Abstract: The present invention relates to a continuous ceramic composite plating method for long doctor base materials which comprises a degreasing step, rinsing step, acid immersion step, rinsing step, electroless ceramic composite nickel plating step, plating solution collection step, rinsing step, and drying step between a first step of supplying continuously one or a plurality of long doctor blade base materials held on one or a plurality of material reels spirally while the blade surfaces are maintained in a horizontal direction with respect to the surface of a solution and a predetermined interval therebetween is maintained and a final step of taking up continuously the one or plurality of blade base materials on a plurality of corresponding take-up reels while the one or plurality of blade base materials are cramped by a plurality of pinch rolls, as well as to an apparatus therefor.

Abstract: A method of coating a substrate is provided. A metallic layer comprising at least about 8% nickel is deposited by thermal spraying on a substrate. The metallic layer has an average density greater than about 80%. A slurry layer comprising from about 10% to about 90% aluminum or alloy thereof is deposited on the metallic layer. Heating to a temperature in excess of 500° C. (932° F.) results in the formation of an intermetallic layer of NiAl. The resulting coating is particularly suited for protecting the surfaces of incinerators or other combustion chambers.

Abstract: A method for manufacturing a black matrix of a plasma display panel includes the steps of forming transparent electrodes of upper electrode patterns and black matrix patterns on an upper substrate, and depositing a predetermined metal material on the transparent electrodes of the black matrix patterns. In the method for manufacturing a black matrix of a plasma display panel, it is possible to manufacture the black matrix without performing a separate baking process. In addition, since it is possible to pattern the upper electrode and the black matrix at the same time, the manufacturing process steps are simplified and the manufacturing cost is saved.

Abstract: A method of plating an aromatic polymer substrate comprises: applying a strippable coating of a non-aromatic polymer to a substrate surface to be plated; selectively illuminating the coated substrate surface with laser light to ablate a selected area of the strippable coating and to activate an underlying region of the substrate surface exposed by the ablation of the strippable coating; contacting the substrate surface with a seeding solution containing polymer-stabilized catalytic seeding particles, so that the seeding particles adhere preferentially to the activated region of the substrate; and electrolessly plating the substrate surface, whereby the seeded areas of the substrate surface are selectively plated.

Abstract: The present invention provides a method of manufacturing a nickel-silicide technology for polysilicon interconnects. Nickel 40 is deposited on polysilicon 30 using a electroless process. Using a rapid thermal anneal process, Ni 40 is transformed to NiSi at about 600° C. without any agglomeration. The method comprises forming a polysilicon layer 30 over a substrate 10. The surface 34 of the polysilicon layer is activated. Nickel 40 is selectively electroless deposited onto the surface of the polysilicon layer forming a Nickel layer over the polysilicon layer. The Ni layer 40 is rapidly thermally annealed forming a Nickel silicide layer 36 over the polysilicon layer 30. The rapid thermal anneal is performed at a temperature of about 600° C. for a time of about 40 sec. The Nickel silicide layer 36 preferably comprises NiSi 36B with a low resistivity.

Abstract: A substrate includes a non-conductive portion to be electroless-plated of a substrate, on the surface of which fine metal catalyst particles composed of silver nuclei and palladium nuclei each having an average particle size of 1 nm or less adhere at a high nuclei density of 2000 nuclei/&mgr;m2 or more. The metal catalyst particles are produced by sensitizing the non-conductive portion of the substrate by dipping the substrate in a sensitizing solution containing bivalent tin ions, activating the non-conductive portion of the substrate by dipping the substrate in a first activator containing silver ions, and activating the non-conductive portion of the substrate by dipping the substrate in a second activator containing palladium ions.

Abstract: Electroless deposition of Cu provides for repair of copper seed layers formed by vacuum deposition processes, for formation of copper seed layers on catalytic materials, and for bulk fill of damascene trenches and via openings. Electroless plating baths for such depositions are formulated for both room temperature and elevated temperature operation, and each include a copper source, an environmentally friendly reducing agent, a pH buffer, a complexing agent, and a surfactant.

Abstract: Provided are methods of preparing an electrically conductive polymeric foam. The methods include the following steps: (a) contacting a polymeric foam with a surfactant solution; (b) contacting the polymeric foam with a sensitizing solution; (c) contacting the polymeric foam with an activation solution; and (d) forming at least one metallic layer on the polymeric foam with an electroless plating process. Also provided are electrically conductive polymeric foams formed by such methods. The present methods and foams have particular applicability to the manufacture of EMI (electromagnetic interference) shielding devices.

Abstract: A novel precious metal doped porous metal catalyst is disclosed. The precious metal is present in from 0.01 to 1.5 weight percent and distributed throughout the particles of porous metal to provide a surface to bulk ratio distribution of not greater than 60. The present invention is further directed to a process of forming said doped catalyst and to improved processes of catalytic hydrogenation of organic compounds.

Abstract: A Cu plated ceramic substrate is used in a semiconductor. On a ceramic substrate layer, a thin-film Cr layer is put, and a thin-firm Au layer is put on the Cr layer. The Au layer is plated with Cu. By providing the Au and Cr layers between the ceramic plate and Cu layer, adhesibility is increased. A Pertier element which includes the Cu plated ceramic layer is employed in a semiconductor to absorb and generate heat efficiently.

Abstract: An electroless plating reaction catalyst is imparted to a substrate and then the catalyst is deactivated or removed at desired locations by irradiating with an energy beam to form groove portions in the substrate.

Abstract: In a method for filling an interconnect opening to form an interconnect of an integrated circuit, the interconnect opening is formed within an insulating layer. The interconnect opening is partially filled with a conductive material to form a recess within the conductive material toward a top of the interconnect opening, and the recess is disposed within the interconnect opening. An alloy is conformally deposited to fill the recess. Any conductive material and the alloy on the insulating layer are polished away such that the conductive material and the alloy are contained within the interconnect opening. A thermal anneal is then performed such that the conductive material and the alloy form into a conductive fill of a single grain structure within the interconnect opening. An additional encapsulating material is formed to cover a top surface of the conductive fill during the thermal anneal from the dopant of the alloy diffusing out of the alloy and along the top surface of the conductive fill.

Abstract: A gas sensor and a method for its manufacture are described. The gas sensor has a solid electrolyte (11) having at least one measuring electrode (15) and one porous protective coating (16). The measuring electrode (15) has an electrically conductive base layer (25) and a further layer (27), the further layer (27) being deposited in the pores of the porous protective coating (16) adjacent to the base layer (25) via galvanic deposition. In order to deposit the further layer (27) via galvanic deposition, the basic body (10), which has been fused with the base layer (25) and the protective coating (16) via vitrification, is immersed in a galvanizing bath, the base layer (25) being connected as the cathode.

Abstract: The present invention relates to a method and apparatus of fabricating electromagnetic coil vanes. The method involves photolithographically exposing high resolution, dense wire patterns in a flash coat of copper, on both sides of a ceramic vane substrate. The substrate can be pre-drilled with a through hole to connect the two copper coil patterns. Additional copper is then deposited on both high resolution patterns and in the through hole by plating until the desired thickness is obtained. A firing operation is then performed that eutectically bonds the copper to the ceramic.

Abstract: Metal patterns (15) can be provided on a glass substrate (1) in an electroless process by modifying the substrate with a silane layer (3), locally removing said layer with a laser or UV-ozone treatment and selectively nucleating the remaining silane layer in a polymer-stabilized Pd sol. Neither a photoresist nor organic solvents are used. The method is very suitable for the manufacture of the black matrix on a passive plate for an LCD, or on panels of other flat colour displays, such as flat cathode ray tubes.

Abstract: A novel precious metal doped porous metal catalyst is disclosed. The precious metal is present in from 0.01 to 1.5 weight percent and distributed throughout the particles of porous metal to provide a surface to bulk ratio distribution of not greater than 60. The present invention is further directed to a process of forming said doped catalyst and to improved processes of catalytic hydrogenation of organic compounds.

Abstract: This invention relates to processes for the formation of composite layers containing insoluble particles in metal matrices onto bodies to achieve enhanced thermal properties.

Abstract: A coating system and a method for its manufacture are provided. An electrically conductive base coat and a porous overcoat lying over the base coat are arranged on a ceramic substrate. At least one additional deposited layer is arranged on the base coat in such a way that the additional layer is formed in the pores of the porous overcoat adjacent to the base coat. The additional layer is deposited either by currentless or electrolytic deposition. For electrolytic deposition of the additional layer, the ceramic substrate sintered with the base coat and the overcoat is submerged in an electrolytic bath and the base coat is connected as a cathode. The currentless deposition takes place from a solution of the metal to be deposited with the addition of a reducing agent.

Abstract: Printed circuit boards, cards and chip carriers are fabricated by treating an already circuitized substrate with a swelling agent, then treating the circuitized substrate with a composition containing an alkaline permanganate, a chromate and/or chlorite and then applying a metal layer to coat the circuitized portion of the substrate.

Abstract: A corrosion resistant gas cylinder and gas delivery system includes an electroless nickel-phosphorous layer overlying the inner surface of a steel alloy cylinder. The nickel-phosphorous layer has a thickness of at least about 20 micrometers and a porosity of no greater than about 0.1%. The electroless nickel-phosphorous layer has a phosphorous content of at least about 10% by weight and a surface roughness of no greater than about 5 micrometers. Prior to introducing liquefied gas into the gas cylinder, a cleaning process is carried out using a two-step baking process to clean the surface of the nickel-phosphorus layer. The nickel-phosphorous layer substantially reduces the contamination of liquefied corrosive gasses stored in the gas cylinder by metal from the steel wall surface underlying the nickel-phosphorous layer.

Abstract: An industrial material such as metal, ceramics or plastics whose surface has a film passivated by fluoridation and a process of manufacturing the above industrial material. The industrial material comprises a substrate, a nickel alloy film formed on the substrate and containing nickel, semimetal and/or other metal whose fluoride becomes a volatile compound, and a fluorine passivated film formed at least on a surface of the nickel alloy film in such a manner that the fluorine passivated film contains nickel and does not contain said other metal or the semimetal, and satisfies stoichiometric ratio. The process of manufacturing an industrial material comprises the steps of performing grounding treatment of a surface of a substrate, forming a nickel alloy film, on the surface of the substrate, containing nickel, semimetal and/or other metal, and forming a fluorine passivated film on the nickel alloy film.

Abstract: A method of fabricating single and dual damascene copper interconnects is achieved. A semiconductor substrate layer is provided. Conductive traces are provided in an isolating dielectric layer. An intermetal dielectric layer is deposited overlying the conductive traces and the isolating dielectric layer. The intermetal dielectric layer is patterned to form trenches to expose the top surfaces of the underlying conductive traces. A barrier layer is deposited overlying the intermetal dielectric layer, the exposed conductive traces, and within the trenches. A platinum ionic seed solution is coated inside the trenches and overlying the barrier layer. A platinum seed layer is deposited from the ionic seed solution by exposing the platinum ionic seed solution to ultraviolet light.

Abstract: A method of circulating an electroless nickel plating solution is characterized in that the system comprises the following process steps effected in the following order: (A) a step of electrolessly plating nickel using a plating solution having nickel hypophosphite contained as a chief chemical material for supplying a plating metal ion Ni2+ and a hypophosphorous acid ion H2PO2− acting as a reducing agent; (B) a step of removing HPO32− from a plating solution that has aged in the step (A); (C) a step of desalting the mother liquor separated from the step (B); and (D) a step of adjusting the components of the treated plating solution and then circulating same back into the step (A) of electroless nickel plating. According to the present invention, the plating solution is free from the formation and accumulation of a sulfuric acid salt and hence a long service life is ensured and a great advantage in environmental protection is provided.

Abstract: Metal patterns (11, 11′, 11″) can be provided on a glass substrate (1) in an electroless process by modifying the substrate with a silane monolayer (3), nucleating said momolayer with a polymer-stabilized Pd sol (5) and, subsequently, locally removing the Pd nuclei and silane layer (9, 9′) with a pulsed laser. Neither a photoresist nor organic solvents are used. The method can very suitably be used for the manufacture of the black matrix on a faceplate of display devices, such as the passive plate for an LCD.

Abstract: A method of providing nickel barrier end terminations for a zinc oxide semiconductor device with exposed body surfaces and end terminal regions, in which the device is controllably reacted with a nickel plating solution only on an exposed end terminal region and thereafter provided with a final tin or tin-lead termination.

Abstract: This invention provides a method and solution for the electroless deposition of Co(P) with a designed coercivity via the programmed addition of supporting electrolytes comprising such sulfur containing compounds as sulfamic acid, potassium sulfate or sodium sulfate to a solution having a source of cobalt ions, a source of citrate ions, a buffering compound to stabilize the pH of the solution, a source of hypophosphite ions and sufficient hydroxide anions to obtain a pH of between about 7 and 9. The magnetized Co(P) material is useful in, for example, rigid magnetic storage disks, hard bias layers for MR thin film heads and magnetic detector tags.

Abstract: A process for selective electroless plating onto a substrate, including providing a substrate having at least a catalytic surface; providing a plating gel comprising a carrier vehicle, an electroless platable metal compound capable of providing metal ions to the carrier vehicle at a specific pH, a reducing agent, and a polymeric thickening agent; applying said plating gel to the substrate surface in a selected pattern, and inducing plating of said metal on the substrate surface in said selected pattern. A stabilizer, and/or buffering and/or organic chelating agent, and/or surfactant and/or a humectant may be included in the plating gel. Preferably the metal compound is a gold complex, and the substrate is aluminum nitride.

Abstract: An automated system for electroless metallization of optical glass fibers, includes a plurality of spaced apart plating stations having different solutions for electroless metallization of optical fibers. A motor-driven fiber transport and dipping apparatus is used in the system for shuttling optical glass fibers to the plating stations and immersing the optical glass fibers in the solutions. A programmable controller directs the transport and dipping apparatus to the plating stations in a selected order and at selected time intervals, and directs the apparatus at each of the stations to immerse the fibers into the solutions at a selected entry rate, for a selected duration, and at a selected withdrawal rate.

Abstract: The present invention provides methods of electrolessly depositing metal onto the surfaces of electronic components using an enclosable single vessel. The methods of the present invention include contacting the electronic components with an activation solution followed by contacting the electronic components with a metal deposition solution. In a preferred embodiment of the present invention, the oxygen levels in the activation solution and metal deposition solution are controlled in a manner for improved processing results. In another preferred embodiment of the present invention, the activation and metal deposition solutions are used one time without reuse.

Abstract: A process for making a roofing ply roll or sheet product which comprises pretreating a fiber glass mat with water to provide greater than 2 and less than 10 wt. % water therein, and impregnating said moisturized mat with molten asphalt, the amount of asphalt retained in said mat being directly related to the amount of water present in the pretreated mat. An ASTM D 2178 Type VI roofing ply sheet comprising a fiber glass mat impregnated with asphalt and having a tensile strength of at least 60 lbf/in CMD and a flexibility of about 0.2 or less in inch/lb stiffness modulus MD.

Abstract: A process for the corrosion protection of copper or copper alloy which process comprises contacting the surface with an aqueous solution of at least one compound of general formula (I), wherein X is N, Y is CR and Z is N, or X is N, Y is N and Z is N or CR or X is CR, Y is N and Z is N, where R is a hydrogen atom or R.sup.1, and R.sup.1 is an alkyl, aryl, aralkyl, halogen, trihalomethyl, amino, heterocyclic, NHR.sup.2, NR.sup.3 R.sup.4, CN, CO.sub.2 H, CO.sub.2 R.sup.5, OH or OR.sup.6 group, where each of R.sup.2 to R.sup.6 independently represents an alkyl, aryl, or aralkyl group.

Abstract: A method for preventing formation of a "bridge" is provided for electrolessly plated nickel or gold between copper patterns. A circuit board having a copper pattern is immersed in a pretreatment solution containing thiosulfate for electroless nickel plating, or the pretreatment solution is sprayed over the board. The pretreatment solution may be incorporated with an additive, such as a pH adjustor, complexing agent, surfactant or corrosion inhibitor.

Abstract: An efficient process for partial electroless plating that causes plating film to deposit only a specific part of substrate which needs plating, without requiring the corrosion step. The process includes five steps of forming a coating film on which electroless plating is performed, activating said coating film, imparting a catalyst to said coating film, activating said catalyst, and performing electroless plating, and said coating film is formed from any one of the following four resin compositions:1. composed of a low-molecular weight compound having an N--H bond, an adhesive polymer having a C.dbd.C double bond, and a polybasic acid having a C.dbd.C double bond;2. composed of an adhesive polymer dense with N--H bonds, and a polybasic acid compatible with said polymer or a monobasic acid having a C.dbd.C double bond;3. composed of a resin component which gives rise to an N--H bond upon curing reaction, and a polybasic acid having a C.dbd.C double bond; or4.

Abstract: As an electroless plating technique capable of surely promoting the plating reaction without Pd substitution reaction and fastening the plating deposition, there are proposed an electroless plating method of subjecting a primary plated film (or metal film) formed on a substrate to a secondary plating (or electroless plating), characterized in that the secondary plating is carried out after a surface potential of the primary plated film is adjusted so as to be more base than such a most base surface potential that a surface current density of the primary plated film is zero in an electroless plating solution for the secondary plating; and a pretreating solution for electroless plating comprising an alkali solution, reducing agent and complexing agent; and an electroless plating bath suitable for use in this method.

Abstract: A process is provided for enhancing the wear resistance of aluminum and other materials by depositing on the substrate a nickel, cobalt, phosphorous alloy coating using an electroless plating bath to provide a plated alloy having a cobalt content of at least about 20% by weight and a % Co/% P weight ratio of at least about 5. A preferred bath contains an effective amount of glycolic acid or salts thereof. The alloy deposit is preferably plated over a zincated aluminum substrate.

Abstract: A method to form copper interconnects with an improved encapsulation layer is achieved. A substrate layer is provided. Conductive traces are provided overlying the substrate layer. A first intermetal dielectric layer is deposited overlying the conductive traces. The first intermetal dielectric layer is etched through to the underlying conductive traces where the first intermetal dielectric layer is not protected by a photoresist mask to form interconnect trenches. A barrier layer is deposited overlying the first intermetal dielectric layer and exposed the conductive traces. A copper layer is deposited overlying the barrier layer and filling the interconnect trenches. The copper layer and the barrier layer are polished down to the top surface of the first intermetal dielectric layer to define copper interconnects.

Abstract: A method for plating a high impact resistant plastic, particularly a polycarbonate substrate which has been modified with up to about 50 percent by weight of acrylonitrile-butadiene-styrene. The surface of the plastic is first conditioned with a halogenated organic solvent conditioner, preferably 1-3-dichloro-2-propanol, prior to the electrochemical deposition of the desired metal layer.

Abstract: Ultra smooth as-deposited electroless nickel coatings are achieved employing a plating bath containing aluminum and/or copper ions. Embodiments include electroless deposition of an amorphous nickel-phosphorous coating on a glass, glass-ceramic, ceramic, or aluminum-containing substrate, with an as deposited average surface roughness (Ra) of less than about 16 .ANG., depositing an underlayer, and depositing a magnetic layer to form a magnetic recording medium.

Abstract: An electrolytic process and apparatus which can operate in a hydrogen reaction chamber at a hydrogen reaction rate corresponding to the increase in the rate of production of hydrogen accompanying the increase in the electrolysis rate and maintain the current efficiency at a very high value with respect to the electrolytic current for producing hydrogen and a process for the production of an electrode for this purpose.

Abstract: An Mg based article excellent in plating adhesion which is produced with an Mg alloy base material regardless of its kind by forming a Zn layer of an average thickness of 0.60 .mu.m or more, or a Zn deposition of 0.43 mg/cm.sup.2 or more formed on the Mg alloy base material and a method of producing the article with good efficiency are provided.

Abstract: A method of transferring a chemical activating agent from an applicator to a substrate surface involves providing an applicator having a raised application surface, applying a chemical activating agent to the application surface, contacting the substrate surface with the application surface, and removing the applicator. The chemical activating agent is transferred in a form in which it is capable of effecting a chemical reaction, such as catalysis, at the surface. Thus, following transfer of the chemical activating agent to the surface in a pattern, a metal can be plated at the substrate surface in the pattern. The applicator can be an elastomeric stamp having a raised portion defining a stamping surface.

Abstract: A method for depositing copper on a titanium-containing surface of a substrate is provided. The method includes forming a patterned catalyst material on the substrate, such that the titanium-containing surface is exposed in selected regions. The catalyst material has an oxidation half-reaction potential having a magnitude that is greater than a magnitude of a reduction half-reaction potential of titanium dioxide. Copper is then deposited from an electroless solution onto the exposed regions of the titanium-containing surface.

Abstract: A method for depositing copper on a titanium-containing surface of a substrate is provided. The method includes forming a patterned catalyst material on the substrate, such that the titanium-containing surface is exposed in selected regions. The catalyst material has an oxidation half-reaction potential having a magnitude that is greater than a magnitude of a reduction half-reaction potential of titanium dioxide. Copper is then deposited from an electroless solution onto the exposed regions of the titanium-containing surface.

Abstract: A method for producing an electronic apparatus casing including: a step of forming a copper layer by way of non-electrolytic plating onto a casing body made from a magnesium or magnesium alloy material shaped into a predetermined configuration; a step of forming a nickel layer on the copper layer by way of non-electrolytic plating; a step of carrying out a surface grinding and a honing to the nickel layer; a step of forming a hard transparent glass layer by using a colloid solution containing SiO.sub.2 and Na.sub.2 O; and a step of forming a silica layer on the hard glass layer by using a partially hydrolyzed solution of an organic silicate ester.

Abstract: Orthophosphite ions produced by oxidation of hypophosphite in an electroless nickel plating bath can be removed by precipitation with an alkali metal or alkaline earth metal cation such as calcium. In order to avoid the precipitation of calcium sulfate and the generation of large amounts of particulates in the bath, nickel sulfate can be replaced by a nickel salt of an alkylsulfonic acid or hypophosphorous acid, whose anion forms a soluble salt with an alkali metal or alkaline earth metal cation.

Abstract: Disclosed is a method of forming electroless metal plating layers on one single surface of a plastic substrate and the product thereof. The method includes steps of degreasing or pre-etching the material for forming the substrate, etching the material, adding catalysis, activating, drying, spraying non-conducting paint on a first surface of the material, accelerating, forming an electroless copper plating layer on a second surface of the material, activating, forming an electroless nickel plating layer on the second surface of the material, sealing, dehydrating, drying, inspecting, and packing. Wherein, the steps of spraying non-conducting paint and drying give the material a beautiful painted appearance on the first surface thereof. The non-conducting paint on the first surface of the material facilitates easy formation of smooth electroless copper and nickel plating layers on the second surface of the material. Therefore, a product of the method can be used in electronic products requiring high sensitivity.

Abstract: Method and baths for electroless depositing Cu on a semiconductor chip using four preferred Cu electroless baths. All four preferred electroless baths use hypophosphite as a reducing agent. The 4 baths use the following mediators (1) Nickel sulfate, (2) Pd Sulfate (3) Co Sulfate (4) Fe Sulfite, and complexing agents (Na Citrite, Boric Acid, Ammonium Sulfite). The baths can operate at a pH between 8 and 10. The invention forms high purity Cu interconnects having adequate step coverage to form in a hole having an aspect ratio greater than 2.7 to 1.

Abstract: An electroless metal plating bath composition, a corresponding method for electrolessly depositing a metal onto a substrate surface, as well as the resulting, metallized substrate, are disclosed. The inventive bath composition includes water, a soluble source of the metal ions it is desired to chemically reduce at, and deposit onto, the substrate surface of interest, and a complexing agent for the metal ions. In addition, the bath composition includes a soluble source of any one or more of a select group of what are termed mediator ions, which group includes palladium (Pd), platinum (Pt), silver (Ag), ruthenium (Ru), iridium (Ir), osmium (Os) and rhodium (Rh) ions, as well as a complexing agent for the mediator ions. Moreover, the bath composition includes a chemical reducing agent, which primarily serves to chemically reduce the mediator ions at the substrate surface of interest.

Abstract: A continuous ceramic composite plating method for long doctor base materials which comprises a degreasing step, rinsing step, acid immersion step, rinsing step, electroless ceramic composite nickel plating step, plating solution collection step, rinsing step, and drying step between a first step of supplying continuously one or a plurality of long doctor blade base materials held on one or a plurality of material reels spirally while the blade surfaces are maintained in a horizontal direction with respect to the surface of a solution; and a predetermined interval therebetween is maintained and a final step of taking up continuously the one or plurality of blade base materials on a plurality of corresponding take-up reels while the one or plurality of blade base materials are cramped by a plurality of pinch rolls, as well as an apparatus therefor. The doctor blades can be plated continuously and efficiently.

Abstract: A method of fabricating an electronic package having an organic substrate. The substrate is formed of fiberglass and epoxy. In order to additively circuitize the electronic package substrate, an organic polyelectrolyte is deposited onto the organic substrate. A colloidal palladium-tin seed layer is deposited atop the organic polyelectrolyte. This is followed by depositing a photoimageable polymer atop the seed layer, and photolithographically patterning the photoimageable polymer to uncover portions of the seed. layer. The uncovered portions of the seed layer are catalytic to the electroless deposition of copper. In this way a conductive layer of copper is deposited atop the uncovered seed layer. The organic polyelectrolyte is deposited from an aqueous solution at the pH appropriate for the desired seed catalyst coating, depending on the ionizable character of the particular polyelectrolyte employed.