Abstract: A process for manufacturing a MOS-technology power device chip and package assembly, the MOS-technology power device chip comprises a semiconductor material layer in which a plurality of elementary functional units is integrated, each elementary functional unit contributing a respective fraction to an overall current and including a first doped region of a first conductivity type formed in the semiconductor layer, and a second doped region of a second conductivity type formed inside the first doped region; the package comprises a plurality of pins for the external electrical and mechanical connection; the plurality of elementary functional its is composed of sub-pluralities of elementary functional units, the second doped regions of all the elementary functional units of each sub-plurality being contacted by a same respective metal plate electrically insulated from the metal plates contacting the second doped regions of all the elementary functional units of the other sub-pluralities; each of the metal plates

Abstract: Undesirable counter doping of n.sup.+ /p.sup.+ gates illustratively through cross diffusion through an overlying silicide is inhibited by insertion of layers of titanium nitride and titanium, tungsten or tantalum between the polysilicon gates and an overlying silicide.

Abstract: A semiconductor device which can interconnect different types of impurity region without increasing a contact resistance including a first impurity diffusion region formed on a first portion of a semiconductor substrate, a second impurity diffusion region formed on a second portion of the semiconductor substrate, an interlevel insulating layer having a contact hole exposing the first and second impurity regions on the semiconductor substrate, a first conductive layer formed on the interlevel insulating layer, a second conductive layer formed on the overall surface of the substrate, wherein the second conductive layer formed on the first impurity diffusion region is doped with the same impurities as doped into the first impurity diffusion region and the second conductive layer formed on the second impurity diffusion region is doped with the same impurities as doped into the second impurity diffusion region, and a manufacturing method thereof are disclosed.

Abstract: A method for manufacturing an integrated circuit, wherein, before providing an IC composite by forming a metal film on an IC assembly which includes a semiconductor substrate and a silicon part formed along the substrate and consisting essentially of silicon, an amorphous region is formed into the silicon part. The IC composite is subjected to first primary and secondary heat treatments in a nitrogen atmosphere and then to a second heat treatment at 600.degree.-700.degree. C., 700.degree.-900.degree. C., and 700.degree.-900.degree. C. to turn the metal film on the silicon part into a metal silicide film of excellent uniformity. The assembly has a silicon dioxide portion, on which the metal film is turned during the first primary and secondary heat treatments into a metal nitride film. The second heat treatment is carried out after the removal of the metal nitride film.

Abstract: A method is achieved for making TFT-load static random access memory (SRAM) cells where the thin film transistor (TFT) gate electrodes are made from an electrical conductor. At the same time, portions of the conductor between P and N doped polysilicon interconnections eliminate the P/N junction. Ohmic contacts are formed while avoiding additional processing steps. N-channel FET gate electrodes are formed from an N.sup.+ doped first polysilicon layer having a first insulating layer thereon. Second polySi interconnections are formed with a second insulating layer thereon. First contact openings are etched in the first and second insulating layers to the N.sup.+ doped FET gate electrodes, and a patterned conductor (TiN, TiSi.sub.2) forms the P-channel TFT gate electrodes and concurrently forms portions over and in the first contact openings. A TFT gate oxide is formed and second contact openings are etched over the first contact openings to the conductor. An N.sup.

Abstract: A semiconductor component is formed in a semiconductor wafer, of a first conductivity type. The semiconductor component includes a plurality of first regions, of a second conductivity type, in a top surface of the wafer and coated with a first metallization layer. The semiconductor component further includes a second region, of the second conductivity type, and a third region, of the first conductivity type, each formed in the top surface of the wafer. A second metallization layer coats the second and third regions. A fourth region, of the first conductivity type, is formed in a bottom surface of the semiconductor wafer and opposes the first and second regions. A fifth region, of the second conductivity type, is also formed in the bottom surface and opposes the third region. A rear surface metallization covers the bottom surface of the semiconductor wafer.