Abstract: Metal patterns (11, 11′, 11″) can be provided on a glass substrate (1) in an electroless process by modifying the substrate with a silane monolayer (3), nucleating said momolayer with a polymer-stabilized Pd sol (5) and, subsequently, locally removing the Pd nuclei and silane layer (9, 9′) with a pulsed laser. Neither a photoresist nor organic solvents are used. The method can very suitably be used for the manufacture of the black matrix on a faceplate of display devices, such as the passive plate for an LCD.

Abstract: A method of providing nickel barrier end terminations for a zinc oxide semiconductor device with exposed body surfaces and end terminal regions, in which the device is controllably reacted with a nickel plating solution only on an exposed end terminal region and thereafter provided with a final tin or tin-lead termination.

Abstract: The method for forming circuitization of the present invention provides a circuitized product which does not have a blanket seed layer and only has seed layer under the metal circuitization. Thus, short circuits between circuit lines are eliminated. It is a further advantage of the method of the present invention that it does not involve stripping portions of the seed layer. The method of the present invention requires less processing steps than conventional methods and employs positive resists which are developable by aqueous alkaline solutions.

Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.

Abstract: A process for selective electroless plating onto a substrate, including providing a substrate having at least a catalytic surface; providing a plating gel comprising a carrier vehicle, an electroless platable metal compound capable of providing metal ions to the carrier vehicle at a specific pH, a reducing agent, and a polymeric thickening agent; applying said plating gel to the substrate surface in a selected pattern, and inducing plating of said metal on the substrate surface in said selected pattern. A stabilizer, and/or buffering and/or organic chelating agent, and/or surfactant and/or a humectant may be included in the plating gel. Preferably the metal compound is a gold complex, and the substrate is aluminum nitride.

Abstract: An automated system for electroless metallization of optical glass fibers, includes a plurality of spaced apart plating stations having different solutions for electroless metallization of optical fibers. A motor-driven fiber transport and dipping apparatus is used in the system for shuttling optical glass fibers to the plating stations and immersing the optical glass fibers in the solutions. A programmable controller directs the transport and dipping apparatus to the plating stations in a selected order and at selected time intervals, and directs the apparatus at each of the stations to immerse the fibers into the solutions at a selected entry rate, for a selected duration, and at a selected withdrawal rate.

Abstract: The present invention provides methods of electrolessly depositing metal onto the surfaces of electronic components using an enclosable single vessel. The methods of the present invention include contacting the electronic components with an activation solution followed by contacting the electronic components with a metal deposition solution. In a preferred embodiment of the present invention, the oxygen levels in the activation solution and metal deposition solution are controlled in a manner for improved processing results. In another preferred embodiment of the present invention, the activation and metal deposition solutions are used one time without reuse.

Abstract: As an electroless plating technique capable of surely promoting the plating reaction without Pd substitution reaction and fastening the plating deposition, there are proposed an electroless plating method of subjecting a primary plated film (or metal film) formed on a substrate to a secondary plating (or electroless plating), characterized in that the secondary plating is carried out after a surface potential of the primary plated film is adjusted so as to be more base than such a most base surface potential that a surface current density of the primary plated film is zero in an electroless plating solution for the secondary plating; and a pretreating solution for electroless plating comprising an alkali solution, reducing agent and complexing agent; and an electroless plating bath suitable for use in this method.

Abstract: The present invention comprises a method of making a circuitized structure. The method comprises the steps of providing a substrate coated with a polymeric dielectric layer, treating the substrate with alkali, baking the substrate to modify the surface of the polymeric dielectric layer, applying a seed layer to the polymeric dielectric layer and applying a conductive layer to the seed layer. The invention also comprises a printed circuit structure produced by the method of the present invention.

Abstract: A method for forming a planar aluminum layer in a flat panel display structure. In one embodiment, the present invention creates a flat panel display structure having a raised black matrix defining wells within the matrix. The present embodiment then deposits a non-conformal layer of acrylic-containing aluminizing lacquer over a layer of phosphors residing within the wells of the black matrix. In so doing, the lacquer layer forms a substantially planar surface on top of the phosphors. The present invention then deposits a layer of catalyst material over the layer of lacquer so that the aluminizing lacquer can be burned off completely and cleanly at a relatively low temperature. The catalytic layer conforms to the planar surface of the lacquer layer. The present invention then deposits an aluminum layer over the catalytic layer. The aluminum layer, in turn, conforms to the planar surface of the catalytic layer. Finally, the present invention bakes off the non-conformal lacquer layer.

Abstract: A process for improving the adhesion of a copper surface to a resinous layer, the process comprising contacting the copper layer with an adhesion promoting composition comprising a reducing agent and a metal selected from the group consisting of gold, silver, palladium, ruthenium, rhodium, zinc, nickel, cobalt, iron and alloys of the foregoing metals.

Abstract: Metal wiring is provided in an integrated circuit by sputter coating onto a semiconductor substrate a copper seed layer; depositing and patterning a photoresist; electroplating or electrolessly plating a metal within the openings of the photoresist; stripping the remaining photoresist; and etching the copper seed layer with an etchant that preferentially etches the copper seed layer at a rate higher than that for the electroplated or electrolessly plated metal.

Abstract: Organic inherently conductive polymers, such as those based on polyaniline, polypyrrole and polythiophene, are sequentially formed in-situ onto polymeric surfaces that are chemically functionalized to molecularly bond the conductive polymers to the substrates. The polymeric substrate is preferably a preshaped or preformed thermoplastic film, fabric, or tube, although other forms of thermoplastic and thermoset polymers can be used as the substrates for functionalization using, most preferably, phosphonylation-based processes followed by exposure to an oxidatively polymerizable compound capable of forming an electrically conductive polymer. It has been found that the degree of electrical conductivity may be modulated by bonding further electrically conductive layers to the article. That is, each underlying conductive layer is functionalized prior to bonding of a subsequent conductive layer thereto until the degree of conductivity is achieved.

Abstract: A method for plating a high impact resistant plastic, particularly a polycarbonate substrate which has been modified with up to about 50 percent by weight of acrylonitrile-butadiene-styrene. The surface of the plastic is first conditioned with a halogenated organic solvent conditioner, preferably 1-3-dichloro-2-propanol, prior to the electrochemical deposition of the desired metal layer.

Abstract: Ultra smooth as-deposited electroless nickel coatings are achieved employing a plating bath containing aluminum and/or copper ions. Embodiments include electroless deposition of an amorphous nickel-phosphorous coating on a glass, glass-ceramic, ceramic, or aluminum-containing substrate, with an as deposited average surface roughness (Ra) of less than about 16 .ANG., depositing an underlayer, and depositing a magnetic layer to form a magnetic recording medium.

Abstract: An electrolytic process and apparatus which can operate in a hydrogen reaction chamber at a hydrogen reaction rate corresponding to the increase in the rate of production of hydrogen accompanying the increase in the electrolysis rate and maintain the current efficiency at a very high value with respect to the electrolytic current for producing hydrogen and a process for the production of an electrode for this purpose.

Abstract: This invention covers a cathodic element free from asbestos fibres that can be obtained by deposition after filtration through a porous medium of an aqueous suspension comprising electrically conductive fibres, at least one cationic polymer, at least one electocatalytic agent, at least one pore-forming agent and at least one binder selected from among the fluoropolymers. The invention also covers a method for preparing such a cathodic element.

Abstract: There is disclosed a method of manufacturing a dielectric filter in which the dielectric filter can be manufactured in a short time, machining accuracy is raised and a cutting tool is prevented from being easily damaged. First in a degreasing process (S1), a surface of a porcelain element body 2 is cleaned. In a surface roughing process (S2), in order to enhance the adhesion of a plating layer to be formed later, the surface of the porcelain element body 2 is etched to form a rough face. Subsequently, after a catalyzer layer is formed entirely on the surface of the porcelain element body 2 (S3), a portion of the catalyzer layer is removed with an ultrasonic cutter (S4). Then, formed is a region on which an insulating region is to be formed. Subsequently, in a plating process (S5), a conductive layer is formed on a region other than the insulating region. The dielectric filter is thus manufactured. Since the catalyzer layer is thin, it can be removed in a short time, and is superior in productivity.

Abstract: According to aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a shaft extending into the tank, and a substrate holder mounted to the shaft. The shaft and the tank are rotatable relative to one another. The substrate holder is configured to support a substrate in position so that at least a first face of the substrate is exposed to the plating solution in the tank.

Abstract: Gold is deposited on a copper base defining electrical circuit features disposed on a substrate containing a palladium seeder, by initially treating the substrate with an alkaline cleaner, followed by treating the substrate with sodium persulfate, and subsequently treating the substrate with a diluted sulfuric acid solution. The substrate is rinsed between each one of the treatments, and after the final rinse following treatment with diluted sulfuric acid, the substrate is immersed in a gold deposition solution whereby gold is deposited on the exposed surfaces of the copper circuit features on a substrate. The process embodying the present invention provides a method for depositing gold on high density copper conductor lines or pads, even in areas of the surface in which the conductors are spaced apart 2.0 mil or less, without cleaning or removing the palladium seed from the surface.

Abstract: A method of transferring a chemical activating agent from an applicator to a substrate surface involves providing an applicator having a raised application surface, applying a chemical activating agent to the application surface, contacting the substrate surface with the application surface, and removing the applicator. The chemical activating agent is transferred in a form in which it is capable of effecting a chemical reaction, such as catalysis, at the surface. Thus, following transfer of the chemical activating agent to the surface in a pattern, a metal can be plated at the substrate surface in the pattern. The applicator can be an elastomeric stamp having a raised portion defining a stamping surface.

Abstract: Copper or copper alloy interconnection patterns are formed with improved barrier layer protection against copper diffusion. A damascene opening is formed in a dielectric layer and a barrier layer is deposited lining the damascene opening and on the dielectric layer. Embodiments include forming a nitride barrier layer with a plasma generated in a chamber containing a shutter which prevents sputtered atoms from impinging on the dielectric layer. The shutter is then opened to allow a metal layer, e.g., Al, Mg or an alloy thereof, to be sputter deposited on the nitride layer in the chamber. Copper or a copper alloy is then deposited to fill the opening, as by electroplating or electroless plating.

Abstract: A method for depositing copper on a titanium-containing surface of a substrate is provided. The method includes forming a patterned catalyst material on the substrate, such that the titanium-containing surface is exposed in selected regions. The catalyst material has an oxidation half-reaction potential having a magnitude that is greater than a magnitude of a reduction half-reaction potential of titanium dioxide. Copper is then deposited from an electroless solution onto the exposed regions of the titanium-containing surface.

Abstract: Disclosed is a method of forming electroless metal plating layers on one single surface of a plastic substrate and the product thereof. The method includes steps of degreasing or pre-etching the material for forming the substrate, etching the material, adding catalysis, activating, drying, spraying non-conducting paint on a first surface of the material, accelerating, forming an electroless copper plating layer on a second surface of the material, activating, forming an electroless nickel plating layer on the second surface of the material, sealing, dehydrating, drying, inspecting, and packing. Wherein, the steps of spraying non-conducting paint and drying give the material a beautiful painted appearance on the first surface thereof. The non-conducting paint on the first surface of the material facilitates easy formation of smooth electroless copper and nickel plating layers on the second surface of the material. Therefore, a product of the method can be used in electronic products requiring high sensitivity.

Abstract: Method and baths for electroless depositing Cu on a semiconductor chip using four preferred Cu electroless baths. All four preferred electroless baths use hypophosphite as a reducing agent. The 4 baths use the following mediators (1) Nickel sulfate, (2) Pd Sulfate (3) Co Sulfate (4) Fe Sulfite, and complexing agents (Na Citrite, Boric Acid, Ammonium Sulfite). The baths can operate at a pH between 8 and 10. The invention forms high purity Cu interconnects having adequate step coverage to form in a hole having an aspect ratio greater than 2.7 to 1.

Abstract: The invention relates to a process for the continuous chemical metallizing of porous substrates in a wet-chemical manner. According to the invention, the different reaction rates of the adsorption or ionic reduction reaction, in the case of activating with Pd/Sn, are adapted to the chemical metallizing reaction used. The removal of the spent process solutions from the pores of the substrate takes place by suction. The invention permits a continuous implementation of the process of depositing a metal layer on an electrically non-conductive, synthetic substrate, which can be used at the start of a galvanic reinforcing process of the chemically deposited metal coating.

Abstract: The process for producing through-connected printed circuit boards or multilayered printed circuit boards with a polymer base with conductive polymers using a combined desmearing and direct metalization process (multilayering) is performed by subjecting the polymer base materials, provided with bore holes, to the following process steps:1) swelling in a per se known treatment liquid and rinsing with water;2) treatment with alkaline permanganate solution (desmearing);3) rinsing with water;4) rinsing with acidic aqueous solution (pH value about 1, rinsing time 10 to 120 s, depending on acid content);5) rinsing with water;6) rinsing with alkaline aqueous solution (pH 8 to 9.5);7) rinsing with water;8) rinsing with microemulsion of ethylene-3,4-dioxythiophene (catalyst);9) rinsing with acid (fixation);10) rinsing with water;11) coppering;12) rinsing with water; and13) drying;14) usual process steps for creating the printed circuit pattern.

Abstract: A die for press-molding glass optical elements which can press-mold glass optical elements having high melting points and various shapes repeatedly, which includes a base material having high strength on which a cutting layer having heat resistance and free cutting machinability is formed. After cutting the cutting layer into the desired shape with high accuracy, the die is coated with a surface protective film.

Abstract: A hydrophilic activating catalytic solution for electroless plating is a mixture of lactate, palladium and alkaline medium. The solution enables depositing palladium catalyst in a short time radiation exposure and removing unwanted photo-sensitive film more effectively by water or the like. The lactate preferably comprises copper lactate and/or zinc lactate and the palladium salt is preferably palladium chloride.

Abstract: Applications of a metallized textile. The textile is activated by precipitating noble metal nucleation sites on the fibers of the textile. Immersing the activated textile in a suitably prepared solution of a metal cation, and adding a reducing agent, leads to the formation of a metal plating tightly and intimately bonded to the fibers of the textile. Exposure of the metallized textile to air oxidizes the surface of the metal plating. Applications of the metallized textile include acaricides, fungicides, bactericides, armor, electrodes, anti-static devices, RF shielding, and radar reflectors.

Abstract: Metallic silver is deposited upon the surface of a nonconducting substrate using a multi-step wet deposition process. The surface is cleaned, and then activated in an aqueous solution containing stannous tin. The silver is deposited as a colloidal material from an aqueous solution of a silver-containing salt, a reduction agent that reduces the salt to form the metallic silver, and a deposition control agent that prevents the silver from nucleating throughout the solution. After the substrate is coated, the coating is stabilized in an aqueous solution of a salt of a metal from the platinum group or gold, dissolved in dilute hydrochloric acid. The process is particularly effective for depositing uniform films of 2 to 2000 Angstroms thickness, which strongly adhere to the substrate.

Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.

Abstract: This invention describes the coating of a nickel-phosphorous bond on steel sheets or pipes of common carbon steel with the aim of forming an Fe--Ni--P bond, using a process of diffusion and enabling the resistance of the exhaust gases to corrosion. The deposit, when submitted to continual use of the vehicle, forms an intermetallic layer, which each time protects the substrate against corrosion.

Abstract: The subject invention relates to a type of metal dual-color extruded plastic key; said key comprising an electroplatable plastic material and a non-electroplatable plastic material; said two parts being subjected to plastic dual-color extrusion forming process; said non-electroplatable plastic material serving to produce a letter or figure; the area surrounding said non-electroplatable plastic material being the electroplatable plastic material; the surface of said electroplatable material being a layer of light-proof electroplated coating, to form the required metal surface; whereby the non-electroplatable plastic material being used to form the area where the letter or figure is to appear, so the lighting could permeate from the letter or figure; the above structure is so designed to provide a high added value to the key product with an exterior of excellent light permeability and comfortable touch.

Abstract: A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed.

Abstract: The present invention provides a novel method of reducing the amount of seed deposited on polymeric dielectric surfaces. The method comprises the following steps: providing a work-piece coated with a polymeric dielectric layer; baking the work-piece to modify the surface of the polymeric dielectric layer; then applying the seed to polymeric dielectric layer and electrolessly plating metal to the seed layer. The invention also relates to a circuit board produced by the method of the present invention.

Abstract: A process for the currentless metallization of electrically non-conductive substrates, includes providing a substrate which is electrically non-conductive; depositing on the substrate a positive lacquer comprising at least one polymer which is UV hardenable, at least one organo-metalllic compound, and a substance which is light-active to provide a positive lacquer coated substrate; irradiating the positive lacquer coated substrate with UV radiation to provide an irradiated coated substrate; and precipitating a metal layer onto the irradiated coated substrate by currentless metallization in a bath effective therefore.

Abstract: A method of electroless plating at least one homogeneous metal coating in a predetermined pattern on a solid substrate surface having pendant hydroxy groups. The method includes the steps of providing a first monatomic metal layer in a predetermined pattern on the solid substrate surface having pendent hydroxy groups and then immersing the solid substrate surface in a bath containing a chemical reducing agent to build up the at least one homogeneous metal coating only on the monatomic metal layer.

Abstract: In accordance with the present invention, it has been discovered that conductive traces made from transient liquid phase sintering (TLPS) pastes, plated by electroless or electrolytic means, result in improved solderability, adhesion and conductivity of the circuitry. Transient liquid phase sintering pastes employed in the practice of the present invention differ from conventional metal loaded polymer thick film (PTF) inks in that they contain, in addition to a binder, they also contain both a relatively high melting metal powder and a relatively low melting solder powder capable of forming a continuous intermetallic/metallic phase after sintering. The present invention is particularly useful, for example, for the fabrication of single and multi-layer printed circuit boards, providing horizontal and vertical conductive interconnects, metallized through-holes, and conductive pads for electronic component attachment.

Abstract: This invention provides a method of electroplating a non-conductive material, the method comprising the steps of bringing a non-conductive material into contact with an acidic hydrosol solution containing a palladium compound, a stannous compound and a copper compound, bringing the material into contact with an aqueous alkaline solution, and electroplating the material. According to the method of the invention, a desired coating having an excellent decorative appearance can be formed by electroplating without involving electroless plating on even a non-conductive material having a large area such as plastic molded components.

Abstract: Bridging between electrically conductive circuit features during conformal plating is prevented by avoiding the deposition of catalytic seed material onto non-circuit areas of the substrate. Preparatory to forming electrical circuit features on a nonconductive substrate by the full additive process, extraneous seed material is either trapped between two layers of a photoimageable film, whereby it is unavailable during plating, or deposited on the surface of an aqueous photoimageable film, which is removed prior to plating. The method embodying the present invention eliminates the need for seed removal after initial plating and prior to conformal plating of a precious metal over the initial plating.

Abstract: A formaldehyde-free chemical bath containing a palladium salt, a nitrogenated completing agent, and formic acid or formic acid derivatives, at a pH of greater than 4 and a process of using the chemical bath for depositing on a metal surface an adhesive, permanently glossy, bright palladium layer with few pores. The metal surface may be pretreated in a cementation palladium bath. The metal surface contains at least one of copper, nickel, and cobalt, as well as their alloys with one another and/or with phosphorus or boron.

Abstract: A breathable, decorative wallcovering having a smooth, continuous, aesthetically appealing exposed surface which can be printed with a design or pattern having sharply defined edges, and having a relatively high moisture permeability, includes a porous polymeric ply fused to and supported by a nonwoven substrate ply which consists of an array of hydroentangled fibers. The porous polymeric ply is formed by thermally fusing a plastisol coating, which is applied to the nonwoven substrate ply, and which has a thickness sufficiently low to permit localized variations in fiber orientation and small variations in the thickness of the nonwoven substrate ply to cause the formation of a multiplicity of miniature discontinuities which are substantially invisible to the unaided eye and which are randomly distributed throughout the coating. The plastisol coating is, however, thick enough to allow the formation of a coating which upon thermal fusion provides a polymeric ply having a smooth continuous appearance.

Abstract: There is provided a method of forming a conductive film having a predetermined pattern in hybrid ICs, high frequency dielectric filters and the like which makes it possible to safely and efficiently perform a series of the steps of preparing an activating catalytic solution for forming a photoreactive film on a base, forming the photoreactive film through the application of the activating catalytic solution, producing an activating catalyst by exposing particular regions of the photoreactive film, developing by flushing away the photoreactive film in unexposed regions, and immersing the base in an electroless plating bath without using an organic solvent and which allows the formation of a plating film having high electrical conductivity and high strength of adherence. A hydrophilic activating catalytic solution is used which is obtained by dissolving copper oxalate, a palladium salt such as palladium chloride into an alkaline solution such as ammonia.

Abstract: A process for activating a textile to catalyze the reduction of a metal cation, a process for metallizing the activated textile with the reduced metal, and the activated textile and metallized textile thereby produced. The textile is activated by precipitating noble metal nucleation sites on the fibers of the textile. Immersing the activated textile in a suitably prepared solution of a metal cation, and adding a reducing agent, leads to the formation of a metal plating tightly and intimately bonded to the fibers of the textile.

Abstract: An apparatus and a method for its use for plating pin grid array packaging modules, with a fixture capable of simultaneously holding a plurality of said pin grid array modules such that three-dimensional bottom surface metallurgy (BSM) is sealingly protected during plating of top surface metallurgy (TSM).

Abstract: A system for selective chemical vapor deposition of polymers onto a substrate. A substrate is provided which comprises a plurality of surface regions, wherein the surface of at least one region provides a more favorable nucleation site for at least one of a polymer or polymer precursor than at least one other region. This may be an intrinsic characteristic of the substrate or may be accomplished through surface treatment of a substrate. The substrate is subjected to chemical vapor deposition of a reactive monomer, producing a polymer coating which is substantially thicker in the regions of favorable nucleation than in the regions of unfavorable nucleation.

Abstract: The present invention teaches electroless liquid vapor deposition/etching process for depositing on a reactive or non-reactive substrate surface or etching a film on a substrate surface in a bathless deposition apparatus during ULSI processing by the steps of: applying liquid chemical precursor solutions to the surface of the substrate, the liquid chemical precursor solutions are reactive to one another and enter the chamber of the inert atmosphere deposition apparatus separately; spinning the substrate during the application of the liquid chemical precursor solutions; and depositing or etching the film. The process may be implemented in inert atmosphere by enclosing the whole arrangement in a chamber and flowing inert gases such as Ar, He, and N.sub.2, etc.

Abstract: A method of producing mirrors comprising depositing a reflecting metal layer by pyrolysis on a ribbon of hot glass during the glass production process characterized by applying to the glass ribbon prior to deposition of the reflecting metal layer a primer for enhancing metal nucleation on the glass. The invention also provides a method of producing mirrors during the glass production process the method comprising pre-treating the surface of a ribbon of hot glass with an activating agent and pyrolytically depositing over the pre-treated surface a reflecting metal layer.

Abstract: A process for depositing catalytically active platinum metal layers from an ionogenic, acidic, platinum metal ions-containing solution which further contains sulfonic acid. This activation leads to more uniform catalyst layers with greater surfaces which are catalytically more efficient. The process according to the invention can be implemented in any chemical process utilizing platinum metal catalysts, e.g. chemical synthesis, environment applications or metallization of surfaces.