coated with a photoresist, imaging the photoresist coating by exposure to pattern radiation and development, flood exposing the photoresist coating to activating radiation, depositing an electroless plating catalyst over the entire imaged photoresist coating and bared underlying substrate, removing the top surface of the flood exposed, catalyzed photoresist coating by development whereby plating catalyst remains in a desired selective pattern and depositing metal over the catalyzed surface to form a metal deposit in a selective pattern such as in a circuit pattern. The process is suitable for the manufacture of diverse articles including printed circuit boards.

Abstract: A method of forming at least one electrically conductive path in a plastic substrate comprising providing a thermoplastic substrate having a melting point below 325.degree. C.

Abstract: The surface of a substrate made of substantially crystalline polyimide is converted to form a layer of substantially amorphous polyimide. The substantially amorphous layer is formed by treating the crystalline polimide surface with a base followed by treatment with an acid to form a polyamic acid layer, which is reimidized to form a substantially amorphous layer by a low temperature heat cycle. Metals or polyimides can be deposited onto this amorphous layer, which is then cured to convert the amorphous layer to substantially crystalline polyimide. This process enhances the adhesion of the metal or polyimide layer without introducing contamination (new foreign materials or new functional groups) from surface treatments of adhesion layers.

Abstract: Conductive surfaces such as copper and/or tungsten surfaces, particularly copper circuitry areas of printed circuit board substrates or fused tungsten circuitry areas of fused tungsten-ceramic packages, are activated for receipt of electroless nickel plating thereon by providing the surfaces with particulate zinc metal, particularly by contact of the surfaces with an aqueous suspension of particulate zinc metal.

Abstract: Light transmission paste and a metallic copper deposition method of the present invention can educe metallic copper in the desired portion by applying or contacting light transmission paste on cuprous oxide and applying light upon the desired portion. Also, the light is applied through a mask corresponding to the pattern to be obtained, so that desired circuit pattern may be easily obtained. Further, metallic copper of high density may be educed by the contacting or applying metal deposition paste upon metal of a substrate.

Abstract: A process of electrolessly metallizing a body on the surface thereof with a metal coating incorporating particulate matter therein, which process comprises contacting the surface of said body with a stable electroless metallizing bath comprising a metal salt, an electroless reducing agent, a complexing agent, an electroless plating stabilizer, a quantity of particulate matter which is essentially insoluble or sparingly soluble in the metallizing bath, and a particulate matter stabilizer (PMS), and maintaining said particulate matter in suspension in said metallizing bath during the metallizing of said body for a time sufficient to produce a metallic coating with said particulate matter dispersed therein.

Abstract: A method for producing extremely smooth metal coatings on zincated aluminum substrates using a special double zincating procedure and/or a specially formulated electroless metal plating bath employing a unique plating process.

Abstract: Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons.

Abstract: A process for preparing a metallized polyimide film, comprising the steps of: forming a solidified film containing 100 parts by weight of an aromatic polyamic acid in the form of a solution obtained by polymerizing approximately equal moles of an aromatic tetracarboxylic acid component and an aromatic diamine component and 5 to 150 parts by weight of an organic polar solvent; applying a surface treatment solution containing a heat-resistant surface treating agent to the surface of the solidified film; heating the solidified film to a high temperature to imidize the polyamic acid, while drying the film to prepare a polyimide film; forming a thin metal vapor-deposited layer by a vapor deposition of a metal on the treated surface of the polyimide film with the heat-resistant surface treatment agent; and applying metal plating onto the metal vapor deposited layer to form a metal plated layer thereon.

Abstract: An electroless gold plating composition comprises an aqueous solution of alkali metal gold cyanide, alkali metal cyanide, alkali metal hydroxide, a reducer selected from borohydrides and alkyl amine boranes, and a stabilizer having the formula ##STR1## wherein R.sub.1 is --COOH, --OH, --CH.sub.2 OH, or --SO.sub.3 H (or an alkali metal salt thereof), R.sub.2 is --COOH, --OH, --Cl, --H, (or an alkali metal salt thereof) and is disposed in the 2, 5, or 6 ring position, and --NO.sub.2 is in the 3 or 4 ring position. This composition has a pH of 12.5-14.0, is heated at 85.degree.-95.degree. C., and operates at an oxidation/reduction potential of -550 to -700 millivolts to produce high purity gold deposits of amorphous structure and good hardness for electronic applications. The composition may be replenished as many as ten turnovers.

Abstract: A bulk RF absorber and a method for constructing same. The absorber is composed of multiple sheets of a reticulated dielectric material, each sheet being coated with at least one layer of radiation absorbing material to create a radiation absorption gradient across a width dimension of the sheet. The sheets are stacked with their respective absorption gradients aligned to form the bulk absorber. In one embodiment, the coated sheets are constructed by lengthwise feeding the dielectric material through a sputtering region and interposing a partial mask between the sputtering material and the face of the dielectric material. The contour of an edge of the mask, the sputtering rate and feed rate determine the resulting absorption gradient of the coated dielectric material. In another embodiment, a dipping process is used to coat each sheet with radiation absorption material.

Abstract: The invention discloses a new electroless plating catalyst and a process of using the same for selective plating. The catalyst and process are especially adapted for formation of EMI shielding for electronic components. The electroless plating catalyst comprises particulates dispersed in a liquid film forming composition which particulates are coated with a hydrous oxide that is reduced to a catalytic metal in contact with an electroless plating solution.

Abstract: In the manufacture of a decorative sheet material to be bonded to a substrate to provide a surface having a brushed metal appearance, a light-reflective, glossy metal layer is formed on a thermoformable carrier film. A pattern of straight and parallel microscopic cracks is created in the metal layer at a temperature below Tg of the carrier film by bi-directionally bending and drawing the resulting sheet material around a straight cracking member. Thereafter, the sheet material is stretched at a temperature above Tg of the carrier film. This creates an attractive brushed metal appearance of reduced gloss.

Abstract: A process forming an organic coating, such as an autodeposited coating, on a plurality of small metallic articles by contacting the articles with a liquid coating composition containing an organic film-forming material comprising:(A) providing a plurality of said articles, with at least some of the articles being in contact with at least one other of said articles;(B) immersing the articles into a bath of said composition under conditions such that said articles are not in conttact with another article in said composition;(C) maintaining said articles in separated form in said composition for a period of time sufficiently long for the entirety of the surfaces of said articles to be coated with said composition; and(D) collecting the coated articles in the bath in a form in which at least some of the coated articles are in contact with another of said coated articles;wherein the coating composition is capable of forming on a steel panel immersed therein a coating having a wet strength such that its rinse resis

Abstract: A surface layer of a material containing carbon and/or a carbide is produced on the outer surface of a solid carbon-based substrate (1) by selective application of material, said surface layer adhering strongly to the substrate, having a high specific surface area and having open pores (5) of a depth of at least 1 nm, and a metal material having a strong affinity for carbon, comprising at least one metal chosen from cerium, cobalt, chromium, iron, hafnium, iridium, osmium, palladium, platinum, rhodium, ruthenium, lanthanum, manganese, molybdenum, nickel, silicon, tantalum, thorium, titanium, uranium and tungsten, is deposited on said surface layer, substantially filling said pores.The metal deposit (8) may be rectified and polished without peeling off, in order to produce a mirror of low inertia.

Abstract: A substrate for a magnetic disk, having fine roughness formed on its surface by subjecting aluminum or an aluminum alloy to anodic oxidation, packing pores in the anodized layer thereby formed, with a material different in the physicochemical properties from the anodized layer, and letting a plating material grow selectively by an epitaxial method.

Abstract: A method for making printed circuit boards wherein the resistance of catalyzed nonconductive surfaces to solutions used in the processing stages, e.g., KOH used to remove an etch resist covering through-holes and the desired circuit lines, is enhanced by treating the catalyzed surface with an accelerator to activate the catalyst, treating the accelerated surface with a reducing agent, followed by baking.

Abstract: An electroless copper plating bath uses a series of tetradentate nitrogen ligands. The components of the bath may be substituted without extensive re-optimization of the bath. The Cu-tetra-aza ligand baths operates over a pH range between 7 and 12. Stable bath formulations employing various buffers, reducing agents and ligands have been developed. The process can be used for metal deposition at lower pH and provides the capability to use additive processing for metallization in the presence of polyimide, positive photoresist and other alkali sensitive substrates.

Abstract: An activation solution for the activating of electrically nonconductive plastic surfaces of the purpose of a subsequent chemical metallization is prepared from an acid, a palladium(II) salt and a tin(II) salt, the palladium being present predominately in complexly dissolved form. The solution is prepared at room temperature, the molar ratio of the palladium employed and of the tin employed being about 1:1 to 1:2. The solution is mature and catalytically effective after about 10 minutes. There are no further stabilizing agents, auxiliary materials or the like present.

Abstract: To electrolessly depositing nickel on tungsten surfaces or molybdenum surfaces which have been deposited on surfaces of ceramic bodies, the ceramic bodies are nucleated, preferably after thorough cleaning, for example with aqueous hydrofluoric acid, by immersion in an aqueous solution containing palladium ions and then introduced into an electroless nickel-plating bath. Before the nickel-plating, the nucleated ceramic bodies are treated in a bath containing a complexing agent for palladium ions, for example in an aqueous cyanide solution.

Abstract: An electroless copper plating bath uses a series of tetradentate nitrogen ligands. The components of the bath may be substituted without extensive re-optimization of the bath. The Cu-tetra-aza ligand baths operates over a pH range between 7 and 12. Stable bath formulations employing various buffers, reducing agents and ligands have been developed. The process can be used for metal deposition at lower pH and provides the capability to use additive processing for metallization in the presence of polyimide, positive photoresist and other alkali sensitive substrates.

Abstract: The invention relates to compositions containinga) at least one organic polymer andb) a dibenzalacetone palladium complex of formula I ##STR1## which is homogeneously dissolved in said polymer but is not copolymerisable therewith, in which formula IR.sup.1 is hydrogen, C.sub.1 -C.sub.18 alkyl, C.sub.1 -C.sub.18 alkoxy or unsubstituted or substituted phenyl,R.sup.2 has one of the meanings of R.sup.1 or is also an amino, nitro or cyano group, an --O--C.sub.m H.sub.2mn OR.sup.4 or --O--CH.sub.2 --CH.OR.sup.4 --CH.sub.2.OR.sup.5 radical or a halogen atom or a glycidyl ether radical,R.sup.3 is hydrogen or C.sub.1 -C.sub.4 alkyl or the two groups R.sup.3 together form a C.sub.2 -C.sub.4 polymethylene chain,R.sup.4 and R.sup.5 have one of the meanings of R.sup.1,q is a value from 1 to 3.5,m is a value from 2 to 6 andn is a value from 0 to 20, with the proviso that the composition does not contain a polymer with an olefinic double bond.

Abstract: Disclosed are an electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, the plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and 1.2.times.10.sup.-4 to 1.2.times.10.sup.-3 mole/l of an iron ion compound as a reaction initiator and/or 1.92.times.10.sup.-4 to 1.92.times.10.sup.

Abstract: An electroless gold plating solution containing 0.1 to 10 ml/l of ethyleneamines and 0.1 to 10 g/l of hexamethylenetetramine as complexing agents in addition to the solution comprising water-soluble gold salts, pH controlling agents, catalysts, alkylamine boranes, alkali cyanides and ethylendiamine tetraacetic acid.According to the present invention, thick coating of a gold plating film having high quality and gloss is possible and the plating time becomes very short.

Abstract: The invention concerns a process disclosed for the pre-treatment of synthetic materials (plastics), particularly polyetherimide, polycarbonate and poly(ester-co-carbonate), for the adhesive chemical metallization, involving treating the synthetic material with a quaternary base dissolved in an organic solvent.

Abstract: The present invention provides a method for producing high density electronic circuit boards comprising the steps of depositing a layer of a first metal upon a layer of foil to produce a composite then attaching the composite to an insulative support to produce a laminate. The layer of foil is then removed from the layer of first metal. Photoresist is then applied to the layer of first metal, exposed and developed. During the development of the photoresist portions of the photoresist are removed from the layer of first metal. A layer of third metal is then plated upon the portions of the layer of first metal that are not covered by the photoresist. All remaining photoresist and the portions of the layer of first metal which are not covered by the third metal are then removed producing a finished fine-line pattern having conductive and insulative areas. The finished fine-line pattern may then be utilized to produce a circuit board.

Abstract: By using a nucleating solution having a low concentration of PdCl.sub.2 at an increased temperature, contact holes can be nucleated in a selective manner and, subsequently, metallized in an electroless bath, said contact holes being etched by means of plasma etching in dielectric layers of VLSI devices having a silicon semiconductor body.

Abstract: Metallic surfaces are imparted to non-conductors or dielectric substrates by electroless(chemical) plating process comprised of coating the substrates with colloid(s) of non-precious metals and wherein the colloids are prepared in a manner as to impart resistance towards further deterioration.

Abstract: A pretreatment composition comprising a combination of an adhesion promoter and corrosion inhibitor which is applied to the surface of a substrate and a process for pretreating the surface of a substrate before the deposition of thin metallic films to prepare mirrored substrates.

Abstract: An improved optical data storage medium is reponsive to incident electromagnetic radiation, and the surface or a surface region of the medium includes a layer of heat sensitive material which has a textured surface pattern in the form of a regular array of grooves or protuberances, the dimensions of the surface features which constitute said textured surface pattern being in the sub-micron range. The textured surface pattern is overcoated with a thin film of an alloy, said alloy comprising (1) a first component which is at least one of ruthenium, rhodium, palladium, osmium, iridium and platinum; and (2) at least one other metallic element, preferably from Groups Va, VIa, VIIa, and Ib of the Periodic Table of elements according to Mendeleev.The preferred alloy compositions for such data storage media contain platinum and tungsten.

Abstract: A method for the electroless coating of ferromagnetic substrates substantially free of microspheres or other unwanted auxillary matter, thereby reducing the roughness of the coated articles. The method and articles produced are subjected to a magnetic field and demagnetized prior to the plating step. The method is of particular utility in the coating of textile machinery parts operating at high rotational speed in the minimizing of dust and yarn damage. The method is also of great utility in the deposition of composite electroless coatings.