Abstract: Resist coating treatments for application of a resist solution to removal of a resist film on a wafer edge portion. A laser irradiation unit applies a laser light in a resist coating unit. At the time of resist coating treatment, the resist solution is discharged onto a central portion of the rotated wafer from a resist solution supply nozzle to form a resist film on the wafer. Thereafter, the laser irradiation unit moves to an outer peripheral portion of the wafer and applies the laser light onto the resist film on the outer peripheral portion to dry the resist film on the outer peripheral portion. The application of laser light is continued, and the solvent supply nozzle moves to a position above the edge portion and supplies solvent to the resist film on the edge portion. The solvent dissolves and removes the resist film on the edge portion.

Abstract: A method for forming a protective coating on a substrate comprising, applying a bond coating to the substrate, the bond coating having a first surface roughness, ionizing an inert gas which flows into the surface of the bond coating so as to impart a second surface roughness to the bond coating greater than the first surface roughness, wherein the inert gas is ionized and caused to flow into the surface of the bond coating by a reverse polarity current supplied to an electrode which removes at least one electron from the inert gas, and applying a top coating to the bond coating. Additionally, a method for preparing a surface to receive and adhere to a coating comprising roughening the surface to create a micro-roughening network on the surface. In addition, a method of improving strain tolerance and cyclic spallation life of a protective coating.

Abstract: A method for continuously processing carbon fiber including establishing a microwave plasma in a selected atmosphere contained in an elongated chamber having a microwave power gradient along its length defined by a lower microwave power at one end and a higher microwave power at the opposite end of the elongated chamber. The elongated chamber having an opening in each of the ends of the chamber that are adapted to allow the passage of the fiber tow while limiting incidental gas flow into or out of said chamber. A continuous fiber tow is introduced into the end of the chamber having the lower microwave power. The fiber tow is withdrawn from the opposite end of the chamber having the higher microwave power. The fiber to is subjected to progressively higher microwave energy as the fiber is being traversed through the elongated chamber.

Abstract: The invention relates to a method for the plasma treatment of glass surfaces, the metal component, in particular the alkali and/or alkaline-earth metal component in the superficial region of the substrate being reduced by a plasma treatment of a substrate.

Abstract: A cutting element may comprise a substrate, a first polycrystalline diamond volume, and a second diamond or diamond like volume. The first polycrystalline diamond volume may contain a catalyst material. The first polycrystalline diamond volume may be bonded to the substrate. The second diamond or diamond like volume may be formed predominantly from carbon atoms and free of catalyst materials. The second diamond or diamond like volume may be adjacent to a working surface of cutting element. The second diamond or diamond like volume may be bonded to the first polycrystalline diamond volume.

Abstract: Methods for making a bearing are disclosed, wherein the bearing includes a substratum and a self-lubricating surface coating composition. The self-lubricating surface coating composition further includes at least one cured thermosetting acrylate and at least one phenolic resin. Methods includes the step of disposing the self-lubricating surface coating composition onto the substratum.

Abstract: A method for forming graphene includes providing a substrate and subjecting the substrate to a reduced pressure environment. The method also includes providing a carrier gas and a carbon source and exposing at least a portion of the substrate to the carrier gas and the carbon source. The method further includes performing a surface treatment process on the at least a portion of the substrate and converting a portion of the carbon source to graphene disposed on the at least a portion of the substrate.

Abstract: Systems and methods for ALD thin film deposition include a mechanism for removing excess non-chemisorbed precursors from the surface of a substrate in a translation-based process involving multiple separate precursor zones. Excess precursor removal mechanisms according to the present disclosure may introduce localized high temperature conditions, high energy conditions, or azeotropes of the excess precursor, to liberate the excess precursor before it reaches a separate precursor zone, thereby inhibiting CVD deposition from occurring without causing heat-induced degradation of the substrate.

Abstract: A plasma treatment system for treating a workpiece with a downstream-type plasma. The processing chamber of the plasma treatment system includes a chamber lid having a plasma cavity disposed generally between a powered electrode and a grounded plate, a processing space separated from the plasma cavity by the grounded plate, and a substrate support in the processing space for holding the workpiece. A direct plasma is generated in the plasma cavity. The grounded plate is adapted with openings that remove electrons and ions from the plasma admitted from the plasma cavity into the processing space to provide a downstream-type plasma of free radicals. The openings may also eliminate line-of-sight paths for light between the plasma cavity and processing space. In another aspect, the volume of the processing chamber may be adjusted by removing or inserting at least one removable sidewall section from the chamber lid.

Abstract: A method of forming a self-cleaning coating on a substrate comprises the step of selecting a substrate, cleaning the substrate, and/or roughening the substrate using an abrasive. In an embodiment, roughening of the substrate create microscopic tortuous grooves. Another embodiment of the method comprises coating the roughened surface with at least one hydrophobic chemical agent. In an exemplary embodiment, the hydrophobic chemical agent covalently binds with the substrate creating nanoscopic grooves. Another embodiment of the present disclosure pertains to an apparatus for depositing a self-cleaning coating on a flat substrate. A further embodiment of the present disclosure pertains to a self-cleaning coating on a substrate comprising a hydrophobic chemical agent covalently bonded to at least one roughened surface of the substrate.

Abstract: Disclosed are solar-reflective roofing and other building materials having high reflectance of near-infrared radiation and high transmission of radiation in the visible light range and a substantial emissivity so as to reduce the heat island effects experienced by the articles while also maintaining an aesthetically pleasing appearance. Also disclosed are related methods for fabrication of such materials.

Abstract: A plasma processing chamber particularly useful for pre-treating low-k dielectric films and refractory metal films subject to oxidation prior to deposition of other layers. A remote plasma source (RPS) excites a processing gas into a plasma and delivers it through a supply tube to a manifold in back of a showerhead faceplate. The chamber is configured for oxidizing and reducing plasmas in the same or different processes when oxygen and hydrogen are selectively supplied to the RPS. The supply tube and showerhead may be formed of dielectric oxides which may be passivated by a water vapor plasma from the remote plasma source. In one novel process, a protective hydroxide coating is formed on refractory metals by alternating neutral plasmas of hydrogen and oxygen.

Abstract: A method for treating a surface of a glass substrate according to the invention has the steps of placing the glass substrate into a vacuum treatment chamber, introducing a gas into the vacuum treatment chamber, providing electric power to generate an ion source and using the ion source to treat the surface of the glass substrate. By this way, the invention can achieve an effect of surface cleaning and further render the conductive film to be coated on the glass substrate in the subsequent stage to have a reduced surface resistance, thereby improving the conductivity of the glass substrate. The film coated on the glass substrate in the subsequent stage will have higher crystalline level as well.

Abstract: There is provided a method and apparatus for plating high strength steel such as advanced high strength steel (AHSS) after irradiating the high strength steel with at least one of laser light and plasma to remove Si/Mn/Al oxides from the surface of the high strength steel, modify the surface of the high strength steel, or make the surface of the high strength steel suitable for a post process such as a zinc plating process. For this, a plating method includes heating high strength steel; treating a surface of the high strength steel with plasma to remove at least one of a Mn oxide, an Al oxide, and an Si oxide formed on the surface of the high strength steel during the heating of the high strength steel; and plating the surface-treated high strength steel.

Abstract: A fluorine-doped tin oxide (FTO) film preparation method includes the step of using a high purity tin ingot in a magnetron sputtering deposition as a target material, the step of applying argon (Ar) as a working gas to generate plasma for removing impurities from the tin target in increasing the purity of the tin target, and the step of applying reactive gases containing F atoms (CF4) and oxygen (O2) for enabling tetrafluoromethane (CF4) to be dissociated by the generated plasma into fluorine ions and excited fluorine atoms for deposition with tin ions from the tin target on a substrate to form a thin film of fluorine-doped tin oxide on the substrate.

Abstract: The present invention relates to an organic/inorganic hybrid hierarchical structure comprising: a polymer electrolyte layer which formed on a base and which has a rough surface; and an inorganic nano-structure formed on the rough surface of the polymer electrolyte layer. The present invention also relates to a method for manufacturing superhydrophobic or superhydrophilic surface using the organic/inorganic hybrid hierarchical structure.

Abstract: Provided is the preparation of a coil-comb block copolymer and a method for producing nanostructures formed by the copolymer. Particularly, provided is a method for producing nanostructured polymer thin films, including: preparing a coil-comb block copolymer via a controlled polymer polymerization process; forming a thin film of the block copolymer on a substrate and carrying out heat treatment to form nanostructures including vertically aligned cylindrical microstructures; and irradiating ultraviolet rays to the thin film and carrying out oxygen plasma treatment to form nanostructured polymer thin films including cylindrical pores.

Abstract: A TEM sample preparation method including: placing a thin sample on a sample holder so that a first side surface of the thin sample which is closer to a desired observation target is opposed to a focused ion beam column; setting a processing region, which is to be subjected to etching processing by a focused ion beam so as to form a thin film portion including the observation target and having a thickness direction substantially parallel to a thickness direction of the thin sample, to a region of the first side surface that is adjacent to the thin film portion; and performing the etching processing to a portion of the thin sample extending from the first side surface thereof to a front surface thereof by irradiating the processing region with the focused ion beam from the focused ion beam column.

Abstract: Provided is a method of preparing a sample for TEM observation, including: supplying deposition gas to a cross-section of a lamellar portion having exposed recesses and irradiating a deposition film forming region of the cross-section including the recesses with an electron beam, thereby forming a deposition film; irradiating the deposition film with an ion beam, thereby removing a deposition film formed on the cross-section; and irradiating the lamellar portion with the ion beam, thereby thinning the lamellar portion.

Abstract: Disclosed is a surface treatment method for producing a coating layer, which improves surface properties (e.g., low friction wear-resistance) of the coating layer at high temperature. The surface treatment method controls a process pressure during the formation of a coating layer to form a fine surface morphology with increased silver (Ag) content. The surface treatment method includes: heating a coated material in a chamber; removing foreign substances from the surface of the heated, coated material; forming a buffer layer on the surface of the coated material; and forming a coating layer on the buffer layer, wherein the process pressure is controlled during the formation of the coating layer to improve the surface properties at high temperatures.

Abstract: A method for manufacturing a printed wiring board includes forming an interlayer insulation layer on a conductive circuit, applying laser to a portion of the interlayer insulation layer such that an opening reaching to the conductive circuit is formed for a via conductor, subjecting the opening to a plasma treatment using a processing gas which includes a reactive gas including a fluorovinyl ether gas having a double bond of two carbon atoms and a fluoroalkyl ether group, forming an upper conductive circuit on the interlayer insulation layer, and forming a via conductor in the opening such that the via conductor connects the conductive circuit and the upper conductive circuit.

Abstract: A method of fabrication of high-k paraelectric metal oxide films at low temperatures utilizing ordered mesoporous metal oxide thin films synthesized by organic templating methodology. The process consisting of (a) chemical solution deposition of periodic ordered mesoporous structures containing high-k metal oxide films, (b) removal of organic template additives, (c) infiltration of the pores with an appropriate second phase, and (d) low temperature thermal and/or annealing of infiltrated films.

Abstract: Magnetic tweezers have two jaws formed by thin magnetic films connected together via a hinge. The magnetic tweezers include a nanoparticle formed by a stack of thin magnetic films. A process for fabricating the magnetic tweezers by techniques used in the fabrication of microelectronic components is presented.

Abstract: An electronic device comprises a substrate (120), at least one electronic component (171, 172, 173) arranged on the substrate, and an encapsulation (140) covering the at least one electronic component (171, 172, 173). An electromagnetic protective layer (130) covers a surface (143) of the encapsulation (140) that faces away from the substrate (120), and the side faces (121, 141; 122, 142) directed transversely with respect to the surface (143). In particular, a thermal and/or electrical coupling (134, 162, 163, 164, 165, 166) couples the electromagnetic protective layer (130) thermally and/or electrically to a region (168) of the electronic device (111, 112) that is enclosed by the encapsulation. For production purposes, the device is singulated from a panel and the electromagnetic protective layer (130) is subsequently applied.

Abstract: A method of forming an integrated circuit structure includes providing a substrate; forming a metal feature over the substrate; forming a dielectric layer over the metal feature; and forming an opening in the dielectric layer. At least a portion of the metal feature is exposed through the opening. An oxide layer is accordingly formed on an exposed portion of the metal feature. The method further includes, in a production tool having a vacuum environment, performing an oxide-removal process to remove the oxide layer. Between the step of forming the opening and the oxide-removal process, no additional oxide-removal process is performed to the metal feature outside the production tool. The method further includes, in the production tool, forming a diffusion barrier layer in the opening, and forming a seed layer on the diffusion barrier layer.

Abstract: A method for providing electroless plating is provided. An amorphous carbon barrier layer is formed over the low-k dielectric layer by providing a flow a deposition gas, comprising a hydrocarbon, H2, and an oxygen free diluent, forming a plasma from the deposition gas, and stopping the flow of the deposition gas. The amorphous carbon barrier layer is conditioned by providing a flow of a conditioning gas comprising H2 and a diluent, forming a plasma from the conditioning gas, which conditions a top surface of the amorphous carbon barrier layer, and stopping the flow of the conditioning gas. The amorphous carbon barrier layer is functionalized by providing a flow of a functionalizing gas comprising NH3 or H2 and N2, forming a plasma from the functionalizing gas, and stopping the flow of the functionalizing gas. An electroless process is provided to form an electrode over the barrier layer.

Abstract: Methods of processing films on substrates are provided. In one aspect, the methods comprise treating a patterned low dielectric constant film after a photoresist is removed from the film by depositing a thin layer comprising silicon, carbon, and optionally oxygen and/or nitrogen on the film. The thin layer provides a carbon-rich, hydrophobic surface for the patterned low dielectric constant film. The thin layer also protects the low dielectric constant film from subsequent wet cleaning processes and penetration by precursors for layers that are subsequently deposited on the low dielectric constant film.

Abstract: Showerhead electrodes for a semiconductor material processing apparatus are disclosed. An embodiment of the showerhead electrodes includes top and bottom electrodes bonded to each other. The top electrode includes one or more plenums. The bottom electrode includes a plasma-exposed bottom surface and a plurality of gas holes in fluid communication with the plenum. Showerhead electrode assemblies including a showerhead electrode flexibly suspended from a top plate are also disclosed. The showerhead electrode assemblies can be in fluid communication with temperature-control elements spatially separated from the showerhead electrode to control the showerhead electrode temperature. Methods of processing substrates in plasma processing chambers including the showerhead electrode assemblies are also disclosed.

Abstract: Methods for fabricating arrays of nanoscaled alternating lamellar or cylinders in a polymer matrix having improved long range order utilizing self-assembling block copolymers, and films and devices formed from these methods are provided.

Abstract: A method for forming a diamond-like carbon (DLC) layer on air bearing surface (ABS) of a slider, comprises steps of: providing sliders arranged in arrays, each slider having an ABS; forming a mixing layer in the ABS of the slider by depositing a first DLC layer on the ABS, the mixing layer consisting of the slider material and the first DLC layer material; removing the first DLC layer to make the mixing layer exposed; forming a second DLC layer on the mixing layer.

Abstract: Enhanced corrosion resistance is achieved in a coating by using a germanium-containing precursor and hollow cathode techniques to form a first layer directly on the surface of a workpiece, prior to forming an outer layer, such as a layer of diamond-like carbon (DLC). The use of a germanium or germanium-carbide precursor reduces film stress and enables an increase in the thickness of the subsequently formed DLC. Germanium incorporation also reduces the porosity of the layer. In one embodiment, a cap layer containing germanium is added after the DLC in order to further reduce the susceptibility of the coating to chemical penetration from the top.

Abstract: A method for producing RFID antennas by vacuum deposition of an electrically conductive material on a web material, wherein at least a first and a second deposition of electrically conductive material are carried out in subsequent steps according to a pattern corresponding to the shape of the antennas.

Abstract: A method for plasma treatment and painting of a surface, the surface including a plurality of different materials includes blasting the surface with a carbon dioxide snow so as to activate the surface to improve an adhesive strength; and treating the surface with a plasma treatment using at least one plasma nozzle following the blasting step, the treating including guiding the at least one plasma nozzle at a distance of not more than 15 mm from the surface at a feed rate of not more than 50 m/min.

Abstract: Disclosed is a covered member including a base material, a first intermediate layer that has a roughened surface and covers the base material, and a DLC film that covers the surface of the first intermediate layer. The first intermediate layer and the DLC film are formed in a state where the temperature of the base material is kept at 300° C. or lower. The surface of the first intermediate layer is roughened by collision of ions.

Abstract: Disclosed are solar-reflective roofing and other building materials having high reflectance of near-infrared radiation and high transmission of radiation in the visible light range and a substantial emissivity so as to reduce the heat island effects experienced by the articles while also maintaining an aesthetically pleasing appearance. Also disclosed are related methods for fabrication of such materials.

Abstract: A method of forming a protective film for a magnetic recording medium is disclosed. The protective film suppresses cobalt elution out of the magnetic recording layer and has a thickness not larger than 3 nm. The method of the invention of forming a protective film for a magnetic recording medium comprises (1) a step of forming a protective film, on a lamination including a substrate and metallic film layers formed on the substrate, by means of a plasma CVD method using a raw gas of a hydrocarbon gas, wherein a flow rate of the hydrocarbon gas is in a range of 50 sccm to 200 sccm and a emission current is in a range of 0.1 A to 0.3 A, and (2) a step of surface treatment on the protective film that has been formed in the step (1), including sub-steps of (2a) a plasma treatment in an argon gas and (2b) a plasma treatment in a gas containing a nitrogen gas.

Abstract: A printing device (10) including a substrate (22) having an aperture (20) extending therethrough, wherein the aperture includes a side wall and defines a liquid ink flow path, an ink firing chamber (24) fluidically connected to the aperture, and a coating positioned on the side wall of the aperture, the coating being impervious to etching by liquid ink, and wherein the coating is chosen from one of silicon dioxide, aluminum oxide, hafnium oxide and silicon nitride.

Abstract: Process for surface functionalization of a glass reinforcement, characterized in that the said reinforcements are chemically modified by means of surface treatment by the action of a homogeneous plasma at atmospheric or sub-atmospheric pressure in a controlled, oxidizing or nitriding gas atmosphere, and in that the said surface portion is contacted with an aqueous impregnating solution of an organic or inorganic matrix, or directly with the matrix.

Abstract: A method for depositing a refractory metal nitride barrier layer having a thickness of about 20 angstroms or less is provided. In one aspect, the refractory metal nitride layer is formed by introducing a pulse of a metal-containing compound followed by a pulse of a nitrogen-containing compound. The refractory metal nitride barrier layer provides adequate barrier properties and allows the grain growth of the first metal layer to continue across the barrier layer into the second metal layer thereby enhancing the electrical performance of the interconnect.

Abstract: Methods for improving coating or etching uniformity of non-conductive substrates in plasma-mediated processes generally include applying an electrically conductive coating to the non-conductive substrate prior to plasma processing. The electrically conductive coating is disposed in electrical communication with a metallic electrode of a plasma reactor. By disposing a conductive layer on the non-conductive substrate, a uniform electric potential is created during plasma processing can be built up on the non-conductive, which is equivalent to that of the metallic electrode upon which it is disposed during plasma processing.

Abstract: Syringes for holding fluids susceptible to void formation when the syringe and fluid are frozen and thawed before use. The interior surface of the syringe barrel is modified by exposure to a plasma such that the incidence of void formation in the fluid is prevented or, at the least, significantly reduced in comparison with conventional syringes.

Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which includes an inner electrode mechanically attached to a backing plate by a clamp ring and an outer electrode attached to the backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release cam pins extending upward from the upper face of the outer electrode. To compensate for differential thermal expansion, the clamp ring can include expansion joins at spaced locations which allow the clamp ring to absorb thermal stresses.

Abstract: The present invention pertains to a process for depositing multi-component and nanostructured thin films. Various parameters are monitored during the process to produce the structure of the thin films, on one hand the residence time of the gas mixture in the reactor is controlled by the pumping rate, on the other side to generate the plasma direct current (DC) or radio frequency (RF) sources are used, plus the combination of three unbalanced magnetrons allows alternative emission of elements that make up the multi-component and nanostructured films. The process is monitored by an optical emission spectrometer (EOE) and a Langmuir probe (SL), the EOE can follow the emission corresponding to the electronic transitions of atoms and molecules in the plasma. Emissions occur in the visible, infrared and ultraviolet domains. The relationships between spectral networks of different elements have been identified that ensure structural characteristics of thin films.

Abstract: A bi-laterally surfaced substrate in which the first surface consists of one or more than one of cerium oxide, aluminum oxide, tin oxide manganese oxide, copper oxide, cobalt oxide, nickel oxide, praseodymium oxide, terbium oxide, ruthenium, rhodium, palladium, silver, iridium, platinum and gold and the second surface consists of one or more than one of ruthenium, rhodium, palladium, silver, iridium, platinum and gold and micro channel micro component reactors including such substrates in a predetermined formed shape and methods for making the same utilizing a thermal spray on one side and a physical deposition process on the other side.

Abstract: Embodiments described herein provide a method of processing a substrate. The method includes depositing an interface adhesion layer between a conductive material and a dielectric material such that the interface adhesion layer provides increased adhesion between the conductive material and the dielectric material. In one embodiment a method for processing a substrate is provided. The method comprises depositing an interface adhesion layer on a substrate comprising a conductive material, exposing the interface adhesion layer to a nitrogen containing plasma, and depositing a dielectric layer on the interface adhesion layer after exposing the interface adhesion layer to the nitrogen containing plasma.

Abstract: An atmospheric film-coating method is described, which includes the following steps. A substrate is provided. A gasification step is performed on a film coating solution to form a plurality of film coating vapor molecules. The film coating vapor molecules are deposited on a surface of the substrate to form the film.

Abstract: The present invention is a processing method for applying predetermined processing to a workpiece with said workpiece mounted on a mounting stage arranged in a process chamber in a depressurized atmosphere, in which when no workpiece is mounted on the mounting stage, an inactive gas is discharged from at least a heat transfer gas supply hole of the mounting stage in the process chamber so that a gas layer is formed on a mounting surface of the mounting stage. The present invention is also a processing apparatus.

Abstract: A multi-layer drug coated medical device such as for example an expandable vascular drug eluting stent is formed by vacuum pulse spray techniques wherein each layer is irradiated to improve adhesion and/or drug elution properties prior to formation of subsequent layers. Layers may be homogeneous or of diverse drugs. Layers may incorporate a non-polymer elution-retarding material. Layers may alternate with one or more layers of non-polymer elution-retarding materials. Polymer binders and/or matrices are not used in the formation of the coatings, yet the pure drug coatings have good mechanical and elution rate properties. Systems, methods and medical device articles are disclosed.

Abstract: The invention concerns a method for producing a coating on a support, in particular a glass support, wherein a thin-film metal oxide is deposited on the support, said thin film being subjected to an etching process to roughen its surface, a second coating capable of adhering to the first metal oxide film is then applied on the roughened surface. The invention is characterized in that it consists in depositing a first doped metal oxide or metal oxynitride doped with at least a second metal oxide or metal oxynitride, the second metal oxide or metal oxynitride being distributed in the deposited film. During the etching process, a plasma-activated gas is used which removes at least a second metal oxide or metal oxynitride less than the first metal oxide or metal oxynitride so as to form, after the etching process, on the surface raised irregularities consisting of at least a second metal oxide or metal oxynitride.

Abstract: The present invention is directed to a camouflage tire suitable for use in various vehicle use environments wherein it is desirable to reduce or eliminate a viewer's visual perception of the tire against the given environmental background.