Abstract: The invention provides a process for producing a plated plastic article, which requires no chemical etching and can ensure high quality of plating without addition of a large amount of any inorganic filler in order to form a physically rough surface for an effective plating adhesion. After molding thermoplastic materials having a shear strength of 50 MPa or more, the surfaces of the molded articles are subjected to liquid honing treatment with an aluminum abrasive so that the surface roughness Rz (average roughness of ten points) is 10 &mgr;m or more, and subsequently addition of catalyst, activation treatment, and electroless plating are carried out.

Abstract: Compositions and methods for coating and plating a non-conductive substrate, the substrate having a surface, comprising coating the surface with a binding solution composition, the binding solution composition comprising between approximately 30% by weight and approximately 70% by weight of a binding solution, between approximately 2% by weight and approximately 10% by weight of carbon black powder, between approximately 25% by weight and approximately 50% by weight of aluminum powder, cleaning the coated surface, and immersing the cleaned, coated surface into a plating bath, the plating bath comprising between approximately 5% by volume and approximately 20% by volume hydrofluoric acid, between approximately 4% by volume and approximately 6% by volume copper sulfate, and water.

Abstract: A method for forming an oxidation barrier including at least partially immersing a semiconductor device structure in an electroless plating bath that includes at least one metal salt and at least one reducing agent. The reaction of the at least one metal salt with the at least one reducing agent simultaneously deposits metal and a dopant thereof. The oxidation barrier may be used to form conductive structures of semiconductor device structures, such as a capacitor electrode, or may be formed adjacent conductive or semiconductive structures of semiconductor device structures to prevent oxidation thereof. The oxidation barrier is particularly useful for preventing oxidation during the formation and annealing of a dielectric structure from a high dielectric constant material, such as Ta2O5 or BST.

Abstract: A conductive electrolessly plated powder used, for example, for bonding a small electrode of an electronic device, its producing method, and a conductive material containing the plated powder. Conventionally, there has been known, as conductive powders, metallic powders such as of nickel, carbon powders, and conductive plating powders the resin core particles of which are coated with a metal, e.g., nickel. However, there has been no conductive electrolessly plated powders having a good conductivity with respect to connection between conductive patterns having an oxide coating thereon or between electrodes and no methods for producing such powders industrially. The conductive electrolessly plated powder of the present invention consists of resin spherical core particles the average size of which is 1 to 20 &mgr;m and each of which has a nickel or nickel alloy coating formed by electroless plating. The coating includes small projections of 0.

Abstract: After treated in a solution containing ozone, a plating material is brought into contact with a solution containing at least one of an anionic surface active agent and a nonionic surface active agent, and an alkaline component. Ozone acts to locally break unsaturated bonds on a surface of the plating material to form C—OH bonds or C═O bonds, thereby activating the surface of the plating material, and since a surface active agent 1 is adsorbed thereon, a catalyst 2 is adsorbed on hydrophilic groups of the surface active agent 1 which has been adsorbed on the above-described functional groups. Consequently, no etching treatment is required, and an electroless plated coating having excellent adhesion can be formed without roughening the surface of the resin material.

Abstract: A method for forming copper-resin composite materials is disclosed. This method affixes a palladium or palladium-tin catalyst onto resin substrate, and then subjects the catalyst-containing resin to an electroless copper plating bath without performing a catalyst acceleration treatment step.

Abstract: A process for the metallization of a plastic surface, whereby the following process steps are performed in sequence, one after another. The plastic surface is subjected to an etching treatment under mild etching conditions. Subsequently, the plastic surface is treated with a metal salt solution, containing at least one salt from the group consisting of a cobalt salt, a silver salt, a tin salt, and a lead salt. The plastic surface is treated with a sulfide solution. Finally, the plastic surface is metallized in a metallizing bath.

Abstract: In the catalyst-applying treatment, the sensitization treatment is carried out by dipping the base material which has been subjected to the preliminary treatment in a tin chloride solution applied with a predetermined amount of fluorine type anionic surfactant, and the activation treatment is carried out by dipping the base material which has been subjected to the preliminary treatment in a palladium chloride solution applied with a predetermined amount of fluorine type anionic surfactant.

Abstract: A process for the metallization of a plastic surface, whereby the following process steps are performed in sequence, one after another. The plastic surface is subjected to an etching treatment under mild etching conditions. Subsequently, the plastic surface is treated with a metal salt solution, containing at least one salt from the following group: cobalt salt, silver salt, tin salt, and lead salt. The plastic surface is treated with a sulfide solution. Finally, the plastic surface is metallized in a metallizing bath.

Abstract: A process for the deposition of a metal on surfaces of a shaped plastic body. A catalyst for metal deposition is incorporated into a shaped body. After removing material from a surface of the body and activating the catalyst with an acid, metal is deposited on the surface by an electroless metal deposition process.

Abstract: A method for electroless plating a metallic layer on the surface of a non-metallic substrate. The method comprises (a) exposing the non-metallic substrate to a solution comprising non-precious metal ions so as to obtain a non-metallic substrate covered with a layer of non-precious metal ions; and (b) exposing the covered non-metallic substrate obtained in step (a) to a reducing solution comprising a reducing agent capable of reducing the metal ions that cover the substrate from their oxidation state in step (a) to a lower oxidation state, preferably to zero valence state. In a preferred embodiment, metallization is accomplished by inducing precipitation of metal, e.g. copper, on the surface to be metallized (this effect also being referred to as “plate-out”), via decomposition of the electroless solution. The inventive process contrasts with the prior art, wherein electroless copper deposition is predominantly initiated or triggered through a Pd-bearing layer.

Abstract: A method of forming a conductive metal layer on a non-conductive surface, including providing a non-conductive surface; contacting the non-conductive surface with an aqueous solution or mixture containing a stannous salt to form a sensitized surface; contacting the sensitized surface with an aqueous solution or mixture containing a silver salt having a pH in the range from about 5 to about 10 to form a catalyzed surface; and electroless plating the catalyzed surface by applying an electroless plating solution to the catalyzed surface.

Abstract: A method of electroless plating for processing a plating surface to form a barrier layer being capable of uniformly forming a barrier layer and reducing the consumption of a processing solution, comprising a step of feeding a processing solution used in at least one of the pre-processing steps of the electroless plating and the electroless plating step to the plating surface for puddling treatment, or, using a processing solution at least containing, with respect to one mole of a first metallic material supplying a main ingredient of the barrier layer, three or more moles of a completing agent and three or more moles of reducing agent and having a pH value adjusted to 9 or more and stored in an atmosphere of an inert gas or ammonia gas, and a corresponding electroless plating apparatus.

Abstract: A method for producing conductor coating on dielectric surface may be used in many areas of industry for preparation of dielectric surfaces for selective electroplating. Using this method, conductor coatings are obtained when dielectric items are etched in acidic solutions containing oxidising agents, then treated in trivalent bismuth compound solution and additionally treated in sulphide solution.

Abstract: A method and apparatus for improving interfacial chemical reactions in electroless depositions of metals, in which the substrate to be plated is pre-heated prior to its immersion in the various processing solutions that require elevated temperatures, and especially before immersion in the electroless plating solution. The pre-heating is carried out to a temperature that is needed to bring about the desired chemical reaction at the substrate-solution interface, allowing the bath of that process step to operate significantly below the temperature that would have been needed if the panel had not been pre-heated, and below the solution temperature of current practice. According to another aspect of the present invention, the electroless plating apparatus for plating a workpiece operates in a vertical mode and it comprises a heating station, with the panel to be plated returning to the heating station as dictated by the temperature required for a given process step.

Abstract: A process for coating substrates having polymer surfaces with metals in the manufacturing of printed circuit boards, in particular in the manufacturing of printed circuit boards having microscopic holes and fine geometries by the application of an electroconductive polymer layer and a subsequent metallization, wherein the electroconductive polymer layer is preferably doped with a zinc-containing, colloidal palladium solution prior to the metallization step, the electroconductive polymer is poly-3,4-ethylenedioxythiophene and a contacting with a copper(II) salt solution is performed prior to the metallization.

Abstract: A method for forming a metal pattern by the micro-stamping process involves the steps of treating a substrate bearing a thin film of a reducing silicon polymer with a solution containing a salt of a metal having a standard oxidation-reduction potential of at least 0.54 volt, allowing metal colloid to deposit on the substrate surface, stamping a pattern of an alkane thiol to the substrate surface for transferring the pattern to the metal colloid-bearing silicon polymer thin film, and effecting electroless metal plating for forming a metal pattern only on the region of the silicon polymer thin film which is not covered with the alkane thiol pattern. The finely defined metal pattern can be formed on any type of substrate though inexpensive simple steps and has good adhesion to the substrate.

Abstract: When a barrier layer formed on a surface of a contact hole is subjected to electroless plating of copper, a salt of a metal such as gold, nickel, palladium, cobalt or platinum is added as a plating accelerator in an amount of 1 mol % or less based on a copper salt in a composition of an electroless plating solution, whereby the metal having the higher catalytic activity than copper is precipitated before precipitation of copper, and copper can then be precipitated as a good-quality plated film.

Abstract: Methods for electroless deposition of conductive material on a substrate using in both cases a stamp having a patterned surface which is pressed onto the surface of a substrate for printing the substrate and providing a pattern of a catalyst on the substrate on which metal deposition occurs in the course of electroless deposition by immersing the printed substrate in a plating bath are provided. In one case, the stamp is pretreated to render the pattern of the stamp wettable with a catalytic ink which is transformed to the surface of the substrate. In the other case, a catalytic layer is provided on the surface of the substrate which is patterned by the stamp transferring a resist material onto the catalytic layer so that a subsequent etching process lays open the desired pattern of the catalytic layer for electroless deposition.

Abstract: A method for forming an oxidation barrier including at least partially immersing a semiconductor device structure in an electroless plating bath that includes at least one metal salt and at least one reducing agent. The reaction of the at least one metal salt with the at least one reducing agent simultaneously deposits metal and a dopant thereof. The oxidation barrier may be used to form conductive structures of semiconductor device structures, such as a capacitor electrode, or may be formed adjacent conductive or semiconductive structures of semiconductor device structures to prevent oxidation thereof. The oxidation barrier is particularly useful for preventing oxidation during the formation and annealing of a dielectric structure from a high dielectric constant material, such as Ta2O5 or BST.

Abstract: A method of activating a non-conductive substrate for use in electroless deposition is proposed, in which an aqueous solution containing nanoparticles of noble metals and their alloys is used as an activation solution in an electroless plating process, so as to electrolessly deposit a conductive metal deposition on the substrate and into micrometer-sized trenches formed on the substrate. By using this method with provision of a solution of a copper or nickel salt, copper or nickel can be deposited on the non-conductive substrate, allowing high aspect-ratio trenches on the substrate to be filled with copper or nickel for subsequent use in fabrication of integrated circuit interconnection.

Abstract: A substrate metal such as aluminum, usually in the form of a web, is anodized to form a porous oxide coating. A catalytic metal is then electrolytically deposited into the base of the pores preferably using an AC current. A portion of the oxide coating is then stripped away to expose the deposited catalytic metal at the surface of the remaining oxide layer. Alternately, a generally non-catalytic base metal may first be deposited followed by the deposition of the catalyst metal within the pores over the base metal. Further alternatives include stripping the oxide down to the base metal and then depositing the catalyst metal on the surface, further anodizing to form additional oxide between the deposited metal and the substrate, and enlarging the cross section of the base of the pores prior to the deposition of the metal.

Abstract: Processes for the integration of illuminated displays with articles of fabric or textiles are described. In one aspect, a rear electrode of an electroluminescent panel is formed directly onto a fabric section substrate by the following process, a formed image is placed over a fabric section to define an area for display and a catalyst is applied to such display area; the fabric section display area with catalyst thereon is immersed in an electroless plating bath and subsequently removed, allowing a chemical reduction to occur in the aqueous solution; such fabric section is immersed in an electrode bath to form an electrode layer integrated with the fabric section and patterned in the associated image. In another aspect, a process is used to form an insulative layer for encapsulating the fabric section substrate having a rear electrode. In still another aspect, process is used to form the layers of an electroluminescent panel integral with a substrate.

Abstract: An improved additive process for metallization of substrates is described whereby a catalyst solution is applied to a surface of a substrate. Metallic catalytic clusters can be formed in the catalyst solution on the substrate surface by heating the substrate. Electroless plating can then deposit metal onto the portion of the substrate surface coated with catalyst solution. Additional metallization thickness can be obtained by electrolytically plating the substrate surface after the electroless plating step.

Abstract: A substrate includes a non-conductive portion to be electroless-plated of a substrate, on the surface of which fine metal catalyst particles composed of silver nuclei and palladium nuclei each having an average particle size of 1 nm or less adhere at a high nuclei density of 2000 nuclei/&mgr;m2 or more. The metal catalyst particles are produced by sensitizing the non-conductive portion of the substrate by dipping the substrate in a sensitizing solution containing bivalent tin ions, activating the non-conductive portion of the substrate by dipping the substrate in a first activator containing silver ions, and activating the non-conductive portion of the substrate by dipping the substrate in a second activator containing palladium ions.

Abstract: A novel precious metal doped porous metal catalyst is disclosed. The precious metal is present in from 0.01 to 1.5 weight percent and distributed throughout the particles of porous metal to provide a surface to bulk ratio distribution of not greater than 60. The present invention is further directed to a process of forming said doped catalyst and to improved processes of catalytic hydrogenation of organic compounds.

Abstract: Provided are methods of preparing an electrically conductive polymeric foam. The methods include the following steps: (a) contacting a polymeric foam with a surfactant solution; (b) contacting the polymeric foam with a sensitizing solution; (c) contacting the polymeric foam with an activation solution; and (d) forming at least one metallic layer on the polymeric foam with an electroless plating process. Also provided are electrically conductive polymeric foams formed by such methods. The present methods and foams have particular applicability to the manufacture of EMI (electromagnetic interference) shielding devices.

Abstract: Metal patterns (15) can be provided on a glass substrate (1) in an electroless process by modifying the substrate with a silane layer (3), locally removing said layer with a laser or UV-ozone treatment and selectively nucleating the remaining silane layer in a polymer-stabilized Pd sol. Neither a photoresist nor organic solvents are used. The method is very suitable for the manufacture of the black matrix on a passive plate for an LCD, or on panels of other flat colour displays, such as flat cathode ray tubes.

Abstract: A novel precious metal doped porous metal catalyst is disclosed. The precious metal is present in from 0.01 to 1.5 weight percent and distributed throughout the particles of porous metal to provide a surface to bulk ratio distribution of not greater than 60. The present invention is further directed to a process of forming said doped catalyst and to improved processes of catalytic hydrogenation of organic compounds.

Abstract: In a method of treating a surface of a face panel for an image display including forming a film on the surface using coating materials, the film is formed of at least two layers including a first layer formed by a spray coating method and a second layer formed by a spin coating method to be superposed on the first layer. Thus, a face plate having antireflection/antistatic effects and providing high-resolution images can be obtained with high efficiency.

Abstract: There are known for use in the electronics industry polyimide substrates with copper coatings, which are produced by decomposition of organometallic compounds by means of a glow discharge process and subsequent electroless metallization of the resulting metal film. From deposition of the first metal coating there results, without addition of oxygen, carbon-containing layers which have a low conductivity and low catalytic activity. If only alkaline metallizing baths are used, initially securely adhering metal coatings are in fact deposited on the polyimide surfaces, the secure adhesion of the metal coatings on the polyimide however is considerably impaired upon contact of the metal with aqueous-alkaline solutions. If operation is in an oxygen atmosphere, palladium layers result which must be subsequently reduced. Such layers provide no or very small adhesion, when they are exposed to chemical or electrochemical process solutions.

Abstract: A transparent electromagnetic radiation shield panel suitable for placement in front of a TV display device, particularly a large plasma display panel, or other such source of electromagnetic radiation to shield the viewer from electromagnetic radiation is provided, which transparent electromagnetic radiation shield material comprises a transparent electromagnetic radiation shield film, a transparent adhesive layer provided on an electromagnetic radiation shield layer of the film, and a display panel having the transparent electromagnetic radiation shield film laminated thereto via the transparent adhesive layer.

Abstract: An efficient process for partial electroless plating that causes plating film to deposit only a specific part of substrate which needs plating, without requiring the corrosion step. The process includes five steps of forming a coating film on which electroless plating is performed, activating said coating film, imparting a catalyst to said coating film, activating said catalyst, and performing electroless plating, and said coating film is formed from any one of the following four resin compositions:1. composed of a low-molecular weight compound having an N--H bond, an adhesive polymer having a C.dbd.C double bond, and a polybasic acid having a C.dbd.C double bond;2. composed of an adhesive polymer dense with N--H bonds, and a polybasic acid compatible with said polymer or a monobasic acid having a C.dbd.C double bond;3. composed of a resin component which gives rise to an N--H bond upon curing reaction, and a polybasic acid having a C.dbd.C double bond; or4.

Abstract: Ultra smooth as-deposited electroless nickel coatings are achieved employing a plating bath containing aluminum and/or copper ions. Embodiments include electroless deposition of an amorphous nickel-phosphorous coating on a glass, glass-ceramic, ceramic, or aluminum-containing substrate, with an as deposited average surface roughness (Ra) of less than about 16 .ANG., depositing an underlayer, and depositing a magnetic layer to form a magnetic recording medium.

Abstract: Extremely thin polymer film substrates are conditioned for subsequent electroless plating by contact with a mild caustic solution. Aqueous solutions of about 1/2 wt % NaOH or KOH can successfully condition polyimide films with contact times of less than an hour. The more robust PET polymer films benefit from the addition of a permanganate salt to the solution to accelerate the conditioning process. Since these films are so thin, less than 1 mil, significant loss of polymer is not necessarily desirable. This process is designed to roughen the surface of the polymer film and render it hydrophilic to enhance the effectiveness of the subsequent electroless metal film deposition.

Abstract: A method of transferring a chemical activating agent from an applicator to a substrate surface involves providing an applicator having a raised application surface, applying a chemical activating agent to the application surface, contacting the substrate surface with the application surface, and removing the applicator. The chemical activating agent is transferred in a form in which it is capable of effecting a chemical reaction, such as catalysis, at the surface. Thus, following transfer of the chemical activating agent to the surface in a pattern, a metal can be plated at the substrate surface in the pattern. The applicator can be an elastomeric stamp having a raised portion defining a stamping surface.

Abstract: An elastic ground plane (50) has an environmental coating (58) attached to a surface of a fabric (54) having a lo plurality of fibers. A conductive substance (56) is applied to the fabric (54) to coat the fabric (54).

Abstract: Disclosed is a method of forming electroless metal plating layers on one single surface of a plastic substrate and the product thereof. The method includes steps of degreasing or pre-etching the material for forming the substrate, etching the material, adding catalysis, activating, drying, spraying non-conducting paint on a first surface of the material, accelerating, forming an electroless copper plating layer on a second surface of the material, activating, forming an electroless nickel plating layer on the second surface of the material, sealing, dehydrating, drying, inspecting, and packing. Wherein, the steps of spraying non-conducting paint and drying give the material a beautiful painted appearance on the first surface thereof. The non-conducting paint on the first surface of the material facilitates easy formation of smooth electroless copper and nickel plating layers on the second surface of the material. Therefore, a product of the method can be used in electronic products requiring high sensitivity.

Abstract: Method and baths for electroless depositing Cu on a semiconductor chip using four preferred Cu electroless baths. All four preferred electroless baths use hypophosphite as a reducing agent. The 4 baths use the following mediators (1) Nickel sulfate, (2) Pd Sulfate (3) Co Sulfate (4) Fe Sulfite, and complexing agents (Na Citrite, Boric Acid, Ammonium Sulfite). The baths can operate at a pH between 8 and 10. The invention forms high purity Cu interconnects having adequate step coverage to form in a hole having an aspect ratio greater than 2.7 to 1.

Abstract: A polymeric yarn to be coated with electroless nickel is pretreated with an acid and a surfactant to render the yarn surfaces water wettable and not substantially mechanically degraded. All surfaces of yarn formed of polymeric monofilament fibers are coated with a layer of electroless nickel which can also include an electrolytic metal such as copper on the nickel. The yarn is passed through an electroless Ni aqueous bath under little or no tension so that the electroless Ni can coat all of the monofilament surface substantially uniformly. The nickel coated yarn then can be coated with electrolytic metal such as copper in an electrolytic metal plating step.

Abstract: A method is provided for selectively metallizing one or more three-dimensional materials in an electronic circuit package comprising the steps of forming a layer of seeding solution on a surface of the three-dimensional material of interest, exposing this layer to light of appropriate wavelength, resulting in the formation of metal seed on regions of the three-dimensional material corresponding to the regions of the layer of seeding solution exposed to light; removing the unexposed regions of the layer of seeding solution by subjecting the exposed and unexposed regions of the layer of seeding solution to an alkaline solution. Thereafter, additional metal is deposited, e.g., plated, onto the metal seed using conventional techniques. Significantly, this method does not involve the use of a photoresist, or of a corresponding chemical developer or photoresist stripper.

Abstract: The invention relates to a process for the continuous chemical metallizing of porous substrates in a wet-chemical manner. According to the invention, the different reaction rates of the adsorption or ionic reduction reaction, in the case of activating with Pd/Sn, are adapted to the chemical metallizing reaction used. The removal of the spent process solutions from the pores of the substrate takes place by suction. The invention permits a continuous implementation of the process of depositing a metal layer on an electrically non-conductive, synthetic substrate, which can be used at the start of a galvanic reinforcing process of the chemically deposited metal coating.

Abstract: The process for producing through-connected printed circuit boards or multilayered printed circuit boards with a polymer base with conductive polymers using a combined desmearing and direct metalization process (multilayering) is performed by subjecting the polymer base materials, provided with bore holes, to the following process steps:1) swelling in a per se known treatment liquid and rinsing with water;2) treatment with alkaline permanganate solution (desmearing);3) rinsing with water;4) rinsing with acidic aqueous solution (pH value about 1, rinsing time 10 to 120 s, depending on acid content);5) rinsing with water;6) rinsing with alkaline aqueous solution (pH 8 to 9.5);7) rinsing with water;8) rinsing with microemulsion of ethylene-3,4-dioxythiophene (catalyst);9) rinsing with acid (fixation);10) rinsing with water;11) coppering;12) rinsing with water; and13) drying;14) usual process steps for creating the printed circuit pattern.

Abstract: Metallic silver is deposited upon the surface of a nonconducting substrate using a multi-step wet deposition process. The surface is cleaned, and then activated in an aqueous solution containing stannous tin. The silver is deposited as a colloidal material from an aqueous solution of a silver-containing salt, a reduction agent that reduces the salt to form the metallic silver, and a deposition control agent that prevents the silver from nucleating throughout the solution. After the substrate is coated, the coating is stabilized in an aqueous solution of a salt of a metal from the platinum group or gold, dissolved in dilute hydrochloric acid. The process is particularly effective for depositing uniform films of 2 to 2000 Angstroms thickness, which strongly adhere to the substrate.

Abstract: Disclosed are an electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, the plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and 1.2.times.10.sup.-4 to 1.2.times.10.sup.-3 mole/l of an iron ion compound as a reaction initiator and/or 1.92.times.10.sup.-4 to 1.92.times.10.sup.

Abstract: A process for metal plating a high impact, high temperature plastic suitable for forming trim elements of an automobile. The process is particularly directed to plating an elastomer-modified PPA resin, and entails closely controlled process steps that include selectively etching the elastomer and the PPA matrix with a solution containing chromic acid, then effectively removing from the substrate any retained chromium which would adversely affect the ability of metal plating to adhere to the substrate, and thereafter protecting the substrate from attack by sulfuric acid. The process is particularly effective for electroplating a PPA resin modified with about five to about 30 weight percent EPDM.

Abstract: A process for metal plating a high impact, high temperature plastic suitable for forming trim elements of an automobile. The process is particularly directed to plating an elastomer-modified PPA resin, and entails closely controlled process steps that include selectively etching the elastomer and the PPA matrix with a solution containing chromic acid, then effectively removing from the substrate any retained chromium which would adversely affect the ability of metal plating to adhere to the substrate, and thereafter protecting the substrate from attack by sulfuric acid. The process is particularly effective for electroplating a PPA resin modified with about five to about 30 weight percent elastomeric materials.

Abstract: A method of electroless plating at least one homogeneous metal coating in a predetermined pattern on a solid substrate surface having pendant hydroxy groups. The method includes the steps of providing a first monatomic metal layer in a predetermined pattern on the solid substrate surface having pendent hydroxy groups and then immersing the solid substrate surface in a bath containing a chemical reducing agent to build up the at least one homogeneous metal coating only on the monatomic metal layer.

Abstract: This invention provides a method of electroplating a non-conductive material, the method comprising the steps of bringing a non-conductive material into contact with an acidic hydrosol solution containing a palladium compound, a stannous compound and a copper compound, bringing the material into contact with an aqueous alkaline solution, and electroplating the material. According to the method of the invention, a desired coating having an excellent decorative appearance can be formed by electroplating without involving electroless plating on even a non-conductive material having a large area such as plastic molded components.

Abstract: A sanitary article, particularly a sanitary fitting or plumbing fitting, having a coated surface, in which on a coating face and/or below a coating face is provided at least one print image which color-contrasts with the coating.