Abstract: Copper foil for printed circuits which comprises a copper layer and a nickel layer formed on one or both sides of said copper layer, the surface of said nickel layer having been subjected to a cathodic chromic acid treatment, and a method for producing the same. Said copper foil can be etched easily and completely with ammonium persulfate solution or with a cupric chloride solution, and is free from so called undercutting phenomenon. A further advantage of printed circuits prepared with said copper foil is that the exposed resin substrate is not stained and the copper foil is strongly adhered to the substrate before and after heating.

Abstract: A process and apparatus for treating a metal foil to enhance its ability to be bonded to a substrate comprise immersing the metal foil in an electrolytic cell having an electrolyte bath solution containing copper and applying a current having regularly recurring pulses and preferably flowing in only one direction to the cell. The current causes a dendritic layer of copper to be deposited on at least one surface of the metal foil at a first current density and bonded thereto at a second current density. The process and apparatus are particularly suited for treating copper foil.

Abstract: A permanently solderable palladium-nickel electroplated coating is formed on electrically conductive surfaces. The coating has a first alloy layer of 46 to 82 atomic percent palladium and 18 to 54 atomic percent nickel. This first layer is covered by a continuous second layer of 96 to 100 atomic percent metallic palladium and 0-4 atomic percent nickel. The second layer has a thickness of up to twenty angstroms. The second layer is formed by dipping the first layer in a solution of sulfuric or hydrochloric acid.

Abstract: A copper alloy welding filler for use in arc welding copper to produce sound welds with good mechanical strength and high electrical conductivity is disclosed. The filler consists essentially of a zirconium-boron copper alloy filler metal wherein the concentration ratio of zirconium to boron is at least about 4 to 1; the minimum concentration of boron is about 300 PPM; and the concentration of zirconium is a maximum of about 6000 PPM. The minimum level of about 300 PPM boron on a weight basis eliminates porosity in the weld; while zirconium below about 6000 PPM is effective to eliminate weld cracking without having a detrimental effect on the electrical conductivity.

Abstract: Layered active brazing material in the form of two microcrystalline or amorphous foils applied to both sides of a ductile metal ribbon acting as a carrier. The foils consist of an alloy containing two or more of the elements Cu, Ti, Ge, Si, Ag, Zr, Ni, Al, Fe and are produced by spraying the molten alloy onto a rapidly rotating, cooled copper cylinder, and the resulting ribbon detaching itself from the cylinder. Production of the ductile metal body covered on both sides with foils using spot welding.

Abstract: A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from the surface followed by vacuum depositing an adherent thin metal film of Cr, Ni, Ni-V alloy, Pt, Pd or Ti onto the substrate. Another metal layer is then provided over the adherent thin film.

Abstract: A one-piece, composite electrical connector is disclosed. The connector is fabricated from at least two portions of electrically conductive metals.

Abstract: A composite structure having improved solderability shelf life and contact resistance is formed by coating a copper alloy substrate material with a tin-containing material. The copper alloy substrate material consists essentially of about 15% to about 30% nickel and the balance essentially copper. The copper alloy may further include up to about 25% zinc. The nickel in the alloy retards the growth of copper-tin and/or copper-zinc-tin intermetallic compounds and the diffusion of the copper through the coating. The coating may be formed from tin or tin alloys including tin solders, e.g. 60% Tin-40% lead solder.

Abstract: A copper-base alloy which consists essentially of 1 to 7% tin and 1 to 7% aluminum and contains aluminum and tin in a total not in excess of 10%, balance copper and inevitable impurities which are due to the manufacturer, is disclosed. It is useful as a coinage material of gold color.

Abstract: Nickel and copper are plated over a thick anodic coating on an aluminum substrate as a step in the manufacture of printed circuit board substrates.

Abstract: A composite material having improved bond strength and a substantially smooth external surface comprises a deoxidized copper alloy core material and a copper-aluminum-silicon clad material. The composite is formed by rolling together the core and clad, preferably in an unheated condition, in a single pass with a reduction of about 50% to 75% to form a metallurgical bond between the core and clad and thereafter enhancing the bond strength by heating the bonded core and cladding to a temperature in the range of about 200.degree. C. to about 750.degree. C. for a time period of about 5 minutes to about 24 hours.

Abstract: In production of a Ti-base materal for eyeglass-frames of a core and sheath construction by cladding, a combination of Ti or Ti-base alloy for the core and Ni or Ni-base alloy for the sheath effectively prevents formation of fragile intermetallic compounds at the border, thereby greatly increasing the brazing strength of the product for advantageous use as eyeglass-frame parts.

Abstract: This invention is directed to the formation of highly protective electroplated multi-metal coatings over an iron basis metal. The high degree of protection is obtained by the deposition of three sucessive layers of two dissimilar metal layers that form a galvanic cell in which one of the two adjacent metals is anodic to the other so that the corroding anodic electroplate will spread the attack laterally and thus prevent the corrosive media from drilling through to the base metal. The coating comprises an initial layer of sulfur free nickel followed in sucession by a sulfur containing bright nickel, cadmium, copper, sulfur free nickel, sulfur containing nickel and microporous chromium.

Abstract: A multifiber electrical brush formed of an electrically conductive matrix material having plural electrically conducting fiber wires embedded therein and extending therefrom, wherein the fiber wires have a diameter varying from 1 to 120.mu.m, a length on the order of 100 times greater than the diameter thereof, and a packing density between 1-25%. Suitable materials for the fiber wires are platinum, gold, silver, copper, palladium, or niobium which may be embedded in a copper, silver, or other suitable matrix material, or copper embedded in an aluminum matrix. The fiber wires may be provided with a coating of a suitable barrier material on the lateral surfaces thereof as may be required to protect the fiber wires from etching during removal of the matrix material, or to prevent and/or retard interdiffusion between the matrix material and the fiber wire material during annealing or hot-forming of brush stock, and/or to impart improved electrical performance to the resultant electrical brush.

Abstract: Large-area, blister-free assemblies of direct-bonded metal to a ceramic or metal substrate are obtained by providing venting channels in the metal-substrate interface. The channels may be formed in the metal or substrate surface to be bonded. The channels in the metal may be formed by etching, while the channels in the ceramic may be formed by mechanical techniques, such as grinding. The metal-to-substrate direct bond may be formed by any conventional processes employing an eutectic melt composition to bond the metal to the substrate.

Abstract: An alloy useful as a coinage alloy, especially as a cladding for a coin comprising a core and a cladding is disclosed. The alloy consists essentially of 4 to 6% nickel, 4 to 6% aluminum, balance copper and inevitable impurities which are due to the manufacture. Also disclosed are coins made therefrom having a gold-like color.

Abstract: Composite material comprising a matrix of an alloy of about 64 percent by weight iron and about 36 percent by weight nickel or of a different alloy containing iron and nickel having a coefficient of thermal expansion of at the most 3.10.sup.-6 K.sup.-1 within the temperature range 20.degree. C. to 100.degree. C. and veins of copper, distributed in one direction through the matrix, with the copper and the alloy metallurgically bonded to each other through a boundary layer containing copper and the alloy having a thickness of at the most 5 .mu.m.

Abstract: A product useful in the manufacture of printed circuits includes a carrier layer of copper having a thickness on the order of about 10-15 microns. A thin layer of copper having a thickness in the range of 1-12 microns, and which will provide the conductive path for the printed circuit, is secured to the copper carrier by an intermediate metallic layer positioned therebetween and secured to both layers of copper. The intermediate layer has a thickness in the range of 0.1-2.0 microns and is selected from the group consisting of nickel, a nickel-tin alloy, a nickel-iron alloy, lead and a tin-lead alloy. The intermediate layer adheres sufficiently to the thin layer of copper to prevent removal thereof during the etching process which removes the carrier layer of copper. The described thin metallic foil is bonded upon opposite sides of a suitable dielectric which may be a reinforced or non-reinforced epoxy or any one of a number of other suitable materials for forming the core of a printed circuit board.

Abstract: Substrates such as boron nitride and titanium diboride and the like joined to other metal or metal sandwiches useful as resistance elements.

Abstract: A steel wire element useful in the reinforcement of rubber compositions in which the steel wire is provided with an adhesive coating comprising a brass alloy containing 58% to 75% copper and cobalt in an amount sufficient in use to improve the adhesion between the coated steel wire and the rubber composition. Preferably the brass alloy contains 2% to 4% of cobalt. Applications include coated steel cords for use in vehicle tires and conveyor belts and hoses.

Abstract: A multi-layer composite brazing alloy useful in mine drills for attaching hardened bits, such as tungsten carbide, to bit holders made of steel and the like, comprises two outer layers of a brazing alloy bonded to an inner layer or core of iron or nickel. While a wide variety of brazing alloys are useful as the outer layers, a cost preferred alloy is AMS-4764 (in percent by weight 9.5 Ni - 52.5 Cu - 38.0 Mn) having a melting range of 880.degree.-925.degree. C. This is approximately 40% less than the melting temperature of the iron or nickel core which, therefore, is not susceptible to melting and alloying with the outer layers when the brazing furnace temperature fluctuates during the brazing operation. On cooling, the ductile iron or nickel core absorbs stresses due to dissimilar thermal expansion coefficients of the carbide tip and the holder and prevents cracking of the joint.

Abstract: Novel and advantageous metal laminates particularly useful in making coins comprising a copper core and a cladding metallurgically bonded thereto of a copper base alloy containing from 2 to 3.5% aluminum, from 1 to 2.5% silicon and the balance essentially copper. Disclosure also teaches a method of preparing copper laminates by providing a copper core in strip form in the hard temper and a copper alloy cladding fully annealed in strip form, wherein the components are rolled together in a single pass with a reduction of from 50 to 75% to provide the metallurgically bonded laminate.

Abstract: An electrically conductive part with an insulation material which withstands high temperatures and a method of manufacturing such a part. Its conductive core is formed by drawing a copper billet coated with a copper-aluminium alloy.

Abstract: A process, article produced therefrom, and compositions are described for the reception of electroless plating onto a substrate of a non-catalytic metal or non-catalytic alloy. The process comprises contacting the surface of the non-catalytic substrate with a promotor composition containing ions selected from the group of nickel, cobalt, iron, and mixtures thereof and a suitable reducing agent, and thereafter contacting the treated surface with an electroless plating bath comprising hypophosphite for metallic build-up.

Abstract: A novel laminated composite material of gold-colored appearance especially suited for, but not limited to, coinage applications has a ferromagnetic core located between sheathing layers of a Cu-Al or Cu-Ni-Al alloy and separated therefrom by layers of copper. Alternative methods involving hot and/or cold rolling techniques are provided for the production of the novel laminates.

Abstract: A continuous film having a solar selective coating on one surface and adhesive on the opposite surface is produced by a coil type process. The film may be cut to size and shape for application to solar collectors.

Abstract: A method of plating a metallic substrate by coating said substrate with a specific metallic system; plating at least one metal onto the coating; and heating the coated and plated metallic substrate to a temperature that effects a bonding of said metallic substrate to said coating and the plated metal. The method is utilized to plate metals onto metal substrates; including substrates such as aluminum and zinc.

Abstract: A method is provided for inhibiting the development of friction fatigue stress between the mating surfaces of paired machine parts, and particularly those subject to oscillatory loads. This is achieved by maintaining the mating surfaces separated by placing between them a material either of a different crystal structure than the parts separated, or a material of a greater hardness. The separating material may be in the form of a connecting element, or it may be coated onto one of the mating surfaces.

Abstract: A solar heat absorber is produced by electrodepositing on a metallic substrate acting as a cathode in a plating bath a black coating including a ternary alloy represented by the formula:Sn--M--Mowhere M is Fe, Co or Ni. The electroplating bath contains a stannous salt, a salt of a metal M selected from the group consisting of cobalt, nickel and iron, a molybdate, an alkali metal pyrophosphate, and an amino acid or an ammonium salt of carboxlyic acid or mineral acid.

Abstract: A method is disclosed for depositing a thick layer of copper upon a copper base wherein the base is heated and flame sprayed with molten copper until globules are observed. The globules are mechanically removed from the base and the flame spraying and globules removing steps repeated.

Abstract: A composite joint system is disclosed in which a composite structure containing carbon fibers embedded in a copper matrix in any configuration, e.g. in one direction, in random directions, in mesh form, spirally or radially is joined to another structure through a brazing material such as solder, Al brazer or Ag brazer. A film of metal such as Ni, Cr, Mo, W, Ta, Ti, Zr, V, an alloy of one or some of such metals, or the combination of some thereof is interposed between the composite structure and the brazing material. The metal film has a good wettability to both the composite structure material and the brazing material.

Abstract: A multi-layered plain slide bearing having a metal base layer, and having a slide layer which is carried by the base layer and which comprises a copper-lead-tin binary or ternary alloy that has been applied to the base layer and that has an unusually high cooper content. The slide layer can contain, by weight, from 20% to 70% of copper, at least 15% and at the most 80% of lead, and from 0% to 30% of tin, and can also optionally contain indium, cadmium or other like metals. The slide bearing can further include a run-in layer which covers the slide layer, and which contains copper, tin, indium and/or lead or their oxides, sulfides or phosphides.

Abstract: A blast-furnace tuyere having excellent thermal shock resistance and high durability consists of a tuyere substrate composed of copper or copper alloy, a self-fluxing alloy metallized layer sprayed on the substrate, a cermet coating sprayed on the alloy metallized layer, and a ceramic coating sprayed on the cermet coating. The cermet coating is made from a mixture of an alloy material consisting essentially of 5 to 60 wt% of Co, 5 to 50 wt% of Ni, 5 to 25 wt% of Cr, 5 to 40 wt% of Mo, 5 to 40 wt% of W, 3 to 40 wt% of Si and inevitable impurities, and a ceramic eutectic material consisting essentially of 95 to 65 wt% of Al.sub.2 O.sub.3, 5 to 30 wt% of ZrO.sub.2, 2 to 20 wt% of TiO.sub.2, 3 to 30 wt% of SiO.sub.2 and inevitable impurities. The ceramic coating is made from the same ceramic material as used in the formation of the cermet coating.

Abstract: A multi-layer plating and method for improving the corrosion resistance of ferrous metal articles, such as steel fasteners, are provided in accordance with the invention. The multi-layer plating comprises, in sequence over a ferrous metal substrate, a layer of an alloy which has micro-throwing power, such as nickel-cadmium, nickel-zinc, iron-cadmium, iron-zinc, cobalt-cadmium, or cobalt-zinc, a layer of cadmium, cadmium-tin alloy, a dual layer of cadmium and tin, zinc or zinc alloy, a layer of copper, a layer of nickel, and a layer of chromium or a metallic chromium substitute. The method comprises plating, and preferably electroplating, the aforementioned layers of alloy and metals over an article having a ferrous metal substrate to obtain improved corrosion resistance.

Abstract: An improved magnetic bubble domain chip and processes for making the chip are described. The chip is comprised of a magnetic bubble domain film in which small bubble domains can be moved, and overlying layers of metallurgy. The layer of metallurgy closest to the bubble film is an electrically conductive layer having apertures (or recesses) therein. This layer is patterned to provide current carrying conductors. The next overlayer is a layer of magnetic material having in-plane magnetization which is patterned to provide the propagation elements used to move the bubble domains. In a particular embodiment, the magnetic layer is comprised of a magnetically soft material, such as permalloy. The chip is characterized by the provision of insulating pedestals located in the apertures of the conductive layer. These insulating pedestals are located in the regions of the chip used for sensing (and/or bubble generation). That is, they take the place of the thick conductive material in those areas of the chip.

Abstract: A fine magnetically shielded conductor wire comprising a core and a metallic sheath metallurgically secured thereto. The sheath is a magnetically soft alloy having low conductivity and comprising about 75 to 85 percent nickel and about 15 to 25 percent iron.

Abstract: A panel for selectively absorbing solar energy comprising an aluminum substrate, a layer of zinc thereon, a layer of nickel over the zinc layer and an outer layer of solar energy absorbing nickel oxide or a copper substrate with a layer of nickel thereon and a layer of solar energy absorbing nickel oxide distal from the copper substrate. A method for making aforesaid panels is disclosed.

Abstract: A solar heat collector comprising a metallic substrate having nodular or dendritic surfaces coated with a black absorber coating, and the method of preparing same.

Abstract: A novel fastening means of a highly corrosion resistant nature and presenting a bright chrome-like outer appearance.

Abstract: This invention relates to a video disc with a thin polymeric dielectric layer formed from acetylene and nitrogen in a glow discharge. The dielectric layer has improved age deterioration resistance and wear characteristics and can be prepared with low power levels.

Abstract: The addition of copper, either as a thin film or as an alloy constituent, to nickel-chromium alloys improves the adhesion of such alloys to polymeric substrates and coatings.

Abstract: A novel fastening means of a highly corrosion resistant nature and presenting a bright chrome-like outer appearance.

Abstract: This invention relates to a capacitive recording means comprising a video disc with a thin conductive bilayer on the surface of the disc wherein the bilayer is a first layer of copper and a second layer of an alloy of nickel, chromium and iron which contains oxygen. An inorganic dielectric layer is disposed on the conductive layer.

Abstract: This invention pertains to a video disc having a conductive bilayer thereon of a copper layer and a nickel/chromium/iron alloy layer wherein the alloy layer contains oxygen which decreases in content from the copper-alloy interface to an alloy-dielectric interface.

Abstract: This invention relates to a video disc with a thin polymeric dielectric layer formed from styrene and nitrogen. The dielectric layer has improved age deterioration resistance, wear characteristics and adhesion to a metal conductive layer.

Abstract: Metal/metal oxide coated articles having selective reflectance and transmittance of radiation over an extended spectral range are provided by a combination of at least three coating layers: one being substantially copper, one being substantially copper oxide and one being substantially nickel disposed between the copper coating layer and the copper oxide coating. Chemical or electroless plating techniques are disclosed for the production of such articles.

Abstract: A process for plating beryllium copper with an excellent electrically conductive material such as gold for use in high reliability applications wherein a heat treating step is employed after forming to yield a desired hardness spring temper comprising the steps of: providing a copper-rich surface on the beryllium copper; electroplating the copper-rich surface with a diffusion barrier preplate; heat treating the beryllium copper material to a desired temper; and electroplating the material with a high electrically conductive material. This process provides for a void-free, durable gold plate which can be produced by a continuous automated strip plating line before and after heat treating.

Abstract: A method of coating a copper substrate comprises the steps of: anodically microsmoothing the copper substrate in an acid bath to provide a substantially smooth surface; electrocoating the microsmoothed substrate with a pin hole free nickel film having a thickness of between about 2.5 microns to about 12.5 microns; single step, non-aqueous electrocoating the microsmoothed, nickel coated substrate with a pin hole free polyamic acid polymer, and curing the polyamic acid coating to form a polyimide film free of copper ion contamination.

Abstract: A thin, ferromagnetic layer which can be continuous, substantially pit-free and uniform, said layer having high bit density capabilities consisting essentially of cobalt in the form of close packed hexagonal crystals. A substrate is treated with a catalytic activator upon which is deposited an electroless conductive layer, such as copper; the cobalt layer is deposited by electroplating on the conductive layer. The ferromagnetic layer has a nominal coercivity of about 200 to about 500 oersteds and exhibits no anisotropy in the plane of deposition.

Abstract: Copper foil is subjected to a two-step electrochemical copper treatment to improve its bond strength, the first step of said treatment involving the use of a copper and arsenic-containing electrolyte. A treatment involving the use of the aforementioned two-step electrochemical copper pretreatment prior to the application of an electrochemical copper treatment. Treated copper foil and printed circuit boards resulting therefrom.