Abstract: A method for manufacturing a black matrix of a plasma display panel includes the steps of forming transparent electrodes of upper electrode patterns and black matrix patterns on an upper substrate, and depositing a predetermined metal material on the transparent electrodes of the black matrix patterns. In the method for manufacturing a black matrix of a plasma display panel, it is possible to manufacture the black matrix without performing a separate baking process. In addition, since it is possible to pattern the upper electrode and the black matrix at the same time, the manufacturing process steps are simplified and the manufacturing cost is saved.

Abstract: A method for forming an indium oxide film on an electrically conductive substrate by immersing the substrate and a counter electrode in an aqueous solution containing at least nitrate and indium ions and flowing an electric current between the substrate and the counter electrode thereby causing indium oxide film formation on the substrate is provided. A substrate for a semiconductor element and a photovoltaic element produced using the film forming method are also provided An aqueous solution for the formation of an indium oxide film by an electroless deposition process, containing at least nitrate and indium ions and tartrate is also disclosed. A film-forming method for the formation of an indium oxide film on a substrate by an electroless deposition process, using the aqueous solution, and a substrate for a semiconductor element and a photovoltaic element produced using the film forming method are further provided.

Abstract: The present invention relates to a method and apparatus of fabricating electromagnetic coil vanes. The method involves photolithographically exposing high resolution, dense wire patterns in a flash coat of copper, on both sides of a ceramic vane substrate. The substrate can be pre-drilled with a through hole to connect the two copper coil patterns. Additional copper is then deposited on both high resolution patterns and in the through hole by plating until the desired thickness is obtained. A firing operation is then performed that eutectically bonds the copper to the ceramic.

Abstract: An improved additive process for metallization of substrates is described whereby a catalyst solution is applied to a surface of a substrate. Metallic catalytic clusters can be formed in the catalyst solution on the substrate surface by heating the substrate. Electroless plating can then deposit metal onto the portion of the substrate surface coated with catalyst solution. Additional metallization thickness can be obtained by electrolytically plating the substrate surface after the electroless plating step.

Abstract: A conductive powder having an organic silicon polymer layer on the surface of each particle and a metal layer enclosing the silicon polymer layer possesses a stronger bond between the particle base and the metal even at elevated temperature and exhibits a high and stable conductivity and heat resistance.

Abstract: Disclosed are methods for replenishing adhesion promoting baths from an unstable state without discarding the bath. Methods of adhesion promoting substrates, such as printed wiring boards, using the replenished baths are also disclosed.

Abstract: Disclosed are catalyst compositions suitable for depositing electroless metal seed layers and for enhancing discontinuous seed layers. Also disclosed are methods of depositing electroless seed layers and enhancing discontinuous seed layers.

Abstract: An aspect of the present invention is a process for modifying a substrate in areas that are exposed to actinic radiation, having the steps: (a) providing on the substrate functional groups adapted for conversion to oxygen-containing photoproducts upon exposure to actinic radiation; (b) exposing at least a portion of the substrate to the actinic radiation, converting the functional groups in an exposed region of the substrate to the photoproducts; (c) contacting the photoproducts with a primary or secondary amine in the presence of hydrogen ions, forming imine groups; and (d) contacting the imine groups with a reducing agent, forming amine groups on the substrate in the exposed region.

Abstract: A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate dopant. The conductive polymer colloidal composition may also contain conductive colloidal particles such as conductive carbon or metal salt particles, oxidants, stabilizers, and preservatives. The conductive polymer colloidal composition may be employed to selectively coat the non-conductive parts of printed wiring boards such that a uniform metal layer can be deposited on the conductive polymer coat. In addition to a uniform metal layer being formed over the conductive polymer, adhesion between the metal layer and the printed wiring board is improved.

Abstract: A laminated structure for electronic equipment includes a printed circuit board having copper foil, an undercoat plating layer made of tin or silver, formed on the printed circuit board, and a gold plating layer formed on the undercoat plating layer by electroless plating. Tin or silver is a metal which acts as an anticatalyst in electroless plating. After formation of the undercoat plating layer, the printed circuit board is dipped in catalyst-applying treating liquid to inhibit the anticatalyst.

Abstract: Provided are methods of preparing an electrically conductive foam. The methods include the following steps: (a) providing a foam substrate comprising a foam layer and a fabric layer; (b) contacting the foam substrate with a sensitizing solution; (c) contacting the foam substrate with an activation solution; and (d) forming a metallic layer on the foam substrate with an electroless plating process. Also provided are electrically conductive foams formed by such methods. The present methods and foams have particular applicability to the manufacture of computer-related shielding devices.

Abstract: A method for manufacturing a black matrix of a plasma display panel includes the steps of forming transparent electrodes of upper electrode patterns and black matrix patterns on an upper substrate, and depositing a predetermined metal material on the transparent electrodes of the black matrix patterns. In the method for manufacturing a black matrix of a plasma display panel, it is possible to manufacture the black matrix without performing a separate baking process. In addition, since it is possible to pattern the upper electrode and the black matrix at the same time, the manufacturing process steps are simplified and the manufacturing cost is saved.

Abstract: A method of plating an aromatic polymer substrate comprises: applying a strippable coating of a non-aromatic polymer to a substrate surface to be plated; selectively illuminating the coated substrate surface with laser light to ablate a selected area of the strippable coating and to activate an underlying region of the substrate surface exposed by the ablation of the strippable coating; contacting the substrate surface with a seeding solution containing polymer-stabilized catalytic seeding particles, so that the seeding particles adhere preferentially to the activated region of the substrate; and electrolessly plating the substrate surface, whereby the seeded areas of the substrate surface are selectively plated.

Abstract: A substrate includes a non-conductive portion to be electroless-plated of a substrate, on the surface of which fine metal catalyst particles composed of silver nuclei and palladium nuclei each having an average particle size of 1 nm or less adhere at a high nuclei density of 2000 nuclei/&mgr;m2 or more. The metal catalyst particles are produced by sensitizing the non-conductive portion of the substrate by dipping the substrate in a sensitizing solution containing bivalent tin ions, activating the non-conductive portion of the substrate by dipping the substrate in a first activator containing silver ions, and activating the non-conductive portion of the substrate by dipping the substrate in a second activator containing palladium ions.

Abstract: Disclosed are new catalysts for electroless metallization deposition, particularly catalysts that can be selectively activated and may be free of palladium and/or tin. Catalysts of the invention are preferably employed for electroless copper deposition.

Abstract: A process for depositing metal coatings on polyimide surfaces for producing conductor tracks includes depositing a first metal coating by decomposition of volatile metal compounds by a glow discharge in a gas mixture containing inert gases and oxygen containing compounds, followed by electroless deposition of a second metal coating from an acid or neutral metallizing bath.

Abstract: A process for the selective activation and plating of a substrate is disclosed. The process involves the application of an activator composition to a substrate in a predetermined pattern by means of a print head wherein the print head moves across the surface of the substrate and selectively deposits the activator composition in said predetermined pattern upon the substrate. The selectively activated substrate is then subjected to electroless plating.

Abstract: An improved colloidal activator is disclosed which is useful in preparing substrates for plating. The activator comprises a source of gold, a source of tin and an organic sulfonic acid. Relatively low levels of palladium have been found to be synergistically advantageous. In addition, sulfonated surfactants have also proven to be useful. The colloidal activator may also include colloid stabilizers. A method for preparing and a process for using the activator are also disclosed.

Abstract: A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.

Abstract: Provided are methods of preparing an electrically conductive polymeric foam. The methods include the following steps: (a) contacting a polymeric foam with a surfactant solution; (b) contacting the polymeric foam with a sensitizing solution; (c) contacting the polymeric foam with an activation solution; and (d) forming at least one metallic layer on the polymeric foam with an electroless plating process. Also provided are electrically conductive polymeric foams formed by such methods. The present methods and foams have particular applicability to the manufacture of EMI (electromagnetic interference) shielding devices.

Abstract: A method of providing a resistance to oxidation of Nickel at high temperatures by combining Ni powder with five percent Pt resinate, and heating the same to a temperature of 500° C. to 1300° C. Electro-conductive components serving as electrodes and the like comprise a Ni/Pt powder subjected to temperatures of between 500° C. and the respective melting points of Ni and Pt.

Abstract: A high-reflectance silver mirror has a high-reflectance film comprising a silver layer formed on a base material made of phosphorus-containing glass. The high-reflectance film is formed by a wet film-forming process on an acid-resistant protection film covering the base material. A reflecting optical element employing the high-reflectance silver mirror, and a process for producing the high-reflectance silver mirror are also provided. The high-reflectance silver mirror is producible at a reduced cost and has improved reflectivity.

Abstract: A process is provided for producing coated synthetic bodies during which, before the coating, the surface to be coated is subjected to a pretreatment in an excited gas atmosphere. The surface is then coated. The gas atmosphere is predominantly formed of a noble gas and nitrogen and/or hydrogen, and the ionic energy in the gas atmosphere and in the are of the surface to be coated is not more than 50 eV. The ionic energy is selected to be not more than 20 eV, preferable not more than 10 eV. The gas atmosphere is excited by means of a plasma discharge or by means of UV radiation.

Abstract: A process of preserving solderability and inhibiting tin whisker growth of exposed copper or copper alloy surfaces on a substrate comprises the steps of preparing an immersion tin plating solution substantially free of other immersion-platable metals; applying the immersion tin plating solution to the substrate to form a tin coating on the surfaces; preparing an immersion alloy plating solution containing at least two immersion-platable metals; applying the immersion alloy plating solution to the substrate by immersing the substrate in the immersion alloy plating solution to form an alloy cap layer on the tin coating. The immersion platable metals in the immersion alloy plating solution may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt.

Abstract: A semiconductor wafer having copper bondpads (17) that are free of voids (13) and a method for coating the copper bondpads (17) with solderable or wirebondable metals such that the copper bondpads (17) are free of the voids (13). The void free metal coatings are achieved using a dual activation process. In a first activation step (27), the copper bondpads (17) are activated by placing them in a palladium bath. In a second activation step (28), the bondpads are placed in a nickel-boron bath. After the dual activation, the copper bondpads (17) are coated with a layer of nickel-phosphorous or palladium. The nickel-phosphorous or palladium layer may be coated with a layer of gold for subsequent formation of solder balls or wirebonds thereon.

Abstract: A process for applying a metal to selected areas of non conducting substrates, including individual fibers, particularly optical fibers, comprises the steps of providing a non-conducting substrate having an uncoated portion to be treated with a sensitizer solution to provide a sensitized portion of the non-conducting substrate. Covering the sensitized portion with an activator solution provides an activated portion of the non-conducting substrate. Coating at least a section of the activated portion with a stannous salt solution forms at least one activated area and at least one deactivated area within the activated portion of the non-conducting substrate to produce a masked portion therefrom. Upon immersing the masked portion of the non-conducting substrate in an electroless plating bath, metal deposits on the activated area to provide a selectively metallized non-conducting substrate. This process provides selectively metallized articles including selectively metallized optical fibers.

Abstract: A process for providing a metal-seeded liquid crystal polymer comprising the steps of providing a liquid crystal polymer substrate to be treated by applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer as an etchant composition for the liquid crystal polymer substrate. Further treatment of the etched liquid crystal polymer substrate involves depositing an adherent metal layer on the etched liquid crystal polymer substrate. An adherent metal layer may be deposited using either electroless metal plating or vacuum deposition of metal such as by sputtering.

Abstract: A gas sensor and a method for its manufacture are described. The gas sensor has a solid electrolyte (11) having at least one measuring electrode (15) and one porous protective coating (16). The measuring electrode (15) has an electrically conductive base layer (25) and a further layer (27), the further layer (27) being deposited in the pores of the porous protective coating (16) adjacent to the base layer (25) via galvanic deposition. In order to deposit the further layer (27) via galvanic deposition, the basic body (10), which has been fused with the base layer (25) and the protective coating (16) via vitrification, is immersed in a galvanizing bath, the base layer (25) being connected as the cathode.

Abstract: The present invention concerns a process for modifying oxidizable surfaces, including diamond surfaces, including methods for metallizing these surfaces, where these methods include oxidation of these surfaces. The present invention also relates to the products of these methods. In this process, a surface is first plasma oxidized, usually under an RF O2 plasma. Chemical functional groups are then attached to the surface. If the surface is to be metallized, the chemical functional groups are selected to be catalyzable, the surface is then catalyzed for electroless metallization, and the surface is finally treated with an electroless plating solution to metallize the surface. If modified surface is to be patterned, the modified surface is exposed through a mask to pattern the surface after the attachment of the chemical functional groups.

Abstract: A sol-gel catalyst composition for electroless plating includes a metal alkoxide in a polar organic solvent, an acid, a chloride salt or acid chloride, and a catalytic metallic salt. The sol-gel catalyst adheres to smooth surfaces without the preconditioning normally associated with other sol-gel smooth surface catalyst, as well as a method for coating a substrate with the sol-gel catalyst composition, and then a metallic platting solution.

Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.

Abstract: The present invention relates to a method and apparatus of fabricating electromagnetic coil vanes. The method involves photolithographically exposing high resolution, dense wire patterns in a flash coat of copper, on both sides of a ceramic vane substrate. The substrate can be pre-drilled with a through hole to connect the two copper coil patterns. Additional copper is then deposited on both high resolution patterns and in the through hole by plating until the desired thickness is obtained. A firing operation is then performed that eutectically bonds the copper to the ceramic.

Abstract: A process for plating metal in submicron structures. A seedlayer is deposited on surfaces of submicron structures. The seedlayer is annealed at a temperature of about 80° C. to about 130° C. Metal is plated on the seedlayer.

Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.

Abstract: This invention relates to processes for the formation of composite layers containing insoluble particles in metal matrices onto bodies to achieve enhanced thermal properties.

Abstract: A process for forming a silver coating on a surface of a vitreous substrate is described. The process comprises an activating step in which said surface is contacted with an activating solution, a sensitising step in which said surface is contacted with a sensitising solution, and a subsequent silvering step in which said surface is contacted with a silvering solution comprising a source of silver to form the silver coating. The process is characterised in that said activating solution comprises ions of at least one of bismuth (III), chromium (II), gold (III), indium (III), nickel (II), palladium (II), platinum (II), rhodium (III), ruthenium (III), titanium (III), vanadium (III) and zinc (II).

Abstract: A coating system and a method for its manufacture are provided. An electrically conductive base coat and a porous overcoat lying over the base coat are arranged on a ceramic substrate. At least one additional deposited layer is arranged on the base coat in such a way that the additional layer is formed in the pores of the porous overcoat adjacent to the base coat. The additional layer is deposited either by currentless or electrolytic deposition. For electrolytic deposition of the additional layer, the ceramic substrate sintered with the base coat and the overcoat is submerged in an electrolytic bath and the base coat is connected as a cathode. The currentless deposition takes place from a solution of the metal to be deposited with the addition of a reducing agent.

Abstract: A process for producing an electrolessly plated molded article, which includes molding a resin composition made of a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, then treating the surface of the molded article with air blast using an abrasive having a sharp granular shape, and then conducting catalyst coating, activation treatment and electroless plating. It has been possible to apply the electroless plating with a high adhesion strength to the molded article of the thermoplastic resin composition without conducting the chemical etching treatment.

Abstract: Printed circuit boards, cards and chip carriers are fabricated by treating an already circuitized substrate with a swelling agent, then treating the circuitized substrate with a composition containing an alkaline permanganate, a chromate and/or chlorite and then applying a metal layer to coat the circuitized portion of the substrate.

Abstract: A process of coating substrates with metal by immersing them into solutions of inorganic compounds in non-aqueous organic liquids. The solution preferably contains two components—a polar organic liquid such as an alcohol, polyol or ketone containing a metal salt in solution. The substrate may be a metal such as steel or aluminum, or a dielectric such as plastic or ceramic, which has been activated by the deposition of colloidal metallic particulates to form a seed metallic layer. The preferred embodiment involves immersion of a metal substrate at room temperature into a simple alcohol such as methanol, containing a salt such as copper chloride. Metal deposits onto the substrate at rates many times greater than aqueous electroless processes. The substrate may be immersed into active solution in a bath, or a paste of the organic and the salt may be formed and painted onto the substrate. In either case, spontaneous deposition occurs on the metal or pre-activated dielectric substrate.

Abstract: A method for producing electro- or electroless-deposited-film, in which the crystal orientation of the film is controlled to provide improved product properties. A paramagnetic material or diamagnetic material in its electrolytic-state is deposited on a substrate by an electro- or electroless-deposition process. A magnetic field having an intensity at least on the order of 7 T is applied in a predetermined direction, so as to perform the deposition in environment added with the magnetic field. A porous plate is preferably arranged adjacent to the substrate, for suppressing flow of an electrolytic liquid that may occur during the application of the magnetic field.

Abstract: A method for selective electroless metal deposition on a substrate. The method comprises applying a patterned coating comprising a silyl hydride functional resin onto a substrate. An electroless plating solution comprising a metal ion is then applied onto the silyl hydride functional resin coating to deposit a patterned metal film on the substrate. The process of the invention is especially useful in the electronics industry.

Abstract: The present invention relates to a process for improving the adhesion of metal particles to a carbon substrate, characterized in that, before the said metal particles are deposited on the carbon substrate, the said substrate is treated in an alkaline medium at a temperature of between 50° C. and 100° C. in a stream of a gas containing oxygen.

Abstract: A method of forming a diamond-like carbon coating in vacuum, comprising the steps of: pretreatment of the surface of the pad; placing the part into a vacuum chamber; treating the surface of the part with accelerated ions; applying a sublayer of a material onto the treated surface of the part; electric are vacuum sputtering a graphite cathode from a cathode spot and producing a carbon plasma accelerating an ion component of the carbon plasma; depositing the produced carbon plasma on the surface of the part and producing the diamond-like carbon coating. A pulsed electric are discharge is used, by which a plurality of cathode spots are excited at the end surface of the graphite cathode, cathode spots moving along the end surface of the cathode at a speed of from 10 to 30 m/s and generating a carbon plasma having an ion energy of 40 to 100 eV and an ion concentration in the plasma of 1012 to 1014 cm−3, with electrically insulating the part in the vacuum chamber.

Abstract: A method for making integrated circuit wafers wherein the wafer has vias or other openings in the wafer which openings have a barrier/adhesion or other metal layer which is metallized to form the circuit comprising activating the metal layer and then sensitizing the metallic layer using a sensitizing displacement composition comprising preferably an alkaline palladium non-ammonia nitrogen (ethylene diamine) complex which is contacted with the wafer at a specially controlled pH. The wafer is activated using an activation solution which contains a complexing agent for any dissolved metal. The sensitizing solution also preferably contains a complexing agent for dissolved metal and preferably contains a second complexing agent such as EDTA to solubilize base metal contaminants.

Abstract: In a plating method for successively treating a plating target from a pre-treatment step until a plating treatment, (A) a vibrationally stirring apparatus for a treatment bath, (B) an aeration apparatus for the treatment bath, (C) an apparatus for swinging an electrode bar for suspending the plating target thereon, and (D) an apparatus for applying vibration to the electrode bar, are operated in a cleaning tank and at least one of an electroless plating tank and an electroplating tank used as a treatment tank in the pre-treatment step and the plating step.

Abstract: An industrial material such as metal, ceramics or plastics whose surface has a film passivated by fluoridation and a process of manufacturing the above industrial material. The industrial material comprises a substrate, a nickel alloy film formed on the substrate and containing nickel, semimetal and/or other metal whose fluoride becomes a volatile compound, and a fluorine passivated film formed at least on a surface of the nickel alloy film in such a manner that the fluorine passivated film contains nickel and does not contain said other metal or the semimetal, and satisfies stoichiometric ratio. The process of manufacturing an industrial material comprises the steps of performing grounding treatment of a surface of a substrate, forming a nickel alloy film, on the surface of the substrate, containing nickel, semimetal and/or other metal, and forming a fluorine passivated film on the nickel alloy film.

Abstract: A method of fabricating single and dual damascene copper interconnects is achieved. A semiconductor substrate layer is provided. Conductive traces are provided in an isolating dielectric layer. An intermetal dielectric layer is deposited overlying the conductive traces and the isolating dielectric layer. The intermetal dielectric layer is patterned to form trenches to expose the top surfaces of the underlying conductive traces. A barrier layer is deposited overlying the intermetal dielectric layer, the exposed conductive traces, and within the trenches. A platinum ionic seed solution is coated inside the trenches and overlying the barrier layer. A platinum seed layer is deposited from the ionic seed solution by exposing the platinum ionic seed solution to ultraviolet light.

Abstract: Formulations and procedures for the deposition of precious metals onto solid substrates are disclosed wherein the formulations are iodide-free and contain an organosulfur compound and/or a carboxylic acid and a source of soluble precious metal ion which is one or more precious metal alkanesulfonates, precious metal alkanesulfonamides and/or precious metal alkanesulfonimides. The formulations and processes may be cyanide-free, and the deposition may be effected by electrolytic, electroless and/or immersion plating techniques.

Abstract: In a process for forming a mirror which includes sensitizing and activating a vitreous substrate, subsequently silvering the vitreous substrate to provide a silver coating thereon, and applying paint to the silver coating, the improvement including activating the vitreous substrate by contacting the vitreous substrate with a solution comprised of at least one ion selected from the group consisting essentially of bismuth (III), chromium (II), gold (III), indium (III), nickel (II), palladium (II), platinum (II), rhodium (III), ruthenium (III), titanium (III), vanadium (III) and zinc (II); and silvering the vitreous substrate by spraying a silvering solution onto a surface of the sensitized and activated vitreous substrate to form a silver coating on the surface, so that a mirror is formed which has no copper layer.