Cu-base Component Patents (Class 428/674)
  • Patent number: 10480049
    Abstract: A copper alloy having the following composition (in % by weight): from 10.6 to 18% of Al, from 10.5 to 14.5% of Ni, optionally up to 2% of Fe, optionally up to 1% of Co, optionally up to 0.5% of Ti, optionally up to 0.5% of Mn, optionally up to 0.15% of B, optionally up to 0.1% of Ca, and optionally up to 0.1% of C, with the balance being copper and unavoidable impurities. Nickel aluminides of the NiAl type are embedded as precipitates in the microstructure of the alloy.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: November 19, 2019
    Assignee: WIELAND-WERKE AG
    Inventors: Igor Altenberger, Hans-Achim Kuhn
  • Patent number: 10087552
    Abstract: An objective of the present invention is to provide a copper substrate for epitaxial growth, which has higher biaxial crystal orientation, and a method for manufacturing the same. The substrate for epitaxial growth of the present invention contains a biaxially crystal-oriented copper layer, wherein the full width at half maximum ?? of a peak based on the pole figure of the copper layer is within 5° and the tail width ?? of the peak based on the pole figure is within 15° Such a substrate for epitaxial growth is manufactured by a 1st step of performing heat treatment of a copper layer so that ?? is within 6° and the tail width ?? is within 25°, and after the 1st step, a 2nd step of performing heat treatment of the copper layer at a temperature higher than the temperature for heat treatment in the 1st step, so that ?? is within 5° and the tail width ?? is within 15°.
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: October 2, 2018
    Assignees: Toyo Kohan Co., Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Takashi Koshiro, Hironao Okayama, Teppei Kurokawa, Kouji Nanbu
  • Patent number: 9356412
    Abstract: A female terminal includes a box portion which is formed into a quadrangular prism-like shape so as for a tab of a male terminal to fit therein by bending a copper alloy plate which is obtained by being continuously and repeatedly bent before an age heat treatment is applied thereto, which has a proof stress of 700 MPa or larger and a width of 10 mm or larger and in which no crack is produced therein when bent 180 degrees about a bending axis which is at right angle to a rolling direction of the copper alloy plate. The box portion comprises notches which are formed in inner sides of bent portions produced by bending the copper alloy plate. A depth of the notch is set to be in the range from ¼ to ½ of a thickness of the copper alloy plate.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: May 31, 2016
    Assignees: YAZAKI CORPORATION, DOWA METALTECH CO., LTD.
    Inventors: Atsushi Kubodera, Hisashi Suda
  • Patent number: 9230998
    Abstract: A thin film transistor substrate and a liquid crystal display device are disclosed. The thin film transistor substrate comprises gate lines arranged on a substrate in a first direction and sub gate lines connected with the gate lines; data lines arranged on the substrate in a second direction to define a pixel including a first pixel and a second pixel, together with the gate lines; a semiconductor layer formed overlapping with each of the gate lines, the sub gate lines and the data lines and connected with the date lines; and a pixel electrode connected with the semiconductor layer. An aperture ratio may be improved at high resolution.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: January 5, 2016
    Assignee: LG Display Co., Ltd.
    Inventors: Hun Jang, Sul Lee
  • Patent number: 9023485
    Abstract: The invention relates to an electro-optical or electromechanical structural component, in particular, an LED, connector or stamped grid, or sliding element, made of a rolled metal substrate of a metal strip, or a sheet produced therefrom, made of Cu or a Cu alloy strip, Al or an Al alloy strip, Fe or a Fe alloy strip, Ti or a Ti alloy strip, Ni or a Ni alloy strip or a stainless steel strip, which has a specially structured surface. The structure of the surface allows joining using optical methods, even in the case of highly reflective surface coatings, and simultaneously improves the functional properties of the components used.
    Type: Grant
    Filed: February 8, 2011
    Date of Patent: May 5, 2015
    Assignee: Wieland-Werke AG
    Inventors: Isabell Buresch, Dieter Stock, Thorsten Weireter
  • Patent number: 9018605
    Abstract: A nuclear fusion reactor first wall component includes a copper alloy element, an intermediate metal layer made from niobium and a beryllium element, directly in contact with the intermediate metal layer. The intermediate niobium layer is further advantageously associated with a mechanical stress-reducing layer formed by a metal chosen from copper and nickel. This mechanical stress-reducing layer is in particular arranged between the intermediate niobium layer and the copper alloy element. Furthermore, when the mechanical stress-reducing layer is made from pure copper, a layer of pure nickel can be inserted between the niobium and the pure copper before diffusion welding. Such a component presents the advantage of having an improved thermal fatigue behavior while at the same time preventing the formation of intermetallic compounds at the junction between the beryllium and the copper alloy.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: April 28, 2015
    Assignee: Commissariat a l'Energie Atomique et aux Energies Alternatives
    Inventors: Pierre-Eric Frayssines, Philippe Bucci, Jean-Marc Leibold, Emmanuel Rigal
  • Patent number: 8993064
    Abstract: Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of 10 nm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: March 31, 2015
    Assignees: Toyo Kohan Co., Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Hironao Okayama, Kouji Nanbu, Akira Kaneko, Hajime Ota, Kotaro Ohki, Takashi Yamaguchi, Kazuhiko Hayashi, Kazuya Ohmatsu
  • Publication number: 20150064496
    Abstract: The present invention relates to a single crystal copper having [100] orientation and a volume of 0.1˜4.0×106 ?m3. The present invention further provides a manufacturing method for the single crystal copper and a substrate comprising the same.
    Type: Application
    Filed: August 28, 2014
    Publication date: March 5, 2015
    Inventors: Chih CHEN, King-Ning TU, Chia-Ling LU
  • Publication number: 20150047884
    Abstract: Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 ?m, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil.
    Type: Application
    Filed: March 26, 2013
    Publication date: February 19, 2015
    Inventors: Tomota Nagaura, Michiya Kohiki, Terumasa Moriyama
  • Patent number: 8956735
    Abstract: A mating-type connecting part can be obtained by stamping and surface-roughening a copper sheet into a predetermined shape with depressions as a plurality of parallel lines. The copper sheet then has a roughness of from 0.5 ?m to 4.0 ?m parallel to a sliding direction upon connection, a mean projection-depression interval of from 0.01 mm to 0.3 mm in that direction, a skewness less than 0, and a protrusion peak portion height of 1 ?m or less. The copper sheet is then plated with Cu and Sn, followed by reflowing. The result is a connecting part having a Sn surface coating layer group as a plurality of parallel lines, and a Cu-Sn alloy coating layer adjacent to each side of each Sn surface coating layer.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: February 17, 2015
    Assignees: Kabushiki Kaisha Kobe Seiko Sho, Shinko Leadmikk Co., Ltd.
    Inventors: Yasushi Masago, Koichi Taira, Toshiyuki Mitsui, Junichi Kakumoto
  • Publication number: 20150030878
    Abstract: The present application provides an ultrathin shielding film of high shielding effectiveness, comprising two or more solid shielding layers. An electrically-conductive adhesive layer is coated onto the outer surface at one side of the solid shielding layers, and one or more insulation film layers are formed on the outer surface at the other side of the solid shielding layers. A carrier film layer is provided on the outer surface of the insulation film layers. A protective film covers the lower surface of the electrically-conductive adhesive layer. The present application further discloses a manufacturing method of an ultrathin shielding film of high shielding effectiveness.
    Type: Application
    Filed: September 28, 2012
    Publication date: January 29, 2015
    Applicant: GUANGZHOU FANG BANG ELECTRONICS CO., LTD.
    Inventor: Su Zhi
  • Patent number: 8940405
    Abstract: A copper sheet is adjusted to have arithmetic mean roughness Ra of from 0.5 ?m to 4.0 ?m in a direction parallel to a sliding direction upon connection, mean projection-depression interval of from 0.01 mm to 0.3 mm in the direction, skewness of less than 0, and protrusion peak portion height of 1 ?m or less. A Sn surface coating layer group X as a plurality of parallel lines is included, and a Cu—Sn alloy coating layer is adjacent to each side of each Sn coating layer. Maximum height roughness is 10 ?m or less in a direction of part insertion. The sheet is surface-roughened by pressing when stamped, thereby forming depressions as a plurality of parallel lines in its surface. The sheet is then plated with Cu and Sn, followed by reflowing.
    Type: Grant
    Filed: August 9, 2013
    Date of Patent: January 27, 2015
    Assignees: Kobe Steel, Ltd., Shinko Leadmikk Co., Ltd.
    Inventors: Yasushi Masago, Koichi Taira, Toshiyuki Mitsui, Junichi Kakumoto
  • Patent number: 8912126
    Abstract: A substrate of the present invention includes a copper layer, an alloy layer containing copper and nickel, formed on the copper layer, a nickel layer formed on the alloy layer, and an intermediate layer formed on the nickel layer. The concentration of nickel in the alloy layer at the interface between the alloy layer and the nickel layer is greater than the concentration of nickel in the alloy layer at the interface between the alloy layer and the copper layer. According to the present invention, there can be provided a substrate that allows the AC loss of a superconducting wire to be reduced, a method of producing a substrate, a superconducting wire, and a method of producing a superconducting wire.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: December 16, 2014
    Assignees: Sumitomo Electric Industries, Ltd., Toyo Kohan Co., Ltd.
    Inventors: Takashi Yamaguchi, Masaya Konishi, Hajime Ota
  • Publication number: 20140315392
    Abstract: A cold spray barrier coated component of a semiconductor plasma processing chamber comprises a substrate having at least one metal surface wherein a portion of the metal surface is configured to form an electrical contact. A cold spray barrier coating is formed from a thermally and electrically conductive material on at least the metal surface configured to form the electrical contact of the substrate. Further, the cold spray barrier coating may also be located on a plasma exposed and/or process gas exposed surface of the component.
    Type: Application
    Filed: April 22, 2013
    Publication date: October 23, 2014
    Applicant: Lam Research Corporation
    Inventors: Lin Xu, Hong Shih, Anthony Amadio, Rajinder Dhindsa, John Michael Kerns, John Daugherty
  • Patent number: 8853587
    Abstract: A wire electrode for cutting by electrical discharge machining may include a core and a covering. The core may include a metal or a metal alloy. The covering may surround the core and may include one or more covering layers, of which at least one contains a mixture of phases including at least one of ? or ?? brass and including ? brass. In the at least one covering layer that contains the mixture, the phases are present next to one another in a fine-grained microstructure having a mean grain size of 5 ?m or less in section perpendicular to the longitudinal axis of the wire electrode.
    Type: Grant
    Filed: November 26, 2009
    Date of Patent: October 7, 2014
    Assignee: Berkenhoff GmbH
    Inventors: Ingo Baumann, Tobias Nöthe
  • Patent number: 8822038
    Abstract: An coated article includes a substrate; and a coating deposited on the substrate, wherein the coating is a titanium layer mixed with a first element and a second element, M is at least one element selected from a group consisting of iron, cobalt, nickel, copper, niobium, hafnium and tantalum; R is at least one element selected from a group consisting of scandium, yttrium and lanthanide.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: September 2, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Shun-Mao Lin
  • Patent number: 8808873
    Abstract: In an embodiment of the invention, a method for manufacturing a carrier-attached copper foil is provided. The method includes providing a carrier foil including stainless steel, titanium, aluminum, nickel or alloy thereof with a surface oxide layer, and forming a copper foil onto the carrier foil to prepare the carrier-attached copper foil.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: August 19, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Chung Chen, Yi-Ling Lo, Hung-Kun Lee, Tzu-Ping Cheng
  • Patent number: 8801971
    Abstract: Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing.
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: August 12, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Youichi Machii, Shunya Yokozawa, Yoshinori Ejiri, Katsuyuki Masuda
  • Publication number: 20140141274
    Abstract: A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance.
    Type: Application
    Filed: September 17, 2013
    Publication date: May 22, 2014
    Applicant: Nan Ya Plastics Corporation
    Inventors: MING-JEN TZOU, KUO-CHAO CHEN, YA-MEI LIN
  • Patent number: 8722199
    Abstract: It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super low profile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: May 13, 2014
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Mitsuyoshi Matsuda, Hisao Sakai, Sakiko Tomonaga, Makoto Dobashi
  • Patent number: 8715836
    Abstract: It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 ?m to 0.7 ?m, the maximum peak to valley height (PV) to be 0.05 to 1.5 ?m, and the surface roughness (Rzjis) to be 0.1 ?m to 1.0 ?m.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: May 6, 2014
    Assignee: Mitsui Mining & Smelting Co., Ltd
    Inventors: Makoto Dobashi, Mitsuyoshi Matsuda, Sakiko Tomonaga, Hisao Sakai, Tomohiro Sakata, Junshi Yoshioka, Jo Nishikawa, Takeo Taguchi
  • Patent number: 8703308
    Abstract: According to one embodiment, a magnetic recording medium includes a substrate, a soft magnetic layer, a multilayered underlayer formed on the soft magnetic layer, and a continuous film type magnetic recording layer formed on the multilayered underlayer. The multilayered underlayer includes a first underlayer made of copper and containing crystal grains having a (100)-oriented, face-centered cubic lattice structure, a second underlayer formed on the first underlayer and made of copper and nitrogen, and a third underlayer formed into islands on the second underlayer. The continuous film type magnetic recording layer contains at least one element selected from Fe and Co and at least one element selected from Pt and Pd, has the L10 structure, and mainly contains (001)-oriented magnetic crystal grains.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: April 22, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Tomoyuki Maeda
  • Patent number: 8691395
    Abstract: A composite material for brazing having features of: forming a homogenous distribution of components in the brazing filler material even after brazing; having an excellent workability; offering low manufacturing costs; and having satisfactory corrosion resistivity as desired. The composite material for brazing has a lamination of a brazing filler material layer thereon, wherein the brazing filler material layer is a layer of alloy that includes copper, aluminum, and nickel.
    Type: Grant
    Filed: January 21, 2009
    Date of Patent: April 8, 2014
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hideyuki Sagawa, Kazuma Kuroki, Hiromitsu Kuroda
  • Publication number: 20140048587
    Abstract: Disclosed is a brazing alloy composition. The composition comprises, by weight, about 94% copper, about 4% zinc, and about 2% iron. Further disclosed is a brazing process utilizing the brazing alloy, a method for the brazing alloy's preparation and a work piece having members joined by the brazing alloy providing stronger bonding as demonstrated by braze joints having increased shear strength.
    Type: Application
    Filed: February 7, 2013
    Publication date: February 20, 2014
    Inventors: Paul Rivest, Robert Biersteker, Joseph Sarazin
  • Publication number: 20130319723
    Abstract: A conductive composite wire includes at least one external jacket made of copper, a first tube including a first metallic material (M1) contacting and located inside the copper jacket; a second tube including a second metallic material (M2) contacting and located inside the first tube; and a fiber including a third metallic material (M3) contacting and located inside the second tube. The copper and the first metallic material are immiscible with each other, the first and second metallic materials are immiscible with each other, and the second and third metallic materials are immiscible with each other. A copper-based coaxial microstructure includes a copper sheath containing an array of nanotubes and nanofibers according to a process for manufacturing the microstructure.
    Type: Application
    Filed: December 9, 2011
    Publication date: December 5, 2013
    Applicants: UNIVERSITE DE POITIERS, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
    Inventors: Ludovic Thilly, Florence Lecouturier, Jean-Baptiste Dubois, Nelson Ferreira, Pierre-Olivier Renault, Patrick Olier
  • Publication number: 20130323532
    Abstract: A copper-based material includes a base comprising copper and a surface treatment layer disposed on a surface of the base, the surface treatment layer including an amorphous layer containing a metal element that has a greater affinity for oxygen than for copper, oxygen, and, optionally, copper diffused from the base.
    Type: Application
    Filed: May 29, 2013
    Publication date: December 5, 2013
    Inventors: Hideyuki SAGAWA, Seigi Aoyama, Toru Sumi, Keisuke Fujito, Hiromitsu Kuroda
  • Patent number: 8590768
    Abstract: Copper metal or metal alloy workpieces and/or aluminum metal or metal alloy workpieces are joined in a solid state weld by use of a reactive material placed, in a suitable form, at the joining surfaces. Joining surfaces of the workpieces are pressed against the interposed reactive material and heated. The reactive material alloys or reacts with the workpiece surfaces consuming some of the surface material in forming a liquid-containing reaction product comprising a low melting liquid that removes oxide films and other surface impediments to a welded bond across the interface. Further pressure is applied to expel the reaction product and to join the workpiece surfaces in a solid state weld bond.
    Type: Grant
    Filed: June 14, 2010
    Date of Patent: November 26, 2013
    Assignee: GM Global Technology Operations LLC
    Inventors: David R. Sigler, James G. Schroth
  • Publication number: 20130302646
    Abstract: An electric connecting structure comprising preferred oriented Cu6Sn5 grains and a method for fabricating the same are disclosed. The method of the present invention comprises steps: (A) providing a first substrate; (B) forming a first nano-twinned copper layer on part of a surface of the first substrate; (C) using a solder to connect the first substrate with a second substrate having a second electrical pad, in which the second electrical pad comprises a second nano-twinned copper layer, and the solder locates between the first nano-twinned copper layer and the second nano-twinned copper layer; and (D) reflowing at the temperature of 200° C. to 300° C. to transform at least part of the solder into an intermetallic compound (IMC) layer, in which the IMC layer comprises plural Cu6Sn5 grains with a preferred orientation; wherein at least 50% in volume of the first and second nano-twinned copper layer comprises plural grains.
    Type: Application
    Filed: March 14, 2013
    Publication date: November 14, 2013
    Applicant: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Chih CHEN, Han-Wen LIN
  • Publication number: 20130294896
    Abstract: A method of increasing wear resistance of one or more part(s) of a rotating mechanism includes manufacturing the one or more part(s) with a portion thereof configured to be exposed to wear during fluid flow associated with the rotating mechanism having a dimension different from that of a desired dimension, applying a protective coating of an aluminum bronze alloy to the portion through welding deposition, and mechanically treating the protective coating. The method also includes applying one or more layer(s) of solid-alloy over the protective coating through electro-erosion deposition, and continuing the mechanical treatment of the protective coating and/or the one or more layer(s) of solid-alloy after the solid-alloy deposition to obtain the desired dimension of the portion.
    Type: Application
    Filed: May 2, 2012
    Publication date: November 7, 2013
    Inventors: VLADIMIR PETROVICH SELKIN, Sergei Vasilvevich Sosnovsky, Turki Saud Mohammed Al-Saud, Mohammed A. Binhussain, Vladimir Enokovich Agabekov
  • Patent number: 8568899
    Abstract: Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer comprises three layers to one layer of the copper layer or copper alloy layer, and there is a concentrated portion of impurities at the boundary of the copper layer or copper alloy layer when the copper layer or copper alloy layer is three layers to two layers, and there is no concentrated portion of impurities when the copper layer or copper alloy layer is a single layer. Additionally provided are a method of producing the composite and a method of producing an electronic circuit board.
    Type: Grant
    Filed: September 16, 2008
    Date of Patent: October 29, 2013
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Michiya Kohiki, Naonori Michishita, Nobuhito Makino
  • Patent number: 8557392
    Abstract: In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni—Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni—Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm2 or more to provide a flexible copper clad laminate.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: October 15, 2013
    Assignees: Furukawa Electric Co., Ltd., Nippon Steel & Sumikin Chemical Co., Ltd.
    Inventors: Satoshi Fujisawa, Yuji Suzuki, Takeo Uno, Koichi Hattori, Naoya Kuwasaki
  • Patent number: 8545998
    Abstract: Embodiments of the current invention describe a method of plating platinum selectively on a copper film using a self-initiated electroless process. In particular, platinum films are plated onto very thin copper films having a thickness of less than 300 angstroms. The electroless plating solution and the resulting structure are also described. This process has applications in the semiconductor processing of logic devices, memory devices, and photovoltaic devices.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: October 1, 2013
    Assignee: Intermolecular, Inc.
    Inventors: Bob Kong, Igor Ivanov, Zhi-Wen Sun, Jinhong Tong
  • Publication number: 20130236742
    Abstract: White bronze is electroplated from a cyanide-free tin/copper bath onto a void inhibiting layer coating a copper underlayer. The void inhibiting metal layer includes one or more void inhibiting metals.
    Type: Application
    Filed: August 30, 2012
    Publication date: September 12, 2013
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Katharina WEITERSHAUS, Wan ZHANG-BEGLINGER, Jonas GUEBEY
  • Patent number: 8518554
    Abstract: A ceramic-metal composite includes a ceramic substrate, an active metal brazing alloy layer, and a metal plate bonded to the ceramic substrate through the active metal brazing alloy layer disposed therebetween. The active metal brazing alloy layer contains a transition metal that is at least one element selected from Group-8 elements specified in the periodic table. According to the above configuration, the following composite and device can be provided: the ceramic-metal composite that exhibits high bonding strength, heat cycle resistance, durability, and reliability even if the ceramic-metal composite is used in a power module and a semiconductor device including the ceramic-metal composite.
    Type: Grant
    Filed: July 3, 2007
    Date of Patent: August 27, 2013
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Materials Co., Ltd.
    Inventors: Takayuki Naba, Michiyasu Komatsu, Noritaka Nakayama, Hiromasa Kato
  • Publication number: 20130195580
    Abstract: A fastening mechanism includes a basic body made from a base metal, onto which at least one corrosion-resistant layer is applied. A further layer is applied at least partially onto the at least one corrosion-resistant layer. The further layer has a lower coefficient of friction than the at least one corrosion-resistant layer.
    Type: Application
    Filed: January 12, 2011
    Publication date: August 1, 2013
    Applicant: Robert Bosch GmbH
    Inventors: Harald Kast, Juergen Reiner
  • Patent number: 8470450
    Abstract: Provided is a method of producing a two-layered copper-clad laminate with improved folding endurance, wherein the two-layered copper-clad laminate retains folding endurance of 150 times or more measured with a folding endurance test based on JIS C6471 by subjecting the laminate in which a copper layer is formed on a polyimide film through sputtering and plate processing to heat treatment at a temperature of 100° C. or more but not exceeding 175° C. Specifically, provided are a method of producing a two-layered copper-clad laminate (two-layered CCL material) in which a copper layer is formed on a polyimide film through sputtering and plate processing, wherein the rupture of the outer lead part of a circuit can be prevented due to the improvement in folding endurance; and a two-layered copper-clad laminate obtained from the foregoing method.
    Type: Grant
    Filed: December 15, 2008
    Date of Patent: June 25, 2013
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Mikio Hanafusa
  • Publication number: 20130143071
    Abstract: The invention relates to a process for treating a metallic surface of an object with an aqueous copper-plating solution, with which a first copper-plating solution, which is free of cyanide and free of strong reducing agent, is electrolessly applied to clean metallic surfaces of the object, or after pretreatment to cleaned metallic surfaces, to form a first copper layer or copper alloy layer as a barrier layer and/or as a conductive layer, and also to the use of the objects produced by the process according to the invention.
    Type: Application
    Filed: August 10, 2011
    Publication date: June 6, 2013
    Applicant: CHEMETALL GMBH
    Inventor: Michael Kleinle
  • Patent number: 8449987
    Abstract: Provided is a rolled copper or copper alloy foil having a roughened surface formed of fine copper particles, obtained by subjecting a rolled copper or copper alloy foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of a temperature of 20 to 50° C. and a current density of 10 to 100 A/dm2. The provided rolled copper or copper alloy foil subject to roughening is reduced in craters which are obvious defects unique to rolled copper or copper alloy foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and also suits for use in producing a flexible printed wiring board capable of bearing a fine wiring pattern.
    Type: Grant
    Filed: June 11, 2007
    Date of Patent: May 28, 2013
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Yousuke Kobayashi, Atsushi Miki, Keisuke Yamanishi
  • Publication number: 20130130059
    Abstract: A coating is provided to a conductor, and has a layered structure of a palladium layer. The palladium layer has a crystal plane whose orientation rate is 65% or more.
    Type: Application
    Filed: November 15, 2012
    Publication date: May 23, 2013
    Applicant: TDK CORPORATION
    Inventor: TDK CORPORATION
  • Patent number: 8445807
    Abstract: A wire material having a copper-zinc alloy layer, which is formed by action of thermal diffusion, and a zinc layer on its circumference surface is subjected to processes, including from a step of drawing the wire material to a step of reducing the diameter of the product, to reliably crash the copper-zinc alloy layer into particles. The particles are embedded in the circumference surface of a core to integrate the diffusion alloy layer and zinc layer with the core and prevent the diffusion alloy layer and zinc layer from falling off from the core. In addition, in order to cover cracks formed in the copper-zinc alloy layer during wire drawing with a zinc thin film, wire drawing is performed at temperatures appropriate for maintaining good malleability and ductility of zinc.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: May 21, 2013
    Assignee: Oki Electric Cable Co,. Ltd.
    Inventors: Koichi Hashizume, Masakazu Yoshimoto, Nobuyuki Washio, Yoichiro Kimoto, Hiroshi Sato, Isao Izui
  • Publication number: 20130118775
    Abstract: The present invention relates to a method of forming copper nanowires with a metallic coating. In a preferred embodiment, the metallic coating is copper. Due to the metal coating, the nanowires become magnetically guidable and chemically stable. As such, the nanowires can be used to form nanomesh. Further, the nanowire and nanomesh of the present invention can be used as transparent electrodes that are used in TV, PC, touch-control, and solar industries.
    Type: Application
    Filed: July 19, 2011
    Publication date: May 16, 2013
    Applicant: NATIONAL UNIVERSITY OF SINGAPORE
    Inventors: Hua Chun Zeng, Shengmao Zhang, Yu Chang, Mei Ling Lye
  • Publication number: 20130122326
    Abstract: An electrodeposited nano-twins copper layer, a method of fabricating the same, and a substrate comprising the same are disclosed. According to the present invention, at least 50% in volume of the electrodeposited nano-twins copper layer comprises plural grains adjacent to each other, wherein the said grains are made of stacked twins, the angle of the stacking directions of the nano-twins between one grain and the neighboring grain is between 0 to 20 degrees. The electrodeposited nano-twins copper layer of the present invention is highly reliable with excellent electro-migration resistance, hardness, and Young's modulus. Its manufacturing method is also fully compatible to semiconductor process.
    Type: Application
    Filed: November 16, 2012
    Publication date: May 16, 2013
    Applicant: NATIONAL CHIAO TUNG UNIVERSITY
    Inventor: NATIONAL CHIAO TUNG UNIVERSITY
  • Patent number: 8431237
    Abstract: A method of forming an electrode includes casting a molten metal in a mould to form an electrode with a header portion and a blade portion. The blade portion of the electrode is then rolled after it has been cast. The blade portion may be rolled into at least two different thicknesses. In one embodiment the metal is lead or lead alloy and the method relates to the forming of a lead or lead alloy anode.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: April 30, 2013
    Inventor: John Thomas Turner
  • Patent number: 8415023
    Abstract: A coated article is described. The coated article includes a substrate, a combining layer formed on the substrate, a plurality of chromium nitride layers and a plurality of copper-titanium alloy layers formed on the combining layer. The combining layer is a chromium layer. Each chromium nitride layer interleaves with one copper-titanium alloy layer. A method for making the coated article is also described.
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: April 9, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Cong Li
  • Patent number: 8409723
    Abstract: A process for joining a brass part and a silicon carbide ceramics part, comprising steps of: providing parts comprising a brass part, a silicon carbide ceramics part, an aluminum foil and a nickel foil; bringing surfaces of the silicon carbide ceramics part, the aluminum foil, the nickel foil and the brass part into contact in turn; applying a joining pressure between about 10 MPa and 40 MPa to the parts; heating the parts at a rate below 50° C./min when a temperature of the parts is below about 300° C.; when the temperature of the parts is above about 300° C., heating the parts at a rate of about 80° C./min˜200° C./min until to a joining temperature of about 550° C. to about 650° C., and maintaining the joining temperature between about 15 minutes and 40 minutes.
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: April 2, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Wen-Feng Hu
  • Patent number: 8394509
    Abstract: Object is to provide a surface-treated copper foil free from chromium in the surface-treatment layer and excellent in peel strength of a circuit and chemical resistance against to degradation of the peel strength after processing into a printed wiring board. To achieve the object, the surface-treated copper foil having a surface-treatment layer on a bonding surface of a copper foil for manufacturing a copper-clad laminate by laminating it to an insulating resin substrate has the surface-treatment layer formed by depositing a metal component having high melting point not lower than 1400° C. by dry process film formation method to the bonding surface of the copper foil after the cleaning treatment and further depositing a carbon component to the surface.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: March 12, 2013
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Seiji Nagatani, Hiroshi Watanabe, Kazufumi Izumida
  • Patent number: 8394508
    Abstract: A plated article has an alloy thin film formed on a substrate and having a catalytically active metal (A) for electroless plating and a metal (B) capable of undergoing displacement plating with a metal ion contained in an electroless plating solution, and a metal thin film formed on the alloy thin film by electroless displacement and reduction plating. The alloy thin film of the catalytically active metal (A) and the metal (B) capable of displacement plating has a composition comprising 5 at % to 40 at % of the metal (A). The metal thin film formed by electroless displacement and reduction plating is a metal thin film having a thickness no greater than 10 nm and a resistivity no greater than 10 ??·cm. Preferably, the metal (B) has a barrier function with respect to a metal of the metal thin film.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: March 12, 2013
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventors: Atsushi Yabe, Junichi Ito, Yoshiyuki Hisumi, Junnosuke Sekiguchi, Toru Imori
  • Patent number: 8383248
    Abstract: A coated article is described. The coated article includes a substrate, a combining layer formed on the substrate, a plurality of titanium dioxide layers and a plurality of copper-zinc alloy layers formed on the combining layer. The combining layer is a titanium layer. Each titanium dioxide layer interleaves with one copper-zinc alloy layer. A method for making the coated article is also described.
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: February 26, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZehen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Cong Li
  • Patent number: RE44510
    Abstract: The invention relates to tuned multifunctional linker molecules for charge transport through organic-inorganic composite structures. The problem underlying the present invention is to provide multifunctional linker molecules for tuning the conductivity in nanoparticle-linker assemblies which can be used in the formation of electronic networks and circuits and thin films of nanoparticles. The problem is solved according to the invention by providing a multifunctional linker molecule of the general structure CON1-FUNC1-X-FUNC2-CON2 in which X is the central body of the molecule, FUNC1 and FUNC2 independently of each other are molecular groups introducing a dipole moment and/or capable of forming inter-molecular and/or intramolecular hydrogen bonding networks, and CON1 and CON2 independently of each other are molecular groups binding to nanostructured units comprising metal and semiconductor materials.
    Type: Grant
    Filed: September 15, 2012
    Date of Patent: September 24, 2013
    Assignee: Sony Deutschland GmbH
    Inventors: Jurina Wessels, William E. Ford, Akio Yasuda
  • Patent number: RE44789
    Abstract: In order to produce a wire electrode having a core consisting of a copper/zinc alloy and to produce a specific sheath layer, the sheath layer is coated onto the core at a temperature at which no diffusion occurs. The wire electrode is subsequently heated at a heating speed higher than 10° C. per second, briefly annealed at temperatures above 500° C. and subsequently cooled again very rapidly at cooling speeds higher than 10° C. per second.
    Type: Grant
    Filed: July 13, 2012
    Date of Patent: March 4, 2014
    Assignee: Berkenhoff GmbH
    Inventors: Bernd Barthel, Heinrich Groos, Hans Hermanni