Abstract: Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.

Abstract: There is provided a method for fabricating electrical wirings capable of being manufactured with low cost and easily applied to large-scale substrates. A photosensitive ground resin film is formed on an insulating substrate by coating process. The ground resin film is subjected to exposure and development processes, by which a ground resin film patterned into a wiring pattern is obtained. Then, on the patterned ground resin film, a low-resistance metal film made of Cu is formed by electroless plating.

Abstract: Electroless plating solutions are disclosed for forming metal alloys, such as cobalt-tungsten alloys. In accordance with the present invention, the electroless plating solutions may be formulated so as not to contain any alkali metals. Further, the solutions can be formulated without the use of tetramethylammonium hydroxide. In a further embodiment, a plating solution can be formulated that does not require the use of a catalyst, such as a palladium catalyst prior to depositing the metal alloy on a substrate.

Abstract: The present invention provides a method for metal plating which makes it possible to perform electroless plating in a favorable manner even on materials difficult to apply electroless plating, and a pretreatment agent for this method. An article to be plated is treated with a pretreatment agent which has been prepared by mixing a solution of a silane coupling agent having a metal-capturing functional group in its molecule and a solution containing a metal that shows catalytic activity in the deposition of a plating metal such as copper, nickel or the like from an electroless plating solution onto the surface of an article to be plated so that the above-mentioned metal is captured by the above-mentioned silane coupling agent, and then adding a reducing agent. Afterward, electroless plating is performed so that a metal thin film is formed on the surface of the article pretreated above. Then, desired metal plating can be performed.

Abstract: Compositions and methods for coating and plating a non-conductive substrate, the substrate having a surface, comprising coating the surface with a binding solution composition, the binding solution composition comprising between approximately 30% by weight and approximately 70% by weight of a binding solution, between approximately 2% by weight and approximately 10% by weight of carbon black powder, between approximately 25% by weight and approximately 50% by weight of aluminum powder, cleaning the coated surface, and immersing the cleaned, coated surface into a plating bath, the plating bath comprising between approximately 5% by volume and approximately 20% by volume hydrofluoric acid, between approximately 4% by volume and approximately 6% by volume copper sulfate, and water.

Abstract: A method for metallizing a surface of substrates is disclosed. Particularly, nonhomogeneous heating deposition occurs by setting the surface and the heater in an electroless plating reactor at different temperatures. Moreover, an adjustable gap is defined between the substrate being metalized and heating source board. The deposit can securely adhere to the surface of the substrate for gap creates and activates metallic nanoparticles, which possess higher activity and bonding strength to the surface. Accordingly, metallization of the surface of the substrate can be easily achieved without using precious metals and carcinogenic materials.

Abstract: A method for forming an oxidation barrier including at least partially immersing a semiconductor device structure in an electroless plating bath that includes at least one metal salt and at least one reducing agent. The reaction of the at least one metal salt with the at least one reducing agent simultaneously deposits metal and a dopant thereof. The oxidation barrier may be used to form conductive structures of semiconductor device structures, such as a capacitor electrode, or may be formed adjacent conductive or semiconductive structures of semiconductor device structures to prevent oxidation thereof. The oxidation barrier is particularly useful for preventing oxidation during the formation and annealing of a dielectric structure from a high dielectric constant material, such as Ta2O5 or BST.

Abstract: A conductive electrolessly plated powder used, for example, for bonding a small electrode of an electronic device, its producing method, and a conductive material containing the plated powder. Conventionally, there has been known, as conductive powders, metallic powders such as of nickel, carbon powders, and conductive plating powders the resin core particles of which are coated with a metal, e.g., nickel. However, there has been no conductive electrolessly plated powders having a good conductivity with respect to connection between conductive patterns having an oxide coating thereon or between electrodes and no methods for producing such powders industrially. The conductive electrolessly plated powder of the present invention consists of resin spherical core particles the average size of which is 1 to 20 &mgr;m and each of which has a nickel or nickel alloy coating formed by electroless plating. The coating includes small projections of 0.

Abstract: A method of preparing a substrate material such that it is capable of sponsoring a catalytic reaction over a pre-determined area of its surface comprising coating some or all of the substrate material with a catalytic material which is capable, once the coated substrate is introduced into a suitable catalytic reaction environment, of sponsoring a catalytic reaction over the coated areas of the substrate wherein the catalytic material is printed onto the substrate by a pattern transfer mechanism.

Abstract: The present invention is a process for manufacturing resistors integral with the printed circuit board by plating the resistors onto the insulative substrate. The invention uses a mask during the activation step so as to selectively activate only selected portions of the surface thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used. The process of the instant invention produced printed circuit boards having greater uniformity and reliability as compared to the prior art.

Abstract: Electroless plating solutions are disclosed for forming metal alloys, such as cobalt-tungsten alloys. In accordance with the present invention, the electroless plating solutions may be formulated so as not to contain any alkali metals. Further, the solutions can be formulated without the use of tetramethylammonium hydroxide. In a further embodiment, a plating solution can be formulated that does not require the use of a catalyst, such as a palladium catalyst prior to depositing the metal alloy on a substrate.

Abstract: A method is provided for the preparation of metal/porous substrate composite membranes by flowing a solution of metal to be plated over a first surface of a porous substrate and concurrently applying a pressure of gas on a second surface of the porous substrate, such that the porous substrate separates the solution of metal from the gas, and the use of the resulting membrane for the production of highly purified hydrogen gas.

Abstract: A method of applying a metal coating to optical element, such as an optical waveguide, comprising the steps of partially depleting stabilizers in an electroless metallic solution and immersing an optical waveguide in the electroless metallic solution to deposit the metal coating to the optical waveguide. The step of partially depleting may include creating an electroless metallic solution having a sodium hypophoshite concentration of about 25 grams per liter. The electroless metallic solution may comprise a Fidelity solution 4865A, a Fidelity solution 4865B and de-ionized water in a ratio of 1:1:18; and sodium hypophosphite crystals. Alternatively, the step of partially depleting may include placing a dummy load into the electroless metallic solution. The dummy load may be a rectangular block of metal, formed of a low carbon steel, and may have a threaded cylindrical passage therein.

Abstract: After treated in a solution containing ozone, a plating material is brought into contact with a solution containing at least one of an anionic surface active agent and a nonionic surface active agent, and an alkaline component. Ozone acts to locally break unsaturated bonds on a surface of the plating material to form C—OH bonds or C═O bonds, thereby activating the surface of the plating material, and since a surface active agent 1 is adsorbed thereon, a catalyst 2 is adsorbed on hydrophilic groups of the surface active agent 1 which has been adsorbed on the above-described functional groups. Consequently, no etching treatment is required, and an electroless plated coating having excellent adhesion can be formed without roughening the surface of the resin material.

Abstract: An electroless copper plating solution which can ensure superior adhesion of a copper plating film to a flat ceramic surface having low roughness and which can form a high-frequency electronic component having superior high-frequency conductivity and a high Q value is provided. Also provided is a high frequency electronic component formed by using this electroless copper plating solution. The electroless copper plating solution of contains copper ions, nickel ions, formaldehyde or a derivative thereof, and tartaric acid or a salt thereof. The ratio of the content of the nickel ions to that of the copper ions on a molar basis is in the range of about 0.0001 to 0.015.

Abstract: The surface to be plated of a composite made of a metallic and a non-metallic material is degreased and otherwise cleaned and immersed in a palladium activator fluid conditioned with a hydrogencarbonate to a pH of 2˜5. After this pretreating process, the composite is plated with a metal and becomes most suitable for use as a material for heat sink on hybrid ICs since it can be efficiently soldered and has better corrosion resistance.

Abstract: A method of electrolessly gold plating copper on a printed circuit board (PCB). Starting with a copper patterned PCB, steps include: clean with ultrasonic agitation with the PCB initially oriented vertically and gradually moved to a 45° angle; rinse; sulfuric acid bath with ultrasonic and mechanical agitation; rinse; another sulfuric acid bath with ultrasonic and mechanical agitation; plate the copper with palladium with ultrasonic agitation with the PCB initially oriented at a 45° angle and flipped half way through to opposing 45° angle; rinse; post dip in sulfuric acid; rinse; electrolessly nickel plate with mechanical agitation; rinse; nitrogen blow dry; visual inspection for nickel coverage of the copper; hydrochloric acid bath with manual agitation; rinse; if full nickel coverage was not achieved, repeat preceding steps starting with second sulfuric acid bath; gold flash plate to establish a first layer of gold; rinse; autocatalytic gold plate; rinse; and nitrogen blow dry.

Abstract: A method for electroless metal plating of substrates, more specifically with electrically non-conductive surfaces, by which the substrates may be reliably metal plated at low cost under manufacturing conditions as well and by means of which it is possible to selectively coat the substrates to be treated only, and not the surfaces of the racks. The method involves the following steps: a. pickling the surfaces with a solution containing chromate ions; b. activating the pickled surfaces with a silver colloid containing stannous ions; c. treating the activated surfaces with an accelerating solution in order to remove tin compounds from the surfaces; and d. depositing, by means of an electroless nickel plating bath, a layer that substantially consists of nickel to the surfaces treated with the accelerating solution, the electroless nickel plating bath containing at least one reducing agent selected from the group comprising borane compounds.

Abstract: A method for electroless plating a metallic layer on the surface of a non-metallic substrate. The method comprises (a) exposing the non-metallic substrate to a solution comprising non-precious metal ions so as to obtain a non-metallic substrate covered with a layer of non-precious metal ions; and (b) exposing the covered non-metallic substrate obtained in step (a) to a reducing solution comprising a reducing agent capable of reducing the metal ions that cover the substrate from their oxidation state in step (a) to a lower oxidation state, preferably to zero valence state. In a preferred embodiment, metallization is accomplished by inducing precipitation of metal, e.g. copper, on the surface to be metallized (this effect also being referred to as “plate-out”), via decomposition of the electroless solution. The inventive process contrasts with the prior art, wherein electroless copper deposition is predominantly initiated or triggered through a Pd-bearing layer.

Abstract: The present invention describes a method for copper deposition on a substrate having a barrier layer wherein a substrate (2) and an activator (1) are immersed in a copper plating bath in order to contact each other for a predetermined period.

Abstract: A cutting tool comprising a metal plate having a central aperture, a forwardly extending blade and a rearwardly extending tang having a second aperture offset from the central aperture, wherein the plate is coated with an electroless nickel layer. Also included is a first elongated member comprising a first handle terminating at a distal end by a jaw and a second elongated member comprising a second handle. The first and second members are pivotally connected to the plate at the central and second apertures by couplers respectively, so that the blade and jaw pivotably move in response to pivotable movement of the first and second members about the coupler in the central aperture.

Abstract: A filament bundle is rewound from a reel, and passes through various sorts of liquid in processing vessels to be used for plating. The filament bundle passes through a fixed guide roller and a movable guide roller while it travels within the liquid in the processing vessel. The movable guide roller is moved periodically, the filament bundle is stretched and slackened by turns, whenever the filament bundle is slackened or untied, the bundle is loosened. The filament bundle with each filament subjected to the plating is taken up to a take-up reel.

Abstract: A method for forming an electrochromic material includes the steps of (a) forming a transparent conductive film on a transparent substrate, (b) forming a metal film on the transparent conductive film by electroless plating, and (c) oxidizing the metal film to form a metal oxide film, which exhibits electrochromic characteristics on the transparent conductive film.

Abstract: A method of forming a conductive metal layer on a non-conductive surface, including providing a non-conductive surface; contacting the non-conductive surface with an aqueous solution or mixture containing a stannous salt to form a sensitized surface; contacting the sensitized surface with an aqueous solution or mixture containing a silver salt having a pH in the range from about 5 to about 10 to form a catalyzed surface; and electroless plating the catalyzed surface by applying an electroless plating solution to the catalyzed surface.

Abstract: A method of electroless plating for processing a plating surface to form a barrier layer being capable of uniformly forming a barrier layer and reducing the consumption of a processing solution, comprising a step of feeding a processing solution used in at least one of the pre-processing steps of the electroless plating and the electroless plating step to the plating surface for puddling treatment, or, using a processing solution at least containing, with respect to one mole of a first metallic material supplying a main ingredient of the barrier layer, three or more moles of a completing agent and three or more moles of reducing agent and having a pH value adjusted to 9 or more and stored in an atmosphere of an inert gas or ammonia gas, and a corresponding electroless plating apparatus.

Abstract: The present invention relates to a method and apparatus for separating out metal copper according to an electroplating of copper using, for example, a solution of copper sulfate to produce copper interconnections on a surface of a substrate. The substrate is brought into contact, at least once, with a processing solution containing at least one of organic substance and sulfur compound which are contained in a plating solution. Thereafter, the substrate is brought into contact with the plating solution to plate the substrate.

Abstract: The present invention provides a unique method for the electroless co-deposition of metal and hard particles on an electrical contact surface to provide electrical, thermal, and mechanical connections between the particle enhanced contact surface and an opposing contact surface, and to enhance the thermal and electrical conductivity between the contact surfaces and their corresponding substrates. The innovative method is able to uniformly deposit metal and particles of any shape, and with a wide range of density and sizes, on contact surfaces, and can be adjusted to provide any desired surface area coverage in desirable deposition patterns. The co-deposited contact surface can, for example, be easily joined to another surface of any type by nonconductive adhesive, resulting in a connection that is mechanically robust, chemically inert, and inherently electrically conductive.

Abstract: A method of patterning a layer of copper on a material surface includes providing a stamp having a base and a stamping surface and providing a copper plating catalyst on the stamping surface. The method can also include applying the stamping surface to the material surface, wherein a pattern of copper plating catalyst is applied to the material surface. The method can further include providing a copper solution over the copper plating catalyst, whereby a layer of copper is patterned on the material surface.

Abstract: A method of chemically depositing a copper film in which a bromine or iodine-containing catalyst component is employed to enhance the deposition rate. The present invention is characterized in that the catalyst component floats on the film surface during the film formation. Accordingly, a film deposition having superior step coverage and high deposition rate is obtained.

Abstract: An improved wire bonding process for copper-metallized integrated circuits is provided by a nickel layer that acts as a barrier against up-diffusing copper. In accordance with the present invention the nickel bath is placed and remains in hydrogen saturation by providing a piece of metal that remains in the nickel plating tank before and during the plating process.

Abstract: A method for producing conductor coating on dielectric surface may be used in many areas of industry for preparation of dielectric surfaces for selective electroplating. Using this method, conductor coatings are obtained when dielectric items are etched in acidic solutions containing oxidising agents, then treated in trivalent bismuth compound solution and additionally treated in sulphide solution.

Abstract: A method and apparatus for improving interfacial chemical reactions in electroless depositions of metals, in which the substrate to be plated is pre-heated prior to its immersion in the various processing solutions that require elevated temperatures, and especially before immersion in the electroless plating solution. The pre-heating is carried out to a temperature that is needed to bring about the desired chemical reaction at the substrate-solution interface, allowing the bath of that process step to operate significantly below the temperature that would have been needed if the panel had not been pre-heated, and below the solution temperature of current practice. According to another aspect of the present invention, the electroless plating apparatus for plating a workpiece operates in a vertical mode and it comprises a heating station, with the panel to be plated returning to the heating station as dictated by the temperature required for a given process step.

Abstract: The invention includes a method of electroless deposition of nickel over an aluminum-containing material. A mass is formed over the aluminum-containing material, with the mass predominantly comprising a metal other than aluminum. The mass is exposed to palladium, and subsequently nickel is electroless deposited over the mass. The invention also includes a method of electroless deposition of nickel over aluminum-containing materials and copper-containing materials. The aluminum-containing materials and copper-containing materials are both exposed to palladium-containing solutions prior to electroless deposition of nickel over the aluminum-containing materials and copper-containing materials. Additionally, the invention includes a method of forming a solder bump over an aluminum-containing material.

Abstract: The invention includes a method of electroless deposition of nickel over an aluminum-containing material. A mass is formed over the aluminum-containing material, with the mass predominantly comprising a metal other than aluminum. The mass is exposed to palladium, and subsequently nickel is electroless deposited over the mass. The invention also includes a method of electroless deposition of nickel over aluminum-containing materials and copper-containing materials. The aluminum-containing materials and copper-containing materials are both exposed to palladium-containing solutions prior to electroless deposition of nickel over the aluminum-containing materials and copper-containing materials. Additionally, the invention includes a method of forming a solder bump over an aluminum-containing material.

Abstract: A method for making a pressure actuated switching device includes applying a conductive coating to the release surface of a transfer substrate to form a conductive electrode film. The conductive film is brought into contact with a surface of a first substrate under conditions of heat and pressure sufficient to cause the conductive film to transfer from the release surface of the transfer substrate to the first surface of the first substrate. The first substrate is then positioned in juxtaposition with a second substrate having a conductive layer film of the first substrate. Also provided herein is a method for spring loading a terminal plug to the pressure actuated switching device.

Abstract: A method for forming a metal pattern by the micro-stamping process involves the steps of treating a substrate bearing a thin film of a reducing silicon polymer with a solution containing a salt of a metal having a standard oxidation-reduction potential of at least 0.54 volt, allowing metal colloid to deposit on the substrate surface, stamping a pattern of an alkane thiol to the substrate surface for transferring the pattern to the metal colloid-bearing silicon polymer thin film, and effecting electroless metal plating for forming a metal pattern only on the region of the silicon polymer thin film which is not covered with the alkane thiol pattern. The finely defined metal pattern can be formed on any type of substrate though inexpensive simple steps and has good adhesion to the substrate.

Abstract: A method of forming a conductive metal layer on a non-conductive surface, including providing a non-conductive surface; contacting the non-conductive surface with an aqueous solution or mixture containing a stannous salt to form a sensitized surface; contacting the sensitized surface with an aqueous solution or mixture containing a silver salt having a pH in the range from about 5 to about 10 to form a catalyzed surface; and electroless plating the catalyzed surface by applying an electroless plating solution to the catalyzed surface.

Abstract: A dielectric coating for a circuit board which is adherent to electroless copper. The coating is an epoxy dielectric including an amount of a solubilized nitrile-free butadiene or isoprene agent for promoting adhesion of an electroless copper coating. A method for producing a circuit board is also disclosed.

Abstract: A barrier layer structure and a method of forming the structure. The barrier layer structure comprises a bilayer, with a first layer formed by chemical vapor deposition and a second layer formed by physical vapor deposition. The first barrier layer comprises a metal or a metal nitride and the second barrier layer comprises a metal or a metal nitride. The barrier bilayer is applicable to copper metallization.

Abstract: There is a method and apparatus for plating in which electroless copper plating is performed in a contact hole and an interconnect trench on a minute scale of a semiconductor integrated circuit device, and a plating structure. Organic material originated from an organic gas carried over from the preceding step is removed from the inner surface of a blind hole, thereafter the surface of the barrier layer is subjected to predetermined pretreatments comprising a hydroxylation treatment, a coupling treatment, a Pd colloidal solution treatment and the like, and following the pretreatments, electroless plating with copper is effected desirably under influence of ultrasonic waves. Hence, a uniform, good quality plating layer is formed inside and outside the hole and a CMP processing following the plating is performed with ease.

Abstract: Provided herein is a method of utilizing electroless copper deposition to form interconnects in a semiconductor device. An opening is formed in a dielectric layer in the form of a trench, via or combination thereof, and a diffusion barrier layer is blanket deposited in the opening. Then, a contact displacement technique is used to form a seed layer on the diffusion barrier layer which includes copper, tin and palladium. Electroless deposition of copper is been undertaken to autocatalytically deposit copper on the activated barrier layer. The process continues to create a conformal, void free electroless copper deposition.

Abstract: When a barrier layer formed on a surface of a contact hole is subjected to electroless plating of copper, a salt of a metal such as gold, nickel, palladium, cobalt or platinum is added as a plating accelerator in an amount of 1 mol % or less based on a copper salt in a composition of an electroless plating solution, whereby the metal having the higher catalytic activity than copper is precipitated before precipitation of copper, and copper can then be precipitated as a good-quality plated film.

Abstract: A method for depositing an adhesion-promoting layer on a spatially bounded metallic layer of a silicon chip is provided. The adhesion-promoting layer is deposited, using at least one wet-chemical process. During the wet-chemical process, the concentration of an inhibitor of a multi-component process bath is checked in at least approximately continuous manner and adjusted to a constant value. The adjustment of the inhibitor concentration is independent of the adjustment of the concentrations of other process-bath components.

Abstract: An activated substrate surface suitable for electronics and microsystems preparation is prepare by contacting the surface with a surface activation compound, e.g. organometallic based on palladium, platinum, rhodium or iridium. The photo labile ligand has an optical absorption band which overlaps with the wavelength of the UV. A UV lamp is used, in combination with a mask, to selectively irradiate the contacted surface. Irradiation of the surface with light of a suitable wavelength decomposes the organometallic compound to the activating metal. The surface is then ready for electroless plating with the desired conducting material. The mask is patterned to delineate areas where surface activation is not to occur. The organometallic compound absorbs ultraviolet radiation in the wavelength range 210-260 nm, or in the wavelength range 290-330 nm, in the solid state if the compound exists as a solid at 25° C. or in the liquid state if the compound exists as a liquid at 25° C.

Abstract: Methods for electroless deposition of conductive material on a substrate using in both cases a stamp having a patterned surface which is pressed onto the surface of a substrate for printing the substrate and providing a pattern of a catalyst on the substrate on which metal deposition occurs in the course of electroless deposition by immersing the printed substrate in a plating bath are provided. In one case, the stamp is pretreated to render the pattern of the stamp wettable with a catalytic ink which is transformed to the surface of the substrate. In the other case, a catalytic layer is provided on the surface of the substrate which is patterned by the stamp transferring a resist material onto the catalytic layer so that a subsequent etching process lays open the desired pattern of the catalytic layer for electroless deposition.

Abstract: A method for forming an oxidation barrier including at least partially immersing a semiconductor device structure in an electroless plating bath that includes at least one metal salt and at least one reducing agent. The reaction of the at least one metal salt with the at least one reducing agent simultaneously deposits metal and a dopant thereof. The oxidation barrier may be used to form conductive structures of semiconductor device structures, such as a capacitor electrode, or may be formed adjacent conductive or semiconductive structures of semiconductor device structures to prevent oxidation thereof. The oxidation barrier is particularly useful for preventing oxidation during the formation and annealing of a dielectric structure from a high dielectric constant material, such as Ta2O5 or BST.

Abstract: A method of electrolessly gold plating copper on a printed circuit board (PCB). Starting with a copper patterned PCB, steps include: clean with ultrasonic agitation with the PCB initially oriented vertically and gradually moved to a 45° angle; rinse; sulfuric acid bath with ultrasonic and mechanical agitation; rinse; another sulfuric acid bath with ultrasonic and mechanical agitation; plate the copper with palladium with ultrasonic agitation with the PCB initially oriented at a 45° angle and flipped half way through to opposing 45° angle; rinse; post dip in sulfuric acid; rinse; electrolessly nickel plate with mechanical agitation; rinse; nitrogen blow dry; visual inspection for nickel coverage of the copper; hydrochloric acid bath with manual agitation; rinse; if full nickel coverage was not achieved, repeat preceding steps starting with second sulfuric acid bath; gold flash plate to establish a first layer of gold; rinse; autocatalytic gold plate; rinse; and nitrogen blow dry.

Abstract: A substrate metal such as aluminum, usually in the form of a web, is anodized to form a porous oxide coating. A catalytic metal is then electrolytically deposited into the base of the pores preferably using an AC current. A portion of the oxide coating is then stripped away to expose the deposited catalytic metal at the surface of the remaining oxide layer. Alternately, a generally non-catalytic base metal may first be deposited followed by the deposition of the catalyst metal within the pores over the base metal. Further alternatives include stripping the oxide down to the base metal and then depositing the catalyst metal on the surface, further anodizing to form additional oxide between the deposited metal and the substrate, and enlarging the cross section of the base of the pores prior to the deposition of the metal.

Abstract: Radioactive coating solutions and sol-gels, and corresponding methods for making a substrate radioactive by the application of the radioactive coating solutions and sol-gels thereto. The radioactive coating solution comprises at least one carrier metal and a radioisotope, which may be soluble or insoluble, and may further comprise a reducing agent. The radioactive sol-gel comprises at least one metal alkoxide and a radioisotope, which may be soluble or insoluble. Methods of making a substrate radioactive by coating with radioactive coating solutions or sol-gels are also disclosed, including electrodeposition, electroless deposition, spin coating and dip coating. In a particular embodiment, the radioactive coating formed by the method is a composite coating. Radioactive substrates are also disclosed, comprising a substrate and one or more radioactive coatings, which coatings may be the same or different.

Abstract: The present invention relates to a method and apparatus of fabricating electromagnetic coil vanes. The method involves photolithographically exposing high resolution, dense wire patterns in a flash coat of copper, on both sides of a ceramic vane substrate. The substrate can be pre-drilled with a through hole to connect the two copper coil patterns. Additional copper is then deposited on both high resolution patterns and in the through hole by plating until the desired thickness is obtained. A firing operation is then performed that eutectically bonds the copper to the ceramic.