Abstract: Provided are multilayer laminates having one or more layers comprising twisted nematic liquid crystals and one or more layers of a polymeric sheet comprising a polymer with a modulus between 20,000 psi (138 MPa) and 100,000 psi (690 MPa). The twisted nematic liquid crystal layers reflect infrared radiation. Thus, the multilayer laminates are useful to reduce the transmission of infrared energy. For example, in some embodiments the multilayer laminates are useful as windows to reduce energy consumption necessary to cool the interior of a structure such as an automobile or building. Preferably, the multilayer laminates retain the beneficial properties of safety glass. The multilayer laminates may include additional layers such as infrared absorbing layers, half wave plates, and the like, to minimize the transmission of infrared energy. The multilayer laminates may also include further additional layers such as polymeric films, polymeric sheets, rigid sheets, and the like.

Abstract: A composite substrate 10 is a composite substrate in which a piezoelectric substrate 11 that is transparent to light used for photolithography and a supporting substrate 12 for supporting the piezoelectric substrate 11 are bonded together via an organic adhesive layer 13. At least one of the supporting substrate 12 and the organic adhesive layer 13 of the composite substrate 10 can absorb light used for photolithography.

Abstract: An epoxy adhesive composition of an epoxy resin and an amine hardener includes a synergistic accelerator of an effective amount of short chain polyol and an effective amount of a dihydric phenol having between about 6 and about 24 carbon atoms. Surfaces of adherends are joined with the dried residue of the epoxy adhesive composition by applying the epoxy resin composition to one or both surfaces, joining the surfaces, and applying pressure, optionally with heating. The joined adherends having the dried epoxy resin composition is another disclosed embodiment.

Abstract: Provided are multilayer laminates having one or more layers comprising twisted nematic liquid crystals and one or more layers of a polymeric sheet comprising a polymer with a modulus of 20,000 psi (138 MPa) or less. The twisted nematic liquid crystal layers reflect infrared radiation. Thus, the multilayer laminates are useful to reduce the transmission of infrared energy. For example, in some embodiments the multilayer laminates are useful as windows to reduce energy consumption necessary to cool the interior of a structure such as an automobile or building. Preferably, the multilayer laminates retain the beneficial properties of safety glass. The multilayer laminates may include additional layers such as infrared absorbing layers, half wave plates, and the like, to minimize the transmission of infrared energy. The multilayer laminates may also include further additional layers such as polymeric films, polymeric sheets, rigid sheets, and the like.

Abstract: Fiber reinforced resin matrix composite laminates are provided comprising: at least one layer of fiber reinforced resin matrix comprising a cured resin matrix; and a surfacing construction bound to the cured resin matrix and forming a surface of the laminate, comprising: at least one barrier layer; and at least one cured adhesive layer derived from high temperature cure adhesive. In some embodiments, barrier layer(s) may be substantially impermeable to organic solvents, water, and/or gasses. In another aspect, fiber reinforced resin matrix composite laminates are provided comprising: a) at least one layer of fiber reinforced resin matrix comprising a cured resin matrix; and b) a surfacing construction bound to the cured resin matrix and forming a surface of the laminate, comprising: at least one barrier layer; and at least one electrically conductive layer. In another aspect, a surfacing construction is provided comprising a barrier layer and a curable adhesive layer.

Abstract: Aqueous resinous binders comprising graft copolymers, water-dilutable urethane polyols and epoxy-phosphorus acid reaction products are disclosed. The binders are useful in primer formulations for automotive applications.

Abstract: An adhesive for a circuit material, comprises a blend of a cure system; and a solid epoxy resin and a nitrile rubber functionalized with epoxy-reactive groups, wherein the solid epoxy resin and the nitrile rubber are reacted to form an adduct prior to blending with the cure system. The adhesive has low dendritic growth and improved solder resistance.

Abstract: An aqueous primer composition of the present invention includes a water-dispersible polyisocyanate (A) and an acrylic resin water dispersion (B), wherein a polystyrene equivalent weight average molecular weight, determined using gel permeation chromatography, of an acrylic resin in the acrylic resin water dispersion (B) is 350,000 or more, and a glass transition temperature, determined by using a differential scanning calorimeter, of the acrylic resin is 15° C. to 130° C., and a weight ratio between the water-dispersible polyisocyanate (A) and the acrylic resin water dispersion (B) is (A):(B)=70:30 to 50:50.

Abstract: The present invention relates to a photocurable composition comprising: (a) 30-80% by weight of an epoxy-containing component (b) 5 to 65% by weight of a compound containing an oxetane ring in its molecule; (c) 1-25% by weight of a polyol having a molecular weight Mw of 2.000 or higher, (d) an antimony-free cationic photoinitiator. wherein the percent by weight is based on the total weight of the photocurable composition. The curable resin composition can be used for photocurable coatings per se and in specific for stereolithography and other such three dimensional printing applications where a 3D object is formed.

Abstract: Disclosed is a composite retardation plate which comprises a retardation plate composed of a transparent resin, a primer layer, and a coating retardation layer comprising an organic modified lay complex and a binder resin laminated in this order, wherein the primer layer is composed of a composition comprising a water-soluble organic metal compound selected from a water-soluble organic titanium compound and a water-soluble organic zirconium compound and a water-soluble resin. The composite retardation plate may further comprise a polarizing plate preferably laminated on the side of the resin retardation plate, thereby providing a composite optical member. The composite optical member may be combined with a liquid crystal cell to provide a liquid crystal display device.

Abstract: A laminate sheet that can be easily produced together with improving the heat resistance and the water absorbency. Provided is a laminate sheet prepared by laminating plural sheet materials by a resin composition, wherein the resin composition is comprised of an aromatic polyamide resin and an epoxy group-containing phenoxy resin having an epoxy group in the molecule, and the resin composition is a polyamide resin composition that contains 30 to 50% by mass of the epoxy group-containing phenoxy resin.

Abstract: The invention provides a cation polymerizable resin composition excellent in curing properties and corrosion resistance with less resin coloration and less cure shrinkage, which is a material suitable as a surface protective material for optical disk. Specifically, the cation polymerizable resin composition comprises an epoxy compound (A) as an essential ingredient represented by formula 1 wherein R1 and R2 each represent a saturated or unsaturated carbon atom, and R3 represents a hydrogen atom or a saturated or unsaturated carbon atom, a cation polymerizable compound (B) other than the epoxy compound represented by formula 1, a photo cation polymerization initiator (C) and a photo radical polymerization initiator (D).

Abstract: A primer composition includes the reaction product of (a) a polyglycidyl ether of a hydroxy-functional material; and (b) an amino polyalkoxysilane. The reaction product, when hydrolyzed, comprises at least 6 silanol groups, such as at least 8 silanol groups, such as at least 10 silanol groups, such as at least 12 silanol groups.

Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.

Abstract: According to one aspect of the present invention, there is provided a prepreg with a carrier, comprising: a sheet-like base member; a first insulating resin layer provided to cover a surface of the sheet-like base member; a first carrier provided to cover the first insulating resin layer; a second insulating resin layer provided to cover a back surface of the sheet-like base member; and a second carrier provided to cover the second insulating resin layer, wherein the first and the second insulating resin layers have different resin compositions or the first and the second insulating resin layers have different thicknesses, and a front surface and a back surface of the prepreg with the carrier is visually identifiable.

Abstract: A paint and method are divulged for protecting the silver film of mirrors. The paint in its preferred embodiment includes a metal carboxylate which will contribute metal ions, namely stannous octoate for the contribution of stannous(II) ions in an amount of 0.5% or greater by weight. Alternate methods of the invention utilize an additional coating over the paint, such as an acrylic, epoxy or blend thereof which is UV curable. In another form of the paint, copper octoate is utilized in a minimum amount of 0.5% by weight for contribution of copper(II) ions.

Abstract: A resin composition excellent in heat resistance after moisture absorption, lead-free solder reflow properties, dimensional stability and electrical characteristics for high-multilayer and high-frequency-capable printed wiring boards, which composition comprises a bisphenol A type epoxy resin (a) having at least two epoxy groups per molecule and a secondary hydroxyl group amount of 0.4 meq/g or less, a novolak type epoxy resin (b) at least two epoxy groups per molecule, a cyanate ester resin (c) having at least two cyanate groups per molecule and spherical silica having an average particle diameter of 4 ?m or less, wherein the equivalent ratio of cyanate groups/epoxy groups in the resin composition is in the range of 0.7 to 1.45, and a prepreg and a metal-foil-clad laminate each of which comprises the resin composition.

Abstract: Compositions that can be polymerized and/or crosslinked into coatings by cationic and/or radical irradiation contain at least one photoinitiator and at least one compound having at least one isocyanate function.

Abstract: A composite structure and method of making the same. The composite structure has a thermoplastic liner that is bonded to wet cement by a thermosetting resin adhesive. The thermosetting resin adhesive contains an epoxy resin system, solvent and a primer therein to form a solvent blend. The solvent blend is formed such that the blend is not flammable and is able to bond to thermoplastic liners with only a single coat and not requiring an extra coat of primer.

Abstract: It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin paste, an adhesive epoxy resin sheet, a conductive connection paste, and a conductive connection sheet using the curable resin composition, and an electronic component joined body. The invention relates to a curable resin composition, which contains an epoxy resin, a solid polymer having a functional group to react with the epoxy group and a curing agent for an epoxy resin, no phase separation structure being observed in a matrix of a resin when a cured product is dyed with a heavy metal and observed with a transmission electron microscope.

Abstract: A heat resistant masking tape, comprising (1) a heat resistant backing film layer; and (2) a pressure-sensitive adhesive layer disposed on the heat resistant backing film layer, wherein the pressure-sensitive adhesive layer comprises a polymer resulting from polymerizing and cross-linking a monomer mixture comprising an alkyl (meth)acrylate with an alkyl group having 4 to 15 carbon atoms, glycidyl (meth)acrylate and (meth)acrylic acid, the glycidyl (meth)acrylate being present in an amount of 2 to 13% by weight of the total weight of monomers and the (meth)acrylic acid being present in an amount of 1 to 7% by weight of the total weight of monomers.

Abstract: Described are heat hardening compounds which contain at least one epoxy resin, A, with on average more than one epoxy group per molecule, at least one impact-strength modifier, B, at least one crack promoter, C, as well as at least one hardener, D, for epoxy resin, which is activated by raised temperature. Silicate layers such as mica or talc and graphite are particularly suitable as crack promoters, C.

Abstract: Aqueous resinous binders comprising graft copolymers, water-dilutable urethane polyols, epoxy-phosphorus acid reaction products, and an aqueous dispersion comprising the reaction product of trimellitic anhydride and a polyol, wherein the molar ratio of trimellitic anhydride to the polyol in the reaction product ranges from 1:2 to 1:4, and wherein the reaction product is further reacted with an anhydride to form another reaction product are disclosed. The binders are useful in primer formulations for automotive applications.

Abstract: An electrical device includes two electrodes and a conductive polymer layer, containing a mixture of a polymer and a conductive filler, separating the electrodes. A oxygen barrier material containing a thermosetting polymer component is present on the exposed surface of the conductive polymer layer that is not in contact with the laminar electrodes. The oxygen barrier material may be a polyamine-polyepoxide material, and may provide for acceptable barrier properties over a wide range of humidity levels.

Abstract: An object of the present invention is to provide a polarizing laminate which is resistant to impact, has the high polarization degree, hardly causes a solvent crack, and hardly causes a fine crack even when perforation-processed, for example, goggles, sunglasses, prescription sunglasses, and shields which are resistant to impact, have higher stability, and can effectively prevent glare. There is provided a polarizing laminate comprising two protective sheets having approximately the same thickness, and a polarizer sheet held by them, wherein a protective sheet and a polarizer sheet are adhered, the protective sheet is any of a polyamide-based resin sheet, and a polyurethane-based resin sheet, and the laminate has the function as an optical lens.

Abstract: A circuit terminal connected structure and a circuit terminal connecting method are provided. Both the structure and the method feature a circuit connecting material formulated with the following components: a curing agent capable of generating free radicals upon heating; an acrylate or methacrylate radical polymerizable substance; and either an acrylic rubber or a maleimide radical polymerizable substance having at least two maleimide groups per molecule. In some embodiments, the curing agent features a 10-hour half life temperature of 40° C. or above and a 1-minute half-life temperature of 180° C. or below. In other embodiments, the circuit connecting material includes conductive particles. In additional embodiments, the circuit connecting material includes a hydroxyl-group-containing resin having a weight average molecular weight of 10,000 or more.

Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract: The present invention provides compositions comprising at least one reaction product obtained from a reaction mixture comprising i) at least one mercaptosilane MS, and also ii) at least one polysilane PS which contains in particular at least one secondary or tertiary amino group, preferably a secondary amino group, and also iii) at least one epoxy resin EP. The compositions are suitable as adhesion promoters, more particularly in the form of primers. They exhibit good adhesion and are especially suitable for the adhesive bonding of glass and glass ceramic.

Abstract: Various methods and apparatus relating to a multi-level layer (140, 440, 540, 640, 740) are disclosed.

Abstract: A coating composition comprising an effective corrosion-inhibiting amount of a carbon pigment is provided. In one embodiment, the corrosion-inhibiting carbon pigment is further comprising other components such as extenders, including neutral to slightly acidic generating extenders and acidic generating extenders, are earth compounds, amino acids and amino acid derivatives, gelatin and gelatin derivatives, organic-based exchange resins, and combinations thereof, to enhance the corrosion resistance of the resultant coating film. In one embodiment, the carbon pigment is a surface-modified carbon pigment. The coating compositions have good adhesion to substrates such as metals, including aluminum and aluminum alloys.

Abstract: A method of bonding an adherent to a substrate, wherein a primer is applied to the substrate by plasma deposition and the adherent is bonded to the primer treated surface of the substrate, and the primer contains functional groups which chemically bond to functional groups in the adherent.

Abstract: Composites having a multi-layer coating system applied to at least a portion thereof are disclosed. Methods for repairing wind blades, such as the leading edge of the wind blade, are also disclosed.

Abstract: Provided is a film which can be industrially coated easily and exhibits excellent gas barrier performance without being subjected to a high-temperature heat treatment. The film exhibits good gas barrier performance immediately after the production, and maintains the excellent gas barrier performance while exhibiting excellent hot water resistance and printing resistance.

Abstract: The invention relates to aqueous coating compositions for producing primer and/or filler layers in a multi-layer coating, in particular in vehicle coating, comprising the following components: A) at least one water-dilutable epoxy resin, B) at least one polyamine curing agent, C) optionally, at least one water-dilutable polyurethane resin, D) water and E) optionally, pigments, fillers, conventional paint additives and/or organic solvents, wherein the polyamine curing agent B) comprises: B1) 5-95% by weight of at least one amino functional compound with at least two secondary and/or primary amino groups and B2) 95-5% by weight of at least one water-dilutable (meth)acrylic copolymer, wherein the percentages by weight of components B1) and B2) are based on the solids and add up to 100% by weight.

Abstract: An optical article includes a plastic substrate and, formed on a surface thereof, a primer layer and a hard coat layer, wherein the primer layer is formed from a coating composition containing the following components (A) to (C): (A) a polyurethane resin; (B) metal oxide fine particles; and (C) an organosilicon compound, and the hard coat layer is formed from a coating composition containing the following component (D): (D) metal oxide fine particles which do not contain titanium oxide.

Abstract: Disclosed is a gas barrier film exhibiting excellent oxygen and water vapor blocking performance, while having resistance to heat sterilization treatments such as a boiling/retorting treatment. A gas barrier film as a first embodiment of the present invention is characterized by having a structure wherein a deposition layer of an inorganic compound is formed on one side of a base film, a gas barrier layer of a polyepoxy cured product having a skeleton represented by the formula (1) below is formed on the deposition layer, and an overcoat layer made of at least one resin selected from the group consisting of polyepoxy resins, polyester resins and polyacrylic resins is formed on the gas barrier layer.

Abstract: An adhesive film composition for semiconductor assembly includes an elastomer resin, an epoxy resin, a phenolic curing resin, and a silsesquioxane oligomer. The silsesquioxane oligomer may be present in an amount of about 0.01 to about 3 wt. %, based on the total solids content of the composition.

Abstract: A conductive adhesive precursor has polyepoxide, free-radically polymerizable (meth)acrylate, conductive fibers, conductive substantially spherical particles, thixotrope, photoinitiator, and thermal curative. The conductive adhesive precursor can be cured to form a conductive adhesive useful for bonding two substrates together.

Abstract: A polymer film with an optical interference system. The optical interference system comprises at least two layers of different refractive index, which layers comprise nanoscale inorganic particles having organic surface groups that are polymerizable and/or polycondensable. The layers are at least partially crosslinked through the organic surface groups.

Abstract: A coating composition containing an epoxy resin and a curing agent comprising a trimer fatty triamine and/or higher oligomeric amine. The coating composition is particularly suitable for use as a primer coating layer on concrete and steel.

Abstract: An article has a body made of a biodegradable resin. A heat insulating material covers over the surface of the body. A resin adhesive is interposed between the body and the heat insulating material. Heat insulation is achieved with such a simplified structure. Heating process is employed to melt the resin adhesive, for example. The heat insulating material can thus easily be detached from the surface of the body. Since the body is made of a biodegradable resin, the body is easily degraded in soil, for example. No waste is generated. When the body is incinerated for thermal recycle, for example, emission of carbon-dioxide is reduced to half an amount of the case where a petroleum resin is incinerated. This results in less deterioration of the environment.

Abstract: A curable adhesive epoxy resin composition including (a) an epoxy resin; (b) an amphiphilic block copolymer containing at least one epoxy resin miscible block segment and at least one epoxy resin immiscible block segment; wherein the immiscible block segment comprises at least one polyether structure provided that the polyether structure of said immiscible block segment contains at least one or more alkylene oxide monomer units having at least four carbon atoms; in an amount such that when the epoxy resin composition is cured, the bond strength of the resulting cured epoxy adhesive resin composition increases compared to an epoxy resin composition without said amphiphilic polyether block copolymer; and (c) at least one curing agent. The amphiphilic block copolymer is preferably an all polyether block copolymer such as a PEO-PBO diblock copolymer or a PEO-PBO-PEO triblock copolymer.

Abstract: [Problems] To provided an adhesive composition for semiconductor that permits handling without an occurrence of cracking or peeling off even when being flexed, that at the time of laminating, permits laminating on the electrode side of a semiconductor wafer provided with bump electrodes of which bump electrodes have a narrow pitch and a high pin proportion, that at the time of dicing, permits a high-speed cutting without any dicing dust contamination or defect, and that facilitates detection of alignment marks at the time of dicing and flip chip assembly. [Means for Solving Problems] There is provided an adhesive composition for semiconductor comprising an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c), wherein per 100 wt parts of the epoxy compound (b), there are contained 15 to 90 wt parts of the organic-solvent-soluble polyimide (a) and 0.1 to 10 wt parts of the hardening accelerator (c), wherein the epoxy compound (b) contains a compound being liquid at 25° C.

Abstract: An object of the invention is to provide a functionalized polyphenylene ether useful for polymer alloys or electrical or electronic materials such as printed boards or insulating sealants. The invention relates to a functionalized polyphenylene ether having an average of not fewer than 0.1 unit of a structure represented by the following formula (1) per molecular chain: wherein n is an integer of 9 or more, R1 is an organic substituent having an epoxy group, and R2 is a hydrogen atom or an organic substituent having an epoxy group.

Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties).

Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil; and a method of bonding two substrates, including the steps of sandwiching the above adhesive sheet between two substrates, and curing the adhesive sheet. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate.

Abstract: Provided are a non-halogen flame retardant epoxy resin composition comprising (A) a silicon-containing, phosphorus-modified epoxy resin, (B) a multifunctional epoxy resin, (C) a mixed curing agent of an amine curing agent and a phenolic curing agent and (D) a metal hydrate inorganic flame retardant, and a prepreg and copper-clad laminate using the same. The epoxy resin composition in accordance with the present invention exhibits excellent flame retardancy without use of a halogen flame retardant, and also advantageously provides well-balanced various physical properties which are to be required in copper-clad laminates, such as higher heat resistance and copper peel strength, and lead heat-resistant characteristics after moisture absorption.

Abstract: Pressure sensitive adhesive tapes produced by a process where cationic cure is conducted against a paper film substrate and an optional second film substrate, both having low moisture content. The low moisture content is maintained during cationic cure by putting the pressure sensitive adhesive tapes in an environment where moisture ingress is prevented. The maintenance of low moisture during cure provides enhanced SAFT values.

Abstract: An optical article includes a plastic substrate, wherein a primer layer and a hard coat layer are formed on a surface of the plastic substrate, and the primer layer is formed from a coating composition containing the following components (A) to (C): (A) a polyurethane resin; (B) metal oxide fine particles; and (C) an organosilicon compound.

Abstract: Provided herein are a phenolic hydroxyl group-containing aromatic polyamide resin and a resin composition containing the resin, such as an epoxy resin composition containing an epoxy resin. The phenolic hydroxyl group-containing aromatic polyamide resin has a structure represented by the following formula (1): wherein m and n are average values satisfying the following formula: 0.005?n/(m+n)<0.05, m+n is a positive value of 2 to 200, Ar1 is a bivalent aromatic group, Ar2 is a phenolic hydroxyl group-containing bivalent aromatic group, and Ar3 is a bivalent aromatic group. Such a phenolic hydroxyl group-containing aromatic polyamide resin has a low ionic impurity content and improved adhesive properties as well as excellent properties inherent in conventional phenolic hydroxyl group-containing aromatic polyamide resins, such as the ability to allow a cured epoxy resin composition to have excellent flexibility, electrical properties, flame retardancy, and the like.