Abstract: A lighting device including a glass tube; a solid state lighting assembly in said glass tube, said assembly having an electrically insulating optical film having at least one arcuate portion lining a part of the inner surface of the glass tube, wherein the glass tube further has a further part defining a light exit portion; and a plurality of solid state lighting elements on a carrier, said carrier contacting said optical film; a thermally conductive member in between at least a part of the solid state lighting assembly and the glass tube for thermally coupling the solid state lighting elements to the glass tube; and a transparent or translucent electrically insulating cover contacting the electrically insulating optical film and covering the solid state lighting elements. A luminaire including such a lighting device and a lighting device assembly method are also disclosed.

Abstract: An electronic device includes a first substrate, a first conductive layer, a plurality of first electrode pads, a plurality of first light-emitting units, a plurality of first signal pads and a conductive structure. The first conductive layer is disposed on the first substrate. The first electrode pads are disposed on the first conductive layer. The first light-emitting units overlap and are disposed on the first electrode pads. The first light-emitting units are electrically connected to the first electrode pads respectively. The first signal pads are disposed on the first conductive layer and electrically connected to the first conductive layer. The conductive structure is disposed on the first signal pads, and at least two of the first signal pads are electrically connected to each other through the conductive structure.

Abstract: An organic EL element comprises a supporting substrate 12 having a first side surface 12b and a second side surface 12c located opposite to the first side surface in the first direction, a first electrode-attached on the supporting substrate, an organic EL body 16 disposed on the first electrode, a second electrode 18 disposed extending from the first side surface to the second side surface and covering at least a part of the organic EL body, and a sealing member disposed on the second electrode, extending from the first side surface to the second side surface and sealing at least the organic EL body, each of the side surfaces 18a and 20a of the second electrode and the sealing member on the first side surface-side being made evened with the first side surface, and each of the side surfaces 18b and 20b of the second electrode and the sealing member on the second side surface-side being made evened with the second side surface, in the first direction.

Abstract: A method for producing a plurality of optoelectronic components are disclosed.

Abstract: A semiconductor package manufacturing method includes the steps of bonding a plurality of semiconductor chips to the front side of a wiring substrate, next supplying a sealing compound to the front side of the wiring substrate to thereby form a sealing layer from the sealing compound on the front side of the wiring substrate, thereby forming a package substrate, next holding the package substrate on a holding tape, next cutting the front side of the resin layer by using a profile grinding tool to thereby form a plurality of ridges and grooves on the front side of the resin layer, thereby increasing the surface area of the front side of the resin layer, and next dividing the package substrate along each division line to obtain a plurality of individual semiconductor packages.

Abstract: A manufacturing method using a micro-miniature LED as a light source for backlight thickness reduction and light efficiency improvement comprising a plurality of spaced apart light emitting diode chips on a substrate. Colloid with uniformly distributed diffusion particles is coated to fill gaps between LED chips. A roller is applied to the surface of the colloid and a continuous geometric structure is formed with a cone structure in the horizontal-vertical (XY axis) direction. An ultraviolet curing device is used for optical UV curing of the continuous geometric structure to create a brightness enhancement layer.

Abstract: A method for manufacturing an OLED display panel is provided. The method includes steps of providing an array substrate; forming an OLED function layer including a first common layer, an organic light-emitting layer, and a second common layer on the array substrate; forming a first opening at a location near to the organic light-emitting layer using a first laser; forming a thin-film encapsulation layer on the OLED function layer; forming a second opening at a location corresponding to the first opening using a dry etching technique, the second opening passing through an inorganic layer of the thin-film encapsulation layer and at least one inorganic layer of the array substrate, and being connected to the first opening; and forming a perforated hole in the substrate at a location corresponding to the second opening using a second laser, thereby producing a through-hole in the OLED display panel.

Abstract: A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.

Abstract: A micro light emitting device including a component layer, a first electrode and a second electrode is provided. The component layer includes a main body and a protruding structure disposed on the main body. The first electrode is electrically connected to the component layer. The second electrode is electrically connected to the component layer. The first electrode, the second electrode and the protruding structure are disposed on the same side of the main body. The protruding structure is located between the first electrode and the second electrode. A connection between the first electrode and the second electrode traverses the protruding structure. The main body has a surface. The protruding structure has a first height with respect to the surface. Any one of the first electrode and the second electrode has a second height with respect to the surface. The relation 0.8?H1/H2?1.2 is satisfied, wherein H1 is the first height and H2 is the second height.

Abstract: The present disclosure provides an electronic system including an electronic device and an electronic tag. The electronic device includes a printed circuit board. The electronic tag includes a substrate and an antenna, wherein the substrate is disposed at a height over the printed circuit board. The substrate has a first side and a second side, wherein the first side is opposite to the second side. The antenna has a first portion and a second portion, wherein the first portion is disposed on the first side, the second portion is to disposed on the second side, and the first portion is electrically coupled to the second portion via plated through holes.

Abstract: The present invention relates to a passivation film deposition method for a light-emitting diode, comprising the steps of: depositing, on an upper part of a light-emitting diode of a substrate, a first passivation film having a silicon nitride (SiNx); and depositing, on an upper part of the first passivation film, a second passivation film having a silicon oxide (SiOx), wherein the ratio of the thickness of the first passivation film to the thickness of the second passivation film is 0.2-0.4:1.

Abstract: A display device manufacturing method, display device and electronics apparatus are provided. The display device manufacturing method comprises: forming the vertical micro-LEDs on a growth substrate: forming a first electrode on top of each of the vertical micro-LEDs; forming a second electrode on side surface of each of the vertical micro-LEDs; and transferring the vertical micro-LEDs from the growth substrate to a display substrate of a display device. An embodiment of this invention can reduce the back-end fabrication process on a display substrate after transfer.

Abstract: Embodiments relate to a micro light-emitting-diode (?LED) fabricated using a self-aligned process. To fabricate the ?LED, a metal layer is deposited on a p-type semiconductor. The p-type semiconductor is on an n-type semiconductor and the n-type semiconductor is on a top side of a substrate. The metal layer is patterned to define a p-metal. The p-type semiconductor is etched using the p-metal as an etch mask. Similarly, the n-type semiconductor is etched using the p-metal and the p-type semiconductor as an etch mask. A negative photoresist layer is deposited over the patterned p-metal and the p-type semiconductor. The negative photoresist is then exposed from the back side of the substrate, thus exposing the regions of the negative photoresist that are not masked by the p-metal. The negative photoresist is then developed to expose the p-metal.

Abstract: A cross-plane flexible micro-TEG with hundreds of pairs of thermoelectric pillars formed via electroplating, microfabrication, and substrate transferring processes is provided herein. Typically, fabrication is conducted on a Si substrate, which can be easily realized by commercial production line. The fabricated micro-TEG transferred to the flexible layer from the Si substrate. Fabrication methods provided herein allow fabrication of main TEG components including bottom interconnectors, thermoelectric pillars, and top interconnectors by electroplating. Such flexible micro-TEGs provide high output power density due to high density of thermoelectric pillars and very low internal resistance of electroplated components. The flexible micro-TEG can achieve a power per unit area of 4.5 mW cm?2 at a temperature difference of ˜50 K, which is comparable to performance of flexible TEGs developed by screen printing.

Abstract: A semiconductor light-emitting device comprises a substrate; a first adhesive layer on the substrate; multiple epitaxial units on the first adhesive layer; a second adhesive layer on the multiple epitaxial units; multiple first electrodes between the first adhesive layer and the multiple epitaxial units, and contacting the first adhesive layer and the multiple epitaxial units; and multiple second electrodes between the second adhesive layer and the multiple epitaxial units, and contacting the second adhesive layer and the multiple epitaxial units; wherein the multiple epitaxial units are totally separated.

Abstract: A light emitting layer including a plurality of light emitting particles embedded within a host matrix material. Each of said light emitting particles includes a population of semiconductor nanoparticles embedded within a polymeric encapsulation medium. A method of fabricating a light emitting layer comprising a plurality of light emitting particles embedded within a host matrix material, each of said light emitting particles comprising a population of semiconductor nanoparticles embedded within a polymeric encapsulation medium. The method comprises providing a dispersion containing said light emitting particles, depositing said dispersion to form a film, and processing said film to produce said light emitting layer.

Abstract: A light emitting device includes a substrate, a light emitting element, and a plurality of bumps. The light emitting element is mounted on the substrate. The bumps connect the substrate and the light emitting element. The bumps are arranged in a plurality of columns extending parallel to one side of an outer edge of the light emitting element. A distance between adjacent ones of the bumps in one of the columns arranged closest to the outer edge of the light emitting element is larger than a distance between adjacent ones of the bumps arranged on an inner side of the light emitting element in a plan view.

Abstract: In order to be more compact and thin, this light emitting device includes LED elements embedded in a resin molded body such that light emitting units are exposed on a lateral surface of the resin molded body and positive electrodes and negative electrodes are exposed on a back surface which is perpendicular to the lateral surface of the resin molded body.

Abstract: A light-emitting device includes: a light-emitting stack including a first active layer emitting a first light having a first peak wavelength; a diode emitting a second light having a second peak wavelength between 800 nm and 1900 nm; and a tunneling junction between the diode and the light-emitting stack, wherein the tunneling junction includes a first tunneling layer and a second tunneling layer on the first tunneling layer, the first tunneling layer has a band gap and a thickness of the first tunneling layer is greater than a thickness of the second tunneling layer.

Abstract: This disclosure provides an array substrate, a manufacturing method thereof, and a display panel. The array substrate includes an organic film layer disposed over a substrate, and is provided with a groove, which is configured for positioning a sealant, extends through the organic film layer, and has an opening on a side opposing to the substrate. The array substrate can further include a sealing film, which covers surfaces of the groove to thereby prevent gas release from the organic film layer.

Abstract: Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.

Abstract: A light-emitting device includes a package, a light-emitting element disposed on the package, and a light-transmissive member over the light-emitting element. An upper surface of the light-transmissive member and an upper surface of the package each have a plurality of projections. The light-transmissive member contains particles of light-transmissive first fillers having refractive indices smaller than the refractive index of a matrix of the light-transmissive member. Part of the particles of the first fillers is exposed to the air from the matrix of the light-transmissive member on the upper surface of the light-transmissive member.

Abstract: Techniques for controlling oxygen concentration levels during annealing of highly-reflective contacts for LED devices together with lamps, LED device and method embodiments thereto are disclosed.

Abstract: Disclosed are dosings of therapeutic macromolecules and immunosuppressants, in some embodiments attached to synthetic nanocarriers, in combination with dosings of therapeutic macromolecules without synthetic nanocarriers, and related methods that provide reduced humoral immune responses.

Abstract: The following relates to barrier coating for organic optoelectronic devices. In particular, the following relates a barrier coating comprising and methods and processes for depositing a barrier coating on a surface.

Abstract: A flexible display device includes a flexible substrate that includes a first side; a display unit disposed in a first region of the first side and that includes a plurality of pixels; and a pad portion disposed in a second region of the first side and that includes a plurality of pad electrodes. The flexible substrate includes a stepwise recess portion disposed along an edge of the first side on which end portions of the pad electrodes are provided.

Abstract: An organic EL element comprises a supporting substrate 12 having a first side surface 12b and a second side surface 12c located opposite to the first side surface in the first direction, a first electrode-attached on the supporting substrate, an organic EL body 16 disposed on the first electrode, a second electrode 18 disposed extending from the first side surface to the second side surface and covering at least a part of the organic EL body, and a sealing member disposed on the second electrode, extending from the first side surface to the second side surface and sealing at least the organic EL body, each of the side surfaces 18a and 20a of the second electrode and the sealing member on the first side surface-side being made evened with the first side surface, and each of the side surfaces 18b and 20b of the second electrode and the sealing member on the second side surface-side being made evened with the second side surface, in the first direction.

Abstract: A light emitting layer including a plurality of light emitting particles embedded within a host matrix material. Each of said light emitting particles includes a population of semiconductor nanoparticles embedded within a polymeric encapsulation medium. A method of fabricating a light emitting layer comprising a plurality of light emitting particles embedded within a host matrix material, each of said light emitting particles comprising a population of semiconductor nanoparticles embedded within a polymeric encapsulation medium. The method comprises providing a dispersion containing said light emitting particles, depositing said dispersion to form a film, and processing said film to produce said light emitting layer.

Abstract: In order to provide an organic EL panel, and a method for producing same, that makes it possible to have excellent moisture resistance and ensure sealing substrate-side transparency, provided is an organic EL panel comprising an element formation substrate (1) on which an organic EL element (2) is formed, a sealing substrate (3), and a sealing layer interposed with no gaps between the element formation substrate (1) and the sealing substrate (3), wherein: the sealing layer is constituted of an inner hygroscopic agent (4) covering the organic EL element (2), an outer peripheral hygroscopic agent (5) provided along an outer peripheral edge of the inner hygroscopic agent (4), and a marginal adhesive (6) provided along an outer peripheral edge of the outer peripheral hygroscopic agent (5); the inner hygroscopic agent (4) is constituted of an ultraviolet curable or thermosetting gel-like resin and a desiccant added at a weight ratio of 0.

Abstract: A light emitting device includes: a substrate; a first electrode disposed on the substrate; a first insulating layer disposed on the substrate to be spaced apart from the first electrode, the first insulating layer having a first height; a second electrode disposed on the first insulating layer; and a bar type LED disposed on the substrate, wherein the bar type LED has a first end and a second end in the length direction thereof, one of the first end and the second end is connected to the first electrode, and the other of the first end and the second end is connected to the second electrode.

Abstract: A highly reliable display device is provided. The display device includes a first substrate, a first resin layer over the first substrate, a pixel portion and a terminal portion over the first resin layer, a second resin layer over the terminal portion, and a second substrate over the second resin layer. The pixel portion includes a transistor and a display element electrically connected to the transistor. The terminal portion includes a conductive layer. The first resin layer includes an opening. The conductive layer includes a first region that is exposed in the opening in the first resin layer. The second resin layer includes a region overlapping with the first region. The conductive layer is the same layer as at least one of a gate of the transistor and a source and a drain of the transistor.

Abstract: A modular headlamp assembly includes a low beam headlamp module, a high beam headlamp module, and front turn/parking lamp module. The low beam headlamp module and the high beam headlamp module are supported by a reflector carrier. Each of the high and low beam headlamp modules includes a heat sink and mounting assembly with a heat sink portion bisecting a reflector member. The reflector carrier is adjustably fastened to a housing to allow for adjustment of the high and low beam headlamp modules within the modular headlamp assembly.

Abstract: A package includes a resin molded body, a first lead electrode, a second lead electrode, and a recess portion. The recess portion is provided on a first side of the resin molded body and a light-emitting element is to be provided in the recess portion. The recess portion includes a bottom portion, a top portion, and a side wall. The bottom portion includes an element mount region and a wire connection region. An upper surface of the first lead electrode is exposed from the resin molded body in the element mount region and the element mount region has an outer peripheral shape in accordance with an outer peripheral shape of the light-emitting element when viewed in a height direction. The wire connection region is provided adjacent to the element mount region and is smaller than the element mount region.

Abstract: A method for manufacturing a light emitting device, having mounting a light emitting element on a board, forming a phosphor layer that contains a phosphor by spraying on surfaces of the board and the light emitting element after the mounting of the light emitting element; and forming a cover layer that contains at least one type of light reflecting material and light blocking material on a surface of the phosphor layer over the board.

Abstract: LED light bulbs include openings in base or cover portions, and optional forced flow elements, for convective cooling. Thermally conductive optically transmissive material may be used for cooling, optionally including fins. A LED light engine may be fabricated from a substrate via planar fabrication techniques and shaped to form a substantially rigid upright support structure. Mechanical, electrical, and thermal connections may be made between a LED light engine and a LED light bulb.

Abstract: A modular headlamp assembly includes a low beam headlamp module, a high beam headlamp module, and front turn/parking lamp module. The low beam headlamp module and the high beam headlamp module are supported by a reflector carrier. Each of the high and low beam headlamp modules includes a heat sink and mounting assembly with a heat sink portion bisecting a reflector member. The reflector carrier is adjustably fastened to a housing to allow for adjustment of the high and low beam headlamp modules within the modular headlamp assembly.

Abstract: A package includes a plurality of electrode pairs, each electrode pair including a first electrode on one side and a second electrode on another side in a plan view. The first electrode is electrically connected to the second electrode included in an electrode pair adjacent to a first or second lateral side of the one electrode pair, and is not electrically connected to the first electrode included in the electrode pair adjacent to the first or second side of the one electrode pair. The second electrode is electrically connected to the first electrode included in an electrode pair adjacent to a lower side of the one electrode pair, and is not electrically connected to the second electrode included in the electrode pair adjacent to the first or second lateral side of the one electrode pair.

Abstract: A light-emitting device is provided. The light-emitting device includes a substrate having a long edge and a short edge, at least one electrode pad assembly, and at least one light-emitting element. The at least one electrode pad assembly is disposed on the substrate and includes a first electrode pad and a second electrode pad. The at least one light-emitting element has a plurality of electrodes electrically connected to the first electrode pad and the second electrode pad of the at least one electrode pad assembly. The first electrode pad and the second electrode pad are arranged along a direction parallel to the short side.

Abstract: A solid-state device includes a metal pattern formed on a substrate, a conductive bump connected to the metal pattern so as to be contact with a side surface of the metal pattern, and a solid-state element connected to the metal pattern via the conductive bump. A bottom surface level of at least a portion of the conductive bump is substantially equal to a bottom surface level of a portion of the metal pattern at which the metal pattern is connected to the conductive bump.

Abstract: Techniques for controlling oxygen concentration levels during annealing of highly-reflective contacts for LED devices together with lamps, LED device and method embodiments thereto are disclosed.

Abstract: A method of manufacturing a display device includes forming a first resin layer on a first substrate; forming a plurality of regions on the first resin layer, the plurality of regions each including a display portion, a terminal portion and a light blocking layer located between the display portion and the terminal portion; forming a second resin layer on a second substrate; bonding the first substrate and the second substrate; directing first laser light along a first line and a second line enclosing the plurality of regions such that the first laser light is transmitted through the second substrate to irradiate the first resin layer and the second resin layer; and directing second laser light along a third line parallel to the light blocking layer such that the second laser light is transmitted through the second substrate to irradiate the light blocking layer and the second resin layer.

Abstract: A method includes providing a first part, a second part and a bonding material between the first part and the second part. The first part and the second part are made of a first material selected from a group consisting of silicon and germanium. The bonding material includes a second material that is different than the first material. The method includes arranging the first part, the bonding material, and the second part in a furnace; and creating a bonded part by heating the first part, the second part and the bonding material to a predetermined temperature for a predetermined period followed by a predetermined solidification period. The predetermined temperature is greater than 1.5 times a eutectic temperature of an alloy including the first material and the second material and less than a melting temperature of the first material.

Abstract: A package for mounting a light emitting element includes a recess; a pair of lead electrodes exposed at a bottom surface of the recess; a plating layer covering a surface of each of the pair of lead electrodes; and a resin molded body retaining the pair of lead electrodes, and forming an area between the pair of lead electrodes at the bottom surface of the recess and a lateral surface of the recess. At least one of the lead electrodes has a front surface protrusion that is linearly formed along the resin molded body at the bottom surface of the recess and along a periphery of the bottom surface of the recess, and a back surface protrusion that is formed at a position at a back surface opposite to a position of the front surface protrusion, and at least a tip of each of the front surface protrusion and the back surface protrusion is exposed outside the plating layer.

Abstract: A method of manufacturing a package, the method comprising the steps of: preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads; forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess; and removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed.

Abstract: Various embodiments of light emitting devices, assemblies, and methods of manufacturing are described herein. In one embodiment, a method for manufacturing a lighting emitting device includes forming a light emitting structure, and depositing a barrier material, a mirror material, and a bonding material on the light emitting structure in series. The bonding material contains nickel (Ni). The method also includes placing the light emitting structure onto a silicon substrate with the bonding material in contact with the silicon substrate and annealing the light emitting structure and the silicon substrate. As a result, a nickel silicide (NiSi) material is formed at an interface between the silicon substrate and the bonding material to mechanically couple the light emitting structure to the silicon substrate.

Abstract: Described herein are devices and methods related to fabrication of organic electroluminescent devices and related components. In certain embodiments, devices and methods for fabricating OLED panels on substrates with non-uniform reflection or un-even surfaces require that the non-uniform features are arranged in a way such that they are not presented in the region where photolithography features are needed. In certain embodiments, where precision processing such as photolithography features are needed, the substrate is designed to be flat.

Abstract: An apparatus for manufacturing a display apparatus includes a stage supporting a substrate, a deposition gas supplying unit above the substrate, the deposition gas supplying unit spraying a deposition gas onto the substrate, and a first mask between the stage and the deposition gas supplying unit, the first mask including at least two first openings through which the deposition gas selectively passes.

Abstract: A method of manufacturing an organic light-emitting display apparatus including forming a liftoff layer containing a fluoropolymer on a substrate, forming a photoresist on the liftoff layer and patterning the photoresist by removing a portion thereof, etching, using a first solvent, the liftoff layer in a region where the photoresist is removed so that a portion of the liftoff layer remains on the substrate, forming an etch stop layer above the liftoff layer that remains on the substrate and above a region where the photoresist remains on the liftoff layer, and removing, using a second solvent, the liftoff layer under the region where the photoresist remains on the liftoff layer.

Abstract: A wide-angle emitting LED driven by built-in power and an assembling method are provided. The wide-angle emitting LED includes a transparent substrate, at least one light-emitting chip, and a driving circuit component. The front of the transparent substrate is provided with a printed circuit where a portion of an upper surface of the transparent substrate is provided with a plurality of conductive bonding pads. Each of the at least one light-emitting chip is bonded on the front of the transparent substrate, and the at least one light-emitting chip is electrically connected to the conductive bonding pads by metal wires. In addition, the driving circuit component is bonded with the transparent substrate and the conductive bonding pads and is electrically connected to the conductive bonding pads by metal wires.

Abstract: There is provided a semiconductor light emitting device, a method of manufacturing the same, and a semiconductor light emitting device package using the same. A semiconductor light emitting device having a first conductivity type semiconductor layer, an active layer, a second conductivity type semiconductor layer, a second electrode layer, and insulating layer, a first electrode layer, and a conductive substrate sequentially laminated, wherein the second electrode layer has an exposed area at the interface between the second electrode layer and the second conductivity type semiconductor layer, and the first electrode layer comprises at least one contact hole electrically connected to the first conductivity type semiconductor layer, electrically insulated from the second conductivity type semiconductor layer and the active layer, and extending from one surface of the first electrode layer to at least part of the first conductivity type semiconductor layer.