Abstract: A radiation-sensitive resin composition includes an acid-dissociable group-containing resin, and a compound shown by the following general formula (1). wherein Z? represents a monovalent anion shown by a general formula (2), M+ represents a monovalent onium cation, R1 represents a linear or branched alkyl group having 1 to 12 carbon atoms substituted or unsubstantiated with a fluorine atom, or a linear or branched alkoxy group having 1 to 12 carbon atoms, and n is 1 or 2.

Abstract: A positive photosensitive resin composition including: a resin comprising a structural unit having an acid dissociative group and a structural unit having a functional group capable of forming a covalent bond by reacting with a carboxyl group or a phenolic hydroxyl group; and an acid generator represented by the following formula (I): wherein in formula (I), R1 represents a hydrogen atom, an alkyl group, an alkenyl group, a cyano group, an aryl group or the like; R2 represents an alkyl group or an aryl group; each of R3 and R4 independently represents a hydrogen atom, an alkyl group an aryl group or the like; and X represents —O—, —S—, —NH— or the like.

Abstract: The invention provides a retardation film, composed primarily of an acrylic polymer, with transparency, heat resistance, and large retardation. The retardation film of the present invention is composed primarily of an acrylic polymer. The film has an in-plane retardation of from 130 nm to 500 nm, inclusive, per 100 ?m thickness at a wavelength of 589 nm. The film has a total light transmittance of not less than 85%. The retardation film has a glass transition temperature of preferably from 110° C. to 200° C., inclusive. The acrylic polymer, which is the primary component, preferably has a lactone ring structure.

Abstract: The present invention relates to a radically polymerizable composition comprising a hydroxylamine ester used to manufacture color filters. The invention further relates to novel hydroxylamine esters. The invention further relates to the use of hydroxylamine esters in all liquid crystal display components requiring post-baking.

Abstract: The present invention provides a dye-containing negative curable composition comprising at least two dyes (A), an oxime photopolymerization initiator (B) and a radical polymerizable monomer (C); or a dye-containing negative curable composition comprising at east two organic-solvent soluble dyes (A), an oxime photopolymerization initiator (B), a radical polymerizable monomer (C) and an organic solvent (D), wherein the moisture content of the composition is less than 1% by mass relative to the total amount of the composition.

Abstract: A photosensitive resin composition of the present invention includes an acid group-containing vinyl ester resin and a photopolymerization initiator as essential components, wherein the acid group-containing vinyl ester resin is an acid group-containing vinyl ester resin having a multiple-branched molecular structure obtained by the following steps where a polybasic anhydride (a3) is reacted with an epoxy vinyl ester resin (v1) that is a reaction product of an aromatic epoxy resin (a1) and a radically-polymerizable unsaturated-double bond-containing monocarboxylic acid (a2); a radically-polymerizable unsaturated-double bond-containing monoepoxy compound (a4) is subsequently reacted with an acid group formed by the reaction; and a polybasic anhydride (a3) is subsequently reacted with a secondary hydroxyl group formed by the reaction of the compound (a4) with the acid group, thereby obtaining the acid group-containing vinyl ester resin having a multiple-branched molecular structure; and contains 1.75 to 3.

Abstract: A positive photosensitive composition includes: (A) a resin that has an acid decomposable repeating unit of formula (I) and increases its solubility in an alkali developer by action of an acid; (B) a compound that generates an acid upon irradiation; (C) a resin that has: a fluorine atom and/or a silicon atom; and a group selected from groups (x) to (z); and (D) a solvent: (x) an alkali soluble group, (y) a group which decomposes by action of an alkali developer and increases a solubility of the resin (C) in an alkali developer, and (z) a group which decomposes by action of an acid, wherein, Xa1 represents hydrogen, alkyl, cyano or halogen, Ry1 to Ry3 each independently represents alkyl or cycloalkyl, and at least two of Ry1 to Ry3 may be coupled to form a ring, and Z represents a divalent linking group.

Abstract: A resist composition contains; a resin having a structural unit derived from a compound represented by the formula (a); and an acid generator represented by the formula (B1). wherein R1 represents a hydrogen atom or a methyl group; A10 represents a single bond, an optionally substituted C1 to C6 alkanediyl group or the like; W1 represents an optionally substituted C4 to C36 alicyclic hydrocarbon group; A20 in each occurrence independently represents an optionally substituted C1 to C6 aliphatic hydrocarbon group; R2 in each occurrence independently represents a C1 to C12 perfluoroalkyl group; n represents 1 or 2; Q1 and Q2 independently represent a fluorine atom or a C1 to C6 perfluoroalkyl group; Lb1 represents an optionally substituted C1 to C17 divalent aliphatic hydrocarbon group; Y represents an optionally substituted C1 to C18 aliphatic hydrocarbon group; and Z+ represents an organic cation.

Abstract: A polymerizable composition containing: (A) a binder polymer; (B) a compound having a polymerizable unsaturated group; and (C) a compound which has a triarylsulfonium salt structure and in which a sum of Hammett's a constants of all substituents bonded to the aryl skeleton is larger than 0.46.

Abstract: A polymer is provided comprising recurring units having a N,N?-bis(alkoxymethyl)tetrahydropyrimidinone or N,N?-bis(hydroxymethyl)tetrahydropyrimidinone structure on a side chain. When a chemically amplified negative resist composition is formulated using the polymer and processed by lithography, a fine resist pattern can be formed with the advantages of improved LER and high resolution.

Abstract: A radiation-sensitive resin composition includes (A) a fluorine-containing compound that includes a group shown by the following formula (1), and (B) a photoacid generator. wherein RC represents a (p+1)-valent aromatic ring group, Q represents a linking group obtained by removing one hydrogen atom from a monovalent hydrophilic group, RE represents a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms, p is an integer from 1 to 5, provided that a plurality of Q and a plurality of RE may respectively be either the same or different when p is an integer from 2 to 5, and “*” indicates a bonding hand.

Abstract: A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizing compound with a polymerizable ethylenic unsaturated bond, (C) a photoradical polymerization initiator containing a 2,4,5-triarylimidazole dimer or its derivative, and (D) a compound represented by the following general formula (1) (wherein R1 and R2 each independently represent C1-20 alkyl, etc., and R3, R4, R5, R6, R7, R8, R9 and R10 each independently represent hydrogen, etc.).

Abstract: A negative-working lithographic printing plate precursor is disclosed that can be developed on the press without going through a development processing step, and a method of lithographic printing is also disclosed that uses this negative-working lithographic printing plate precursor. A negative-working lithographic printing plate precursor is provided that exhibits excellent on-press developability, nonimage area fine line reproducibility and printing durability and that resists the production of scum during on-press development.

Abstract: Disclosed is a photosensitive resin composition which has excellent transparency, heat resistance, thermal discoloration resistance, adhesion to a substrate and electrical characteristics, while exhibiting good developability and storage stability. Specifically disclosed is a photosensitive resin composition which contains the following components (A), (B) and (C).

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes: (A) a resin capable of increasing a solubility of the resin (A) in an alkali developer by an action of an acid; and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, wherein (B) the compound capable of generating an acid upon irradiation with an actinic ray or radiation is contained in an amount of 10 to 30 mass % based on the entire solid content of the actinic ray-sensitive or radiation-sensitive resin composition, and a pattern forming method uses the composition.

Abstract: Provided is an actinic ray-sensitive or radiation-sensitive resin composition including: (A) a resin capable of increasing the solubility in an alkali developer by the action of an acid, the resin containing (a) a repeating unit represented by the following formula (AN-01), (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and (C) a resin that contains at least either a fluorine atom or a silicon atom and contains a repeating unit having a group capable of decomposing by the action of an alkali developer to increase the solubility in an alkali developer: wherein the variables in formula (AN-01) are defined in the description.

Abstract: A resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the acid-generator component (B) including an acid generator (B1) represented by general formula (b1-1) [in the formula, Y0 represents an alkylene group of 1 to 4 carbon atoms or a fluorinated alkylene group, R0 represents an alkyl group, an alkoxy group, a halogen atom, a halogenated alkyl group, a hydroxy group or an oxygen atom (?O); p represents 0 or 1; and Z+ represents an organic cation.

Abstract: An optical moulding process is disclosed comprising the sequential steps of: (a)(y) forming a layer of a photocurable composition; and (bXz) irradiating selected areas of the composition in the layer with radiation from a radiation source, thereby curing the composition in said selected areas and repeating the steps a) and b) on top of an earlier cured layer to form a three dimensional structure, wherein the radiation source used in step b) is a non-coherent source of radiation and wherein the photocurable composition comprises at least two curable components: (i) 45%-95% (and preferably at least 50%, more preferably at least 60%, e.g.

Abstract: A negative photoresist composition and a method of manufacturing an array substrate. The negative photoresist composition includes a photocurable composition including an ethylene unsaturated compound containing an ethylene unsaturated bond and a photopolymerization initiator, a thermosetting composition including an alkali-soluble resin crosslinked by heat and an organic solvent. The negative photoresist composition improves stability, photosensitivity, detachability after performing a developing operation and reduces residue to improve the reliability of an organic insulation layer. Furthermore, the negative photoresist composition improves the transmittance of an organic insulation layer and reduces the variation of color coordinates to improve the display quality of a display apparatus.

Abstract: This invention relates to iodonium salts, acetal copolymers and polymer binders comprising functional groups capable of undergoing cationic or radical polymerization, their method of preparation and their use in the preparation of coating solutions and coatings. This invention also relates to coatings containing the iodonium salts, acetal copolymers and/or polymer binders and to negative working lithographic printing plates comprising these coatings.

Abstract: An embodiment of the composition contains any of compounds of general formula (I) below:

Abstract: A lithographic printing plate precursor is provided which comprises an aluminum support having a hydrophilic surface and a coating provided thereon, said coating comprising a photopolymerisable composition having a polymerisable compound, a pigment dispersed with a dispersant, a polymerization initiator and a binder, characterized in that the dispersant is a compound free of —COOH, —PO3H2 or —OPO3H2 groups, and the polymerization initiator is a trihalomethyl-aryl sulphone wherein the aryl group is substituted by at least one electron-donating group and wherein the sum of the Hammett constants (sigma) of the substituting groups on said aryl group has a negative value. The printing plate precursor exhibits an excellent daylight stability and shelf-life.

Abstract: The present invention provides a compound represented by the formula (I): wherein R1 represents a hydrogen atom or a methyl group, A1 represents a single bond or *—(CH2)m—CO—O— in which m represents an integer of 1 to 4 and * represents a binding position to —O—, B1 represents —O— or —S—, B2 represents —CH2—, —O— or —S— and W1 represents an optionally substituted aromatic ring, a resin comprising a structural unit derived from the compound and a photoresist composition comprising the resin.

Abstract: A polymer is obtained from a hydroxyphenyl methacrylate monomer having an acid labile group substituted thereon. A positive resist composition comprising the polymer as a base resin has a very high contrast of alkaline dissolution rate before and after exposure, a high resolution, a good profile and minimal line edge roughness of a pattern after exposure, a retarded acid diffusion rate, and good etching resistance.

Abstract: Provided are photoresist compositions useful in forming photolithographic patterns by a negative tone development process. Also provided are methods of forming photolithographic patterns by a negative tone development process and substrates coated with the photoresist compositions. The compositions, methods and coated substrates find particular applicability in the manufacture of semiconductor devices.

Abstract: A photoresist composition is provided. The photoresist composition comprises two or more kinds of photoinitiators having different activation wavelengths whose difference is at least 20 nm. The photoresist composition has high sensitivity and forms a pattern whose thickness is easy to control depending on the exposure intensity through a slit or transflective mask. Further provided are a transparent thin film formed using the photoresist composition and a liquid crystal display device comprising the thin film.

Abstract: The present invention relates to a photosensitive resin composition which is developable with an alkaline aqueous solution and does not need a high temperature for curing and the like, and has all the properties suitable for use in a cover film of a printed circuit board or a laminated body for a semiconductor, and a dry film comprising the same. The photosensitive resin composition comprises (A) a polyamic acid comprising a polymer of at least one diamine compound and at least one acid dianhydride; (B) a photopolymerizable compound having at least one polymerizable ethylenic unsaturated bond in its molecule; and (C) a photoinitiator.

Abstract: Curable compositions have high sensitivity and excellent developability, and further have good storage properties as required. The compositions include a hydroxythiol compound represented by Formula (1) below and a compound with an ethylenically unsaturated double bond: wherein R1 and R2 are each independently a hydrogen atom, a C1-10 alkyl group or an aromatic ring; X is an aliphatic group, an aromatic ring-containing group or a heterocyclic ring-containing group; Y is an ester bond; k and l are each an integer ranging from 1 to 20; m is an integer of 0, 1 or 2; and n is 0 or 1.

Abstract: An alkali development-type solder resist includes (A) a carboxyl group-containing photosensitive resin obtained by reacting (a) a compound having two or more cyclic ether or thioether groups in the molecule with (b) an unsaturated monocarboxylic acid, reacting the product with (c) a polybasic acid anhydride, reacting the resulting resin with (d) a compound having a cyclic ether group and an ethylenic unsaturated group in the molecule, and reacting the product additionally with (c) a polybasic acid anhydride, (B) an oxime ester-based photopolymerization initiator containing a specific oxime ester group, (C) a compound having two or more ethylenic unsaturated groups in the molecule, and (D) a thermosetting component, wherein the dry film obtained by applying the composition has an absorbance of 0.3 to 1.2 per 25 ?m of the film thickness at a wavelength of 350 to 375 nm.

Abstract: A method of forming a resist pattern, including: forming a resist film on a substrate using a resist composition containing a base component (A) which exhibits decreased solubility in an organic solvent under action of an acid and an acid-generator component (B) which generates an acid upon exposure, conducting exposure of the resist film, and patterning the resist film by a negative tone development using a developing solution containing an organic solvent, wherein the base component (A) includes a resin component (A1) containing a structural unit (a0) derived from an acrylate ester containing an acid decomposable group which generates an alcoholic hydroxy group by the action of acid to thereby exhibit increased hydrophilicity.

Abstract: A radiation-sensitive resin composition includes a resin and a photoacid generator. The resin includes a polymer including a first repeating unit shown by a following formula (1) and an acid-dissociable group-containing repeating unit, wherein R1 represents a hydrogen atom or a methyl group, R2 represents an alkylene group having 1 to 12 carbon atoms or an alicyclic alkylene group, and m is an integer from 1 to 3.

Abstract: The positive tone photosensitive composition of the invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound producing an acid by light, a thermal crosslinking agent and an acrylic resin. It is possible to provide a positive tone photosensitive composition that can be developed with an aqueous alkali solution, has sufficiently high sensitivity and resolution, and can form a resist pattern with excellent adhesiveness and thermal shock resistance.

Abstract: Disclosed is a polymerizable fluoromonomer represented by the following general formula (1). In the formula, R1 represents a hydrogen atom, methyl group, fluorine atom, or trifluoromethyl group. n is an integer of 0 or 1, and m is that of from 1 to (3+n). R2 and R3 each independently represents a hydrogen atom or a protective group. A resist containing a fluoropolymer obtained by polymerizing or copolymerizing the monomer is suitable for use in microfabrication by immersion exposure or by a double patterning process based on immersion exposure.

Abstract: The invention provides an acetal compound containing an adamantane ring having an alcoholic hydroxyl group which is protected with an acetal group having a carbonyl moiety of branched structure. A photoresist film comprising a polymer comprising recurring units derived from the acetal compound and an acid generator is characterized by a high dissolution contrast when it is subjected to exposure and organic solvent development to form an image via positive/negative reversal.

Abstract: The photosensitive resin composition of the invention is characterized by comprising (A) a binder polymer, (B) a photopolymerizing compound with at least one polymerizable ethylenic unsaturated bond in the molecule, (C) a photopolymerization initiator and (D) a compound represented by the following general formula (1). In formula (1), R1, R2, R3 and R4 are each independently hydrogen or a compound of the following general formula (2). In general formula (2), R5 represents a C4-30 hydrocarbon group.

Abstract: Provided are sulfonamide-containing photoresist compositions for use in lithographic processes that have improved properties for high resolution, low blur imaging. Also provided are alcohol-soluble photoresists for resist-on-resist applications.

Abstract: Provided are sulfonamide-containing compositions, topcoat polymers, and additive polymers for use in lithographic processes that have improved static receding water contact angles over those known in the art.

Abstract: A chemically amplified negative resist composition is provided comprising (A) an alkali-soluble polymer, (B) an acid generator, and (C) a nitrogen-containing compound as a basic component, the polymer (A) turning alkali insoluble under the catalysis of acid. A basic polymer having a secondary or tertiary amine structure on a side chain serves as components (A) and (C). Processing the negative resist composition by EB or EUV lithography process may form a fine size resist pattern with advantages including uniform diffusion of base, improved LER, controlled deactivation of acid at the substrate interface, and a reduced degree of undercut.

Abstract: A chemically amplified positive resist composition for EB or EUV lithography is provided comprising (A) a polymer or a blend of polymers wherein a film of the polymer or polymer blend is insoluble in alkaline developer, but turns soluble under the action of acid, (B) an acid generator, (C) a basic compound, and (D) a solvent. The basic compound (C) is a polymer comprising recurring units bearing a side chain having a secondary or tertiary amine structure as a basic active site and constitutes a part or the entirety of the polymer or polymers as component (A).

Abstract: A lithographic printing plate precursor includes a support; and an image forming layer formed from a photosensitive composition, wherein the photosensitive composition includes: a photopolymerization initiator; a polymerizable compound; and a binder polymer including a graft chain, and the graft chain is a hydrophilic graft chain including a hydrophilic group.

Abstract: A polymer comprising recurring units of formula (1) and having a solubility in alkaline developer which increases under the action of an alkaline developer is provided. The polymer has transparency to radiation of up to 200 nm and improved water repellency, water slip, acid lability and hydrolysis and is useful as an additive polymer to formulate a resist composition. R1 is H, F, methyl, or trifluoromethyl, R2 is a monovalent fluorinated hydrocarbon group, An is a (n+1)-valent hydrocarbon or fluorinated hydrocarbon group, and n is 1, 2 or 3.

Abstract: A positive resist composition comprising a polymer having a tetrahydrobenzocycloheptane-substituted secondary or tertiary carboxyl group ester as an acid labile group exhibits a high contrast of alkaline dissolution rate before and after exposure, a high resolution, a good pattern profile and minimal edge roughness after exposure, a significant effect of suppressing acid diffusion rate, and improved etching resistance.

Abstract: A negative resist composition comprises a base polymer comprising recurring units having an alkylthio group and having a Mw of 1000-2500, an acid generator, and a basic component, typically an amine compound containing a carboxyl group, but not active hydrogen. A 45-nm line-and-space pattern with a low value of LER can be formed.

Abstract: A fluorinated monomer has formula (1) wherein R1 is H, F, methyl or trifluoromethyl, R2 is a monovalent hydrocarbon group which may have halogen or oxygen, A is a divalent hydrocarbon group, and k1 is 0, 1 or 2. A polymer derived from the fluorinated monomer may be endowed with appropriate water repellency, water slip, acid lability and hydrolysis and is useful as an additive polymer in formulating a resist composition.

Abstract: There is provided a photosensitive adhesive composition having a lowest melt viscosity at 20° C. to 200° C. after pattern formation of 30,000 Pa·s or lower.

Abstract: A fluorine-containing polymeric compound which contains a structural unit (f1) that is decomposable in an alkali developing solution as a block copolymer portion, a base component (A) that exhibits increased solubility in an alkali developing solution under the action of acid, and an acid generator component (B) that generates acid upon exposure.

Abstract: Coating compositions include a polymer including: wherein R1 is a silicon containing moiety, R2 is an acid stable lactone functionality, and R3 is an acid labile lactone functionality; X1, X2, X3 are independently H or CH3; and m and o are non-zero positive integers and n is zero or a positive integer representing the number of repeat units; a photoacid generator; and a solvent. Also disclosed are methods for forming a pattern in the coating composition containing the same.

Abstract: A colored curable composition with which a coating film having excellent uniformity and surface planarity can be formed even when the support (substrate) has irregularities, and which exhibits excellent developability, and which is capable of forming a high-resolution colored pattern, is provided. The colored curable composition includes: (A) a polymer that contains a structural unit having a carboxyl group bonded to a main chain thereof via a linking group containing an ester group; (B) a photopolymerization initiator; (C) a polymerizable compound; (D) a pigment; and (E) a dispersant containing a phosphoric acid group.

Abstract: The invention relates to an antireflective coating composition for a photoresist layer comprising a polymer, a crosslinking agent and an acid generator, where the polymer comprises at least one unit of structure 1, where, X is a linking moiety selected from a nonaromatic (A) moiety, aromatic (P) moiety and mixture thereof, R? is a group of structure (2), R? is independently selected from hydrogen, a moiety of structure (2), Z and W—OH, where Z is a (C1-C20) hydrocarbyl moiety and W is a (C1-C20) hydrocarbylene linking moiety, and, Y? is independently a (C1-C20) hydrocarbylene linking moiety, where structure (2) is where R1 and R2 are independently selected from H and C1-C4alkyl and L is an organic hydrocarbyl group. The invention further relates to a process for imaging the antireflective coating composition.

Abstract: The present invention relates to a photosensitive resin composition including a) an alkali-soluble acrylate resin, b) a cross-linking monomer having at least two ethylenic double bonds, and c) a phosphinoxide based photopolymerization initiator and an acridon based photopolymerization initiator; a preparation method thereof; and a dry film resist comprising the same.