Abstract: A composite structure having a number of thermoset resin containing elements and a number of thermoplastic elements and at least one interface between the thermoset resin containing elements and the thermoplastic elements is provided. The thermoset resin containing elements and the thermoplastic elements have functional groups at the interface which bond to each other when the composite structure is cured and the functional groups are independently selected from amines, carboxylic acids, acid anhydrides, oxiranes, and derivatives thereof in their non-bonded condition. Additionally, a blade having such a composite structure is provided.

Abstract: A curable resin composition which contains an epoxy compound (A1), active ester compound (A2), filler (A3), and alicyclic olefin polymer (A4) containing groups which have reactivity with respect to epoxy groups, wherein a ratio of content of the alicyclic olefin polymer (A4) to 100 parts by weight of said epoxy compound (A1) is 2 to 50 parts by weight is provided. According to the present invention, a curable resin composition which is excellent in resin fluidity and which can give a cured article which is low in linear expansion and is excellent in wire embedding flatness, electrical characteristics, and heat resistance can be provided.

Abstract: The present invention provides coating systems for surfaces and methods for coating and repairing surfaces.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin, a hardener, and a modifier, wherein the modifier is a polymer solution obtainable from the following steps: (a) dissolving an N,O-heterocyclic compound of Formula I or Formula II into a first solvent to form a first reaction solution: (b) heating the first reaction solution to a first temperature to carry out a ring-opening polymerization to provide a solution of ring-opening polymerized product; and (c) cooling the solution of ring-opening polymerized product to a second temperature to substantially terminate the ring-opening polymerization to obtain the polymer solution, wherein, the first solvent is unreactive to the N,O-heterocyclic compound; the first temperature is higher than the softening temperature of the N,O-heterocyclic compound and lower than the boiling point of the first solvent; and the second temperature is lower than the first temperature.

Abstract: Disclosed is a sealant laminated composite for collectively sealing a semiconductor devices mounting surface of a substrate on which semiconductor devices may be mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices may be formed, including a support wafer that may be composed of silicon and an uncured resin layer that may be constituted of an uncured thermosetting resin formed on one side of the support wafer.

Abstract: A prepreg curing process for preparing composites having superior surface finish and high fiber consolidation is provided.

Abstract: The present invention is directed to a coated substrate comprising: A) a heat sensitive substrate having a heat distortion temperature less than 120 degrees C., and B) a coating layer deposited on at least one surface of the substrate, wherein the coating layer is deposited from a waterborne coating composition comprising: (a) a continuous phase comprising water, and (b) a dispersed phase comprising: (i) optional pigments; (ii) polymeric particles containing carboxylic acid functionality prepared from the polymerization of a mixture of ethylenically unsaturated compounds including ethylenically unsaturated monomers; and (iii) a polycarbodiimide or a polyhydrazide.

Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

Abstract: A method for manufacturing a propylene polymer, including: a) fermenting and optionally purifying first renewable materials to produce an alcohol or an alcohol mixture, the alcohol or alcohol mixture including at least isopropanol and/or at least a mixture of ethanol and 1-butanol; b) dehydrating the resulting alcohol or the alcohol mixture to produce an alkene or alkene mixture in a first series of reactors, the alkene or alkene mixture containing at least propylene; c) polymerizing the propylene in a second reactor, optionally in the presence of a comonomer, so as to produce a propylene polymer; d) isolating the propylene polymer obtained in step c); and e) grafting the propylene polymer obtained from step d). A grafted propylene polymer capable of being obtained by the method, to the compositions containing the polymer, as well as to the uses of the polymer.

Abstract: An electrical insulation system includes a first insulation layer having a first polymer and a first filler in the form of nanoparticles, and a second insulation layer including a second polymer and a second filler in the form of either chromium oxide, Cr2O3, iron oxide, Fe2O3, or a mixture of chromium oxide and iron oxide. At least one of the insulation layers is in the form of a solid and flat sheet. By an insulation system combining the first insulation layer with well dispersed nanoparticles and the second insulation layer filled with Cr2O3 particles and/or Fe2O3 particles, a synergetic effect of the two insulation layers provides an excellent shield and resistance of the insulation system against electrical discharges. The sheet material allows anybody to put together an insulation system without any special equipment.

Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.

Abstract: In one aspect, the present invention provides composite coatings for implantable or insertable medical devices. These composite coatings comprise (a) an inorganic portion and (b) a polymeric portion that comprises a poly(vinyl pyrrolidone) (PVP) block.

Abstract: The invention provides materials and methods for forming coatings on substrates. The coatings are durable and resistant to damage from environmental, chemical, thermal, and/or radiative sources. In some embodiments, the coatings comprise bilayers of electrostatically charged materials. The bilayers are created by alternately applying solutions comprising water-soluble, electrostatically charged materials. Durability is imparted to the coatings by the formation of crosslinks that are formed within and between layers after deposition of the coatings.

Abstract: An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40° C. to 110° C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40° C. to 110° C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 ?m, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product.

Abstract: A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.

Abstract: Modified lignin having covalently attached phosphorous containing groups and methods for preparing such compounds are described herein. The modified lignin described herein provides a renewable source of flame retardant material.

Abstract: An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1. n represents an integer from 0 to 10. In Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms.

Abstract: A coated thermoplastic film and a method of making the coated film, wherein at least one side of the film is coated with a coating composition, the coating composition comprising the reaction product of a polyalkyleneimine having at least primary nitrogens, and an epoxide compound having at least one epoxide moiety and a weight average molecular weight (Mw) of at least 200 g/mole. The weight of the dried coating compound on each side of the film is within the range from 0.005 g/m2 to 0.100 g/m2, and is especially useful in coating films to allow for printability when the film surface will be exposed to high levels of silicon that might come from, for example, release paper/films.

Abstract: The invention relates to a wood substrate rendered flame-retardant. The invention provides that on the substrate there is a coating and/or impregnation system with a flame retardant selected from the group consisting of room-temperature-liquid organic halogen compounds and organic phosphorus compounds and organic boron compounds, and that there is also a layer of coating material applied thereto.

Abstract: There is disclosed an adhesive composition comprising the following Components (A), (B) and (C), wherein a minimum melt viscosity of the composition is less than 500 Pa·s, a temperature which gives the minimum melt viscosity is less than 200° C., and, a melt viscosity at 200° C. of the composition is 500 Pa·s or more: (A) a polymer having a reactive functional group (B) a thermosetting resin (C) a compound having flux activity. As a result, there is provided an adhesive composition which can be suitably used for preparation of a semiconductor apparatus, particularly an adhesive composition which difficultly causes voids between bumps at the bonding, difficultly causes positional divergence of bumps, and difficultly causes voids after completion of solder bonding.

Abstract: A multi-layered composite material is disclosed, which includes an ordered periodic array of particles held in a matrix composition. The composite material further includes inorganic nanosized particles infused into the array of particles.

Abstract: A resin composition includes (A) 100 parts by weight of epoxy resin; (B) 20 to 100 parts by weight of polybutadiene styrene divinylbenzene graft terpolymer resin; (C) 2 to 20 parts by weight of di-tert-butylhydroquinone (DTBHQ); (D) 5 to 50 parts by weight of polyphenyl ether modified cyanate ester resin; and at least one of (E) inorganic filler, (F) chain extending sealing agent, and (G) catalyst. The resin composition is characterized by specific ingredients and proportions thereof to attain high heat resistance, low dielectric constant Dk, and low dielectric dissipation factor Df, and being halogen-free, and therefore is applicable to protective film of printed circuit boards, insulating protective film of electronic components, and resin insulation film of leadframes.

Abstract: A container unit door and container monitoring system are disclosed. The container unit door comprises a first layer of a first polyester epoxy glass fiber composite material, a second layer of a second polyester epoxy glass fiber composite material and, a core sandwiched between the first and second layers, wherein the door is substantially transparent to radio frequency radiation. The monitoring system includes a communications system (200) embedded in the door.

Abstract: To provide a flame-retardant resin composition that has superior adhesion subsequent to curing and molding when used as a printed wiring board adhesive and that provides superior printed wiring board electrical characteristics; and a flexible printed wiring board metal-clad laminate, a coverlay, a flexible printed wiring board adhesive sheet, and a flexible printed wiring board employing this resin composition. (SOLUTION) The flame-retardant resin composition comprises a thermosetting resin, a hardener, and a phosphorus-containing polymer.

Abstract: An entry sheet comprising polymer material for drilling printed circuit boards is provided. The entry sheet is suitable for use with a broad range of diameters, including commonly available drill diameters. The entry sheet comprises an adhesive epoxy configured to, among others, resist drill deflection, resist mechanical damage, and reduce to dust such that the entry sheet may increase drilling accuracy, protect printed circuit board from damage, minimize entry burrs, and may addresses other issues such as fliers, bird nesting, and the like.

Abstract: A rotomoulded article can have one or more layers, including a layer A. The layer A can have from 50 to 99.4 wt % of a polyolefin, from 0.5 to 50 wt % of a polyester, and from 0.1 to 20 wt % of a co- or ter-polymer. The co- or ter-polymer can have 50 to 99.9 wt % of an ethylene or a styrene monomer, 0.1 to 50 wt % of an unsaturated anhydride-containing monomer, epoxide-containing monomer or carboxylic acid-containing monomer, and 0 to 50 wt % (meth)acrylic ester monomer.

Abstract: A polarizing plate, a fabrication method thereof, and a display device using the same are provided. The polarizing plate includes a polarizing element, a first adhesive layer formed on one surface of the polarizing element, a second adhesive layer formed on the other surface of the polarizing element, a protective film attached to an upper portion of the first adhesive layer, a bonding layer attached to a lower portion of the second adhesive layer, and a luminance enhancement film attached to the bonding layer.

Abstract: The present application relates to an encapsulating film, an electronic device and a method of manufacturing the same. In the present application, an encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided.

Abstract: The invention relates to a method for bonding a thermoplastic polymer to a thermosetting polymer component, the thermoplastic polymer having a melting temperature that exceeds the curing temperature of the thermosetting polymer. The method comprises the steps of providing a cured thermosetting polymer component comprising an implant of a thermoplastic polymer at least at the part of the thermosetting polymer component to be bonded, locating a thermoplastic polymer in contact with at least the part to be bonded, heating the assembly to the melting temperature of the thermoplastic polymer, whereby the thermoplastic polymer of the implant melts and fuses with the thermoplastic polymer, and cooling the assembly.

Abstract: An object having a coating produced using an adhesion promoter, wherein the adhesion promoter comprises at least one, optionally oligomeric, addition product having no terminal C?C double bonds and having hydrolyzable silane groups.

Abstract: An ultraviolet (UV) crosslinkable acrylic pressure sensitive adhesive comprises an acrylic copolymer and a cationic photoinitiator. The acrylic copolymer comprises pendant reactive functional groups. The pressure sensitive adhesive formed from the acrylic copolymer with the pendant reactive functional groups result in high green strength and/or high temperature holding strength of the adhesive.

Abstract: A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a second type having a surface area to mass ratio in the range of 0.59 m2/g to 2.19 m2/g and a tap density in the range of 3.2 to 6.9 g/cm3 and a first type having a surface area to mass ratio of 0.05 to 0.15 m2/g and a tap density in the range of about 4.7 to 8.2 g/cm3. According to certain embodiments of the invention the first type of silver particles includes oblong silver particles. The thermally conductive adhesive further comprises a binder, and optionally a solvent.

Abstract: The present invention is to provide a photocurable fluorinated copolymer composition which is uniform and excellent in transparency, and a coating film layer obtainable by using it, is excellent in heat resistance and abrasion resistance and exhibits a particularly excellent weather resistance performance. The photocurable fluorinated copolymer composition comprises a specific fluorinated copolymer (A), a specific hydrolysable silane compound (B), an epoxy resin (C) having a cyclohexane ring structure, and a photoreaction initiator (D).

Abstract: Epoxy containing phosphonate monomers, polymers, copolymers, oligomers and co-oligomers and methods for making the same are describes herein. These materials can be used to make polymers, and can be combined with other polymers, oligomers or monomer mixtures to make resins with excellent fire resistance that can be used in a variety of industrial and consumer products.

Abstract: Disclosed is the use of a curable composition for padding-free encapsulation of instrument transformers comprising (a) a cycloaliphatic epoxy resin, (b) a polyoxyalkylene diglycidylether (c) an OH-terminated polysiloxane, (d) a cyclic polysiloxane and (e) a non-ionic, fluoroaliphatic surface-active reagent, (f) a filler, (g) a hardener selected from anhydrides, (h) a curing accelerator selected from accelerators for anhydride curing of epoxy resins.

Abstract: Co-cured urethane and vinyl ester, epoxy, or unsaturated polyester gel coats having improved toughness and flexibility compared with conventional polyester gel coats are disclosed. The gel coats, which have 10-50 wt. % urethane content, adhere well to structural layers and can be used in a traditional in-mold process. Co-cured elastomeric coatings comprising from 50 to 95 wt. % of a urethane component and an unsaturated polyester, epoxy, or vinyl ester are also disclosed. Unlike conventional urethane coatings, the elastomeric coatings adhere well to structural layers and can be used in a traditional in-mold process. Castings or structural layers comprising a reinforced thermoset of co-cured urethane and vinyl ester, epoxy, or unsaturated polyester components, including 10-95 wt. % of the urethane component, are also described. The invention includes in-mold processes for making laminates that utilize the gel coats, elastomeric coatings, and/or structural layers.

Abstract: A sealing film which includes a resin layer having a flow within the range of 150 to 1800 ?m at 80° C., or having a resin layer with a viscosity within the range of 10000 to 100000 Pa·s in a B-stage state at 50 to 100° C. in thermosetting viscoelasticity measurement, and containing: (A) both (a1) a high-molecular-weight component including crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of ?50 to 50° C., and (a2) a thermosetting component including an epoxy resin as a main component, (B) a filler having an average particle size within the range of 1 to 30 ?m, and (C) a colorant, as well as a manufacturing method thereof and a semiconductor device using the same.

Abstract: This invention relates to an epoxy resin composition, in particular a curable phosphorus containing flame retardant epoxy resin composition comprising epoxy resin and an epoxy resin chain-extending amount of a diaryl alkylphosphonate and/or diaryl arylphosphonate and a cross-linking agent. The curable flame retardant compositions are useful in e.g., printed wiring boards or molding compounds for electronic applications, protective coatings, adhesives, as well as structural and decorative composite materials.

Abstract: Disclosed are Bisphenol A (BPA), Bisphenol F, Bisphenol A diglycidyl ether (BADGE), and Bisphenol F diglycidyl ether (BFDGE)-free coating compositions for metal substrates including an under-coat composition containing a polyester (co)polymer, and an under-coat cross-linker; and an over-coat composition containing a poly(vinyl chloride) (co)polymer dispersed in a substantially nonaqueous carrier liquid, an over-coat cross-linker, and a functional (meth)acrylic (co)polymer. Also provided is a method of coating a metal substrate using the BPA, BPF, BADGE and BFDGE-free coating system to produce a hardened protective coating useful in fabricating metal storage containers. The coated substrate is particularly useful in fabricating multi-part foodstuffs storage containers with “easy-open” end closures.

Abstract: A thermally-conductive and electrically-insulating composite composition is provided. The composite composition includes an epoxy resin and a filler. The epoxy resin has at least two epoxide groups per molecule, and a reactive diluent. The composite composition includes about 5 volume percent to about 20 volume percent of the filler, based on the total volume of the composite composition. An electrical component having a coating of the composite composition is also provided.

Abstract: A fiber reinforced powder paint provides improved flexural fatigue resistance for composites substrates. Fiber loading in the powder is greater than 40%. Aramid fiber loading in an epoxy based powder paint is exemplified. A composite bow limb coated with the powder paint survives a remarkably greater number of bending cycles before failure when coated with the powder paint.

Abstract: A coating which provides corrosion resistance, wear resistance, and, optionally, lubrication, for deposition on a threaded article is disclosed. The coating comprises a polymer matrix, such as a polyimide, which is modified with small amounts of a fluorine containing polymer modifier, as well as other compounds or additives to improve performance of the coating. Additionally, the coating can further comprise a solid lubricant or an anticorrosion compound dispersed within the polymer matrix.

Abstract: An acrylic adhesive composition includes: an acrylic resin; an epoxy resin; and a cationic photoinitiator, the acrylic adhesive composition having a storage modulus of about 6×106 dyne/cm2 to about 1×108 dyne/cm2 at 25° C. and a storage modulus of about 5×103 dyne/cm2 to about 1×106 dyne/cm2 at 80° C. A polarizing plate includes a polarizing film and an adhesive layer on one or both sides of the polarizing film, the adhesive layer including a cured product of the acrylic adhesive composition. A liquid crystal display including a liquid crystal panel and the polarizing plate on one or both sides of the liquid crystal panel is also disclosed.

Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.

Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin and diaminodiphenylsulfone mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.

Abstract: A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.

Abstract: A color sampling display product is provided that includes a radiation-curable water-based coating composition applied to a substrate, and shows mechanical integrity and aesthetic appeal.

Abstract: The present invention provides a blend comprising one or more epoxy resins and a mixture which comprises 0.3 to 0.9 amine equivalent, per equivalent of epoxide of the epoxy resin used, of a hardener component a) and as hardener component b) a compound of the formula I, a process for preparing this blend, the use of the blend of the invention for producing cured epoxy resin, and an epoxy resin cured with the blend of the invention.

Abstract: A method for producing a composite material including a fiber reinforced resin and a lightweight core adjacent thereto, is capable of preventing inflow of a resin into holes on the surface of the lightweight core without increasing the weight of the composite material and also capable of producing a composite material with a high molding accuracy and at a high production rate. In order to produce a composite material including a lightweight core and a fiber reinforced resin that is adjacent to at least a part of a surface of the lightweight core, the method includes arranging, inside a molding tool, a fiber base material adjacently to a foundry core which includes a part which has a part having a shape substantially the same as a shape of a part of the lightweight core which is adjacent to the fiber reinforced resin, which is performed first.

Abstract: A method of producing a structural component comprising manufacturing a structural component from a moisture absorbable material the toughness of which increases with increasing moisture absorption and subsequently subjecting the structural component to at least one of elevated temperature and humidity for a period of time such that the structural component attains a predetermined moisture content and distribution.