Abstract: Method for plating an electroless nickel phosphorus containing alloy deposit on a substrate where the deposit has a high weight percent of phosphorus above 8 or 10 weigh percent and is plated at high deposition rates above 10 and up to 25 micrometers per hour and where the plating deposition is conducted in the presence of a nickel chelating agent having a stability constant, log K.sub.a, above 3 such as citric acid and at a pH of from about 5.0 to about 8.0.

Abstract: The process for producing through-connected printed circuit boards or multilayered printed circuit boards with a polymer base with conductive polymers using a combined desmearing and direct metalization process (multilayering) is performed by subjecting the polymer base materials, provided with bore holes, to the following process steps:1) swelling in a per se known treatment liquid and rinsing with water;2) treatment with alkaline permanganate solution (desmearing);3) rinsing with water;4) rinsing with acidic aqueous solution (pH value about 1, rinsing time 10 to 120 s, depending on acid content);5) rinsing with water;6) rinsing with alkaline aqueous solution (pH 8 to 9.5);7) rinsing with water;8) rinsing with microemulsion of ethylene-3,4-dioxythiophene (catalyst);9) rinsing with acid (fixation);10) rinsing with water;11) coppering;12) rinsing with water; and13) drying;14) usual process steps for creating the printed circuit pattern.

Abstract: A die for press-molding glass optical elements which can press-mold glass optical elements having high melting points and various shapes repeatedly, which includes a base material having high strength on which a cutting layer having heat resistance and free cutting machinability is formed. After cutting the cutting layer into the desired shape with high accuracy, the die is coated with a surface protective film.

Abstract: The present invention provides a novel method of reducing the amount of seed deposited on polymeric dielectric surfaces. The method comprises the following steps: providing a work-piece coated with a polymeric dielectric layer; baking the work-piece to modify the surface of the polymeric dielectric layer; then applying the seed to polymeric dielectric layer and electrolessly plating metal to the seed layer. The invention also relates to a circuit board produced by the method of the present invention.

Abstract: A method for electroless deposition of Cu.sub.x In.sub.y Ga.sub.z Se.sub.n (x=0-2, y=0-2, z=0-2, n=0-3) precursor films and powders onto a metallic substrate comprising:preparing an aqueous bath solution of compounds selected from the group consisting of:I) a copper compound, a selenium compound, an indium compound and gallium compound; II) a copper compound, a selenium compound and an indium compound; III) a selenium compound, and indium compound and a gallium compound; IV) a selenium compound and a indium compound; and V) a copper compound and selenium compound; each compound being present in sufficient quantity to react with each other to produce Cu.sub.x In.sub.y Ga.sub.z Se.sub.n (x=0-2, y=0-2, z=0-2, n=0-3);adjusting the pH of the aqueous bath solution to an acidic value by the addition of a dilute acid; andinitiating an electroless reaction with an oxidizing counterelectrode for a sufficient time to cause a deposit of Cu.sub.x In.sub.y Ga.sub.z Se.sub.

Abstract: Disclosed are an electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, the plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and 1.2.times.10.sup.-4 to 1.2.times.10.sup.-3 mole/l of an iron ion compound as a reaction initiator and/or 1.92.times.10.sup.-4 to 1.92.times.10.sup.

Abstract: Metallic silver is deposited upon the surface of a nonconducting substrate using a multi-step wet deposition process. The surface is cleaned, and then activated in an aqueous solution containing stannous tin. The silver is deposited as a colloidal material from an aqueous solution of a silver-containing salt, a reduction agent that reduces the salt to form the metallic silver, and a deposition control agent that prevents the silver from nucleating throughout the solution. After the substrate is coated, the coating is stabilized in an aqueous solution of a salt of a metal from the platinum group or gold, dissolved in dilute hydrochloric acid. The process is particularly effective for depositing uniform films of 2 to 2000 Angstroms thickness, which strongly adhere to the substrate.

Abstract: Processes for producing improved environmental protection, corrosion resistance and improved paint adhesion for metals; e.g., ferrous, aluminum, or magnesium alloys; and other surfaces upon contact is disclosed. The processes comprise use of one or more Group IV-A metals such as zirconium in an acidic solution with one or more oxyanions or other non-fluoanions to stabilize and solubilize the metal while fluorides are specifically excluded from the processes and compositions. The processes optionally contain pretreatment stages that serve to activate a surface and/or promote formation of a Group IV-A metal oxide matrices through use of an oxygen donor. The compositions are at a pH below about 5.0 and is preferably in a range between about 1.0 and about 4.0. The coatings may contain surfactants, sequestering agents, or organic additives for improved corrosion protection and paint adhesion. The substrate may be treated by immersion, spray, fogging or rollcoat.

Abstract: This invention describes the coating of a nickel-phosphorous bond on steel sheets or pipes of common carbon steel with the aim of forming an Fe--Ni--P bond, using a process of diffusion and enabling the resistance of the exhaust gases to corrosion. The deposit, when submitted to continual use of the vehicle, forms an intermetallic layer, which each time protects the substrate against corrosion.

Abstract: A method of manufacturing a general type press forming knife-mould made of plain, soft and thin material, being comprised of selecting a medium, low carbon steel plate as a base whereon a knife edge having a desired contour is formed by shaping milling, then the knife edge or the knife edge together with the milled base being placed into a plating tank for hard chromium plating to increase hardness of the knife edge to Rockwell hardness 70 degrees; thereby, cost for material selection and cost of production of the knife-mould can be lowered, the life of use of the knife-mould can be prolonged, and the knife-mould can get a rust-proof effect by the method and is suitable for press forming of plain papers, card boards or plastic plates etc. on a knife-mould mounting machine.

Abstract: A drive key (10) for an aircraft wheel comprises a hardened and tempered steel member (10) having improved wear and corrosion resistance. The steel member (10) is coated selectively with a tungsten carbide-cobalt coating (22) to provide wear resistance at side portions (18) where the drive key (10) is engaged by portions of an aircraft brake, and the entire steel member (10) including the tungsten carbide-cobalt coating can be plated with electroless nickel to provide improved corrosion resistance.

Abstract: An improved process for chromizing commercial quantities of small, industrial, ferrous-based parts, such as but not limited to threaded connectors, pins, bolts, nuts, washers, fasteners, fittings, couplings, studs, etc., uses a retort filled with layers of parts coated with a chromium-containing slurry. The plurality of parts are arranged in layers on sheets of refractory felt paper and are heat treated simultaneously for causing the chromizing reaction between the slurry and the ferrous-based parts.

Abstract: This invention provides a method of electroplating a non-conductive material, the method comprising the steps of bringing a non-conductive material into contact with an acidic hydrosol solution containing a palladium compound, a stannous compound and a copper compound, bringing the material into contact with an aqueous alkaline solution, and electroplating the material. According to the method of the invention, a desired coating having an excellent decorative appearance can be formed by electroplating without involving electroless plating on even a non-conductive material having a large area such as plastic molded components.

Abstract: A method of utilizing electroless copper deposition to form interconnects on a semiconductor wafer. Once a via or a trench is formed in a dielectric layer, a titanium nitride (TiN) or tantalum (Ta) barrier layer is blanket deposited. Then, a contact displacement technique is used to form a thin activation seed layer of copper on the barrier layer. An electroless deposition technique is then used to auto-catalytically deposit copper on the activated barrier layer. The electroless copper deposition continues until the via/trench is filled. Subsequently, the surface is polished by an application of chemical-mechanical polishing (CMP) to remove excess copper and barrier material from the surface, so that the only copper and barrier material remaining are in the via/trench openings. Then an overlying silicon nitride (SiN) layer is formed above the exposed copper in order to form a dielectric barrier layer.

Abstract: A sanitary article, particularly a sanitary fitting or plumbing fitting, having a coated surface, in which on a coating face and/or below a coating face is provided at least one print image which color-contrasts with the coating.

Abstract: Durable electrolytic cell electrodes having low hydrogen overpotential and performance stability. A highly porous electrocatalytic primary phase and an outer, secondary phase reinforcement coating are provided on an electrically conducting transition metal substrate to make the electrodes. Durability is achieved by the application of the outer secondary phase to protect the primary phase electrocatalytically active coating. A process is also disclosed for catalizing a substrate surface to promote electroless deposition of a metal.

Abstract: There is provided a method of forming a conductive film having a predetermined pattern in hybrid ICs, high frequency dielectric filters and the like which makes it possible to safely and efficiently perform a series of the steps of preparing an activating catalytic solution for forming a photoreactive film on a base, forming the photoreactive film through the application of the activating catalytic solution, producing an activating catalyst by exposing particular regions of the photoreactive film, developing by flushing away the photoreactive film in unexposed regions, and immersing the base in an electroless plating bath without using an organic solvent and which allows the formation of a plating film having high electrical conductivity and high strength of adherence. A hydrophilic activating catalytic solution is used which is obtained by dissolving copper oxalate, a palladium salt such as palladium chloride into an alkaline solution such as ammonia.

Abstract: A process for activating a textile to catalyze the reduction of a metal cation, a process for metallizing the activated textile with the reduced metal, and the activated textile and metallized textile thereby produced. The textile is activated by precipitating noble metal nucleation sites on the fibers of the textile. Immersing the activated textile in a suitably prepared solution of a metal cation, and adding a reducing agent, leads to the formation of a metal plating tightly and intimately bonded to the fibers of the textile.

Abstract: An apparatus and a method for its use for plating pin grid array packaging modules, with a fixture capable of simultaneously holding a plurality of said pin grid array modules such that three-dimensional bottom surface metallurgy (BSM) is sealingly protected during plating of top surface metallurgy (TSM).

Abstract: The present invention teaches electroless liquid vapor deposition/etching process for depositing on a reactive or non-reactive substrate surface or etching a film on a substrate surface in a bathless deposition apparatus during ULSI processing by the steps of: applying liquid chemical precursor solutions to the surface of the substrate, the liquid chemical precursor solutions are reactive to one another and enter the chamber of the inert atmosphere deposition apparatus separately; spinning the substrate during the application of the liquid chemical precursor solutions; and depositing or etching the film. The process may be implemented in inert atmosphere by enclosing the whole arrangement in a chamber and flowing inert gases such as Ar, He, and N.sub.2, etc.

Abstract: The present invention relates to a bond enhancement process for promoting strong, stable adhesive bonds between surfaces of copper foil and adjacent resin impregnated substrates or superimposed metallic sublayers. According to the process of the invention, a black oxide-coated copper surface is treated with an aqueous reducing solution containing sodium metabisulfite and sodium sulfide to convert the black oxide coating to a roughened metallic copper coating. The roughened metallic copper-coated surface is then passivated and laminated to a resin impregnated substrate. The bond enhancement process is especially useful in multilayer printed circuit fabrication and in the treatment of copper circuit lines and areas which are disconnected from each other, that is, which do not have electrically conductive continuity.

Abstract: A copper-tungsten or copper-molybdenum substrate is plated with a nickel/gold plating by first activating a surface of the substrate. In activating, the surface is contacted to a concentrated alkaline solution at elevated temperature, and then to a concentrated acidic solution. The surface is thereafter plated with a nickel strike layer, plated with a nickel primary layer overlying the nickel strike layer, sintered, re-activated in a concentrated acidic solution, plated with a nickel secondary layer overlying the nickel primary layer, and plated with a gold layer overlying the nickel secondary layer.

Abstract: A process for depositing catalytically active platinum metal layers from an ionogenic, acidic, platinum metal ions-containing solution which further contains sulfonic acid. This activation leads to more uniform catalyst layers with greater surfaces which are catalytically more efficient. The process according to the invention can be implemented in any chemical process utilizing platinum metal catalysts, e.g. chemical synthesis, environment applications or metallization of surfaces.

Abstract: An optimized electroless copper plating technique suitable for plating electroless copper upon ceramics.

Abstract: A method for forming a magnetic transducer, and a magnetic transducer formed through the method. There is first provided a substrate. There is then formed over the substrate a first magnetic pole layer. There is then formed upon the first magnetic pole layer a gap filling dielectric layer. There is then formed upon the gap filling dielectric layer a seed layer. There is then formed upon the seed layer a photoresist frame employed in a photoresist frame plating method for forming a plated second magnetic pole layer upon the seed layer, where a base of a sidewall of the photoresist frame has a taper which provides a notch within an edge of the plated second magnetic pole layer at its interface with the seed layer.

Abstract: A method of selectively fabricating metallization on a dielectric substrate is disclosed. A seed layer is sputtered on a polymer dielectric, a patterned photoresist mask is disposed over the seed layer, exposed portions of the seed layer are etched, the photoresist is stripped, and copper is deposited without a mask by electroless plating on the unetched seed layer to form well-adhering high density copper lines without exposing the photoresist to the electroless bath.

Abstract: Methods and apparatus are disclosed for imprinting a catalyst and/or adsorbent composition on a flat or corrugated substrate. The coated substrate is useful in pollutant treating devices to remove pollutants from a gas.

Abstract: This invention is to provide a multilayer printed circuit board having excellent appearance and reliability and a method of producing the same, and proposes a build-up multilayer printed circuit board comprising an interlaminar insulating layer 4 comprised of an adhesive for additive process between an inner layer copper pattern 3 provided at its surface with a fine uneven layer 9 and an outer layer copper pattern 6 in which the surface of uneven layer 9 in the inner layer copper pattern 3 is covered with a metal layer containing one or more of metals having an ionization tendency not lower than that of copper but not higher than that of titanium, or a noble metal layer 10, and a production technique therefor.

Abstract: A method for the deposition of a diamond film, which includes the steps of immersing metallic or nonmetallic substrate in and electroless nickel plating bath containing a reducing agent to form a nickel layer; and depositing the diamond film on the electroless nickel plated substrate. As a result, employing electroless plating to form an inter layer is improved. In addition, the diamond film can be formed regardless of the type of materials used.

Abstract: A method producing a coating on a substrate by aluminizing, chromizing or siliconizing the substrate, and depositing on the coated substrate by electrolytic or electroless deposition a metal matrix M.sub.1 from a bath containing particles of CrAlM.sub.2 to co-deposit the particles with the matrix as M.sub.1 CrAlM.sub.2, where M.sub.1 is Ni, Co or Fe or two or all of these elements and M.sub.2 is Y, Si, Ti, Hf, Ga, Nb, Mn, Pt, a rare earth element or two or more of these elements. Preferably, the method includes platinum aluminizing of the substrate. Heat treatments may be incorporated before and after deposition of the M.sub.1 CrAlM.sub.2. The deposition of the M.sub.1 CrAlM.sub.2 is carried out at a current density of less than 5 mA per square centimeter. Preferably, the deposition forms a M.sub.1 CrAlM.sub.2 layer less than 50 microns thick, and occurs at a bath loading of less than 40 grams per liter of the particles.

Abstract: A process for preparing a solder bump can be prepared by the following procedure. The chip package was cleaned with an alkali or acid solution followed by Zn displacement (zincating)in a displacement solution which comprises NaOH, Z.sub.n o, potassium sodium tartrate and sodium nitrate. After zinc displacement the chip package was performed the electroless Ni--Cu--P deposit in the strong reducing solution which contains NaH.sub.2 PO.sub.2. The chip package deposited with Ni--Cu--P was then dipped into an organic solution as flux which is a mixture of the stearic acid and glutamic acid. Finally, dip soldering of the Ni--Cu--P deposited chip packages in a molten solder bath at a temperature 40.degree..about.80.degree. C. higher than the melting point of the corresponding Pb--Sn alloy.

Abstract: A process is disclosed for preparing an aramid surface to be metal plated by nonaqueous treatment with a strong base followed by water washing--all in the absence of metal cations.

Abstract: A method for monitoring the constituents present in an electroless plating bath solution. The method involves measuring ac spectra using a working electrode which has a high hydrogen overvoltage. First, a selected dc potential is applied to a working electrode which has been subjected to pretreatment and which is present in the electroless bath being analyzed. The electrode must have a high hydrogen overvoltage and is preferably an alloy of a low hydrogen overvoltage noble metal and a high overvoltage metal. A constant ac signal is superimposed on the dc potential. The dc potential is then swept over a chosen range at a selected sweep rate. The various constituents in the bath are then monitored by measuring the ac current at one or more reference phase angles with respect to the constant ac signal between the working electrode and a reference electrode as the dc potential is varied. The resulting ac spectra provides a useful measurement of the make-up of the constituents in the electroless plating solution.

Abstract: A method for plating a graphite aluminum metal matrix composite material with nickel and gold utilizes the steps of: cleaning a surface of the metal matrix composite material so as to substantially remove grease and particulates therefrom; forming a layer of copper upon the surface of the metal matrix composite material; heating the copper layer to drive out entrapped fluids; applying acid to the copper layer to remove oxidation therefrom; forming a layer of nickel upon at least a portion of the layer of copper; heating the nickel layer to relieve stress therein; and electrolytically forming a layer of gold upon at least a portion of the layer of nickel.

Abstract: A metal material characterized in that the material comprises a substrate metal, a film comprising a nickel fluoride layer and formed on the substrate metal, and a film comprising a carbon layer and formed on the film.

Abstract: A composite material of silicon carbide particles in an aluminum matrix is base coated with a layer of a nickel-boron alloy by an electroless process. The base-coated composite material is heat treated at a temperature of about 450.degree. C. to interdiffuse the base coating with the composite material. A nickel or gold top layer is electrolytically deposited over the base coat on the heat-treated composite material.

Abstract: A substrate metal such as aluminum or titanium, usually in the form of a web, is anodized to form a porous unsealed oxide coating. An inexpensive core metal such as copper or chromium is then electrodeposited in the pores of the oxide coating to form metal nodules extending above the oxide coating in a bulbous, undercut configuration. A second metal, usually an expensive catalytic metal, is deposited onto the surface of the core metal nodules by electro or chemical deposition. A large surface area of catalyst is formed with the use of a minimum amount of catalyst metal. The nodules may be liberated from the substrate metal surface by dissolving the oxide layer and releasing discrete particles to form a fine catalyst powder.

Abstract: The present invention provides a method for application of metal coatings, specifically copper and silver, to continuous ceramic fibers, by electroless deposition. The method comprises the steps of: winding the uncoated ceramic fibers over a frame so that the fibers are coiled adjacent to each other; introducing the wound ceramic fibers into a solution of metal with which the fibers are to be coated; circulating the solution through said fibers; and contacting and causing the metal to be deposited on the wound fibers. Coated continuous ceramic fibers produced by the method of the present invention are also included within the scope of this invention.

Abstract: The protection against black and white rust on zinciferous surfaces by a conventional chromating treatment is improved by drying into place on the zinciferous surface before chromating a pre-treatment composition that contains hexavalent chromium ion plus one or more salts of nickel and cobalt, in an amount to produce an add-on of 0.5 to 100 mg/m.sup.2 of metal.

Abstract: A method is provided for creating gated filament structures for a field emission display. A multi-layer structure is provided that includes a substrate, an insulating layer, a metal gate layer positioned on a top surface of the insulating layer and a gate encapsulation layer positioned on a top surface of the metal gate layer. A plurality of gates are provided and define a plurality of apertures on the top of the insulating layer. A plurality of spacers are formed in the apertures at their edges on the top surface of the insulating layer. The spacers are used as masks for etching the insulating layer and form a plurality of pores in the insulating layer. The pores are plated with a filament material to create a plurality of filaments. The pores can be overplated to create the plurality of filaments. The filaments are vertically self-aligned in the pores.

Abstract: The invention provides a method and structure in which a nucleating species [54] is implanted through apertures [52] of a metal-phobic layer [40] into a support layer [17] and copper or a like metal is selectively grown at the implant site or sites. The implant support layer [17] is preferably composed of a material which inhibits diffusion therethrough of the copper or other like grown metal.

Abstract: A process for efficient modification and metallization of substrates includes the steps of providing a substrate with highly photoefficient chemical functional groups on at least a portion of this substrate, exposing the substrate to actinic radiation to transform, deactivate, or remove these chemical functional groups, to modify their chemical reactivity, and carrying out further chemical reaction steps on these modified chemical functional groups.

Abstract: The present invention relates in one aspect to a method of manufacture of a security thread suitable for use in security articles including security paper such as that used for banknotes. In the method a magnetic metal is deposited on a film of polymeric substrate as the substrate passes through a solution containing the magnetic metal and a preparatory operation is carried out on a surface of the substrate prior to immersion of the substrate in the solution. The preparatory operation ensures that magnetic metal is deposited on the substrate in a pattern such that when the security thread is produced from the film by cutting the film the magnetic metal on the security thread has a specific pattern and provides both a visually discernible security feature and a magnetically detectable security feature.

Abstract: A laminated structure (1) comprising a substrate (3) and a polymer layer (5) is provided. The polymer layer consists of conductive areas (7) having a sheet resistance of maximally 1000 .OMEGA./square. The adjacent parts of the polymer layer are substantially non-conductive and have a sheet resistance which is a factor of 10.sup.6 higher. An electrodeposited metal layer (9), for example of copper, is present on the conductive areas (7).A simple method of photochemically generating the conductive pattern (7) which can be reinforced in an aqueous metal-salt solution by electrodeposition of a metal layer (9) is also provided and most preferably the conductive pattern is inter alia, the patterned exposure of a layer of 3,4-ethylene dioxythiophene or polyaniline. The method can very suitably be used for the manufacture of metal patterns on insulating substrates, such as printed circuit boards.

Abstract: A chemical metallization process is used for electrically non-conducting porous substrates, in needle felts, nonwovens or open-pored foams which possesses a porosity of from 40 to 97%. The metallization follows activation of the fiber surfaces or of the surfaces of the pore walls with a noble metal-containing solution. The volume of the chemical metallizing solution used is reduced to produce a considerable reduction in the operating costs, not only in respect of the solution itself but also in respect of the disposal of the waste water from the chemical metallization. Since less waste water is produced from the start in the chemical metallization process, a considerable contribution to the protection of the environment results.

Abstract: A photoelectrochemical method and apparatus are disclosed for fabricating electronic circuits. An electroplating solution is applied to the surface of a reverse biased p-type semiconductor material, such as NiO. The solution-covered NiO surface is illuminated with a light beam directed by computer aided design data to photoelectrochemically deposit a seed layer of metal in an electronic circuit pattern. The seed layer may be thickened by further deposition in a plating bath to form metallic circuit traces on the NiO. If desired, the metallic circuitry may be transferred from the NiO to an alternate substrate having a low dielectric constant. The porosity of the NiO surface can be adjusted to optimize the metallic circuit adhesion for image retention or ease of transfer. The metallic traces may also be treated to reduce adhesion of subsequently deposited metal that can be transferred readily.

Abstract: A process for simultaneously selectively depositing a high purity nickel containing alloy (i.e. a nickel-boron alloy having a nickel content in excess of 99.5 percent) over a preformed metallurgy pattern (including the individual, electrically isolated contact pads and the seal band area thereon) on the top-side dielectric surface of a multi-layer ceramic module. The metallurgy pattern on such top-side surface of such module is appropriately catalyzed and then immersed in a bath which is essentially lead-free and which includes a source of nickel ions, a borane reducing agent, and an effective amount of an organic divalent sulfur compound, preferably thiodiglycollic acid.

Abstract: Nanoparticle metal powder having a controllable and narrow size distribution are by electrolessly plating a metal on the interior of a vesicle made of at least one polymerized phospholipid. Electroless plating may be accomplished by catalytic reduction of the metal ion or u.v. reduction of the metal ion.

Abstract: A method for coating a substrate with a corrosion resistant surface comprises the steps of coating a portion of the substrate with a nickel (II) nitrate hexahydrate solution. The solution-coated substrate is then heated to a temperature greater than 303.degree. C. until a nickel oxide coating remains.

Abstract: A method for metallizing selected areas of a two dielectric layered sequentially processed circuit board (100) involves exposing the resin A (204) by photo-definition. The resin A (204) contains 10% or less, by weight Cu.sub.2 O particles (300) mixed uniformly throughout the resin. The circuit board (100) is sprayed with a reduction solution to form catalytic islands (301) predominately of Cu.sup.0 or CuH. The circuit board (100) is then electrolessly plated to form conductors, pads or vias, where the resin A (204) has been exposed. The reduction solution includes a primary reducing agent, a secondary reducing agent and a capturing agent. The reduction solution preferably has a pH of 10 or greater. The primary reducing agent is preferably a borohydride. The secondary reducing agent is preferably an iodide and the capturing agent is a chelating agent preferably EDTA.