Abstract: A process for activating a textile to catalyze the reduction of a metal cation, a process for metallizing the activated textile with the reduced metal, and the activated textile and metallized textile thereby produced. The textile is activated by precipitating noble metal nucleation sites on the fibers of the textile. Immersing the activated textile in a suitably prepared solution of a metal cation, and adding a reducing agent, leads to the formation of a metal plating tightly and intimately bonded to the fibers of the textile.

Abstract: The present invention relates to a plating bath of the hydrazine type for electroless plating on the surface of a plated substance with iridium. The first plating bath is an electroless plating bath of iridium which contains a hydrazine complex of iridium and has pH of 1-7. The second plating bath is an electroless plating bath of iridium which contains hydrazine hydrate and/or hydrazinium salt, and iridium halide and/or halogenoiridate in the molar ratio of 1-1.0 and has pH of lower than 3. The plating bath of this invention is used, for example, for producing of a junction of a cation exchange membrane and iridium, which is used for a water electrolytic cell of the macromolecule solid electrolyte type.

Abstract: The present invention teaches electroless liquid vapor deposition/etching process for depositing on a reactive or non-reactive substrate surface or etching a film on a substrate surface in a bathless deposition apparatus during ULSI processing by the steps of: applying liquid chemical precursor solutions to the surface of the substrate, the liquid chemical precursor solutions are reactive to one another and enter the chamber of the inert atmosphere deposition apparatus separately; spinning the substrate during the application of the liquid chemical precursor solutions; and depositing or etching the film. The process may be implemented in inert atmosphere by enclosing the whole arrangement in a chamber and flowing inert gases such as Ar, He, and N.sub.2, etc.

Abstract: The invention pertains to a process for throughplating of printed circuit boards using conductive plastics for direct plating, wherein a polymer film with intrinsic electric conductivity is adhesively deposited on non-conductive areas of the printed circuit boards, whereupon a metal film is applied. Selective production of the polymer film has previously been seen as requiring an oxidative pre-treatment of the printed circuit board, though this can negatively affect the further course of the process. With the present invention the potential negative effects are avoided by forgoing the oxidation pre-treatment.

Abstract: An adhesive is provided for bonding cyanate ester composite parts together which is also plateable with metal once chemically etched. The adhesive comprises a polymeric matrix and a filler of cyanate ester polymer. The polymeric matrix comprises at least one polyepoxide resin and a curing agent, while the cyanate ester polymer filler is present in the adhesive as a powder. In practice, the present adhesive is applied to the surface of cyanate ester composite articles to be bonded and is allowed to cure at room temperature. Thereafter, the surface of the assembly is chemically etched and then plated with metal. The present adhesive enable the complete coverage of the cyanate ester composite assembly with the plated metal, including the adhesive bondlines.

Abstract: There are disclosed an adhesive obtained by dispersing a cured amino resin fine powder soluble in acid or oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent when being subjected to a curing treatment as well as a printed circuit board using this adhesive and a method of producing the same. The adhesive has excellent properties such as resistance to chemicals, heat resistance, electric properties, hardness and adhesion property owing to the use of the amino resin fine powder. Therefore, the printed circuit board using such an adhesive is not influenced by service circumstance and is high in the connection reliability without forming short circuit between patterns. Furthermore, in the method of producing the printed circuit board, the adhesive is provided in form of a sheet or a prepreg, whereby the printed circuit board can be produced easily and cheaply.

Abstract: A method for monitoring the constituents present in an electroless plating bath solution. The method involves measuring ac spectra using a working electrode which has a high hydrogen overvoltage. First, a selected dc potential is applied to a working electrode which has been subjected to pretreatment and which is present in the electroless bath being analyzed. The electrode must have a high hydrogen overvoltage and is preferably an alloy of a low hydrogen overvoltage noble metal and a high overvoltage metal. A constant ac signal is superimposed on the dc potential. The dc potential is then swept over a chosen range at a selected sweep rate. The various constituents in the bath are then monitored by measuring the ac current at one or more reference phase angles with respect to the constant ac signal between the working electrode and a reference electrode as the dc potential is varied. The resulting ac spectra provides a useful measurement of the make-up of the constituents in the electroless plating solution.

Abstract: A method is provided for preparing the surface of a cyanate ester polymer or composite for metal plating. The surface is treated with a preheated solution containing a compound selected from the group consisting of at least one quaternary ammonium hydroxide and at least one primary amine. The method of the invention operates to improve adhesion between the treated surface and a subsequently plated metal, such that the resulting cyanate ester polymer or composite may replace certain metallic components in such applications as aircraft, spacecraft, and automobiles given its highly conductive metallic coating.

Abstract: A method of treating a halogenated polymeric-containing substrate including exposing at least portions of the halogenated polymeric-containing substrate to a composition containing a reducing agent and an aprotic solvent selected from the group consisting of nitriles, nitro compounds, amides, esters, carbonates, oxides, sulfo compounds and mixtures thereof. The solvent is free of ethers, amines, ammonia. The composition is prepared by reacting a metal with an organic compound selected from the group consisting of polyaryl compounds, aromatic carbonyl containing compounds, aromatic nitriles, and aromatic heterocyclic nitrogen containing compounds in a reaction solvent that does not react with the metal but permits reaction between the metal and the organic compound to thereby provide the reducing agent. The reducing agent is isolated from the reaction solvent to obtain a reaction product as a solid. The reaction product is added to the aprotic solvent.

Abstract: Disclosed is a method for electroless metal deposition, which comprises steps of: forming, on the surface of a non-conductive body to be plated, a coating of a resin composition for the electroless metal deposition containing therein a polymer (A) having a chemical structure of at least one compound selected from the group consisting of the below-listed (a), and at least one compound selected from the group of the below-listed (b)1 and (b)2; applying a negative electrostatic voltage to the film coating of the resin composition at a temperature level above the glass transition point of said resin composition; thereafter removing the applied voltage at a temperature lower than the glass transition temperature; and successively carrying out the metal deposition steps inclusive of the catalyst imparting step and the activating step:(a) a chemical structure, in which a part of hydrogen in the main chain of polymer is substituted with the halogen group or the nitrile group, and a chemical structure having a double

Abstract: A vacuum metallized polyimide film comprising an aromatic polyimide layer containing a hydrocarbyl tin compound in oxidation states (II) or (IV) as an additive and a metal plated layer bonded integrally with a high bonding strength or high adhesion through a vacuum deposited metal layer without the use of an adhesive. The metallized polyimide film can be used for flexible printed circuits and multilayer printed wiring boards, as well as for heaters, antennas and antistatic films.

Abstract: The present invention relates in one aspect to a method of manufacture of a security thread suitable for use in security articles including security paper such as that used for banknotes. In the method a magnetic metal is deposited on a film of polymeric substrate as the substrate passes through a solution containing the magnetic metal and a preparatory operation is carried out on a surface of the substrate prior to immersion of the substrate in the solution. The preparatory operation ensures that magnetic metal is deposited on the substrate in a pattern such that when the security thread is produced from the film by cutting the film the magnetic metal on the security thread has a specific pattern and provides both a visually discernible security feature and a magnetically detectable security feature.

Abstract: An automotive headlamp capable of effectively shielding the electromagnetic waves generated by the discharge lamp of a light source and peripheral portions. A conductive layer for shielding electromagnetic waves, which is composed of a durable metallic plating layer, is provided on the surface of the lamp body of the headlamp. With such a shielding layer, a good electromagnetic shielding effect is obtained a long period of time.

Abstract: A method of making a hollow waveguide for transmitting electromagnetic radiation includes: filling voids on the inner surface of an insulator tube with a coating of a void-filling, hydrophylic material having a free pair of electrons and capable of complexing metal ions; applying a solution of a metal salt over the void-filling material to form a metal complex with the void-filling material; reducing the metal complex to a pure metal layer; and depositing a dielectric film on the pure metal layer.

Abstract: A positive metallization process for metallizing a plastic composite piece containing a polymer and grains of one or more oxides, includes three successive steps. The first step consists of irradiating the plastic piece surface to be metallized with a light beam emitted by an excimer laser. The second step consists of immersing the irradiated piece into at least one autocatalytic bath containing metal ions and without palladium. This immersion induces the deposit of the metal ions onto the irradiated surface to form a metal film onto the surface. The third step consists of thermally processing the metallized plastic piece to induce the diffusion of the deposited metal into the plastic piece.

Abstract: A chemical metallization process is used for electrically non-conducting porous substrates, in needle felts, nonwovens or open-pored foams which possesses a porosity of from 40 to 97%. The metallization follows activation of the fiber surfaces or of the surfaces of the pore walls with a noble metal-containing solution. The volume of the chemical metallizing solution used is reduced to produce a considerable reduction in the operating costs, not only in respect of the solution itself but also in respect of the disposal of the waste water from the chemical metallization. Since less waste water is produced from the start in the chemical metallization process, a considerable contribution to the protection of the environment results.

Abstract: A method for forming an acrylic resist on a surface of a copper layer includes the steps of processing a surface of the copper layer by an ammonia water, and depositing a layer of acrylic resist on the surface of the copper layer after a processing by the ammonia water.

Abstract: A method for patterned metallization of the surface of substrates (1), particularly circuit boards, using electromagnetic radiation (5) in which an electrically nonconducting prime coat (2) is applied full-surface to the substrate (circuit board 1); an electrically nonconducting cover coat which is easily ablated by electromagnetic irradiation (5) in the ultraviolet range is applied full-surface to the prime coating (2), the cover coat (4) being applied in a thickness that is at least equal to the thickness of the metal layer that is to be applied; the cover coat is removed from partial areas by the action of electromagnetic irradiation (5) in the ultraviolet range to form patterns (6) with sharp and steep flanks (7) and expose the prime coat (2); and in the area of the exposed patterns (6) on the prime coat (2), a metal layer is applied, guided by the flanks (7), in a reducing bath.

Abstract: A method is provided for preparing the surface of a cured cyanate ester resin or composite for metal plating. The composite may comprise graphite fibers embedded in a cured cyanate ester resin matrix The surface is treated with a preheated solution containing an alkali metal salt of an alkoxide. Preferred alkoxides are methoxide, ethoxide, propoxide, isopropoxide, butoxide, tert-butoxide, sec-tutoxide, 2- methyl-2-butoxide, pentoxide and hexoxide. The method of the invention operates to improve adhesion between the treated surface and a subsequently plated metal, such that the resulting cured cyanate ester resin or composite may replace certain metallic components in such applications as aircraft, spacecraft, and automobiles given its highly conductive metallic coating.

Abstract: Nanoparticle metal powder having a controllable and narrow size distribution are by electrolessly plating a metal on the interior of a vesicle made of at least one polymerized phospholipid. Electroless plating may be accomplished by catalytic reduction of the metal ion or u.v. reduction of the metal ion.

Abstract: A process for the production of metal coated melamine-formaldehyde fibers is disclosed. Prior to coating, the fibers are first activated. Activation consists of applying a metal layer to the fibers by reducing a water soluble cobalt, copper or nickel salt with either: 1) a less noble metal or metal salt or 2) a hydride compound and a complexing agent. The desired metal coating is then applied to the pretreated fibers by reducing a water soluble salt of the metal with a reducing agent in the presence of a complexing agent.

Abstract: The invention is a method for making a metal containing article, comprising the steps of: providing a layer of a porous ground in a selected area; exposing selected regions of the layer of porous ground to light, thereby metallizing the selected regions; repeating the foregoing steps a selected number of times to produce a selected number of layers; and selectively modifying the metallized regions of the layers. The initial metallization can be by electroless or semiconductor photo deposition plating. The subsequent modification of the metallized regions can be by electroless plating, electroplating or sintering. It is also possible, in some instances, to forego the second phase modification, the initial phase having provided the desired parameters. In a third preferred embodiment, the invention is a method using an initial metallization phase effected by exposure of a metal salt, such as a metal halide, to light, thereby inducing activation of the halide.

Abstract: A method for depositing a conductive metal onto a dielectric substrate is provided. The method includes obtaining a metal sheet having a roughened surface that has the following parameters:R.sub.a =0.05-0.08 mil,R.sub.max =0.20-0.55 mil,S.sub.m =1.00-3.00 mil,R.sub.p =0.20-0.35 mil, andsurface area=0.90-1.20 square milswherein R.sub.a is the average roughness and the arithmetic mean of the departures from horizontal mean line profile;R.sub.max is the maximum peak-to-valley height;S.sub.m is the mean spacing between high spots at the mean line;R.sub.p is the maximum profile height from the mean line; andsurface area is the area under the surface profile from each measurement using a Talysurf S-120 profilometer;The sheet is laminated to the dielectric substrate surface by pressing the roughened surface of the metal sheet against the surface of the substrate and then removed from the substrate.

Abstract: Methods and compositions for electroless metallization. In one aspect, the invention is characterized by the use of chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups that are chemically bound to the substrate. In a preferred aspect, the invention provides a means for selective metallization without the use of a conventional photoresist patterning sequence, enabling fabrication of high resolution metal patterns in a direct and convenient manner.

Abstract: The adhesion of metal coatings deposited by electroless deposition on polycarbonate-addition polymer substrates, especially polycarbonate-ABS substrates, is improved by first contacting the substrate with an alkali metal hydroxide solution followed by concentrated nitric acid.

Abstract: A wet-chemical metallization process is used for electrically non-conductive, previously chemically activated plastic substrate sheets. After metallization, the metallizing solution is separated from the substrate sheet by the influence of gravity or centrifugal force, and the sheet is rinsed with rinsing water. The metallizing solution and the rinsing water are each collected separately and subjected to a treatment for the purpose of reuse. To this end, the metallizing solution is distilled and reused as rinsing water. The rinsing water is worked up into a reusable metallizing solution by the addition of chemical metallizing components, thereby saving costs for make-up water (i.e. distilled water) and reducing pollution of the environment by contaminated effluents.

Abstract: Polyimide-metal laminates are formed by etching the surfaces of a polyimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper per deposition. The glycol containing etchant can be utilized to form through holes through the web.

Abstract: This invention proposes the addition of imidazole and imidazole derivatives to various activator solutions for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed circuit boards without substantial extraneous plating on the solder mask surfaces.

Abstract: A process is disclosed for batchwise metal plating aramid fibers wherein the fibers are knitted into a tube, plated, deknitted, reknitted into a tube, and plated again; and wherein the plating is durable and highly conductive.

Abstract: A method of forming at least one electrically conductive path in a thermoplastic substrate having a melting point below 325.degree. C.

Abstract: A electroless plating method of an Ni--Al intermetallic compound includes steps of a) providing a reducing solution containing a reducing agent and reducing nickel ions, b) adding a proper amount of aluminum powder to the reducing solution, and c) permitting the reducing agent to reduce the reducing nickel ions to be deposited on the aluminum powder. Such electroless plating method permits the Ni--Al compound to be produced inexpensively/efficiently/fastly.

Abstract: A process is disclosed for treating aramid fibers such that metal plating applied thereto is durable, highly conductive, and strongly adherent. The process involves contacting the fibers with an acid, neutralizing and washing the fibers with water, and then plating the fibers by an electroless plating process. The acid treatment of the fibers promotes adhesion between the metal and the fibers and promotes high electrical conductivity for the plated metal.

Abstract: Substrates are activated for subsequent metallization by contacting the substrate with a electrolyte in which reducing agents which are electrochemically generated in the electrolyte. The reducing agents are sorbed by the substrate which is contacted with a seeding medium to dispose on the substrate seed, preferably palladium seed for subsequent electroless and electrolytic metallization.

Abstract: Moldings based on polyamides are surface treated with mixtures of at least 20% strength by weight aqueous hydrochloric acid with mono- or diethers of an aliphatic polyfunctional hydroxy compound in a mixing ratio of from 90:10 to 10:90% by volume.

Abstract: A process for promoting the adhesion of metal to thermoplastic substrates such as polyetherimides. The improvement comprises conditioning the substrate by treating with an inorganic hydroxide solution prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of flexural strength of the substrate throughout subsequent processing steps.

Abstract: A process is disclosed for making metal plated fibrids wherein the plating is conductive and highly durable. The process involves contacting the fibrids with an 80 to 90% sulfuric acid solution, neutralizing and washing the fibrids with water, and then plating the fibrids by an electroless plating process. The acid treatment of the fibrids promotes adhesion between the metal and the fibrids and promotes high electrical conductivity for the plated metal.

Abstract: An adhesive composition containing a special internal mold release agent obtained from tri-, di-, or mono-alkyl phosphoric ester, said alkyl moiety having 6 to 18 carbon atoms, and an amine in addition to major components of an epoxy resin, acrylonitrile-butadiene rubber, an alkylphenol resin, and an inorganic filler is suitable for producing printed wiring boards by an additive process excellent in adhesiveness to plated copper.

Abstract: Electroless deposition of copper from solution onto a substrate, particularly a polymeric laminate for use in electronic circuitry, is accomplished by first treating said substrate with a stilbene-based fluorescent brightener to sensitize said substrate and thereafter contacting said substrate first with a solution of a catalytic metal and then with an electroless copper plating solution.

Abstract: Substrates comprising blends of at least one polyphenylene ether and at least one poly(alkenylaromatic compound) (e.g., polystyrene) are treated with aqueous tetravalent cerium in a concentration of at least about 0.1 M, preferably acidified with nitric acid, to improve adhesion to metal coatings subsequently deposited nonelectrolytically; for example, by electroless deposition. The metallized articles are heat treated following metal deposition. Further metal coatings may be deposited, preferably followed by further heat treatment.

Abstract: The method serves for the electroless deposition of a metal layer (7) from a metallization liquid on a top side of a flat article to be metallized, more in particular a flat disc, for example, a master disc (1) which is used for the reproduction of optical discs. According to the method the top side of the article is first made hydrophilic, if so necessary, after which, with the article supported in a horizontal position, a quantity of metallization liquid is provided on the top side which was previously made hydrophilic as a stable liquid layer (16) bounded by the edges of the article, after which the deposition of the metal from the liquid on the article takes place and the liquid layer is the removed entirely from the surface.

Abstract: Conductive fibers of a combination of aramid and polyvinyl pyrrolidone (PVP) are disclosed having a strongly bonded metal coating applied by electroless plating. PVP increases adhesion of the fiber surface to the electroless plating. The preferred aramid is poly(p-phenylene terephthalamide).

Abstract: Increases in surface resistivity of electroless nickel coatings on polycarbonate-containing substrates are inhibited by employing two electroless nickel plating solutions. The first solution is one which deposits a metal layer containing phosphorus, if any, in an amount up to 5% by weight and is used to deposit a layer at least 0.5 micron thick. The second solution is one which deposits a layer containing phosphorus in the amount of at least 5% and preferably at least 6% by weight. Another metal layer may be interposed between the two nickel layers.

Abstract: A process and catalyst for electroless plating of metal over a substrate. The process involves providing a catalyst that is the product of reaction of a noble metal with bromide ions where the ratio of bromide ions to noble metal ions is at least 100 to 1 and the noble metal is present in a concentration sufficient to catalyze an electroless plating reaction, contacting a substrate to be plated with the catalyst, and reducing the catalyst prior to or during plating of the substrate.

Abstract: Metallic silver is deposited upon the surface of a nonconducting substrate using a multi-step wet deposition process. The surface is cleaned, and then activated in an aqueous solution containing stannous tin. The silver is deposited as a colloidal material from an aqueous solution of a silver-containing salt, a reduction agent that reduces the salt to form the metallic silver, and a deposition control agent that prevents the silver from nucleating throughout the solution. After the substrate is coated, the coating is stabilized in an aqueous solution of a salt of a metal from the platinum group or gold, dissolved in dilute hydrochloric acid. The process is particularly effective for depositing uniform films of 2 to 2000 Angstroms thickness, which strongly adhere to the substrate.

Abstract: A method and apparatus for coating an interior surface in which a spinning vaned plate is used to apply a low-water-content mortar-like substance to an interior surface, such as a manhole, wetwell or similar structure. A tank containing the mortar-like substance is positioned above the vaned plate, and a valve is located between the tank and the vaned plate for controlling the flow of mortar-like substance from the tank to the spinning vaned plate. An agitating element such as a vibrator head is associated with the tank for inducing the mortar-like substance to flow freely. The apparatus may be lowered into a structure, and the mortar-like substance applied to the interior walls without a worker having to enter the structure.

Abstract: A method of selectively seeding or activating metal interconnections patterned on polyimide dielectric surfaces using an aqueous solution of palladium sulfate, palladium perchlorate, palladium trifluoromethane sulfonate, palladium nitrate or other palladium salts having poorly coordinating counter ions. This strongly selective seeding and the corresponding ability to reliably remove all traces of the seeding material from the polyimide surface eliminates shorting, bridging and reduction of breakdown voltage during electroless plating of a thin layer of nickel or cobalt.

Abstract: Primers, essentially consisting of a film former or matrix former, an additive, an ionic and/or colloidal noble metal, a filler and a solvent, are suitable for coating substrate surfaces for subsequent chemical metallization.

Abstract: A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical conductivity therein. Also, new structures containing a free standing halogenated polymeric-containing layer and electrical conductive pattern thereon are provided.

Abstract: A method for roughening the surface of a resin molded article to make it susceptible to metallizing is disclosed, comprising contacting a resin molded article at least the surface of which to be toughened mainly comprises a block copolymer comprising 100 parts by weight of a polyphenylene sulfide resin and from 30 to 100 parts by weight of a polyphenylene sulfide ketone resin with a solvent capable of dissolving a polyphenylene sulfide ketone resin more than a polyphenylene sulfide resin.

Abstract: A method of preparing an electrically insulating polymer substrate, particularly those containing an aromatic group, for the reception of an electrically conductive pattern, said substrate having a glass transition temperature or a softening temperature, comprises the steps of: performing a first cleaning of the substrate; heating the substrate in a nitrogen atmosphere for about 3 hours at a temperature of about 20.degree. C. below the glass transition temperature or the softening temperature of the substrate; cooling the substrate to room temperature; roughening the surface of the substrate by, for example, etching said substrate in a chromic acid-containing solution for about 3 minutes at a temperature of between 65.degree. C. and 70.degree. C.; and performing a second cleaning and drying of the substrate.