Abstract: A bonding pad structure for a semiconductor device includes a first lower metal layer beneath a second upper metal layer in a bonding region of the device. The lower metal layer is formed such that the metal of the lower metal layer is absent from the bonding region. As a result, if damage occurs to the structure during procedures such as probing or bonding at the bonding region, the lower metal is not exposed to the environment. Oxidation of the lower metal layer by exposure to the environment is prevented, thus improving reliability of the device.

Abstract: The invention concerns a composite material consisting of intermetallic phases and ceramic, in particular in the form of a coating on metallic substrates, as well as an arc wire spraying process for production of the composite material in which the intermetallic phases and the ceramics to be deposited are newly formed during the deposit process from the components of the supplied wires by chemical reaction. The invention further concerns wear resistant layers formed by the composites, tribologic layers and plating or hard-facing materials.

Abstract: A coated article has a metallic substrate with a substrate composition, and a metallic coating overlying and contacting the metallic substrate. The metallic coating has a metallic-coating composition different from the substrate composition. A protective coating overlies and contacts the metallic coating. The protective coating includes an aluminide layer overlying and contacting the metallic coating, and optionally a thermal barrier coating overlying and contacting the aluminide layer. This structure may be used to restore a key dimension of an article that has previously been in service and to protect the article as well.

Abstract: An Al—Mg—Si based aluminum alloy sheet having undergone normal-temperature aging (or being in a underaged state) after a solution treatment thereof is, before press forming, subjected to a heating treatment (partial reversion heating treatment) in which the alloy sheet is partially heated to a temperature in the range of 150 to 350° C. for a time of not more than 5 minutes so that the difference in strength (difference in 0.2% proof stress) between the heated part and the non-heated part will be not less than 10 MPa. The alloy sheet thus treated is subjected to cold press forming in the condition where the heated part with low strength is put in contact with a wrinkle holding-down appliance of the press and the non-heated part with high strength is put in contact with the shoulder part (radius) of the punch. In the partial reversion heating treatment, the temperature rise rate and the cooling rate in cooling down to 100° C. or below are set to be not less than 30° C./min.

Abstract: A coating process and system for an article having a substrate formed of a metal alloy that is prone to the formation of a secondary reaction zone (SRZ). The coating system includes an aluminum-containing overlay coating and a stabilizing layer between the overlay coating and the substrate. The overlay coating contains aluminum in an amount greater by atomic percent than the metal alloy of the substrate, such that there is a tendency for aluminum to diffuse from the overlay coating into the substrate. The stabilizing layer is predominantly or entirely formed of at least one platinum group metal (PGM), namely, platinum, rhodium, iridium, and/or palladium. The stabilizing layer is sufficient to inhibit diffusion of aluminum from the overlay coating into the substrate so that the substrate remains essentially free of an SRZ that would be deleterious to the mechanical properties of the alloy.

Abstract: The present invention provides a method for manufacturing a clad material and the equipment for manufacturing the clad material, in which the productivity is excellent, the surface state and the flatness of the clad material can be readily controlled and the deterioration in adhesion rarely occurs in the clad material.

Abstract: A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent which includes boron provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5, as an amount of boron measured by fluorescence X-ray analysis, where the amount of boron is defined as a value obtained by an expression: (a peak height of B-K?/a peak height of X-K?) x 100000 and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.

Abstract: The present invention relates to a process for fabricating a composite functional body/substrate, either by melting with an energy beam or by spin coating. The functional material is preferably a piezoelectric material (PVDF). The energy beam is preferably a laser beam.

Abstract: Disclosed is a high strength aluminium alloy brazing sheet, including an Al—Cu core layer and at least one clad layer, the core layer having the following composition (in weight percent): Cu: 1.2-4.0, Mn: 0.06-1.5, Mg: 0.06-1.5, Si: up to 0.5, Zn: ?0.4, Zr: ?0.25, Fe: ?0.5, Ti: ?0.25, Cr: ?0.25; V?0.25; the balance substantially aluminium and impurities, the clad layer including an Al—Si based filler alloy and being applied on at least one side of the core layer. Also disclosed is a brazed assembly including the brazing sheet and the use of the brazing sheet for a brazing application such as a heat exchanger.

Abstract: To provide a method for producing a quasi-crystalline particle dispersed alloy clad material which can be formed into a thick plate or a member for a structure having a specific shape, in particular, a complicated shape while maintaining quasi-crystalline particles, and can be enhanced in strength when used as a member for a structure, in particular, in strength in a high temperature environment. According to the method for producing a quasi-crystalline particle dispersed alloy clad material 1 of the present invention, a quasi-crystalline particle dispersed alloy clad material 1 is produced by forming a quasi-crystalline particle dispersed alloy containing quasi-crystalline particles dispersed in a matrix, onto a base material 2 by a clad layer forming apparatus 100 at a temperature lower than or equal to a decomposition temperature of the quasi-crystalline particles.

Abstract: A coated article is prepared by furnishing a nickel-base article substrate having a free sulfur content of more than 0 but less than about 1 part per million by weight. A protective layer is formed at a surface of the article substrate. The protective layer includes a platinum aluminide diffusion coating. The protective layer may be substantially yttrium-free, or have a controlled amount of yttrium. A ceramic layer may overlie the protective layer.

Abstract: A method for the manufacture of a hard material protective coating on a substrate consisting of a metal or of a electrically conductive ceramic material, e.g. a coated tool for use in a machine tool, or components exposed to high temperature wherein, prior to the deposition of the hard protective material coating, the substrate is pretreated by bombardment with metal ions of at least one rare earth element thereby resulting in implantation of some of said ions into said substrate.

Abstract: The assembly comprises a stack structure made up of the following elements assembled together in pairs by brazing: the titanium-based metal piece (10); a first intermediate piece (11) suitable for deforming to accommodate differential expansion between the metal piece (10) and a piece (20) made of ceramic material based on silicon carbide and/or carbon; a second intermediate piece (12) that is rigid, having a coefficient of expansion close to that of said ceramic material piece (20) and made of aluminum nitride (AlN) or of tungsten (W); and the ceramic material piece (20).

Abstract: An outwardly grown diffusion aluminide bondcoat is formed on a superalloy substrate and has higher concentrations of Al and Pt and lower concentrations of harmful impurities (e.g. Mo, W, Cr, Ta, S, etc.) at an outermost region of the bondcoat than at an innermost region thereof adjacent the substrate. The bondcoat is pretreated prior to deposition of a ceramic thermal insulative layer in a manner that reduces grain boundary ridges on the outermost bondcoat surface without adversely affecting the outermost region thereof, and then is heat treated to thermally grow a stable alpha alumina layer on the bondcoat prior to deposition of a ceramic layer.

Abstract: A component having a platinum-aluminum substrate surface region which is formed in the area of the substrate surface of the component by diffusion of platinum and aluminum into the substrate surface and which contains platinum and aluminum as well as the constituents of the substrate composition. The integrated aluminum content and/or the integrated platinum content in the substrate area is less than 18 wt %.

Abstract: An electronic casing and a method of manufacturing the same are provided. The method includes the following steps. Step (a): a metal laminate and a die of a predetermined shape are provided. The metal laminate comprises a metal top layer and a metal bottom layer that are bonded by interface atom diffusion. Step (b): the metal laminate is processed to form a casing blank by using the die, and the casing blank has at least one turning portion. Step (c): a profiler of a predetermined shape and an electromagnetic forming device are provided. Step (d): the casing blank is attached to the profiler, and the electromagnetic forming device is disposed at a position corresponding to the turning portion. Step (e): the electromagnetic forming device is activated, so that the casing blank has a shape corresponding to the predetermined shape of the profiler.

Abstract: The object is to provide a thin film having high barrier properties and high translucency with no safety and health problems, which is capable of suppressing degradation due to moisture, oxygen and carbon dioxide gas and degradation due to the diffusion of impurities such as alkali metals and alkali earth metals, a deposition apparatus of the thin film, and products coated with the thin film by the deposition apparatus. Another object is to provide an extended usable range of the products of an environmentally friendly biodegradable material and a prolonged quality preservation period. The feature is that a single layer or laminated layer of a layer expressed by AlNxOy or layer expressed by AlxNy is deposited (coated) over the inner surface of a packaging film. The single layer or laminated layer thereof has high translucency, being capable of enhancing the barrier properties against moisture, oxygen and carbon dioxide gas, the heat resisting properties, and the mechanical strength.

Abstract: A brazing product for low temperature fluxless brazing comprises a filler metal-forming composition which melts in the range from about 380-575° C. The filler metal-forming composition comprises zinc optionally in combination with aluminum and/or silicon, and further comprises at least one braze promoter selected from nickel, cobalt, iron and palladium. The filler metal-forming composition may comprise a single layer or may comprise a number of distinct layers. The brazing product may take the form of a brazing preform or a brazing sheet or casting in which the filler metal-forming composition is deposited on a non-consumable substrate. The substrate may preferably comprise aluminum or an aluminum alloy, but may instead be comprised of one or more metals other than aluminum.

Abstract: In a process involving the formation of an insulating film on a substrate for an electronic device, the insulating film is formed on the substrate surface by carrying out two or more steps for regulating the characteristic of the insulating film involved in the process under the same operation principle. The formation of an insulating film having a high level of cleanness can be realized by carrying out treatment such as cleaning, oxidation, nitriding, and a film thickness reduction while avoiding exposure to the air. Further, carrying out various steps regarding the formation of an insulating film under the same operation principle can realize simplification of the form of an apparatus and can form an insulating film having excellent property with a high efficiency.

Abstract: The invented shield components are used for a plasma processing system to adhere deposition materials or process residuals during wafer processing, thus preventing excessive wafer contamination, even when exposed to high temperatures. One embodiment of the invented shields consists of a reaction barrier layer to separate the underlying substrate from the overlying spray coating to prevent solid-state chemical reaction between the substrate and the coating. Another embodiment of the invented shields consists of a substrate and a coating with a substrate-coating combination chosen to allow no new solid-state phase to form at the interface. The invented shields have well-bonded materials interfaces that preserve thermal and mechanical stability under high temperature conditions in a plasma processing system for the containment of deposition contaminates.

Abstract: There is provided an aluminum alloy blank for a lithographic printing plate including iron in a range of 0.20 to 0.80 wt %; and the balance being aluminum, a crystal grain refining element, and unavoidable impurity elements. The unavoidable impurity elements may include silicon and copper, wherein a content of silicon is in a range of 0.02 to 0.30 wt % and a content of copper is equal to or below 0.05 wt %. A solid solution amount of silicon is in a range of 150 ppm to 1500 ppm.

Abstract: A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.

Abstract: Aluminum-plated components of semiconductor material processing apparatuses are disclosed. The components include a substrate and an optional intermediate layer formed on at least one surface of the substrate. The intermediate layer includes at least one surface. An aluminum plating is formed on the substrate, or on the optional intermediate layer. The surface on which the aluminum plating is formed is electrically-conductive. An anodized layer can optionally be formed on the aluminum plating. The aluminum plating or optional the anodized layer comprises a process-exposed surface of the component. Semiconductor material processing apparatuses including one or more aluminum-plated components, methods of processing substrates, and methods of making the aluminum-plated components are also disclosed.

Abstract: A process for increasing the thermal radiation absorbance of objects that are to be melted or softened. An agent is applied to the object, such as an aluminum sow, and the object is placed in a furnace. The furnace exposes the object to thermal radiation, such as by blasting the sow with jets of burning gas, and the material melts. The increase in absorbance on the outer surface of the object reduces the amount of energy needed to melt or soften the material, as thermal energy is absorbed by the object more rapidly than uncoated materials.

Abstract: In a connecting material of the present invention, a Zn series alloy layer is formed on an outermost surface of an Al series alloy layer. In particular, in the connecting material, an Al content of the Al series alloy layer is 99 to 100 wt. % or a Zn content of the Zn series alloy layer is 90 to 100 wt. %. By using this connecting material, the formation of an Al oxide film on the surface of the connecting material at the time of the connection can be suppressed, and preferable wetness that cannot be obtained with the Zn—Al alloy can be obtained. Further, when an Al series alloy layer is left after the connection, since the soft Al functions as a stress buffer material, the high connection reliability can be achieved.

Abstract: Metallic substrates have a surface for receiving application of an adhesive that includes a precipitated coating of metallic nanoparticulates. A first portion of the nanoparticulates is adhered to the surface and a second portion is in contact with the first portion. Also provided are adhered constructs. These constructs include a first substrate with a first surface that has a metallic precipitated coating of nanoparticulates. A first portion of the nanoparticulates is adhered to the surface and a second portion contacts the first portion. The constructs include a second substrate that has a second surface; and an adhesive is applied between the first surface and the second surface.

Abstract: A coating process and system suitable for use on components subjected to high temperatures. The coating system includes an overlay coating of predominantly B2 phase rhodium aluminide (RhAl) intermetallic compound containing about 25 to about 90 atomic percent rhodium, about 10 to about 60 atomic percent aluminum, optionally up to a combined total of about 25 atomic percent of one or more platinum group metals chosen from the group consisting of platinum, palladium, ruthenium, and iridium, and up to about 20 atomic percent of the base metal and alloying constituents of the substrate. The RhAl intermetallic coating may serve as an environmental coating, a diffusion barrier layer for an overlying environmental coating, or both, with or without an outer ceramic coating.

Abstract: A metallic body of carbon steel covered with an adhesive layer capable of adhering to a rubber matrix based on diene elastomer. The carbon content of the steel is between 0.35 and 1.2% by weight. The adhesive layer is formed of a metallic layer bearing aluminum oxides or hydroxides, which itself is covered with an organosilane film which is at least bifunctional, capable of ensuring, as coupling agent, the bond between the aluminum oxides or hydroxides on one hand, and the rubber matrix on the other hand.

Abstract: When an aluminum plate is bonded directly to a ceramic substrate by cooling and solidifying molten aluminum which is injected into a mold so as to contact the ceramic substrate arranged in the mold, an additive, such as a TiB alloy, Ca or Sr, for decreasing the grain size of the aluminum plate to 10 mm or less while preventing the drop in thermal conductivity of the aluminum plate from the thermal conductivity of a pure aluminum plate from exceeding 20% of the thermal conductivity of the pure aluminum plate is added to the molten aluminum. When an aluminum alloy plate of an aluminum-silicon alloy is bonded directly to a ceramic substrate by cooling and solidifying a molten aluminum-silicon alloy which is injected into a mold so as to contact the ceramic substrate arranged in the mold, an aluminum-silicon alloy containing 0.1 to 1.5 wt % of silicon and 0.03 to 0.10 wt % of boron is injected into the mold.

Abstract: The present invention generally discloses the use of a nanostructured non-silicon thin film (such as an alumina or aluminum thin film) on a supporting substrate which is subsequently coated with an active layer of a material such as silicon or tungsten. The base, underlying non-silicon material generates enhanced surface area while the active layer assists in incorporating and transferring energy to one or more analytes adsorbed on the active layer when irradiated with a laser during laser desorption of the analyte(s). The present invention provides substrate surfaces that can be produced by relatively straightforward and inexpensive manufacturing processes and which can be used for a variety of applications such as mass spectrometry, hydrophobic or hydrophilic coatings, medical device applications, electronics, catalysis, protection, data storage, optics, and sensors.

Abstract: Provided is a metal double-layer structure in which a modified metallic member modified from a flat plate metallic member is bonded to be stuck to a plate material, manufacturing method thereof, and a method of regenerating a sputtering target using the method. The method includes the steps of: overlapping the plate material with the metallic member; inserting a rotary tool having a rotor and a probe projecting from a bottom surface of the rotor into a surface of the metallic member while rotated; bringing a distal end of the probe to a position close to a mating plane between the metallic member and the plate material to generate friction heat and stir the distal end, and moving the rotary tool to form adjacent motion tracks on the surface of the metallic member; and forming stirred areas along the mating plane to bond the metallic member and the plate material together, and modifying the metallic member into a modified metallic member.

Abstract: A coating process and system suitable for use on components subjected to high temperatures. The coating system includes an overlay coating of predominantly B2 phase rhodium aluminide (RhAl) intermetallic compound containing about 25 to about 90 atomic percent rhodium, about 10 to about 60 atomic percent aluminum, optionally up to a combined total of about 25 atomic percent of one or more platinum group metals chosen from the group consisting of platinum, palladium, ruthenium, and iridium, and up to about 20 atomic percent of the base metal and alloying constituents of the substrate. The RhAl intermetallic coating may serve as an environmental coating, a diffusion barrier layer for an overlying environmental coating, or both, with or without an outer ceramic coating.

Abstract: An aqueous, acidic zincating composition comprising: zinc cations; fluoride anions; and a carboxylic acid having at least one additional —OH substituent is provided that is useful in a process of making a corrosion resistant article comprising contacting an article having an aluminum surface with the zincating composition and thereafter coating the article with an autodeposition coating.

Abstract: The invention relates to a method that involves (a) removing graphite from at least one surface of a metal graphite composite material; (b) chemically cleaning or plasma etching the surface of the metal graphite composite material; (c) applying a metal-containing material to the surface of the chemically cleaned or plasma etched metal graphite composite material, and thereby forming an intermediate layer; (d) applying a metal coating on the intermediate layer, and thereby forming a composite material. The invention also relates to a composite material comprising (a) a metal graphite composite substrate having at least one surface that is substantially free of graphite; (b) a metal-containing intermediate layer located on a surface of the substrate; and (c) a metal coating on the intermediate layer.

Abstract: The present invention is a process for producing a radiator member for electronic appliances, and is characterized in that, in a process for producing a radiator member for electronic appliances, the radiator member comprising a composite material in which SiC particles are dispersed in a matrix metal whose major component is Al, it comprises a filling step of filling an SiC powder into a mold, a pre-heating step of pre-heating the mold after the filling step to a pre-heating temperature which falls in a range of from a melting point or more of said matrix metal to less than a reaction initiation temperature at which a molten metal of the matrix metal and SiC particles in the SiC powder start to react, and a pouring step of pouring the molten matrix metal whose molten-metal temperature falls in a range of from the melting point or more of the matrix metal to less than the reaction initiation temperature, into the mold after the pre-heating step, and impregnating the SiC powder with the molten metal by pressur

Abstract: A method of bonding dissimilar metals, a bonding structure formed by such a method and a bonding apparatus for performing such a method. The resulting bond is capable of preventing corrosion (e.g., electric corrosion) resulting from contact of the dissimilar metals and obtains a dissimilar material joint exhibiting anti-corrosive property and bonding strength at low costs. The method includes overlapping two materials made from dissimilar metals having a seal material interposed therebetween and discharging the seal material from a bonding interface and bonding the two materials in direct contact with each other.

Abstract: The invention relates to an alloy consisting of at least three components A, B, C, which form at least a first matrix and a soft phase dispersed therein, with a first surface (5) and a second surface (9) lying opposite it, the proportions of components A, B, C in the alloy being different from one another in the regions of the first (5) and the second surface (8). At least one of the components forms a hard phase and at least one of the other components forms another matrix different from the first matrix, the first matrix being disposed at least in the region of the first surface (5) and the other matrix being disposed at least in the region of the second surface (8), whilst the hard phase is dispersed through both the first and the other matrix.

Abstract: A gas turbine part comprises a superalloy metal substrate, a bonding underlayer formed on the substrate and comprising an intermetallic compound of aluminum, nickel, and platinum, and a ceramic outer layer anchored on the alumina film formed on the bonding underlayer. The bonding underlayer essentially comprises an Ni—Pt—Al ternary system constituted by an aluminum-enriched ?-NiPt type structure, in particular an Ni—Pt—Al ternary system having a composition NizPtyAlx in which z, y, and x are such that 0.05?z?0.40, 0.30?y?0.60, and 0.15?x?0.40.

Abstract: There are provided a process for the production of an entry sheet for drilling, comprising preparing a water-soluble resin composition solution by using a mixed solvent containing water and isopropyl alcohol in a specific ratio as a solvent of a water-soluble resin composition, then applying the solution to a sheet-like base material and drying the resultant base material to form a resin layer on the base material, and a method of drilling a printed wiring board material using the above entry sheet. According to the present invention, the problems of remaining bubbles in the resin layer and a decrease in surface flatness and smoothness due to the occurrence of a ridge, which are caused because the melting point of the water-soluble resin is lower than the boiling point of water, are overcome, and an entry sheet for drilling excellent in hole position accuracy is provided.

Abstract: To provide an aluminium composite structure having a highly airtight channel therein, including: a core material having a concave groove on a surface; a covering material made up of aluminium or aluminium alloy which covers the surface of the core material other than an inner surface of the concave groove; and a lid which is firmly fixed to the covering material to close an opening of the concave groove of the core material, forms a channel for running a heat exchange medium therein, and is made up of the aluminium or aluminium alloy, and a method of manufacturing the same.

Abstract: The invention relates to a brazing sheet product comprising a core sheet, a clad layer on said core sheet made of an aluminum alloy containing silicon in an amount in the range of 4 to 14% by weight, an optional layer comprising nickel on the outersurface of said clad layer, and a diffusion layer comprising nickel-tin alloy on the outer surface of said nickel layer. The invention further relates to a method of manufacturing such a brazing product comprising the process step of plating different metal layers and subjecting the plated brazing product to an annealing treatment by holding the plated brazing product at a temperature in the range of 100 to 500° C. for a period of 1 sec. to 300 minutes to form a diffusion layer comprising nickel-tin alloy on the outer surface of said layer comprising nickel.

Abstract: A laminated sheeting and method for making the sheeting. The sheeting is a metal composite sheeting with a single metal sheet. The sheeting is relatively lightweight and inexpensive and can manufactured rapidly in a continuous process. The sheeting is especially designed for use in applications requiring lightweight materials such as finish for vehicles, trailers, caravans, and buildings.

Abstract: An insulating substrate board for a semiconductor of the present invention comprises a ceramic substrate board (2) and a metal alloy layer (3) consisting of aluminum formed on one surface portion of the ceramic substrate board (2), wherein the Vickers hardness of the metal alloy layer (3) is not less than 25 and not more than 40. The metal alloy layer (3) includes silicon of not less than 0.2% by weight and not more than 5% by weight. The ceramic substrate board (2) is made of a material selected from a group consisting of alumina. aluminum nitride, and silicon nitride.

Abstract: A method of depositing a bond coating to a surface of an article includes the steps of depositing an inner layer of the bond coating consisting of ?-NiAl comprising Fe, Ga, Mo, B, Hf or Zr or ?/?-MCrAlY comprising Fe, Ga, Mo, B, Hf or Zr or ?/??- or ?-MCrAlY, and depositing an outer layer of the bond coating, which is more coarse the in the inner layer, consisting of ?-NiAl comprising Fe, Ga, Mo, B, Hf or Zr or ?/?-MCrAlY comprising Fe, Ga, Mo, B, Hf or Zr or ?/??- or ?-MCrAlY, wherein said elements Fe, Ga, Mo, B, Hf or Zr above mentioned are present individually or in combination. The coating also includes a noble metal selected from the group consisting of platinum, palladium and rhodium in the inner and outer layer or as a separate layer.

Abstract: When an aluminum plate is bonded directly to a ceramic substrate by cooling and solidifying molten aluminum which is injected into a mold so as to contact the ceramic substrate arranged in the mold, an additive, such as a TiB alloy, Ca or Sr, for decreasing the grain size of the aluminum plate to 10 mm or less while preventing the drop in thermal conductivity of the aluminum plate from the thermal conductivity of a pure aluminum plate from exceeding 20% of the thermal conductivity of the pure aluminum plate is added to the molten aluminum. When an aluminum alloy plate of an aluminum-silicon alloy is bonded directly to a ceramic substrate by cooling and solidifying a molten aluminum-silicon alloy which is injected into a mold so as to contact the ceramic substrate arranged in the mold, an aluminum-silicon alloy containing 0.1 to 1.5 wt % of silicon and 0.03 to 0.10 wt % of boron is injected into the mold.

Abstract: An intermetallic composition suitable for use as an environmentally-protective coating on surfaces of components used in hostile thermal environments, including the turbine, combustor and augmentor sections of a gas turbine engine. The coating contains the gamma-prime (Ni3Al) nickel aluminide intermetallic phase and either the beta (NiAl) nickel aluminide intermetallic phase or the gamma solid solution phase. The coating has an average aluminum content of 14 to 30 atomic percent and an average platinum-group metal content of at least 1 to less than 10 atomic percent, the balance of the coating being nickel, incidental impurities, and optionally hafnium.

Abstract: An intermetallic composition suitable for use as an environmentally-protective coating on surfaces of components used in hostile thermal environments, including the turbine, combustor and augmentor sections of a gas turbine engine. The coating contains the gamma-prime (Ni3Al) nickel aluminide intermetallic phase and either the beta (NiAl) nickel aluminide intermetallic phase or the gamma solid solution phase. The coating has an average aluminum content of 14 to 30 atomic percent and an average platinum-group metal content of at least 1 to less than 10 atomic percent, the balance of the coating being nickel, one or more of chromium, silicon, tantalum, and cobalt, optionally one or more of hafnium, yttrium, zirconium, lanthanum, and cerium, and incidental impurities.

Abstract: There are provided sandwich type composite materials comprising a first layer comprising aluminium, titanium, or steel; a foamable core layer comprising aluminium and a foaming agent; and a second layer comprising aluminium, titanium, or steel. The first and second layers can be the same or different. There are also provided processes for preparing such composite materials.

Abstract: Performance and reliability of microelectromechanical system (MEMS) components enhanced dramatically through the incorporation of protective thin film coatings. Current-generation MEMS devices prepared by the LIGA technique employ transition metals such as Ni, Cu, Fe, or alloys thereof, and hence lack stability in oxidizing, corrosive, and/or high temperature environments. Fabrication of a superhard, self-lubricating coating based on a ternary boride compound AlMgB14 is described in this letter as a potential breakthrough in protective coating technology for LIGA microdevices. Nanoindentation tests show that hardness of AlMgB14 films prepared by pulsed laser deposition ranges from 45 GPa to 51 GPa, when deposited at room temperature and 573 K, respectively. Extremely low friction coefficients of 0.04-0.05, which are thought to result from a self-lubricating effect, have also been confirmed by nanoscratch tests on the AlMgB14 films.

Abstract: A hillock-free conductive layer comprising at least two aluminum (Al) layers formed on a substrate, wherein said at least two Al layers comprise a barrier Al layer formed on the substrate, and a pure Al layer formed on the barrier Al layer. The barrier Al layer could be an aluminum nitride (AlNx) layer, an aluminum oxide (AlOx) layer, an aluminum oxide-nitride (AlOxNy) layer, or an Al—Nd alloy layer. Also, the pure Al layer is physically thicker than the barrier Al layer, for effectively inhibiting the occurrence of hillocks and the like.