Abstract: Embodiments of the present disclosure relate to an oxygen cleaning chamber with UV radiation generator temperature control and a method of atomic oxygen cleaning a substrate. The atomic oxygen cleaning chamber includes a process chamber and a cooling chamber coupled to the process chamber and a divider sealingly separating the process chamber from the cooling chamber. An ultraviolet (UV) radiation generator is disposed in the cooling chamber and provides UV radiation through the divider into the process chamber. A gas distribution assembly distributes ozone over an upper surface of a pedestal in the process chamber and a coolant distribution assembly distributes cooling gas into the cooling chamber to cool the UV radiation generator. By actively cooling the UV radiation generator, a higher intensity UV radiation at a stable wavelength is produced, i.e., without wavelength drift normally associated with high power UV radiation generator outputs.

Abstract: A thin film resistor (TFR) module may be formed in copper interconnect in an integrated circuit device. A pair of displacement-plated TFR heads may be formed by forming a pair of copper TFR head elements (e.g., damascene trench elements) spaced apart from each other in a dielectric region, and displacement plating a barrier region on each TFR head element to form a displacement-plated TFR head. A TFR element may be formed on the pair of displacement-plated TFR heads to define a conductive path between the pair of TFR head elements through the TFR element and through the displacement-plated barrier region on each metal TFR head. Conductive contacts may be formed connected to the pair of displacement-plated TFR heads. The displacement-plated barrier regions may protect the copper TFR heads from copper corrosion and/or diffusion, and may comprise CoWP, CoWB, Pd, CoP, Ni, Co, Ni—Co alloy, or other suitable material.

Abstract: A method and apparatus for thermally processing material on a low-temperature substrate using pulsed light from a flash lamp is disclosed. Material is conveyed past the flash lamp. The pulses of light are formed by Pulse Width Modulation to tailor the shape of the pulses to generate a thermal gradient in the substrate that enables the material to be heated beyond the maximum working temperature of the substrate without damage. Its shaped pulse rate is synchronized to the conveyance speed of a conveyance system. By using the information from a feedback sensor, the thermal gradient is recalculated to alter the shape of the pulses in real time for optimizing subsequent curings in real time without powering down the curing apparatus. The combined pulse shaping and synchronization allow a temperature profile to be tailored in the sample that is uniformly cured in the conveyance direction.

Abstract: Asymmetric structures formed on a substrate and microlithographic methods for forming such structures. Each of the structures has a first side surface and a second side surface, opposite the first side surface. A profile of the first side surface is asymmetric with respect to a profile of the second side surface. The structures on the substrate are useful as a diffraction pattern for an optical device.

Abstract: A method for forming a multilayer composite structure comprises providing a first sheet comprising a copper-comprising layer sandwiched by first and second graphene layers, wrapping the first sheet to form a first rod, and compacting the first rod to form a first multilayer composite structure.

Abstract: There is provided a method of manufacturing a semiconductor device which includes: supplying a process gas to a process chamber in a state in which a substrate with an insulating film formed thereon is mounted on a substrate support part inside the process chamber; supplying a first power from a plasma generation part to the process chamber to generate plasma and forming a first silicon nitride layer on the insulating film; and supplying a second power from an ion control part to the process chamber in parallel with the generation of plasma, to form a second silicon nitride layer having lower stress than that of the first silicon nitride layer on the first silicon nitride layer.

Abstract: A semiconductor manufacturing method includes setting a relative position between first through holes of a first plate-shaped part and second through holes of a second plate-shaped part to a first relative position. The method includes supplying a first gas containing a component of the first film onto the semiconductor substrate in a reactor through the first through holes not closed with the second plate-shaped part, to form the first film on the semiconductor substrate. The method includes relatively moving the first plate-shaped part and the second plate-shaped part to change the relative position to a second relative position. The method includes supplying a second gas containing a component of the second film onto the semiconductor substrate through the first through holes not closed with the second plate-shaped part, to laminate the second film on the first film.

Abstract: The embodiments disclose a method including depositing a resist layer using a mixture of several different length polymer strings materials spanning a range of natural periodicity, and imprinting the mixture of several different length polymer strings using sheared guiding patterns to increase flexibility.

Abstract: The present disclosure provides a biochip and methods of fabricating. The biochip includes a fluidic part and a sensing part bonded together using a polymer. The fluidic part has microfluidic channel pattern on one side and fluidic inlet and fluidic outlet on the other side that are fluidly connected to the microfluidic channel pattern. The fluidic inlet and fluidic outlet are formed by laser drilling after protecting the microfluidic channel pattern with a sacrificial protective layer. The polymer bonding is performed at low temperature without damaging patterned surface chemistry on a sensing surface of the sensing part.

Abstract: Disclosed is a TiAgN coating layer, formed by subjecting a substrate having a surface roughness of about 0.05˜0.1 ?m to plasma coating by periodically turning on/off an Ag source while a Ti source is continuously turned on in a nitrogen gas atmosphere, a TiAgN coating method, and a TiAgN coating apparatus.

Abstract: Provided are a plasma processing apparatus with a radio-frequency power supply supplying temporally modulated intermittent radio-frequency power which can be controlled with high precision in a wide repetition frequency band, and a plasma processing method using the plasma processing apparatus. A plasma processing apparatus includes: a vacuum vessel; a plasma generating section plasma in the vacuum vessel; a stage installed in the vacuum vessel and mounted with a sample; and a radio-frequency power supply applying temporally modulated intermittent radio-frequency power to the stage, wherein the radio-frequency power supply has two or more different frequency bands and temporally modulates the radio-frequency power by a repetition frequency which has the same range of analog signals used in each of the frequency band.

Abstract: In a transparent electroconductive film including a transparent substrate and a transparent electroconductive oxide layer disposed on the transparent substrate, when the transparent electroconductive oxide layer is composed of zinc oxide, the surface resistivity of the transparent electroconductive oxide layer increases with time and thus it has been difficult to obtain a transparent electroconductive film stable against an environmental variation. Consequently, hard carbon films are provided on the surfaces of a transparent electroconductive oxide layer including at least one layer and containing zinc oxide as a main component in “the order of transparent substrate-hard carbon film-transparent electroconductive oxide layer-hard carbon film” or “the order of hard carbon film-transparent substrate-transparent electroconductive oxide layer-hard carbon film”. Alternatively, an organosilicon compound covering layer is provided on a surface of the transparent electroconductive oxide layer.

Abstract: Disclosed is a surface treatment method for producing a coating layer, which improves surface properties (e.g., low friction wear-resistance) of the coating layer at high temperature. The surface treatment method controls a process pressure during the formation of a coating layer to form a fine surface morphology with increased silver (Ag) content. The surface treatment method includes: heating a coated material in a chamber; removing foreign substances from the surface of the heated, coated material; forming a buffer layer on the surface of the coated material; and forming a coating layer on the buffer layer, wherein the process pressure is controlled during the formation of the coating layer to improve the surface properties at high temperatures.

Abstract: A light emitting diode (LED) package including a substrate unit, a light emitting unit and an encapsulant. The substrate unit includes a metal substrate and a circuit board. The metal substrate has a first carrier portion and a second carrier portion. The second carrier portion is projected from the first carrier portion. The first carrier portion has a first carrier face. The second carrier portion has a second carrier face located higher than the first carrier face. The circuit board is disposed on the first carrier face, and the second carrier portion passes through the circuit board. The light emitting unit includes at least one LED chip disposed on the second carrier face of the second carrier portion, and the LED chip electrically connected to the circuit board. The encapsulant encapsulates the LED chip.

Abstract: The substrate treatment apparatus includes a first substrate transport robot having a hand which holds a substrate, a second substrate transport robot having a hand which holds the substrate, and a hand cleaning unit which cleans the hand of the first substrate transport robot and the hand of the second substrate transport robot. The hand cleaning unit is configured to be accessible by the hand of the first substrate transport robot and the hand of the second substrate transport robot, and is disposed above or below a substrate transfer place at which the substrate is transferred between the first and second substrate transport robots.

Abstract: The present invention is a method and apparatus for applying coatings in a rarefied gaseous medium. A cold cathode electron gun is used to generate an electron beam, which is directed to a crucible containing initial solid materials in a vacuum chamber, thus generating an initial solid material vapor. Nitrogen reaction gas is bled into the vacuum chamber, and ionization of the nitrogen gas in high frequency discharge. Subsequent interaction of initial material vapor with nitrogen ions and atoms results in generation of solid product heating of the substrate. Condensation of the vapor on the surface of substrate generates a thin film of solid electrode or electrolyte. The resulting rate of deposition of thin film of vitreous solid electrolyte and LiPon solid electrolyte is substantially higher than can be achieved with a magnetron sputtering process.

Abstract: A system and method A method of growing an elongate nanoelement from a growth surface includes: (a) cleaning a growth surface on a base element; (b) providing an ultrahigh vacuum reaction environment over the cleaned growth surface; (c) generating a reactive gas of an atomic material to be used in forming the nanoelement; (d) projecting a stream of the reactive gas at the growth surface within the reactive environment while maintaining a vacuum of at most 1×10?4 Pascal; (e) growing the elongate nanoelement from the growth surface within the environment while maintaining the pressure of step c); (f) after a desired length of nanoelement is attained within the environment, stopping direction of reactive gas into the environment; and (g) returning the environment to an ultrahigh vacuum condition.

Abstract: A circuit substrate includes: a substrate; an insulating coating layered structure formed on the substrate, having top and bottom surfaces, and formed with a patterned recess that is indented inwardly from the top surface, that is disposed above the bottom surface, and that is defined by a recess-defining wall, the recess-defining wall having a bottom wall portion and a surrounding wall portion that extends upwardly from a periphery of the bottom wall portion; and a patterned metallic layered structure including an electroless plating metal layer formed on the bottom wall portion of the recess-defining wall.

Abstract: The present invention relates to a separator plate for a fuel cell and to a method for producing the same, and relates to an invention wherein a surface-modification layer is formed through the use of low temperature plasma processing such that it is possible to prevent the hydrophobic characteristics which occur during gasket forming and to have outstanding hydrophilic characteristics, and such that it is possible to obtain the advantageous effect of highly outstanding corrosion resistance and electrical conductivity not only initially but also even after long-term use in a fuel-cell operating environment, and also such that it is possible to maintain outstanding durability even when using a normal low-price stainless-steel sheet base material, and it is possible to reduce the unit cost of production of the separator plate for the fuel cell since surface processing can be carried out at low cost.

Abstract: A method of increasing strength of a panel edge includes providing a panel having a lateral surface treated by plasma. An elastic material is provided, photoinitiator is added therein, and the elastic material is then liquefied by heating. Subsequently, the liquefied elastic material is sprayed on the lateral surface, and is then cured to result in a protective layer bonded on the lateral surface.

Abstract: A process of preparing a lamella from a substrate includes manufacturing a protection strip on an edge portion of the lamella to be prepared from the substrate, and preparing the lamella, wherein the manufacturing the protection strip includes a first phase of activating a surface area portion of the substrate, and a second phase of electron beam assisted deposition of the protective strip on the activated surface area portion from the gas phase.

Abstract: Provided herein is a carbon based coating and methods of producing the same. The carbon based coating comprising an amorphous carbon thin film deposited on a substrate, the carbon based coating characterized in that the carbon based coating imparts enhanced surface durability properties.

Abstract: The system of the present invention includes a conductive element, an electronic component, and a partial power source in the form of dissimilar materials. Upon contact with a conducting fluid, a voltage potential is created and the power source is completed, which activates the system. The electronic component controls the conductance between the dissimilar materials to produce a unique current signature. The system can also measure the conditions of the environment surrounding the system.

Abstract: During a deposition process, material may deposit not only on the substrate, but also on other chamber components. In a MOCVD chamber, one of those components is the gas distribution showerhead. The showerhead may be cleaned by bombarding the showerhead with radicals generated by a plasma that includes an inert gas and chlorine. In order to generate the plasma, the showerhead may be negatively biased or floating relative to the substrate support. The showerhead may comprise stainless steel and be coated with a ceramic coating.

Abstract: The invention relates to a process for depositing an anti-fouling top coat onto the outermost coating layer of a coated optical article, comprising the following steps: a) providing an optical article having two main faces, at least one of which being coated with an outermost layer; b) treating said outermost layer with energetic species resulting in surface physical attack and/or chemical modification; and c) vacuum evaporating a liquid coating material for an anti-fouling top coat by means of an evaporation device, resulting in the deposition of the evaporated coating material onto the treated outermost layer of the optical article, wherein prior to the vacuum evaporation step of the liquid coating material, said liquid coating material has been treated with energetic species.

Abstract: A non-magnetic stainless steel wire with an adherent corrosion resistant coating is disclosed. The surface of the non-magnetic stainless steel is pre-treated so as to be sufficiently free from oxides and form a good adhesion with the above corrosion resistant coating. The non-magnetic stainless steel wire is used as a armouring wire for a power cable for transmitting electrical power.

Abstract: A method of forming a graphene film (20) on one or more surfaces (10) of a copper-containing substrate (12) comprising the steps of: (i) heating a copper-containing substrate (12) defining one or more surfaces (10) to an exposure temperature; (ii) exposing the substrate (12) to a carbon-containing precursor gas at the exposure temperature for a predetermined period of time to dissolve carbon atoms into the substrate (12) and saturate the substrate (12) with carbon atoms; and (iii) cooling the substrate (12) so as to segregate the dissolved carbon atoms (16) from the substrate (12) to form a graphene film (20) on the or each surface (10) of the substrate (12); wherein the method further includes the step of selecting the copper-containing substrate (12) on the basis of its thickness to control the depth of the graphene film (20) formed on the or each surface (10) of the substrate (12) on cooling the substrate (12) so as to segregate the dissolved carbon atoms from the substrate (12).

Abstract: A method for manufacturing an optical substrate includes: a step for preparing a long film-shaped mold; a step for preparing a sol; a step for forming a coating film of the sol on a substrate; a step for drying the coating film; a step for pressing a pattern surface of the film-shaped mold against the dried coating film with a pressing roll while feeding the film-shaped mold to the pressing roll; a step for releasing the film-shaped mold from the coating film; and a step for baking the coating film to which the concave and convex pattern has been transferred.

Abstract: There is provided a method of coating a substrate with a zinc oxide film. The method includes (a) providing a substrate with at least one substantially flat surface, (b) subjecting the surface at least partially to a plasma-etching process, and (c) depositing on the etched surface, a layer that includes zinc oxide. The method is particularly suitable for manufacturing solar cells.

Abstract: A method of enhancing a material layer on a substrate is described. The method comprises establishing a gas cluster ion beam (GCIB), and treating a host region of the substrate by exposing the host region of the substrate to the GCIB. The treatment with the GCIB may selectively remove an undesirable specie and/or introduce a desirable specie to the host region.

Abstract: Provided is a transparent carbon nanotube (CNT) electrode comprising a net-like (i.e., net-shaped) CNT thin film and a method for preparing the same. More specifically, a transparent CNT electrode comprises a transparent substrate and a net-shaped CNT thin film formed on the transparent substrate, and a method for preparing a transparent CNT electrode, comprising forming a thin film using particulate materials and CNTs, and then removing the particulate materials to form a net-shaped CNT thin film. The transparent CNT electrode exhibits excellent electrical conductivity while maintaining high light transmittance. Therefore, the transparent CNT electrode can be widely used to fabricate a variety of electronic devices, including image sensors, solar cells, liquid crystal displays, organic electroluminescence (EL) displays, and touch screen panels, that have need of electrodes possessing both light transmission properties and conductive properties.

Abstract: Methods for maintaining clean etch rate and reducing particulate contamination with PECVD of amorphous silicon films are provided. The method comprises cleaning a processing chamber with a plasma comprising a cleaning gas, exposing at least a portion of the interior surfaces and components of the processing chamber to an oxidation gas and a nitration gas in the presence of a plasma and depositing a bi-layer seasoning layer on the interior surfaces and components of the processing chamber.

Abstract: A method of coating molded metals includes cleaning a molded metal, coating the molded metal with a coating, and curing the coated molded metal. The coating includes monofunctional monomers, multifunctional monomers, and acrylic oligomers. A molded metal coating application system includes a conveyor configured to transport a molded metal. A cleaning stage is configured to clean the molded metal. A coating stage is configured to deposit a coating on the molded metal. A curing stage is configured to cure the deposited coating on the molded metal. The coating includes monofunctional monomers, multifunctional monomers, and acrylic oligomers.

Abstract: Method of manufacturing a resistive touch sensor circuit using a roll to roll process to print microscopic patterns on a single side of at least one flexible dielectric substrate using a plurality of flexo-masters to print the microscopic patterns which are then plated to form conductive microscopic patterns.

Abstract: A method for applying a protective layer to an electronic device such as the ABS of a slider, magnetic head, etc. for reducing paramagnetic deadlayer thickness includes selecting an etching angle for minimizing formation of a paramagnetic deadlayer at an interface of an electronic device and an adhesive layer subsequently formed on the electronic device, etching a surface of an electronic device at the selected angle, the selected angle being less than about 75 degrees from an imaginary line extending perpendicular to the surface, forming an adhesive layer on the etched surface of the electronic device, and forming a protective layer on the adhesive layer. A magnetic head formed by the process is also disclosed.

Abstract: A method for applying hot melt adhesive powder onto a sole or shoe part includes the steps of applying a cleaning agent, irradiating, applying a conductive liquid which has a conductivity at least 100 times higher than purified water which has a conductivity of 5.5·10?6 S/m, spraying hot melt adhesive powder; and heating. The method can save energy, reduce the working space, reduce the labor intensity and improve the working environment by continuously carrying out the spraying and the melting operation of the hot melt adhesive.

Abstract: The present invention proposed manufacturing method of coating layers with good conductivity and corrosion resistance at high productivity comprising etching the oxide layer on the stainless steel substrate by plasma etching to activate the surface and prevent from decreasing it's conductivity, coating metal nitrides like CrN or TiN in nano size thickness on the etched surface and coating carbon layer at nano size thickness on top of it. According to the present invention, it is possible to produce manufacture fuel cell bipolar plate, electrode material and stainless steel with reinforced conductivity and corrosion resistance in mass.

Abstract: Disclosed is a reinforcing material for the local reinforcement of a component formed with a composite material, in particular in areas of force introduction and/or connecting areas. The reinforcing material is formed by a metallic sheet-like formation, the metallic sheet-like formation having a surface with increased roughness to improve adhesion and a coating applied to the surface to provide a seal and improve the bond with the composite material. As a result of the presence of a coating on the metallic sheet-like formation, once it has been rolled up on supply rolls, said sheet-like formation can be drawn off from the supply rolls and at the same time processed in an automated manner by means of known computer-controlled laying devices with CRP prepreg materials in web form by laying layer by layer to produce components, in particular of large format, for aircraft.

Abstract: [Problem] An object is to provide a magnetic recording medium with improved HDI characteristics, such as impact resistance, and its manufacturing method. [Solution] A typical structure of a magnetic recording medium 100 according to the present invention includes, on a base, at least a magnetic recording layer 122, a protective layer 126, and a lubricating layer 128, wherein the magnetic recording layer 122 includes, in an in-plane direction, a magnetic recording part 136 configured of a magnetic material and a non-recording part 134 magnetically separating the magnetic recording part 136, and a surface corresponding to the non-recording part 134 protuberates more than a surface corresponding to the magnetic recording part 136.

Abstract: An optical fiber with a b-stageable hybrid adhesive coating includes an optical fiber and an outer jacket. The outer jacket includes at least one layer that includes a partially cured b-stageable hybrid adhesive.

Abstract: Methods of forming dielectric layers using high-density plasma chemical vapor deposition are described. Dielectric layers are formed over metal films. The metal film is present on a substrate prior to entering the high-density plasma processing chamber. The metal film is processed to remove oxidation and optionally to improve adhesion of the dielectric layer on the metal film.

Abstract: A coated article includes a substrate and an anti-fingerprint film formed on the substrate. The anti-fingerprint film is a mixture layer of tin and polyformaldehyde, a mixture layer of indium and polyformaldehyde, or a polyformaldehyde layer. The anti-fingerprint film has an excellent abrasion resistance. A method for making the coated article is also described.

Abstract: In a method of irradiating a gas cluster ion beam on a solid surface and smoothing the solid surface, the angle formed between the solid surface and the gas cluster ion beam is chosen to be between 1° and an angle less than 30°. In case the solid surface is relatively rough, the processing efficiency is raised by first irradiating a beam at an irradiation angle ? chosen to be something like 90° as a first step, and subsequently at an irradiation angle ? chosen to be 1° to less than 30° as a second step. Alternatively, the set of the aforementioned first step and second step is repeated several times.

Abstract: The present disclosure relates to an apparatus and method utilizing double glow discharge for sputter cleaning of a selected surface. The surface may include the inner surface of a hollow substrate such as a tube which inner surface may then be coated via magnetron sputter deposition.

Abstract: The embodiments fill the need to enhance electro-migration performance, provide lower metal resistivity, and improve silicon-to-metal interfacial adhesion for copper interconnects by providing improved processes and systems that produce a silicon-to-metal interface. An exemplary method of preparing a substrate surface of a substrate to selectively deposit a layer of a metal on a silicon or polysilicon surface of the substrate to form a metal silicide in an integrated system is provided.

Abstract: Methods for depositing film stacks by plasma enhanced chemical vapor deposition are described. In one example, a method for depositing a film stack on a substrate, wherein the film stack includes films of different compositions and the deposition is performed in a process station in-situ, is provided. The method includes, in a first plasma-activated film deposition phase, depositing a first layer of film having a first film composition on the substrate; in a second plasma-activated deposition phase, depositing a second layer of film having a second film composition on the first layer of film; and sustaining the plasma while transitioning a composition of the plasma from the first plasma-activated film deposition phase to the second plasma-activated film deposition phase.

Abstract: A laminate body includes a base material, a film-like or a membrane-like undercoat layer that is formed in at least a portion of the outer surface of the base material, and an atomic layer deposition film that is formed on a surface opposite to a surface coming into contact with the base material among both surfaces of the undercoat layer in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film bind to the undercoat layer, and the atomic layer deposition film is formed into a membrane shape covering the undercoat layer.

Abstract: A method for descaling a metal strip, in which the metal strip is guided in a direction of conveyance through at least two plasma descaling units, in which it is subjected to a plasma descaling, where the plasma descaling is followed directly or indirectly by an operation in which the metal strip is coated with a coating metal by hot dip galvanizing of the metal strip. The metal strip is coated with the coating metal by a vertical passage process. The coating metal is retained as a coating bath in a coating tank by an electromagnetic seal. The metal strip preheated by the plasma descaling is guided, without exposure to air, from the plasma descaling into a protective gas atmosphere of a continuous furnace necessary for the coating.

Abstract: A coated metallic part includes a substrate including a metallic surface; a first coating layer supported on the metallic surface and including a first polymer, the first polymer including silicon; and a second coating layer including a second polymer different from the first polymer, the first coating layer being positioned between the metallic surface and the first coating layer. The first coating layer may have a silicon atomic percentage of 5 to 50 atomic weight percent. The first polymer of the first coating layer may have an oxygen-to-silicon ratio of 1.0 to 4.0. The second polymer of the second polymer layer may include at least one of an acrylic polymer, a polyester, an alkyd, a polyurethane, a polyamide, a polyether, a copolymer thereof, and a mixture thereof.

Abstract: A cross section processing method to be performed on a sample by irradiating the sample having a layer or a structure of an organic substance on a surface at a cross section processing position thereof with a focused ion beam using a focused ion beam apparatus includes: a protective film forming step for forming a protective film on the surface of the layer or the structure of the organic substance by irradiating the surface of the sample including the cross section processing position with the focused ion beam under the existence of source gas as the protective film; and a cross section processing step for performing cross section processing by irradiating the cross section processing position formed with the protective film with the focused ion beam at a voltage higher than an accelerating voltage in the protective film forming step.