Abstract: A resin composition is provided. The resin composition comprises an epoxy resin and a hardener, wherein the amount of the hardener is about 10 parts by weight to about 200 parts by weight per 100 parts by weight of the epoxy resin and the hardener comprises a first styrene-maleic anhydride copolymer (SMA) copolymer and a second SMA copolymer, the first SMA copolymer has a molar ratio of styrene to maleic anhydride m1, the second SMA copolymer has a molar ratio of styrene to maleic anhydride m2, and m1?m2?3.

Abstract: A sheet for forming a resin film for a chip, with which a semiconductor device is provided with a gettering function, is obtained without performing special treatment to a semiconductor wafer and the chip. The sheet has a release sheet, and a resin film-forming layer, which is formed on the releasing face of the release sheet, and the resin film-forming layer contains a binder polymer component, a curing component, and a gettering agent.

Abstract: In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, in the multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, in applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.

Abstract: A curing agent composition including at least one benzylated polyamine compound. The benzylated polyamine compound is a reaction product of a benzaldehyde compound or benzyl halide compound and a polyamine according to the following formula: H2N—CH2-A-CH2-NH2 where A is a phenylene group or a cyclohexylene group. A method for making the curing agent composition and an amine-epoxy composition are also disclosed.

Abstract: The present disclosure relates to the preparation and application of conducting polymers nanoparticle composites. Specifically, the disclosure relates to the preparation of polyaniline, or similar conducting polymers, as polymer nanoparticles on substrates prepared by chemical polymerization of aniline on the surface or inside the pores of the substrate. Isolated polymerization, e.g. inside the pores, avoids the formation of aggregate polyaniline nanoparticles. The process of the present disclosure may be used for both inorganic and organic porous solids that are water insoluble, acid resistant, and resistant to oxidants such as ammonium persulfate. The conducting polymer nanoparticle composites may be used in a variety of applications, including as anticorrosion coatings.

Abstract: The present disclosure relates to the field of anticorrosive pigments. Anticorrosive pigments are used with organic coatings to reduce the corrosion rate of the substrate metal. An anticorrosive pigment is incorporated in the topcoat of an anticorrosion coating system which greatly reduces the corrosion rate of the substrate metal in the environments of aggressive ions.

Abstract: There is provided an intermediate layer material including a curing type resin composition and a fiber base material, to be used to form an intermediate layer of a composite laminate, wherein a cured material obtained by curing the intermediate layer material at a temperature of 180° C. has such properties as (i) a planar linear expansion coefficient (?1) equal to or lower than 20 ppm/° C., in a range equal to or higher than 25° C. and equal to or lower than a glass transition temperature (Tg); and (ii) a Barcol hardness equal to or more than 40 and equal to or less than 65, at 25° C.

Abstract: A coating composition, an anticorrosion film formed by the composition, as well as an anticorrosive article, are disclosed. The coating composition comprises 1-35% by weight of one or more fluoropolymer; 1-70% by weight of one or more epoxy resin; 5-70% by weight of one or more polyamideimide; 0-40% by weight an auxiliary binder consisting of one or more of polyethersulfone, polyphenylene sulfide, polyamide, polyimide, polyether ether ketone, polyetherimide, polyurethane, alkyd resin, polyester, or acrylic polymers; and, based on 100 parts by weight of the above components, 100-400 parts by weight of solvent.

Abstract: Surface-modified, structurally modified fumed silicas Surface-modified, structurally modified fumed silicas are surface-modified with N-containing silicon compounds. They are used as fillers in resins and adhesives.

Abstract: A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer.

Abstract: Polymer compositions containing a polyoxymethylene polymer are disclosed that are receptive to paints and ink coatings. The polymer composition contains a polyoxymethylene polymer having a relatively high functional group content in combination with a coupling agent, a texturizing agent, and optionally a thermoplastic elastomer. The polymer composition can be molded into various articles at a mold temperature less than about 125° C., such as from about 60° C. to about 120° C. and then painted or printed with an ink composition. The polymer composition has been found to dramatically improve adhesion between the molded article and the ink or paint coating.

Abstract: A multi-layer film structure suitable as sealable sheet specially used for closing foodstuff containers producing a peelable seal. This multi-layer film comprises a polyester substrate layer and a sheat-sealable layer. The heat-sealable layer is applied by coextrusion and comprises as major component a polymer composition comprising residues of epoxy-containing monomers selected from glycidyl methacrylate, glycidyl acrylate, allyl glycidyl ether, 3,4-epoxy-1-butene, or a mixture of any two or more of such monomers.

Abstract: To provide an electrically conducting member for electrophotography which can not easily come to change in electrical resistance value even upon application of direct current and also has made any ion conducting agent kept from bleeding. The electrically conducting member has an electrically conducting substrate and an electrically conducting layer; the electrically conducting layer containing an epichlorohydrin rubber having in the molecular structure at least an alkylene oxide (AO) unit, an epichlorohydrin (ECH) unit and a unit having a sulfonate ion; the AO unit being at least one unit of an ethylene oxide unit, a propylene oxide unit and a butylene oxide unit; and the AO unit(s) in the rubber being in a content of 5 to 60% by mass in total and the ECH unit in the rubber being in a content of 30% by mass or more.

Abstract: A high adhesive strength and good conduction reliability can be realized when anisotropic connection is performed under compression conditions of a compression temperature of 130° C. and a compression time of 3 seconds using an anisotropic conductive film which uses a polymerizable acrylic compound capable of being cured at a comparatively lower temperature and in a comparatively shorter time than a thermosetting epoxy resin along with a film-forming resin. Consequently, an anisotropic conductive film has a structure in which an insulating adhesive layer and an anisotropic conductive adhesive layer are laminated. The insulating adhesive layer and the anisotropic conductive adhesive layer each contain a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator. The polymerization initiator contains two kinds of organic peroxide having different one minute half-life temperatures.

Abstract: A structure may comprise a skin member and a hat stringer. The hat stringer may include a base portion and first and second webs extending outwardly from the base portion. The first and second webs may be formed of a wrap laminate having wrap plies and a cover laminate having cover plies. The first and second webs may be interconnected by a cap. The hat stringer and skin member may be co-cured.

Abstract: Disclosed is a resin composition exhibiting a low thermal expansion coefficient, as well as higher heat resistance, flame resistance and insulation reliability than ever before when used in a multilayer printed wiring board that requires fine wiring work. Also disclosed are a prepreg, a resin sheet, a metal-clad laminate, a printed wiring board, a multilayer printed wiring board and a semiconductor device, all of which comprising the resin composition. The resin composition of the present invention comprises (A) an epoxy resin, (B) a cyanate resin and (C) an onium salt compound as essential components.

Abstract: Provided is a transfer film for in-mold molding which is superior in solvent resistance, heat resistance, durability, blocking resistance, and moldability, and is capable of suppressing the generation of gate flow, and also provided is a method for producing such a film. The film is provided with: a transfer layer (11) which is to be transferred to an in-mold molded body and which is to be cured when irradiated with active energy rays after the transfer; and a film shaped substrate (L0). The transfer layer (11) comprises an IMD layer (L2) laminated on the substrate (L0) and to be arranged on the outermost surface of the molded body after the in-mold molding. The TMD layer (L2) is constituted by a mixture composition containing at least one active-energy curable resin and at least one thermosetting resin.

Abstract: The laminate according to the present invention includes a thermoplastic resin film-containing layer and a rubber layer, in which the rubber layer contains a modified diene polymer, and the rubber layer has a dynamic storage modulus E? at ?20° C. of 1.0×105 to 1.0×108 Pa. This laminate can improve the resistance to the fractures and the cracks of the inner liner.

Abstract: Provided is a curable resin composition which can provide a cured article having a low dielectric constant and a low dielectric tangent, and can also provide a cured article having excellent moldability at ordinary press-molding temperatures, excellent heat resistance and excellent adhesion properties. The present invention provides a curable resin composition containing a polyphenylene ether, wherein the average number of phenolic hydroxy groups is 0.3 or more per molecule of the polyphenylene ether, the resin flow amount of the curable resin composition upon curing is 0.3 to 15% inclusive, and a cured article having a dielectric tangent of 0.005 or less at 1 GHz and a glass transition temperature of 170° C. or higher can be produced.

Abstract: The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond ? electrons and is capable of coordinating with a metal.

Abstract: The present disclosure relates to a water-based amine curing agent which is a reaction product obtained from the reaction of an aqueous epoxy resin dispersion and a polyamine component. The water-based amine curing agent may be used as part of a two component coating system in the curing of modified or unmodified liquid or pre-dispersed curable resin.

Abstract: An apparatus includes a substrate having a top surface, a substantially regular array of raised structures located over the top surface, and a layer located on the top surface between the structures. Distal surfaces of the structures are farther from the top surface than remaining portions of the structures. The layer is able to contract such that the distal surfaces of the structures protrude through the layer. The layer is able to swell such that the distal surfaces of the structures are closer to the top surface of the substrate than one surface of the layer.

Abstract: UV resistant inorganic coatings which exhibit photochemical activity that destroys toxic biological and chemical agents are disclosed. The inorganic coatings include semiconductor metal oxide nanoparticles that are photo-chemically active dispersed in an inorganic binder. In one embodiment, anatase titanium dioxide nanoparticles are dispersed in a silicon dioxide or silicate binder. Applications may include spacecraft, aircraft, ships, military vehicles, high value equipment and buildings such as subway stations, hospitals, railroad stations and stadiums.

Abstract: The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.

Abstract: One exemplary embodiment includes a thermo-reversible polymer adhesive including a dry adhesive layer and shape memory polymer layer, the shape memory polymer material capable of transitioning from a first shape to a second shape upon heating and imposition of a load to conform to the surface topography of a substrate to which the adhesive is applied.

Abstract: An embodiment relates to a prepreg having a structure comprising a first layer and a second layer, wherein the prepreg comprises component (A) comprising a reinforcing fiber, component (B) comprising a thermosetting resin, and component (C) comprising a particle or a fiber of a thermoplastic resin, the component (C) is substantially locally distributed in the first layer and the prepreg is a partially impregnated prepreg.

Abstract: The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.

Abstract: A powdered epoxy coating composition for coating a substrate. The coating composition comprises: (a) from about 50 wt % to about 90 wt % of at least one epoxy resin; (b) from about 1 wt % to about 30 wt % of at least one catechol novolak-type adhesion promoter; and (c) from about 0.1 wt % to about 5 wt % of magnesium oxide. The coating may also include from about 10 wt % to about 48 wt % of an inorganic filler. The coating composition provides improved adhesion at high temperature operating conditions and improved resistance to damage by cathodic disbondment for pipe, rebar, and other substrates.

Abstract: A composite article and its method of manufacture are disclosed. The composite article includes a matrix formed of a mixture of glass particles and a cured polymer, and a layer of cured polymer material that is substantially free of the glass particles, said layer being formed on at least one surface of the cast article whereby the glass particles are not surface exposed on the at least one surface.

Abstract: A curable epoxy resin formulation composition useful as insulation for an electrical apparatus including (a) at least one divinylarene dioxide; (b) at least one epoxy resin different from the divinylarene dioxide of component (a); (c) at least one anhydride hardener; (d) at least one filler; and (e) at least one cure catalyst; wherein the epoxy resin formulation composition upon curing provides a cured product with a requisite balance of electrical, mechanical, and thermal properties such as Tg, tensile strength, dielectric strength, and volume resistivity such that the cured product can be used in applications operated at a temperature of greater than or equal to 100° C.

Abstract: The present invention provides an epoxy resin composition for a fiber reinforced composite material comprising an epoxy resin (A) comprising an epoxy resin (a1) having a weight average molecular weight of up to 1,000 and an epoxy resin (a2) having a weight average molecular weight of 10,000 to 100,000 which contains at least 20% by weight of the basic skeleton of the epoxy resin (a1), a thermoplastic resin (B), and a curing agent (C). The cured composition has a co-continuous phase of the epoxy resin (A) and the thermoplastic resin (B) and/or a continuous phase of the thermoplastic resin (B). A cured product having a high toughness can be obtained from this epoxy resin composition.

Abstract: A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of the polyaryleneoxy structures (I) are linked through a structural site (II) represented by a structural formula 1 (wherein Ar represents a phenylene group, a phenylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms, a naphthylene group, or a naphthylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms).

Abstract: Disclosed herein are an insulating film and a producing method of the insulating film which can address problems caused by dents by providing a reinforcing layer having the weight ratio of the silica of 60 to 80 wt % on one surface of the insulating film.

Abstract: An insulation laminate is disclosed having a base laminate layer, with at least one flat side coated with a layer of an insulating varnish, the insulating varnish including a basecoat; and an added lubricant.

Abstract: A varnish composition includes composition (A): an epoxy resin, composition (B): a hardener, composition (C): an accelerator, composition (D): phosphor-containing flame retardant, and composition (E): fillers, wherein composition (A) includes composition (A-1): phosphor-containing epoxy resin, phosphor-containing and silicon-containing epoxy resin, or a mixture thereof; composition (A-2): dicyclopentadiene epoxy resin; and composition (A-3): oxazolidone epoxy resin.

Abstract: The present invention deals with a flexible printed wiring board in the form of a printed wiring board wherein the conductive elements are fully encapsulated by an epoxy adhesive comprising a novel aromatic di-isoimide chemical compound. The conductive elements are thereby protected. The flexible printed wiring board is readily cured at a temperature in the range of 100 to 250° C. However, before curing, by virtue of the latent cure feature of the epoxy adhesive, the adhesive component of the printed wiring board has an extended shelf life, and avoids premature curing during processing.

Abstract: Coated Fibrous Substrates The present invention provides a method of improving the adhesion of coatings to fibrous base materials. The method comprises treating a fibrous base material with one or more salt(s) of receptor species to provide a pre-coated fibrous base material comprising specific inorganic receptor sites within the fibrous base material. The one or more salt(s) of receptor species is selected from the groups comprising: (a) aluminium salts; (b) titanium salts; (c) zirconium salts; (d) iron salts; (e) soluble alkali silicates; or a combination thereof. The method further comprises coating the treated fibrous base material with a coating formulation comprising one or more compound(s) containing epoxy and alkoxysilane groups. The coating formulation acts as an adhesion promoter and cross-linker.

Abstract: This invention relates to coating compositions that include water; a latex polymer and a silane coupling agent. The latex polymer preferably comprises acetoacetoxy functionality, or is a multistage latex, or is an acetoacetoxy functional multistage latex. The silane coupling agent is preferably a functionalized silane coupling agent (more preferably an epoxy-functional silane coupling agent). The compositions may be used to coat a variety of substrates, including wood, cement and fiber cement. Articles having the coating applied thereto are also provided.

Abstract: The present application provides agents for producing an impact-modified epoxy adhesive encompassing at least two components A and B packaged separately from each other, wherein (a) component A contains at least one compound having two or more isocyanate groups together with one or more further additives, (b) component B contains at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, together with one or more further additives, (c) at least one of components A and/or B contains at least one epoxide prepolymer as an additive, (d) at least one of components A and/or B contains at least one latent hardener for epoxide prepolymers as an additive, and (e) components A and B contain no blowing agent that is capable of being heat activated.

Abstract: An apparatus comprising a first substrate, a second substrate, a bonding layer positioned between the first substrate and the second substrate, the bonding layer holding the first substrate and the second substrate together, and a reactive layer embedded in the bonding layer. The reactive layer can generate sufficient thermal energy to cause the first substrate to separate from the second substrate without damaging at least one of the first substrate or the second substrate when the reactive layer is activated, and is preferably comprised of a reactive multilayer foil.

Abstract: A film which can be industrially coated easily and exhibits excellent gas barrier performance without being subjected to a high-temperature heat treatment, good gas barrier performance immediately after the production, and maintains the excellent gas barrier performance while exhibiting excellent hot water resistance and printing resistance; a gas barrier laminated film including a resin layer on an inorganic thin film formed on at least one surface of a support film, the resin layer being formed by applying: (1) an aqueous dispersion containing polyvinyl alcohol (a), an ethylene-unsaturated carboxylic acid copolymer (b), and inorganic particles (c); (2) an aqueous dispersion containing an ethylene-unsaturated carboxylic acid copolymer (b), inorganic particles (c), and/or a cross-linking agent (d); or (3) an aqueous dispersion containing polyvinyl alcohol (a), an ethylene-unsaturated carboxylic acid copolymer (b), inorganic particles (c), and cross-linking agent (d), to the inorganic thin film surface; and a

Abstract: To suppress an excessive reduction in resistance of an electro-conductive roller under an H/H environment and reduce a resistance value thereof under an L/L environment, provided is an electro-conductive member for electrophotography, comprising: an electro-conductive mandrel; and an electro-conductive layer provided on a periphery of the mandrel, wherein the electro-conductive layer contains a binder resin having an alkylene oxide structure, and a sulfo or a quaternary ammonium group as an ion exchange group, and an ion having polarity opposite to polarity of the ion exchange group, a water content of the electro-conductive layer under a temperature of 30° C. and a relative humidity of 80% is 10 mass % or less, and a spin-spin relaxation time of the electro-conductive layer, which is determined by pulse NMR measurement with a hydrogen core being a measurement core under a temperature of 15° C. and a relative humidity of 10%, is 200 ?sec or more.

Abstract: One embodiment includes a multilayer thermo-reversible dry adhesive system comprising of at least one layer of soft dry adhesive and one layer of shape memory polymer.

Abstract: An adhesive composition for stealth dicing of a semiconductor, an adhesive film, and a semiconductor device including the adhesive film, the adhesive composition including a polymer resin, the polymer resin having a glass transition temperature of about 5° C. to about 35° C., an epoxy resin, the epoxy resin including a liquid epoxy resin and a solid epoxy resin, a phenolic resin curing agent, an inorganic filler, a curing catalyst, and a silane coupling agent.

Abstract: An aqueous solution coating composition comprising an autoxidisable polyvinyl polymer having ?20% of fatty acid residue by weight of polymer; Tg from ?60 to +15° C.; acid value of 15 to 75 mg KOH/g, Mw from 2500 to 100000 g/mol; polydispersity ?30, said composition having ?25% co-solvent by weight of solids, ?30% solids by weight of composition; said composition when in the form of a coating having a telegraphing value defined as the difference in gloss at a 20° angle of between a film cast on rough PVC and a film cast on smooth PVC of 10 gloss units.

Abstract: Provided is a resin composition from which a melt molded product which is excellent in transparency, gas barrier property and flexibility and has biodegradability can be obtained. The present invention relates to a resin composition, which comprises a polyvinyl alcohol-based resin (i) comprising a structural unit represented by the following general formula (1) and an aliphatic-aromatic polyester (ii) comprising a specific component, wherein each of R1, R2 and R3 independently represents a hydrogen atom or an organic group, X represents a single bond or a bonding chain, and each of R4, R5 and R6 independently represents a hydrogen atom or an organic group.

Abstract: Provided are a resin composition which offers both high transparency and a low linear expansion coefficient and can be used as a material for a dry film, and also a dry film obtained from this composition, an optical waveguide, and a photoelectric composite wiring board. The resin composition for an optical waveguide includes: (A) an epoxy resin constituted by a solid epoxy resin with one or less hydroxyl group in a molecule, and a liquid epoxy resin with one or less hydroxyl group in a molecule; (B) a curing agent with one or less hydroxyl group in a molecule; and (C) a nanosize silica sol, and contains no compound including two or more hydroxyl groups in a molecule as a resin component.

Abstract: There is disclosed an adhesive composition containing: (A) 100 parts by mass of a phenoxy resin; (B) 5 to 200 parts by mass of an epoxy resin; (C) 1 to 20 parts by mass of an alkoxysilane-partial hydrolytic condensate which is a partial hydrolytic condensate of alkoxysilane including one kind or two or more kinds of alkoxysilane represented by the following general formulae (1) and (2) Si(OR3)4??(1) R1Si(OR3)3??(2), wherein the weight average molecular weight is 300 or more and 30,000 or less and an amount of residual alkoxy is 2 wt % or more and 50 wt % or less; (D) a curing catalyst for an epoxy resin; (E) an inorganic filler; and (F) a polar solvent having a boiling point of 80° C. to 180° C. and a surface tension of 20 to 30 dyne/cm at 25° C. There can be a sheet for forming a semiconductor wafer-protective film and an adhesive composition capable of forming a protective film excellent in evenness, cutting characteristics and adhesiveness.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: A laminated polyester film provided on at least one side with layer (X) made from acrylic urethane copolymer resin (A), isocyanate compound (B), epoxy compound (C), compound (d-1) having a polythiophene structure and compound (d-2) having an anion structure, wherein the layer (X) has a continuous phase structure.