Abstract: The invention relates to a rigid composite metal panel comprising at least two metal parallel plates and/or sheets secured to the peaks and troughs of a corrugated aluminium stiffener sheet arranged between the parallel plates and/or sheets, wherein the corrugated aluminium stiffener sheet is an aluminium brazing sheet product made from an aluminium brazing sheet product including a core sheet (1) made of an aluminium alloy having on at least one surface of the core sheet clad, and preferably on both sides, an aluminium clad layer (2), the aluminium clad layer being made of an aluminium alloy comprising silicon in an amount in the range of 2 to 18% by weight, preferably 5 to 14%, and a layer (3) comprising nickel on the outer surface of the aluminium clad layer. The invention further relates to a method of manufacturing thereof.

Abstract: Disclosed is an aluminium brazing product, such as a brazing sheet product, having a substrate (1) of an aluminium alloy comprising silicon in an amount in the of 2 to 18% by weight, and on at least one outer surface a layer (2) comprising nickel, wherein a separately deposited layer (3) is applied on one side of the layer (2) comprising nickel and the layer (3) comprising a metal such that taken together the aluminium base substrate (1) and all layers exterior thereto form a metal filler having a liquidus temperature in the range of 490 to 570° C., and preferably in the range of 510 to 550° C. The invention also relates to a method of manufacturing such a brazing product and to a brazed assembly comprising at least one component made of the brazing sheet product.

Abstract: The present invention relates to a cobalt electroless plating bath composition and method of using it for microelectronic device fabrication. In one embodiment, the present invention relates to cobalt electroless plating in the fabrication of interconnect structures in semiconductor devices.

Abstract: Changes in the infrared reflection spectrum of a thin film of silica-like resinous material sandwiched between metal electrodes can be induced by applying an electric potential to a top electrode which is semitransparent. Characteristic infrared absorption lines change in proportion to a small electric current flowing through the material. These changes occur with response times of the order of seconds, and show time constants of the order of minutes to reach stationary values.

Abstract: The present invention provides a method of producing a bonded body of a beryllium member and a copper or copper alloy member, in which the bonding strength and thermal cycle resistance property are further increased. When the beryllium member and the copper or copper alloy member are bonded to each other, a thin layer of titanium, chromium, molybdenum, or silicon is formed as a diffusion inhibition layer on the surface of the beryllium; a copper layer is formed as a bonding layer on the surface of the diffusion inhibition layer; a thin layer of aluminum or zinc is formed as a bonding promotion layer on the surface of the bonding layer; and the beryllium member and the copper or copper alloy member are diffusion bonded to each other with the intermediate layer formation side being the bonding surface.

Abstract: An article is coated with a multi-layer coating having a stainless steel color. The coating comprises an electroplated layer or layers on the article surface, a refractory metal or refractory metal alloy strike layer on the electroplated layer or layers, a color layer containing a refractory metal oxide or refractory metal alloy oxide having a substoichiometric oxygen content on the strike layer, and a refractory metal oxide or refractory metal alloy oxide having a substantially stoichiometric oxygen content layer on said color layer.

Abstract: A copper foil for use in making a printed wiring board and a copper clad laminate comprising the copper foil are herein disclosed and the copper foil is characterized in that a metal chromium layer is formed on at least one side of the copper foil by vapor deposition or characterized in that one side of the copper foil is supported by a carrier through a releasing layer and a metal chromium layer is formed on the other side of the foil by vapor deposition. The copper foil is excellent in the adhesion to various substrates (the peel strength between the substrate and the copper foil), moisture resistance, chemical resistance and heat resistance and therefore, the copper foil can suitably be used in the production of printed wiring boards.

Abstract: A drill resistant plate, which presents a rough surface of hardened particles to drilling attack, and which tends to snap or destroy drill bits before they can began drilling. The plate is made by brazing hard particles into a matrix of brazing material attached to a steel plate. Nickel-Silver brazing material is used to form the matrix on the steel plate, and tungsten carbide particles of 8-10 mesh are secured within the matrix, with the hard particles of tungsten carbide partially exposed, presenting a roughened surface with angular pieces of tungsten carbide to the drilling attack.

Abstract: In order to improve the wear resistance of the swash plate of a swash-plate type compressor, on which plate copper alloy is flame-sprayed, a composite material, which consists of copper or first copper alloy (for example Cu—Pb alloy) including at least unmelted phase and aluminum or first aluminum alloy (for example Al—Si alloy) including at least melted phase, is flame sprayed on the sliding surface with a shoe.

Abstract: To provide an electrodeposited copper foil with carrier, in which electrical connection holes such as through holes (PTH), interstitial via holes (IVH), and blind via holes (BVH) can be readily formed. The invention provides an electrodeposited copper foil with carrier comprising a carrier foil, an organic release interface layer formed on a surface of the carrier foil, and an electrodeposited copper foil layer deposited on the release interface layer, wherein copper microparticles are deposited on the surface of the carrier foil onto which the organic release interface layer and the electrodeposited copper layer are formed.

Abstract: A personal ornament having a white coating layer comprises a base article made of a metal, and a white-colored stainless steel coating layer formed by a dry plating process on at least a part of the surface of the base article. Another personal ornament having a white coating layer comprises a base article made of a nonferrous metal, an underlying plating layer formed on the surface of the base article, and a white-colored stainless steel coating layer formed by a dry plating process on at least a part of the surface of the underlying plating layer.

Abstract: In accordance with the invention a reactive multilayer foil is fabricated by providing an assembly (stack or multilayer) of reactive layers, inserting the assembly into a jacket, deforming the jacketed assembly to reduce its cross sectional area, flattening the jacketed assembly into a sheet, and then removing the jacket. Advantageously, the assembly is wound into a cylinder before insertion into the jacket, and the jacketed assembly is cooled to a temperature below 100° C. during deforming. The resulting multilayer foil is advantageous as a freestanding reactive foil for use in bonding, ignition or propulsion.

Abstract: There is provided a sintered material of which dimensional accuracy has been increased by improving the sinterability of Cu—Al based sintered material. More specifically, there are provided a sintered material and a composite sintered contact component, which are excellent in strength, wear resistance, seizure resistance and corrosion resistance. The sintered material is a Cu—Al based sintered material containing at least 1 to 12 wt % Sn and 2 to 14 wt % Al, and the composite sintered contact component is formed by sinter-bonding this sintered material to a metal baking.

Abstract: Disclosed is a copper foil—for printed circuit boards—which is especially excellent in soft etching property and also superior in such properties as heat discoloration resistance, rust-proofing and solder-ability. The copper foil for printed circuit boards comprising a first layer formed by applying 12 to 50 mg/m2 of a sulfur-contained zinc alloy containing 0.1 to 2.5 percent by weight of sulfur on the surface on at least one side of the copper foil and a second layer formed of a chromate layer on the first layer by applying 0.5 to 2.5 mg/m2 of chromium and, if necessary, 1.5 to 6 mg/m2 of phosphorus.

Abstract: The invention provides fluororesin fiber paper excellent in adhesion to a copper foil, heat resistance, chemical resistance, low water absorption and electric insulation and capable of being used as a substrate of a printed board suitable for use in high frequency, of which a low dielectric loss is required. The fluororesin fiber paper is a porous sheet obtained by forming a slurry comprising fluororesin fiber into a sheet by a wet paper making method and sintering the resultant sheet and has an average pore diameter of 0.5 to 50 &mgr;m and a maximum pore diameter of at most 250 &mgr;m. A copper-clad laminate for printed board is produced by laminating the fluororesin fiber paper and a copper foil having a ten point mean height of surface roughness profile (Rz) of 0.5 to 8.0 &mgr;m on each other by means of vacuum hot pressing.

Abstract: To provide a contact material suitable for a commutator of a micromotor which can improve wear resistance and prolong the life of the micromotor by improving an Au-based clad composite material provided at an outermost layer with Au or an Au alloy. The present invention provides the Au-based clad composite material including a surface of a contact substrate having an Ag—Cu—Si alloy layer cladded with Au or the Au alloy, wherein an intermetallic compound Cu—Si is dispersed and deposited in Au or the Au alloy.

Abstract: A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer (14) is on the electrolyte side of said carrier foil (12). A thin functional foil (16) formed by deposition of copper has a front side in contact with the release layer (14) and an opposite back side. The electrolyte side of the carrier foil (12) has a surface roughness Rz less than or equal to 3.5 &mgr;m. There is also presented a method for manufacturing such a composite copper foil.

Abstract: An electrical conductor for use in an electronic structure is disclosed which includes a conductor body that is formed of an alloy including between about 0.001 atomic % and about 2 atomic % of an element selected from the group consisting of Ti, Zr, In, Sn and Hf; and a liner abutting the conductor body which is formed of an alloy that includes Ta, W, Ti, Nb and V. The invention further discloses a liner for use in a semiconductor interconnect that is formed of a material selected from the group consisting of Ti, Hf, In, Sn, Zr and alloys thereof, TiCu3, Ta1−XTix, Ta1−X, Hfx, Ta1−X, Inxy, Ta1−XSnx, Ta1−XZrx.

Abstract: A composite material, comprising a carrier strip the carrier strip comprising a first side the first side comprising a substantially uniform roughness, an electrolytically deposited copper foil layer having opposing first and second sides and a thickness of from 0.1 micron to 15 microns and the entire metal foil layer thickness having been deposited from a copper containing alkaline electrolyte, and a release layer effective to facilitate separation of the metal foil layer from the carrier strip disposed between and contacting both the first side of the carrier strip and the second side of the metal foil layer.

Abstract: The present invention relates to a porous electrode wire for use in electrical discharge machining and the method of manufacturing the same. The wire improves the machining speed at least 15% compared with a conventional zinc coated wire, which results from an increased cooling ability of the wire with a cooling liquid because of the increase in the surface area of the wire having porous surface morphology. Since the surface of the porous wire presents uniform profile of outer periphery rather than surface protrusions, it does not affect machining accuracy. Further, the porous nature of the wire is expected to improve flushability during the electrical discharge machining, providing spaces to eliminate particles of the machining. Therefore, in accordance with the method of the present invention, a zinc coated wire having improved performance of machining speed and flushability compared with a conventional coated wire can be provided without additional processes.

Abstract: A component for a gauge comprising a bourdon tube having a first end and a second end. A socket is joined to the first end of the bourdon tube and a closure member is joined to the second end of the bourdon tube. At least one of the bourdon tube and the closure member comprises a copper nickel alloy and/or the socket comprises a nickel silver alloy. In addition, a low temperature soldering material, such as a tin-bismuth soldering material, was used to affix the socket to the bourdon tube and the closure member to the bourdon tube. Preferably, the components contain substantially no free copper. Such a component resists corrosion, especially corrosion formed when certain fluids are used with such components.

Abstract: The present invention relates to a porous electrode wire for use in electrical discharge machining device and the method of manufacturing the same. The wire improves the machining speed at least 15% compared with a conventional zinc coated wire, which results from an increased ability to cool the wire with a cooling liquid, because of the increase in the surface area of the wire due to its having porous surface morphology. Since the surface of the porous wire presents uniform profile of outer periphery rather than surface protrusions, it does not affect machining accuracy. Further, the porous nature of the wire is expected to improve flushability during electrical discharge machining, providing spaces to eliminate particles resulting from the machining. Therefore, in accordance with the method of the present invention, a zinc coated wire having improved performance of machining speed and flushability compared with a conventional coated wire can be provided without additional processes.

Abstract: The present invention provides an electrodeposited copper foil which solves problems of electrodeposited-copper-clad laminates to which the foil has been incorporated, such as bow, twist, and poor dimensional stability, and a method of inspecting an electrodeposited copper foil so as to assure the quality of the foil. In the invention, there is employed an electrodeposited copper foil which recrystallizes by heating at low temperature during production of a copper-clad laminate employing an electrodeposited copper foil and which exhibits an elongation as high as 18% or more in an atmosphere of 180° C., wherein the maximum rate of decrease in maximum tensile strength falls within the aging time ranging from 5 to 10 minutes in a process in which tensile strength decreases as time elapses during aging in an atmosphere at 170° C., and the change in tensile strength in a knick portion shown in a {tensile strength} vs.

Abstract: A method is disclosed for laser lap welding a pair of metal members together. At least one of the pair of metals having a protective metal layer. Each of the metal members having a melt temperature greater than the melt temperature of the protective metal layer. The method includes placing one end of the pair of metal members in an overlapping relation to an other end of the pair of metal members to form an overlapping section. The method also includes inserting a metal alloying agent between the pair of metal members of the overlapping section to form a gap therebetween. A laser welder is used to join the pair of metal members and the alloy agent together so that the protective metal layer and the alloying agent are melted to form an alloy layer between the pair of metal members.

Abstract: A membrane 30 and a method 12 for making the membrane 30 comprising the steps of selectively placing a first material 14 upon a substrate 16, depositing a certain material 26 upon a first material 14, and heating the materials 14, 16, 26, thereby forming a membrane 30.

Abstract: Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient.

Abstract: Reproducible texturing of magnetic recording media is enhanced by sputtering a buffer layer, such as Ni—P, on a nonmagnetic substrate, prior to sputtering a textured bump layer. A magnetic recording medium comprising a sputter textured metal layer and high coercivity is achieved by employing an underlayer, such as NiAl or FeAl, preferably a composite underlayer containing a chromium or chromium-alloy layer and a NiAl layer, on the sputter textured layer. Advantageously, the buffer layer, underlayer, textured bump layer, magnetic layer and carbon overcoat can be sputter deposited in a single apparatus.

Abstract: A copper foil for a TAB tape carrier, comprising (a) a copper foil having a shiny surface and a mat surface; and (b) an alloy layer comprising nickel, cobalt and molybdenum, which is formed at least on the shiny surface; a TAB carrier tape, comprising a flexible insulating film and the copper foil for a TAB tape carrier applied onto the flexible insulating film with a surface on the side of the mat surface facing the flexible insulating film; and a TAB tape carrier, which is produced from the TAB carrier tape by etching the copper foil for a TAB tape carrier to form a copper lead pattern.

Abstract: A method for producing a laminated metal ribbon comprises the steps of (a) vapor-depositing a third metal layer on at least one welding surface of a first metal ribbon 4 and a second metal ribbon 5 in a vacuum chamber 1, the third metal being the same as or different from a metal or an alloy of the first and second metal ribbons 4, 5; (b) pressure-welding the first metal ribbon 4 to the second metal ribbon 5; and (c) subjecting the resultant laminate 9 to a heat treatment for thermal diffusion.

Abstract: A terminal material is composed of a base material and a plurality of plating layers provided on the base material and containing an Sn-plating layer as its outermost layer. When the plating layers include an Ni-plating layer, the plating layers are formed so that the Sn-plating layer does not come in contact with the Ni-plating layer. A crimp portion of a crimp terminal is formed of the terminal material.

Abstract: A surface treated metallic material according to the present invention comprises a metallic substrate and a metallic compound layer formed thereon, wherein the entire surface of the metallic compound layer is covered with minute, upright, scaly protrusions. The width in the major axial direction of the scaly protrusions is between 0.05˜0.5 &mgr;m and the thickness between 0.01˜0.1 &mgr;m, and the thickness of the metallic compound layer is between 0.1˜1.0 &mgr;m. The metallic compound layer incorporates one, or two or more of, the materials selected from the group consisting of chromium oxide, chromium hydroxide, niobium oxide, niobium hydroxide, rhodium oxide, rhodium hydroxide, vanadium oxide, vanadium hydroxide, palladium oxide, palladium hydroxide, nickel oxide, and nickel hydroxide. By using surface treated metallic materials of this type, bonding strength to a resin layer can be improved.

Abstract: Described is a method for producing a diffusion bonded sputtering target assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to alloy solution and artificially age the backing plate material after diffusion bonding to a target. Thermal treatment of the diffusion bonded sputtering target assembly includes quenching by partial-immersion in a quenchant and is performed after diffusion bonding and allows for various tempers in the backing plate.

Abstract: A component for use in forming a printed circuit board comprised of a copper foil, a layer of chromium chemically deposited thereon, the layer of chromium having a thickness of less than about 0.10 &mgr;m; and a layer of electrodeposited copper on the layer of chromium, the layer of electrodeposited copper having a thickness of less than 35 &mgr;m. A nodular treatment layer is provided on the copper foil and the layer of electrodeposited copper.

Abstract: In order to produce a wire electrode having a core consisting of a copper/zinc alloy and to produce a specific sheath layer, the sheath layer is coated onto the core at a temperature at which no diffusion occurs. The wire electrode is subsequently heated at a heating speed higher than 10° C. per second, briefly annealed at temperatures above 500° C. and subsequently cooled again very rapidly at cooling speeds higher than 10° C. per second.

Abstract: A method of producing an Nb—Sn compound superconducting wire precursor includes forming composite filament materials, each filament including a niobium material of an Nb-based metal and a titanium material of pure Ti enveloped in the niobium material; forming a composite rod in which composite filament materials are arranged in a matrix of a Cu-based metal but not in contact with one another, the matrix containing Sn diffused by heat treatment to combine with the niobium material to form a compound; and drawing the composite rod.

Abstract: A joint body according to the invention is strong for a heat cycle and generates no local cracks. The joint body has the following features. An end portion of the metal member and the ceramic member are connected via a metal connection portion. The metal connection portion has a metallized layer formed on the ceramic member and a brazing connection portion interposing at least between the metallized layer and an end portion of the metal member. A melt point of a brazing member constructing the brazing connection portion is lower than that of a brazing member constructing the metallized layer.

Abstract: The present invention provides a soldering method and a soldered joint securing a strength of joint equivalent to soldering using a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and without causing a rise in cost. A soldering method comprising a step of covering Cu electrodes of electronic equipment by a rust-proofing coating consisting of an organic compound including N and a step of forming soldered joints on the covered Cu electrodes, by using a solder material consisting of at least 2.0 wt % and less than 3 wt % of Ag, 0.5 to 0.8 wt % of Cu, and a balance of Sn and unavoidable impurities. The solder material used in the present invention further contains not more than 3 wt % in total of at least one element selected from the group consisting of Sb, In, Au, Zn, Bi, and Al.

Abstract: Copper matrix composites reinforced with continuous SiC and/or boron fibers.

Abstract: The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 and 10. A particular brazing filler metal of the invention contains silver, copper, and nickel. The invention is also directed to composite materials formed by infiltration of the brazing material into a porous matrix, and to methods for preparing the composite materials. The invention is further directed to composite articles fabricated from composite materials, including steel bearings or bushings, and to methods of preparing the composite articles.

Abstract: A kind of composite metal coil/plate includes one parent metal coil/plate and at least one clad metal coil/plate as well as an interlayer composed of atoms of a brazing filler, the parent metal and the clad metal. The interlayer is about 2-10 &mgr;m in thickness. The present invention also relates to a method of manufacturing composite metal coil/plate. The method comprises pre-cladding the parent and clad metal coils/plates as well as the brazing filler foil in an inert or reductive atmosphere at 850-1000° C., and hot rolling cladding the same under inert or reductive atmosphere at 900-1050° C. A composite metal plate is obtained after cooling.

Abstract: A personal ornament having its surface covered with a colored coating, the colored coating formed by dry-plating, which personal ornament comprises a basis material for personal ornament, composed of a copper alloy or zinc; a nickel plating layer on a surface of the basis material, or a nickel plating layer on a surface of a copper plating layer on a surface of the basis material; an amorphous nickel/phosphorus alloy plating layer on a surface of the nickel plating layer; and at least one colored coating layer on a surface of the amorphous nickel/phosphorus alloy plating layer, the colored coating layer formed by dry-plating, and wherein the amorphous nickel/phosphorus alloy plating layer has a phosphorus content of 11 to 16% by weight. As compared with conventional personal ornaments, this personal ornament is furnished with a colored coating having excellent corrosion resistance and can be produced at low cost.

Abstract: A surface enhanced Raman scattering structure may be used for detecting analytes such as organic contaminants in air and aqueous environments, and metallic and anionic contaminants in water. The structure is fabricated by etching a surface of a glass substrate to form a roughened surface; creating an adhesion layer on the roughtened surface; forming metal islands, such as gold, silver, or copper, on the adhesion layer to create a composite structure; and placing the composite structure in a thiol solution to form a self-assembled monolayer over the metal islands. The thiol solution is selected to attract an analyte of interest. The roughened surface enhances the SERS response of the structure and preferably has an average surface roughness that does not exceed about 2500 Å and a periodicity that does not exceed about 12.5 microns.

Abstract: The invention is directed to a photoresist-free method for depositing films composed of metals, such as copper, or its oxides from metal complexes. More specifically, the method involves applying an amorphous film of a metal complex to a substrate. The metal complexes have the formula MfLgXh, wherein M is selected from the group consisting of Ti, V, Cr, Au, Mn, Fe, Co, Ni, Cu, Zn, Si, Sn, Li, Na, K, Ba, Sr, Mo, Ru, Pd, Pt, Re, Ir, and Os, L is a ligand of the formula (R2NCR2′CO) wherein R and R′ are independently selected from H, CnHm and CnHmAxBy wherein A and B are independently selected from main group elements and f, g, h, n, m, x and y represent integers and wherein X is an anion independently selected from N3, NCO, NO3, NO2, Cl, Br, I, CN, OH, H and CH3. These films, upon, for example, thermal, photochemical or electron beam irradiation may be converted to the metal or its oxides.

Abstract: The present invention relates generally to a joined structure of dissimilar metallic materials having different characteristics. More specifically, the invention relates to a joined structure of a current-carrying contact or arching contact which are used for, e.g., a power breaker, or a coating end structure of a metal base and a coating material for improving conductivity and heat resistance.

Abstract: A laminate for use in production of printed circuit boards comprising a metal layer having a first side and a second side; a metallic substrate, one side of the metallic substrate being attached to the first side of the metal foil; an adhesive substrate formed of a polymeric material having a first surface and a second surface, the first surface being attached to the second side of the copper foil, the adhesive substrate being at least partially uncured; and a releasable protective film along the second surface of the adhesive substrate.

Abstract: A Cu plated ceramic substrate is used in a semiconductor. On a ceramic substrate layer, a thin-film Cr layer is put, and a thin-firm Au layer is put on the Cr layer. The Au layer is plated with Cu. By providing the Au and Cr layers between the ceramic plate and Cu layer, adhesibility is increased. A Pertier element which includes the Cu plated ceramic layer is employed in a semiconductor to absorb and generate heat efficiently.

Abstract: A semiconductor wafer having copper bondpads (17) that are free of voids (13) and a method for coating the copper bondpads (17) with solderable or wirebondable metals such that the copper bondpads (17) are free of the voids (13). The void free metal coatings are achieved using a dual activation process. In a first activation step (27), the copper bondpads (17) are activated by placing them in a palladium bath. In a second activation step (28), the bondpads are placed in a nickel—boron bath. After the dual activation, the copper bondpads (17) are coated with a layer of nickel—phosphorous or palladium. The nickel—phosphorous or palladium layer may be coated with a layer of gold for subsequent formation of solder balls or wirebonds thereon.

Abstract: A protective layer for load-transferring contact surfaces of gas turbine components, especially titanium turbine components is capable to take up alternating loads at higher temperatures. The protective layer is formed of an alloy having the following composition in percent by weight: aluminum (Al) 4-8%; chromium (Cr) 2-5%; iron (Fe) 0-3.5%; and copper (Cu) remainder.

Abstract: A casting-die body (1) made of a hardenable copper alloy is provided with an inner wear-protective layer (7) of chromium whose hardness decreases from the billet-side surface (8) in the direction of the casting-die body (1). The wear-protective layer (7) is made up of two chromium layers (9, 10). For this purpose, the casting-die body (1) is given a solution heat treatment, is chromium plated, and is then hardened, as a result of which the initially very great hardness of the chromium layer (9) is reduced. The hardness of the chromium layer (9) then is about 650 HV. Subsequently, to increase the wear protection, the second chromium layer (10) is applied. The result is a conventional chromium-plated layer having a hardness of between 850 HV and 1050 HV.

Abstract: A method of forming a laminate used in the manufacture of printed circuit boards, comprising the steps of applying a layer of chromium having a thickness from about 30 grams per square meter to about 160 grams per square meter to each side of a steel substrate having a thickness from about 0.10 mm to about 0.20 mm. Applying a layer of copper having a thickness from about 2 &mgr;m to about 70 &mgr;m to each of the chromium layers. Positioning the steel substrate between two dielectric layers with adhesive disposed between the copper layers and the dielectric layers. Applying heat and pressure to the layers to bond the copper layers to the dielectric layers. Separating the steel substrate from the copper layers, and discarding the steel substrate.