Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor Patents (Class 438/26)
  • Patent number: 11462715
    Abstract: A display device in one embodiment according to the present invention includes a first region including a light emitting layer, a first nitride insulating layer over the light emitting layer, a first organic insulating layer over the first nitride insulating layer, a second nitride insulating layer over the first organic insulating layer, and a third nitride insulating layer over the second nitride insulating layer. The second nitride insulating layer is in contact with the first organic insulating layer and the third nitride insulating layer. An absolute value of a stress of the second nitride insulating layer is greater than or equal to an absolute value of a stress of the first nitride insulating layer and less than an absolute value of a stress of the third nitride insulating layer.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: October 4, 2022
    Assignee: Japan Display Inc.
    Inventors: Hiroki Ohara, Akinori Kamiya
  • Patent number: 11444255
    Abstract: A flexible display device is manufactured with high yield. A display device having high resistance to repeated bending is provided. The display device is manufactured by forming a separation layer over a support substrate; forming, over the separation layer, an inorganic insulating layer including a first portion and a second portion; forming a display element over the inorganic insulating layer to be overlapped with the first portion; forming a connection electrode over the inorganic insulating layer to be overlapped with the second portion; sealing the display element; separating the support substrate and the inorganic insulating layer using the separation layer; attaching a substrate to the inorganic insulating layer to be overlapped with the first portion; and etching the second portion using the substrate as a mask to expose the connection electrode.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: September 13, 2022
    Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
    Inventors: Takaaki Nagata, Tatsuya Sakuishi, Kohei Yokoyama, Yasuhiro Jinbo, Taisuke Kamada, Akihiro Chida
  • Patent number: 11415291
    Abstract: Provided are a light-emitting device and a method of manufacturing the same. The light-emitting device includes a flexible surface light source curved in a desired shape, a first fixture that includes first and second positioning ribs, and has a first curved surface between the first and second positioning ribs, and a second fixture having a second curved surface. The method includes mounting the surface light source in a flat state on the first positioning rib and the second positioning rib such that the front or rear surface and the first curved surface face to each other across a space, bringing the second fixture close to the first fixture and pushing the surface light source toward the first fixture to curve the surface light source, and fixing the first and second fixtures together with the curved surface light source held therebetween.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: August 16, 2022
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Koichiro Ano, Hiroyuki Chikama, Kazuho Nakajima
  • Patent number: 11398592
    Abstract: A method for manufacturing a light emitting module includes: providing light emitting devices each including a light emitting element having an upper surface, a lateral surface, and an electrode positioned on the upper surface, a first light reflective member arranged on the lateral surface of the light emitting element, and a metal film formed on upper surfaces of the electrode and the first light reflective member; placing the light emitting devices on a light guide plate with gaps between the light emitting devices, with the metal films of the light emitting devices facing upward; forming masks respectively covering the metal films; forming a second light reflective member in the gaps between the light emitting devices on the light guide plate; removing the masks; and forming, on the light emitting devices and on the second light reflective member, wiring segments that connect to the metal films.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: July 26, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Koji Taguchi, Masaaki Katsumata
  • Patent number: 11398524
    Abstract: A chip-on-board type photoelectric device exemplarily includes: a package substrate, provided with a chip mounting region, a first electrode and a second electrode, the first and second electrodes being arranged spaced from each other at a periphery of the chip mounting region; first photoelectric chips, arranged in the chip mounting region to form inwardly concave strip-shaped patterns as mutually spaced first color temperature regions, and electrically connected between the first and second electrodes to form at least one first photoelectric chip string; and second photoelectric chips, arranged in the chip mounting region to form second color temperature regions. A light-emitting color temperature of each the second color temperature region is higher than that of each the first color temperature region. The second photoelectric chips are electrically connected between the first and second electrodes to form second photoelectric chip strings. A good uniformity of light mixing can be achieved.
    Type: Grant
    Filed: October 3, 2021
    Date of Patent: July 26, 2022
    Assignee: KAISTAR LIGHTING (XIAMEN) CO., LTD.
    Inventors: Chen Chu, Gang Wang
  • Patent number: 11374208
    Abstract: A method of manufacturing a display apparatus includes: forming a plurality of displays including a light-emitting diode on a surface of a first mother substrate; preparing a second mother substrate; forming a first sealed area on a surface of at least one of the first mother substrate or the second mother substrate, wherein the first sealed area surrounds each of the plurality of displays and includes a frit; firstly bonding the first mother substrate to the second mother substrate by melting the frit in the first sealed area by radiating a first laser beam; and secondly bonding the first mother substrate to the second mother substrate by forming a second sealed area in which the frit and the first mother substrate, and/or the frit and the second mother substrate, are melted and mixed with each other by radiating a second laser beam partially in the first sealed area.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: June 28, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Taekyu Kim, Kwangbok Kim, Wonhee Lee
  • Patent number: 11374133
    Abstract: A method for forming electrical contacts for a solar cell and a solar cell formed using the method is provided. The method includes forming a first metal layer over predefined portions of a surface of the solar cell; depositing a carbon nanotube layer over the first metal layer; and forming a second metal layer over the carbon nanotube layer, wherein the first metal layer, the carbon nanotube layer, and the second metal layer form a first metal matrix composite layer that provides electrical conductivity and mechanical support for the metal contacts.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: June 28, 2022
    Assignee: UNM RAINFOREST INNOVATIONS
    Inventors: Sang M. Han, Omar Abudayyeh, David Wilt, Nathan Gapp
  • Patent number: 11362244
    Abstract: A light-emitting diode display having sub-pixel regions is provided. Each of the sub-pixel region includes a substrate, first and second electrodes, a light-emitting diode, and at least one blocking wall. The substrate has an active device. The first and second electrodes are separately disposed on the substrate. The first electrode is electrically connected to the active device, and a horizontal distance between the first and second electrodes is W1. The light-emitting diode is disposed on the substrate and includes a semiconductor stack, and first and second pads. The first pad contacts the first electrode, the second pad contacts the second electrode, and a maximum thickness of the semiconductor stack is H1. The blocking wall is disposed on the substrate and located between the first and second pads to prevent a contact therebetween. A height of the blocking wall is H2 and a width thereof is W2. H2?½H1, and W2?W1.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: June 14, 2022
    Assignee: Au Optronics Corporation
    Inventors: Yi-Fen Lan, Tsung-Tien Wu
  • Patent number: 11333896
    Abstract: The systems and methods discussed herein are for the fabrication of diffraction gratings, such as those gratings used in waveguide combiners. The waveguide combiners discussed herein are fabricated using nanoimprint lithography (NIL) of high-index and low-index materials in combination with and directional etching high-index and low-index materials. The waveguide combiners can be additionally or alternatively formed by the directional etching of transparent substrates. The waveguide combiners that include diffraction gratings discussed herein can be formed directly on permanent transparent substrates. In other examples, the diffraction gratings can be formed on temporary substrates and transferred to a permanent, transparent substrate.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: May 17, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Ludovic Godet, Wayne McMillan, Rutger Meyer Timmerman Thijssen
  • Patent number: 11319486
    Abstract: A ceramic complex that has improved optical characteristics including luminous efficiency is provided. A method for producing a ceramic complex, including: preparing a molded body containing rare earth aluminum garnet fluorescent material, aluminum oxide, and lutetium oxide, and having a content of the rare earth aluminum garnet fluorescent material in a range of 15% by mass or more and 50% by mass or less, and a content of the lutetium oxide in a range of 0.2% by mass or more and 4.5% by mass or less, based on the total amount of the rare earth aluminum garnet fluorescent material, the aluminum oxide, and the lutetium oxide; and calcining the molded body in an air atmosphere to provide a ceramic complex having a relative density in a range of 90% or more and less than 100%.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: May 3, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Masaki Kondo, Shozo Taketomi, Takafumi Sumie, Seigo Sunagawa, Hirofumi Ooguri
  • Patent number: 11322665
    Abstract: A converter layer bonding device, and methods of making and using the converter layer bonding device are disclosed. A converter layer bonding device as disclosed herein includes a release liner and an adhesive layer coating the release liner, the adhesive layer is solid and non-adhesive at room temperature, and is adhesive at an elevated temperature above room temperature.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: May 3, 2022
    Assignee: Lumileds LLC
    Inventors: Emma Dohner, Grigoriy Basin, Daniel B. Roitman, Vernon K. Wong
  • Patent number: 11312803
    Abstract: The present invention pertains to a vinylidene fluoride polymer, to a process for manufacturing said vinylidene fluoride polymer and to an article comprising said vinylidene fluoride polymer.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: April 26, 2022
    Assignee: SOLVAY SPECIALTY POLYMERS ITALY S.P.A.
    Inventors: Ségolène Brusseau, Julio A. Abusleme
  • Patent number: 11315898
    Abstract: A method for fastening a semiconductor chip on a substrate and an electronic component are disclosed. In an embodiment a method includes providing a semiconductor chip, applying a solder metal layer sequence on the semiconductor chip, providing a substrate, applying a metallization layer sequence on the substrate, applying the semiconductor chip on the substrate via the solder metal layer sequence and the metallization layer sequence and heating the applied semiconductor chip on the substrate for fastening the semiconductor chip on the substrate. The solder metal layer may include a first metallic layer comprising an indium-tin alloy, a barrier layer arranged above the first metallic layer and a second metallic layer comprising gold arranged between the barrier layer and the semiconductor chip, wherein an amount of substance of the gold in the second metallic layer is greater than an amount of substance of tin in the first metallic layer.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: April 26, 2022
    Assignee: OSRAM OLED GMBH
    Inventors: Klaus Mueller, Andreas Ploessl, Mathias Wendt
  • Patent number: 11309470
    Abstract: An array substrate and a method of fabricating the array substrate are disclosed. The array substrate includes a substrate including a plurality of pixel units arranged in an array. Each of the pixel units has a first electrode and a second electrode, and a first gap is provided between the first electrode and the second electrode. A bonding adhesive is disposed at the first gap. A micro light-emitting diode is disposed on the first electrode, the second electrode, and the bonding adhesive to prevent a failure of the micro light-emitting diode and improve product yield.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: April 19, 2022
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Yong Fan
  • Patent number: 11305465
    Abstract: A method for manufacturing a phosphor sheet is provided. In the method, a particulate phosphor and a particulate transparent medium are mixed to a first light transmissive resin in a liquid state. The first light transmissive resin containing the phosphor and the transparent medium in the liquid state is supplied into a lower mold of a mold, and the mold is closed. The first light transmissive resin containing the phosphor and the transparent medium in the liquid state is changed to a solid state having a predetermined thickness by applying a heat and a pressure to the first light transmissive resin containing the phosphor and the transparent medium in the liquid state.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: April 19, 2022
    Assignee: MINEBEA MITSUMI Inc.
    Inventors: Tadashi Ono, Makoto Kitazume
  • Patent number: 11302889
    Abstract: A flexible display module and a method for manufacturing the same solve a problem that the existing flexible display module is easy to be failure after being bent. The flexible display module includes: a flexible glass layer; and a display panel disposed inside the flexible glass layer.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: April 12, 2022
    Assignee: Yungu (Gu'an) Technology Co., Ltd.
    Inventors: Kun Hu, Hao Feng, Pengle Dang, Lu Rao, Bo Yuan, Shixing Cai
  • Patent number: 11264409
    Abstract: There is provided an array base plate, including: a substrate; a first patterned part disposed on the substrate and adjacent to an encapsulation region of the substrate; a second patterned part disposed on the substrate, in a same layer as the first patterned part and adjacent to the first patterned part; wherein the first patterned part includes a through part on its side close to the second patterned part. There is also provided a manufacturing method for manufacturing the array base plate, and a display panel including the array base plate.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: March 1, 2022
    Assignees: ORDOS YUANSHENG OPTOELECTRONICS CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Nini Bai, Feng Kang, Liangliang Liu, Liang Tang, Zhiyong Xue, Hailong Li
  • Patent number: 11257705
    Abstract: A method of selecting semiconductor chips includes: A) providing the semiconductor chips in a composite, B) producing a cohesive, mechanical first connection between the semiconductor chips and a carrier film, C) singulating the semiconductor chips, wherein the carrier film mechanically connects the semiconductor chips to one another after singulation, D) selectively weakening the first connection between some singulated semiconductor chips and the carrier film, depending on electro-optical and/or electrical properties of the semiconductor chips, and E) removing the semiconductor chips whose first connection is selectively weakened from the carrier film.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: February 22, 2022
    Assignee: OSRAM OLED GmbH
    Inventors: Daniel Richter, Gunnar Petersen, Konrad Wagner
  • Patent number: 11143913
    Abstract: A display apparatus and a backlight unit thereof. The display apparatus includes: a frame; a plurality of light emitting diodes regularly arranged on the frame; an optical part disposed above the plurality of light emitting diodes and including a display panel and at least one of a phosphor sheet and an optical sheet; and a light guide plate disposed between the frame and the optical part to cover the plurality of light emitting diodes, wherein the light guide plate is formed with light source grooves placed corresponding to locations of the plurality of light emitting diodes, respectively, such that light emitted from each of the light emitting diodes enters the corresponding light source groove to spread light in a lateral direction when the light enters the light guide plate, thereby enabling use of a direct type backlight unit without a separate lens.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: October 12, 2021
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Eun Ju Kim
  • Patent number: 11121059
    Abstract: The present invention concerns a power module composed of a first and second parts (100a, 100b), the first part being composed of conductor layers and insulation layers, characterized in that a first conductor layer is on bottom of the first part, the second part is composed of at least one second conductor layer, the first and/or the second conductor layers comprise cavities that form pipes (300a, 300b) when the first and second conductor layers are in contact, and in that the first and the second conductor layers are bonded together by a metal plating (400a, 400g) of the walls of the pipes.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: September 14, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Roberto Mrad, Stefan Mollov
  • Patent number: 11063177
    Abstract: A process for producing at least two adjacent regions, each comprising an array of light-emitting wires connected together in a given region by a transparent conductive layer, comprises: producing, on a substrate, a plurality of individual zones for growing wires extending over an area greater than the cumulative area of the two chips; growing wires in the individual growth zones; removing wires from at least one zone forming an initial free area to define the arrays of wires, the initial free area comprising individual growth zones level with the removed wires; and depositing a transparent conductive layer on each array of wires to electrically connect the wires of a given array of wires, each conductive layer being separated from the conductive layer of the neighbouring region by a free area. A device obtained using the process of the invention is also provided.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: July 13, 2021
    Assignees: ALEDIA, COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Eric Pourquier, Hubert Bono
  • Patent number: 11043654
    Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: June 22, 2021
    Assignee: OSRAM OLED Gmbh
    Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang
  • Patent number: 11015769
    Abstract: A lighting device including a glass tube; a solid state lighting assembly in said glass tube, said assembly having an electrically insulating optical film having at least one arcuate portion lining a part of the inner surface of the glass tube, wherein the glass tube further has a further part defining a light exit portion; and a plurality of solid state lighting elements on a carrier, said carrier contacting said optical film; a thermally conductive member in between at least a part of the solid state lighting assembly and the glass tube for thermally coupling the solid state lighting elements to the glass tube; and a transparent or translucent electrically insulating cover contacting the electrically insulating optical film and covering the solid state lighting elements. A luminaire including such a lighting device and a lighting device assembly method are also disclosed.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: May 25, 2021
    Assignee: SIGNIFY HOLDING B.V.
    Inventors: Qun Luo, YueJun Sun, Xing Peng Yang, Min Chen, Dirk Gehrels, Ximei Lian, Mark Sipkes, Martinus Hermanus Wilhelmus Maria Van Delden
  • Patent number: 11013111
    Abstract: An electronic device includes a first substrate, a first conductive layer, a plurality of first electrode pads, a plurality of first light-emitting units, a plurality of first signal pads and a conductive structure. The first conductive layer is disposed on the first substrate. The first electrode pads are disposed on the first conductive layer. The first light-emitting units overlap and are disposed on the first electrode pads. The first light-emitting units are electrically connected to the first electrode pads respectively. The first signal pads are disposed on the first conductive layer and electrically connected to the first conductive layer. The conductive structure is disposed on the first signal pads, and at least two of the first signal pads are electrically connected to each other through the conductive structure.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: May 18, 2021
    Assignee: INNOLUX CORPORATION
    Inventors: Wen-Chang Tsai, Li-Wei Mao, Ming-Chun Tseng, Chi-Liang Chang, Yi-Hua Hsu, Meng-Chieh Cheng
  • Patent number: 10991904
    Abstract: An organic EL element comprises a supporting substrate 12 having a first side surface 12b and a second side surface 12c located opposite to the first side surface in the first direction, a first electrode-attached on the supporting substrate, an organic EL body 16 disposed on the first electrode, a second electrode 18 disposed extending from the first side surface to the second side surface and covering at least a part of the organic EL body, and a sealing member disposed on the second electrode, extending from the first side surface to the second side surface and sealing at least the organic EL body, each of the side surfaces 18a and 20a of the second electrode and the sealing member on the first side surface-side being made evened with the first side surface, and each of the side surfaces 18b and 20b of the second electrode and the sealing member on the second side surface-side being made evened with the second side surface, in the first direction.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: April 27, 2021
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Masaya Shimogawara, Shinichi Morishima, Masato Shakutsui
  • Patent number: 10950746
    Abstract: A method for producing a plurality of optoelectronic components are disclosed.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: March 16, 2021
    Assignee: OSRAM OLED GMBH
    Inventor: Marco Englhard
  • Patent number: 10937668
    Abstract: A semiconductor package manufacturing method includes the steps of bonding a plurality of semiconductor chips to the front side of a wiring substrate, next supplying a sealing compound to the front side of the wiring substrate to thereby form a sealing layer from the sealing compound on the front side of the wiring substrate, thereby forming a package substrate, next holding the package substrate on a holding tape, next cutting the front side of the resin layer by using a profile grinding tool to thereby form a plurality of ridges and grooves on the front side of the resin layer, thereby increasing the surface area of the front side of the resin layer, and next dividing the package substrate along each division line to obtain a plurality of individual semiconductor packages.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: March 2, 2021
    Assignee: DISCO CORPORATION
    Inventors: Youngsuk Kim, Byeongdeck Jang
  • Patent number: 10928674
    Abstract: A manufacturing method using a micro-miniature LED as a light source for backlight thickness reduction and light efficiency improvement comprising a plurality of spaced apart light emitting diode chips on a substrate. Colloid with uniformly distributed diffusion particles is coated to fill gaps between LED chips. A roller is applied to the surface of the colloid and a continuous geometric structure is formed with a cone structure in the horizontal-vertical (XY axis) direction. An ultraviolet curing device is used for optical UV curing of the continuous geometric structure to create a brightness enhancement layer.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: February 23, 2021
    Assignees: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD., INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD., GENERAL INTERACE SOLUTION LIMITED
    Inventors: Hsien-Ying Chou, Po-Lun Chen, Nai-Hau Shiue, Chun-Ta Chen, Ta-Jen Huang, Yi-Lin Sun
  • Patent number: 10847504
    Abstract: A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: November 24, 2020
    Assignee: LUMENS CO., LTD.
    Inventors: Taekyung Yoo, Daewon Kim, Seongbok Yoon, Yelim Won, Myungji Moon, Hanbeet Chang, Yongpil Kim, Jaesoon Park
  • Patent number: 10847589
    Abstract: A method for manufacturing an OLED display panel is provided. The method includes steps of providing an array substrate; forming an OLED function layer including a first common layer, an organic light-emitting layer, and a second common layer on the array substrate; forming a first opening at a location near to the organic light-emitting layer using a first laser; forming a thin-film encapsulation layer on the OLED function layer; forming a second opening at a location corresponding to the first opening using a dry etching technique, the second opening passing through an inorganic layer of the thin-film encapsulation layer and at least one inorganic layer of the array substrate, and being connected to the first opening; and forming a perforated hole in the substrate at a location corresponding to the second opening using a second laser, thereby producing a through-hole in the OLED display panel.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: November 24, 2020
    Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventor: Ming Xiang
  • Patent number: 10818819
    Abstract: A micro light emitting device including a component layer, a first electrode and a second electrode is provided. The component layer includes a main body and a protruding structure disposed on the main body. The first electrode is electrically connected to the component layer. The second electrode is electrically connected to the component layer. The first electrode, the second electrode and the protruding structure are disposed on the same side of the main body. The protruding structure is located between the first electrode and the second electrode. A connection between the first electrode and the second electrode traverses the protruding structure. The main body has a surface. The protruding structure has a first height with respect to the surface. Any one of the first electrode and the second electrode has a second height with respect to the surface. The relation 0.8?H1/H2?1.2 is satisfied, wherein H1 is the first height and H2 is the second height.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: October 27, 2020
    Assignee: PixeLED Display CO., LTD.
    Inventors: Pai-Yang Tsai, Fei-Hong Chen, Yi-Chun Shih
  • Patent number: 10810480
    Abstract: The present disclosure provides an electronic system including an electronic device and an electronic tag. The electronic device includes a printed circuit board. The electronic tag includes a substrate and an antenna, wherein the substrate is disposed at a height over the printed circuit board. The substrate has a first side and a second side, wherein the first side is opposite to the second side. The antenna has a first portion and a second portion, wherein the first portion is disposed on the first side, the second portion is to disposed on the second side, and the first portion is electrically coupled to the second portion via plated through holes.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: October 20, 2020
    Assignee: MICROELECTRONICS TECHNOLOGY, INC.
    Inventors: Chang-Chun Chen, Wei Huang Chen, Tung-Hua Yang
  • Patent number: 10777777
    Abstract: The present invention relates to a passivation film deposition method for a light-emitting diode, comprising the steps of: depositing, on an upper part of a light-emitting diode of a substrate, a first passivation film having a silicon nitride (SiNx); and depositing, on an upper part of the first passivation film, a second passivation film having a silicon oxide (SiOx), wherein the ratio of the thickness of the first passivation film to the thickness of the second passivation film is 0.2-0.4:1.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: September 15, 2020
    Assignee: TES CO., LTD
    Inventors: Hong-Jae Lee, Jong-Hwan Kim, Woo-Pil Shim, Woo-Jin Lee, Sung-Yean Yoon, Don-Hee Lee
  • Patent number: 10756069
    Abstract: A display device manufacturing method, display device and electronics apparatus are provided. The display device manufacturing method comprises: forming the vertical micro-LEDs on a growth substrate: forming a first electrode on top of each of the vertical micro-LEDs; forming a second electrode on side surface of each of the vertical micro-LEDs; and transferring the vertical micro-LEDs from the growth substrate to a display substrate of a display device. An embodiment of this invention can reduce the back-end fabrication process on a display substrate after transfer.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: August 25, 2020
    Assignee: Goertek Inc.
    Inventor: Quanbo Zou
  • Patent number: 10741717
    Abstract: Embodiments relate to a micro light-emitting-diode (?LED) fabricated using a self-aligned process. To fabricate the ?LED, a metal layer is deposited on a p-type semiconductor. The p-type semiconductor is on an n-type semiconductor and the n-type semiconductor is on a top side of a substrate. The metal layer is patterned to define a p-metal. The p-type semiconductor is etched using the p-metal as an etch mask. Similarly, the n-type semiconductor is etched using the p-metal and the p-type semiconductor as an etch mask. A negative photoresist layer is deposited over the patterned p-metal and the p-type semiconductor. The negative photoresist is then exposed from the back side of the substrate, thus exposing the regions of the negative photoresist that are not masked by the p-metal. The negative photoresist is then developed to expose the p-metal.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: August 11, 2020
    Assignee: Facebook Technologies, LLC
    Inventors: Celine Claire Oyer, David Massoubre, Tilman Zehender
  • Patent number: 10680155
    Abstract: A cross-plane flexible micro-TEG with hundreds of pairs of thermoelectric pillars formed via electroplating, microfabrication, and substrate transferring processes is provided herein. Typically, fabrication is conducted on a Si substrate, which can be easily realized by commercial production line. The fabricated micro-TEG transferred to the flexible layer from the Si substrate. Fabrication methods provided herein allow fabrication of main TEG components including bottom interconnectors, thermoelectric pillars, and top interconnectors by electroplating. Such flexible micro-TEGs provide high output power density due to high density of thermoelectric pillars and very low internal resistance of electroplated components. The flexible micro-TEG can achieve a power per unit area of 4.5 mW cm?2 at a temperature difference of ˜50 K, which is comparable to performance of flexible TEGs developed by screen printing.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: June 9, 2020
    Assignee: The Chinese University of Hong Kong
    Inventors: Wenhua Zhang, Dongyan Xu
  • Patent number: 10651335
    Abstract: A semiconductor light-emitting device comprises a substrate; a first adhesive layer on the substrate; multiple epitaxial units on the first adhesive layer; a second adhesive layer on the multiple epitaxial units; multiple first electrodes between the first adhesive layer and the multiple epitaxial units, and contacting the first adhesive layer and the multiple epitaxial units; and multiple second electrodes between the second adhesive layer and the multiple epitaxial units, and contacting the second adhesive layer and the multiple epitaxial units; wherein the multiple epitaxial units are totally separated.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: May 12, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Hsin-Chih Chiu, Chih-Chiang Lu, Chun-Yu Lin, Ching-Huai Ni, Yi-Ming Chen, Tzu-Chieh Hsu, Ching-Pei Lin
  • Patent number: 10644207
    Abstract: A light emitting layer including a plurality of light emitting particles embedded within a host matrix material. Each of said light emitting particles includes a population of semiconductor nanoparticles embedded within a polymeric encapsulation medium. A method of fabricating a light emitting layer comprising a plurality of light emitting particles embedded within a host matrix material, each of said light emitting particles comprising a population of semiconductor nanoparticles embedded within a polymeric encapsulation medium. The method comprises providing a dispersion containing said light emitting particles, depositing said dispersion to form a film, and processing said film to produce said light emitting layer.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: May 5, 2020
    Assignee: Nanoco Technologies, Ltd.
    Inventors: Imad Naasani, Nigel Pickett
  • Patent number: 10615310
    Abstract: A light emitting device includes a substrate, a light emitting element, and a plurality of bumps. The light emitting element is mounted on the substrate. The bumps connect the substrate and the light emitting element. The bumps are arranged in a plurality of columns extending parallel to one side of an outer edge of the light emitting element. A distance between adjacent ones of the bumps in one of the columns arranged closest to the outer edge of the light emitting element is larger than a distance between adjacent ones of the bumps arranged on an inner side of the light emitting element in a plan view.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: April 7, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Kenji Ozeki, Akira Goto
  • Patent number: 10607967
    Abstract: In order to be more compact and thin, this light emitting device includes LED elements embedded in a resin molded body such that light emitting units are exposed on a lateral surface of the resin molded body and positive electrodes and negative electrodes are exposed on a back surface which is perpendicular to the lateral surface of the resin molded body.
    Type: Grant
    Filed: November 25, 2016
    Date of Patent: March 31, 2020
    Assignee: OMRON Corporation
    Inventors: Wakahiro Kawai, Kazuyuki Otake
  • Patent number: 10600938
    Abstract: A light-emitting device includes: a light-emitting stack including a first active layer emitting a first light having a first peak wavelength; a diode emitting a second light having a second peak wavelength between 800 nm and 1900 nm; and a tunneling junction between the diode and the light-emitting stack, wherein the tunneling junction includes a first tunneling layer and a second tunneling layer on the first tunneling layer, the first tunneling layer has a band gap and a thickness of the first tunneling layer is greater than a thickness of the second tunneling layer.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: March 24, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Chih-Chiang Lu, Yi-Chieh Lin, Rong-Ren Lee, Yu-Ren Peng, Ming-Siang Huang, Ming-Ta Chin, Yi-Ching Lee
  • Patent number: 10490578
    Abstract: This disclosure provides an array substrate, a manufacturing method thereof, and a display panel. The array substrate includes an organic film layer disposed over a substrate, and is provided with a groove, which is configured for positioning a sealant, extends through the organic film layer, and has an opening on a side opposing to the substrate. The array substrate can further include a sealing film, which covers surfaces of the groove to thereby prevent gas release from the organic film layer.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: November 26, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Jideng Zhou, Wei Zhang
  • Patent number: 10440834
    Abstract: Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: October 8, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Hirohisa Hino, Naomichi Ohashi, Yuki Yoshioka, Masato Mori, Yasuhiro Suzuki
  • Patent number: 10418533
    Abstract: A light-emitting device includes a package, a light-emitting element disposed on the package, and a light-transmissive member over the light-emitting element. An upper surface of the light-transmissive member and an upper surface of the package each have a plurality of projections. The light-transmissive member contains particles of light-transmissive first fillers having refractive indices smaller than the refractive index of a matrix of the light-transmissive member. Part of the particles of the first fillers is exposed to the air from the matrix of the light-transmissive member on the upper surface of the light-transmissive member.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: September 17, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Koji Abe, Yasushi Okamoto
  • Patent number: 10374122
    Abstract: Techniques for controlling oxygen concentration levels during annealing of highly-reflective contacts for LED devices together with lamps, LED device and method embodiments thereto are disclosed.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: August 6, 2019
    Assignee: SORAA, INC.
    Inventors: Christophe Hurni, Remi Delille
  • Patent number: 10357483
    Abstract: Disclosed are dosings of therapeutic macromolecules and immunosuppressants, in some embodiments attached to synthetic nanocarriers, in combination with dosings of therapeutic macromolecules without synthetic nanocarriers, and related methods that provide reduced humoral immune responses.
    Type: Grant
    Filed: May 2, 2014
    Date of Patent: July 23, 2019
    Assignee: Selecta Biosciences, Inc.
    Inventors: Roberto A. Maldonado, Takashi Kei Kishimoto
  • Patent number: 10355246
    Abstract: The following relates to barrier coating for organic optoelectronic devices. In particular, the following relates a barrier coating comprising and methods and processes for depositing a barrier coating on a surface.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: July 16, 2019
    Assignee: OTI Lumionics Inc.
    Inventors: Michael Helander, Zhibin Wang, Jacky Qiu, Yi-Lu Chang, Qi Wang
  • Patent number: 10334737
    Abstract: A flexible display device includes a flexible substrate that includes a first side; a display unit disposed in a first region of the first side and that includes a plurality of pixels; and a pad portion disposed in a second region of the first side and that includes a plurality of pad electrodes. The flexible substrate includes a stepwise recess portion disposed along an edge of the first side on which end portions of the pad electrodes are provided.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: June 25, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Young Sik Heo, Myeong Seok Jeong, Won Ho Lee
  • Patent number: 10312418
    Abstract: A light emitting layer including a plurality of light emitting particles embedded within a host matrix material. Each of said light emitting particles includes a population of semiconductor nanoparticles embedded within a polymeric encapsulation medium. A method of fabricating a light emitting layer comprising a plurality of light emitting particles embedded within a host matrix material, each of said light emitting particles comprising a population of semiconductor nanoparticles embedded within a polymeric encapsulation medium. The method comprises providing a dispersion containing said light emitting particles, depositing said dispersion to form a film, and processing said film to produce said light emitting layer.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: June 4, 2019
    Assignee: Nanoco Technologies Ltd.
    Inventors: Imad Naasani, James Harris, Nigel Pickett
  • Patent number: 10312467
    Abstract: An organic EL element comprises a supporting substrate 12 having a first side surface 12b and a second side surface 12c located opposite to the first side surface in the first direction, a first electrode-attached on the supporting substrate, an organic EL body 16 disposed on the first electrode, a second electrode 18 disposed extending from the first side surface to the second side surface and covering at least a part of the organic EL body, and a sealing member disposed on the second electrode, extending from the first side surface to the second side surface and sealing at least the organic EL body, each of the side surfaces 18a and 20a of the second electrode and the sealing member on the first side surface-side being made evened with the first side surface, and each of the side surfaces 18b and 20b of the second electrode and the sealing member on the second side surface-side being made evened with the second side surface, in the first direction.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: June 4, 2019
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Masaya Shimogawara, Shinichi Morishima, Masato Shakutsui