Abstract: The invention relates to a steel substrate with metal coatings for the reinforcement of vulcanizable elastomers, as well as a method for the continuous manufacture of a thus coated substrate and elastomer objects reinforced with said substrate.The substrate is provided with a first coating and a second coating at least covering part of the first one and a bonding layer being present between the two said coatings. The second coating comprises e.g. cobalt that can be applied by plasma sputtering. The coating combination can be easily adapted to the specific elastomer compositions and the reinforcement requirements aimed at.

Abstract: A corrosion resistant coating and process comprises the following layers applied in sequence over a ferrous metal substrate: a micro-throwing nickel-zinc alloy plating; an optional galvanically protective zinc metal plating; a zinc-nickel alloy plating containing 5 to 30 weight percent nickel; and an organic coating such as paint. In place of the organic coating there may be utilized sequential layers of copper, nickel and chromium or chromium-substitute plating. The coating is preferably used with steel drill screw fasteners.

Abstract: Bath surfaces of a polyimide sheet are coated with a layer of electroless nickel or cobalt which can also include a thin electroless copper layer on the Ni. or Co. This tenaciously bonded coating is subsequently treated in such a way so as to increase its permeability or porosity without substantially altering its resistive properties. The induced porosity allows water and other volatiles trapped in the dielectric polyimide sheet to be removed while the preserved electrical continuity of the metal layer is sufficient to support electrolytic copper plating which services the dual purpose of providing a copper thickness useful for the subsequent production of electronic circuitry and preventing the readsorption of water into the dielectric core by permanently sealing or coating said porous metal layer.

Abstract: A copper-clad laminated board which comprises a resin substrate and a copper foil laminated on said substrate, said copper foil having a resin substrate bonding surface coated completely with a layer consisting essentially of a phosphorus-containing nickel layer formed by electrodeposition, said substrate being in face-to-face contact with said bonding surface of said copper foil.

Abstract: Sintered composite material containing 80% to 95% weight of copper, 2% to 15% weight of nickel and 2% to 5% weight of graphite, designed for the manufacture of electrical contact pads for low voltage switchgear devices. The copper powder can be of a spongy form having an average diameter of less than 24 .mu.m, an oxygen content of lower than 2000 ppm and a purity in metallic elements of 99.5%. The graphite powder can be of pellicular form, having particles about 100 .mu.m in length and 20 .mu.m in thickness, and an ash content of less than 0.2 ppm. The nickel powder can be of a spheroid shape having an average diameter of less than 5 .mu.m.

Abstract: Bonding between a metallic conductor and a substrate is improved by using a primer layer having a graded composition which continuously varies from a composition predominant in a metal which bonds well to the substrate at the substrate-primer layer interface to a composition predominant in the metal of the conductor at the conductor-primer layer interface. Specifically, the bonding characteristics of copper to polyimide substrate are improved by using a chromium-copper graded composition primer layer which is chromium-rich at the substrate-primer layer interface and copper-rich at the conductor-primer layer interface.

Abstract: A member for a semiconductor apparatus for carrying or holding a semiconductor device, obtained by joining an aluminum nitride substrate and a radiating substrate, comprises an insulating member formed by an aluminum nitride sintered body to be provided thereon with the semiconductor device, a radiating member to be joined to the insulating member, which radiating member is mainly formed of a copper-tungsten alloy or a copper-molybdenum alloy, a stress relieving member interposed between the insulating member and the radiating member and a silver solder member for joining the insulating member, the stress relieving member and the radiating member with each other.

Abstract: The present invention discloses a rigid magnetic recording disk and a method of making the same. The substrate is formed by metallurgically bonding at least a first and second layer of clad materials. The hardness and mechanical strength of the first layer is substantially greater than the second layer. The first layer has a thickness which is from about 0.2% to about 20% the thickness of the second layer. The unbonded surface of the first layer is substantially flat and asperity free. The second layer is less dense than the first layer. A magnetic layer is deposited on the unbonded surface of the first layer.

Abstract: An electromagnetic radiation attenuating coating comprising an electronic housing base material coating with a first electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus rich in copper and a second electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel land cobalt, and phosphorus rich in nickel. The coating provides superior radiation attenuation and comprises fewer processing steps in its formation.

Abstract: A process for electrodepositing a multilayer deposit on an electrically-conductive substrate from a single electrodeposition bath yields a deposit which includes a sequence of essentially repeating groups of layers. Each group of layers comprises a layer of a first electrodeposited material and a layer of a second electrodeposited layer. The process includes the steps of immersing the substrate in an electrodeposition bath and repeatedly passing a charge burst of a first electric current and a second electric current through the electrodeposition bath to the substrate. The first electric current is a pulsed current with a first pulsed-on/off waveform and a first peak current density which is effective to electrodeposit the first electrodeposited material. The second electric current has a second waveform and a second current density which is effective to electrodeposit the second electrodeposited material.

Abstract: Both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion, as well as a modification of IPC test 2.4.9 method E for resistance to thermal cycling.

Abstract: Bronze-grey films for window glazing structures are disclosed. The subject bronze-grey films are characterized by having a layer of reactive-sputtered titanium suboxide of controlled composition between the bronze-grey metal layer and the plastic sheet which makes up the substrate of the film. The process by which these films can be made is also disclosed. These films offer superior resistance to failure by delamination.

Abstract: A filler metal for brazing parts made of superalloys has a brazing temperature of 1025.degree.-1080.degree. C., a solidus temperature above 1000.degree. C., a liquidus temperature above 1018.degree. C. and a composition of, in weight percent, 5-30 gold, 15-35 palladium, 10-30 nickel, 20-48 copper, 5-25 manganese.

Abstract: A magneto-optical recording medium comprises a transparent substrate and a magneto-optical recording layer overlaid on the transparent substrate. The magneto-optical recording layer is formed by alternately overlaying a plurality of thin layers containing a rare earth metal-transition metal alloy for magneto-optical recording, and a plurality of thin layers containing at least one metal selected from the group consisting of gold, silver, lead, magnesium, copper, and iridium which are solid solution non-formable metals.

Abstract: Band or wire shaped material consisting of a metal alloy containing at least phosphorus and tin, for example, phosphor bronze or a similar material, and comprisng an outer coating made of a tin-lead alloy. When the phosphorus content of the metal alloy ranges from 0.03 to 0.13 percent by weight, and preferably from 0.05 to 0.06 percent by weight, the tin content of the metal alloy is greater than or equal to 7 percent by weight. When the tin content amounts to less than 7 percent by weight of the metal alloy, the phosphorus content is greater than 0.13 percent by weight of the alloy, and preferably is between 0.27 and 0.35 percent by weight of the alloy.

Abstract: A joint construction is provided for lined equipment in which mutually weldable backing plates or sheets are lined with layer or facing sheets weldable to each other but not to the backing. An intermediate metal is optionally included between the backing and layer. A channel is provided between the layer sheets overlying the joint between the backings. A bridging strip weldable to the layer sheets is disposed in the channel and welded to the respective edges of the layer sheets. In some embodiments spaced strips of the layer material are disposed under the respective edges and the bridging strip and welds are made to join the spaced strips, the bridging strip and the edges of the layer sheets.

Abstract: In construction of a composite type metal gasket having a hard metal substrate, use of Cu, Cu-base alloy, Al or Al-base alloys for covering layers well enhances sealing effect and consolidates substrate-covering bonding.

Abstract: The present invention relates to a process for maintaining the fine grain size of and providing excellent bend formability, hot ductility and strength properties to a copper-nickel-manganese alloy to be exposed to elevated temperatures. The process of the present invention includes a final cold working step during which the material to be fabricated into a desired article and/or exposed to the elevated temperatures has its thickness reduced by about 4% to about 30%, preferably from about 5% to about 25%. The alloys described herein have particular utility in brazed articles or assemblies.

Abstract: An article of manufacture, such as is used in plumbing, is formed by soldering copper workpieces together with a lead-free solder having a tin content of from about 92 to 99%, a copper content of from about 0.7 to 6% and a silver content of from about 0.05-3%, by weight.

Abstract: A multi-layer structure that includes a transparent dielectric substrate, a layer of a nickel-containing steel alloy, and a layer of copper and/or chrome.

Abstract: The present invention relates to composites having excellent combinations of bending strength, electrical conductivity, stress relaxation in bending and bend formability and having particular utility in electrical connector applications. The composites of the present invention have a core formed from a copper base alloy having an electrical conductivity of at least about 80% IACS and a clad formed from a copper-nickel alloy containing more than about 30% by weight nickel. Preferred composites are triclad composites formed from copper alloy C151 and MONEL 400 and having clad layer thicknesses of at least about 10%, most preferably at least about 20%, of the overall composite thickness.

Abstract: A filler metal material particularly suited for brazing titanium base articles is described. In a preferred embodiment, the material is characterized by a central portion of titanium, and adjacent layers of copper and nickel. The solidus and liquidus temperatures of the filler metal are about 925.degree. and 945.degree. C., respectively.

Abstract: One or both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion.

Abstract: An improved copper bump tape for tape automated bonding inhibits electromigration of the copper after bonding to a semiconductor device. The improved tape is characterized by the plating of a migration resistant metal onto the inner ends of connector beams of the tape. The migration resistant metal is coated onto all surfaces of the connector bump, except for the surface which is to be bonded to the semiconductor device. In this way, the surfaces of the bump which remain exposed after connection to the semiconductor are inhibited from electromigration.

Abstract: An electrode wire for wire electric discharge machining a workpiece at high speed and high accuracy and a process for preparing the same are provided. The electrode wire comprises a core wire made of a copper clad steel wire, 10 to 70% of the sectional area of the copper clad steel wire being occupied by copper, and a copper-zinc alloy layer covering the core wire. The copper-zinc alloy layer is prepared by coating the core wire with zinc by electroplating or hot galvanizing, followed by heating to disperse copper in the zinc layer to convert the same into a copper-zinc alloy layer wherein the concentration of zinc is increased gradually along the radially outward direction. The preferable thickness of the copper-zinc alloy layer ranges from 0.1 to 15 microns and the average concentration of zinc in the copper-zinc alloy layer is preferably less than 50% by weight but not less than 10% by weight.

Abstract: Plated metal parts, such as sealing lids for semiconductor packages, in which an iron-based alloy layer is electroplated with a first layer of nickel, a first layer of gold is electroplated on the first nickel layer, a second layer of nickel is electroplated onto the first gold layer and a second layer of gold is electroplated onto the second layer of nickel. The resultant plated parts exhibit higher salt atmosphere corrosion resistance than parts plated with a single nickel-gold set. Other metals can be used as the plating layers.

Abstract: A composite of metal and resin comprising a resin layer and a metal layer having a surface roughness of a degree giving a lusterless appearance and a color of olive brown to black closely adhered through said surface to the resin layer is excellent in adhesive strength between the metal and resin layers, the metal layer being excellent in acid resistance, and is suitable for producing printed circuit boards.

Abstract: A magnetic recording medium is described, comprising a support having provided thereon a thin magnetic metal vapor deposition film, said film being provided by evaporating a magnetic metal material from an evaporation source to generate a vapor flow and directing the vapor flow to contact a moving support at an inclined angle, and having a curved and inclined column structure formed by continuously altering the incident angle of said vapor flow on the moving support from a high degree (.theta..sub.max) to a low degree (.theta..sub.min), and a non-magnetic metal vapor deposition film provided on the magnetic metal film, said non-magnetic metal film being provided by continuously altering the incident angle of vapor flow of the non-magnetic metal material to the moving support on which the magnetic metal film is formed between a high degree (.theta..sub.max') and a low degree (.theta..sub.min').

Abstract: A copper foil resistant to acids and heat and yet easy to etch is obtained by forming a cobalt layer containing molybdenum and/or tungsten on the bonding surface thereof. Roughening of the foil surface prior to formation of the layer provides highly peel-resistant bonding of the foil thereat to resin-containing substrates of the type found in typical printed circuit boards. The provision of a chromate layer on the cobalt further improves the adhesion between the copper foil and resin-containing substrates.

Abstract: A ceramic part is joined to a metal part by means of a molybdenum copper composite interlayer disposed between, and brazed to, the ceramic part and the metal part.

Abstract: Solar insulating window film comprising a sheet of substantially transparent flexible polymer thin film plastic material having first and second surfaces. First, second and third layers are adherent to the first surface of the film. The second layer is formed of copper. The first layer is formed of a material which possesses substantially the same nobility as copper or is inert to copper. The first layer counting from the first surface is formed of a material selected from nickel and palladium and oxides and sulfides thereof. The third layer counting from the first surface is formed of a material selected from nickel, palladium and chromium and oxides and sulfides thereof.

Abstract: An aureate coin, coin blank, medallion, medallion blank, token or token blank has a coin-shaped core with opposed faces and a peripheral side edge and of mintable metallic material. An electroplated coating of copper and tin completely encases the core and provides a golden appearance. The electroplated coating contains from about 8 to about 16% tin by weight and has a thickness of from about 10 to about 150 .mu.m.

Abstract: An improved treatment for copper foil that is to be used for lamination to a board comprises electrodepositing a dendritic layer of copper on the side of the foil that is to be laminated to the board. The dendritic layer is secured by electrodepositing a gilding layer of copper over it. A barrier layer is next electrodeposited over the gilding layer. The barrier layer is formed by means such as electrodeposition from a solution containing ions of zinc, nickel and antimony. This in turn is covered with an anticorrosion layer that is formed of chromates or phosphates, disposed over the barrier layer.

Abstract: An article comprising a substrate having a hard and corrosion-proof coating thereon. The coating includes a thin metallic layer having an ultrafine distribution of hard materials and a particular compact morphology.

Abstract: A flexible thinwalled sleeve for gravure printing is provided, which, going from inside to outside, essentially consists of(1) a slightly conical layer of nickel to provide mechanical strength,(2) a layer of copper, having the structure of high-gloss copper and which is essentially free of internal stresses, said layer having a cylindrical outer surface,(3) a thin, cylindrical layer of hard copper having a structure suitable for electronic engraving and having a gravure pattern on its outer surface, and if desired,(4) a thin protective layer of chrome.These layers are all firmly adhered to each other and especially the two layers of copper cannot be separated by peeling off. Since a high-gloss copper layer, which is free of internal stresses, has been found unsuitable for electronic engraving, and since the layer of hard copper, suitable for electronic engraving, has been found to have internal stresses, which would be unacceptable in the first layer of copper, the two layers must necessarily be different.

Abstract: A metal-ceramics composite material is produced by forming a metal film comprised of three layers on a ceramic substrate, and laminating a metal member thereon, the metal film comprising first layer of Group IV a metal, second layer of Group VIa metal and third layer of Group Ib metal, wherein the first and second layers are formed by gas deposition technique and the Group Ib layer may be formed by gas deposition technique or electrochemical plating. An additional Group VIII metal layer may be interposed between Group VIa layer and Group Ib layer by gas deposition technique.

Abstract: A silver-coated electric material wherein a partial or total surface of an electroconductive or non-electroconductive substrate is provided with a coating of silver or silver alloy, having the first intermediate coating layer made of Ni, Co, Cr, Pd or their alloys and the second intermediate coating layer made of Sn, Cd, Pd, Ru or their alloys between the silver coating and the surface of the substrate, and the method of preparing the same.

Abstract: A magnetic material wire is composed of a core of magnetic material having a Curie point of 70.degree. to 250.degree. C. and a high conductive metal sheathing of a uniform thickness covering the core. The ratio of the metal sheathing to the wire in cross-section is in the range of 15 to 40%. There is also disclosed a method of producing such a wire.

Abstract: A composite structure of thin films including alternating layers of relatively high conductivity metals and low conductivity metals to combine the effects of reflection and absorption and thereby maximize the attenuation of the structure. Additionally, a similar structure of layers of materials with differing magnetic permeabilities may be used for the same purpose.

Abstract: Copper alloy solders are disclosed which contain 0.5 to 20% by weight of cobalt. The copper and cobalt may be arranged in heterogeneous phases.

Abstract: A process for producing cooper foil laminated plates using rolled copper foils made of oxygen-free copper is described. The major feature of the present process is that in laminating a rolled copper foil on an insulating substrate, the rolled copper foil is ground or abraded and immediately brought into contact with water or steam to form a hydrate layer on the surface thereof. This hydrate layer increases the adhesion strength of the rolled copper foil to the insulating substrate through an adhesive, producing a copper foil laminated plate having an adhesion strength sufficiently high for practical use. Thus these copper foil laminated plates are very suitable for use in wiring of electronic devices.

Abstract: A process for the adhesive metallization of polyimide through pretreating of the polyimide and subsequent activation, as well as chemical metallization, if necessary, followed by galvanic metal deposition, characterized in that the polyimide is pretreated with an aqueous solution of alkali hydroxide and an organic nitrogen compound such as one selected from the group consisting of N,N,N', N'-tetra-(2-hydroxypropyl)-ethylenediamine, ethylenediaminetetraacetic acid and nitrilotriacetic acid. The plastics metallized according to the present invention find use as shaped parts, preferably in the fields of electrical engineering and electronics.

Abstract: Disclosed is a novel three-layered metallic interlayer material which provides good diffusion bonding between titanium alloys and steel or between titanium alloys and nickel alloys. The interlayer is comprised of three separate layers of metals as follows: a nickel layer which is placed in contact with the steel or nickel alloys, a Group V-B metal layer which is placed in contact with the titanium alloy and a copper layer which is sandwiched between the nickel and the Group V-B metal layers.

Abstract: Shielding means comprising a non-conductive base material having thereon a combined electrolessly-deposited metal layer of copper over lain with a second layer.

Abstract: Aluminum-shielded coaxial cable is repaired by using a wraparound metallic sheet, such as copper, having a contact means on the sheet, such as "dragon skin" brass strips, and a sealing means, such as a mastic. The metallic sheet provides the electrical continuity and radio frequency shielding and the sealing means provides the environmental seal to prevent moisture from entering the opening in the aluminum shield. The sheet and contact means are held in position by compression means, such as clamps, and the sheet and compression means can then be covered with a wraparound heat-recoverable closure to protect the entire assembly.

Abstract: A lightweight, thin walled, plural metal coated plastic sleeve for use in rotogravure or flexographic printing as well as a rotogravure printing cylinder are disclosed. The sleeve is supported internally and laterally by, for example, an expanding mandrel containing journal bearings and the resulting combination may be used as a rotogravure printing cylinder in a rotogravure printing machine. The sleeve and cylinder are lightweight and easy to handle and store and are adapted for quick changes in the printing machine without removal of the journals and the internal support. The particular method of making the sleeve enhances the adhesion of the copper to the plastic base.

Abstract: Electrical contact materials are provided which belong to the general category of copper that is overplated with a noble metal, usually gold. The improvement resides in the provision of an electroless nickel deposit laid down over the copper layer and under the gold layer, which electroless nickel deposit is laid down from a particular class of nickel-boron or nickel-phosphorus baths.

Abstract: A product useful in the manufacture of printed circuits includes a carrier layer of copper having a thickness on the order of about 10-15 microns. A thin layer of copper having a thickness in the range of 1-12 microns, and which will provide the conductive path for the printed circuit, is secured to the copper carrier by an intermediate metallic layer positioned therebetween and secured to both layers of copper. The intermediate layer has a thickness in the range of 0.1-2.0 microns and is selected from the group consisting of nickel, a nickel-tin alloy, a nickel-iron alloy, lead and a tin-lead alloy. The intermediate layer adheres sufficiently to the thin layer of copper to prevent removal thereof during the etching process which removes the carrier layer of copper. The described thin metallic foil is bonded upon opposite sides of a suitable dielectric which may be a reinforced or non-reinforced epoxy or any one of a number of other suitable materials for forming the core of a printed circuit board.

Abstract: A composite comprises a first metal or alloy component having a thin refractory oxide layer on a first surface thereof. A second metal or alloy component has a second thin refractory oxide on the first surface thereof. Means are provided having a closely matched coefficient of thermal expansion to the first and second metal or alloy components for bonding the first and second thin refractory oxide layers and for electrically insulating the first component from the second component whereby thermal stress between the metal or alloy components and the bonding means is substantially eliminated.

Abstract: Case for a semiconductor component, including at least two parts, one of the parts being a cap, at least the cap being formed of a material having low hydrogen permeability and a weak catalytic effect for an oxyhydrogen gas reaction.