Abstract: There are disclosed multi-crystalline silicon which is added with Ga (gallium) as a dopant and a method for producing Ga-doped multi-crystalline silicon, which comprises adding Ga to silicon melt in a crucible, which is melted by heating, and cooling the silicon melt to allow growth of multi-crystalline silicon. According to the present invention, there are provided multi-crystalline silicon and a multi-crystalline silicon wafer for producing solar cells showing stable conversion efficiency for light energy without causing photodegradation as well as methods for producing them.
Abstract: A magenta dye-donor element for thermal dye transfer comprising a support having thereon a dye layer comprising a mixture of magenta dyes and a yellow dye dispersed in a polymeric binder, at least one of the magenta dyes having the formula:
at least another of the magenta dyes having the formula:
said yellow dye having the formula:
and said element contains a complexing agent having the formula:
Type:
Grant
Filed:
June 9, 1999
Date of Patent:
January 30, 2001
Assignee:
Eastman Kodak Company
Inventors:
Derek D. Chapman, Richard C. Vanhanehem
Abstract: A dye-donor element for thermal dye transfer comprising a support having on one side thereof a dye layer and on the other side a slipping layer comprising a binder containing polyalkylsilsesquioxane particles wherein less than about 8% of the particles have a diameter of >0.8 .mu.m.
Type:
Grant
Filed:
November 24, 1997
Date of Patent:
December 14, 1999
Inventors:
William H. Simpson, Jacob J. Hastreiter, Jr., Ronald M. Wexler, Daniel F. Hurley, George B. Bodem
Abstract: A silicon on insulator (SOI) process is disclosed which includes the steps of forming an etch stop layer in a starting wafer, forming an insulating layer on the etch stop layer, bonding this wafer to a handle wafer, thinning the start wafer down to the etch stop and then recovering a device layer from the etch stop layer by outgassing dopants from the etch stop layer.
Abstract: A method for n-doping a material layer with antimony, comprising ion implanting antimony from an antimony precursor composition including a compound of the formula SbX.sub.n ((CH.sub.2).sub.y SiR.sub.3).sub.n-3, wherein: n is an integer having a value of 1 or 2; y is an integer having a value of from 1 to 3 inclusive; each R is independently selected from C.sub.1 -C.sub.4 alkyl; and each X is independently selected from halo substituents. The antimony precursor composition may further include a fluorine-containing auxiliary gas, to effect in situ cleaning of the ionization chamber during ion implantation.
Type:
Grant
Filed:
December 3, 1996
Date of Patent:
October 26, 1999
Assignee:
Advanced Technology Materials, Inc.
Inventors:
Timothy E. Glassman, Thomas H. Baum, James V. McManus, W. Karl Olander
Abstract: A polysilicon diffusion doping method which employs a deposited dopant-rich oxide layer with a highly uniform distribution of dopant atoms and thickness. Polysilicon layers 1,500 angstroms thick have been doped, achieving average resistance values of 60 ohms and non-uniformity values of 5 percent. Resistance values were measured using the four-point probe method with probe spacings of 0.10 cm. After a polysilicon layer has been formed upon a surface of a silicon wafer, a dopant-rich oxide layer is deposited upon the polysilicon layer at reduced pressure. The dopant-rich oxide layer is deposited, and serves as a source of dopant atoms during the subsequent diffusion process. The dopant-rich oxide layer is a phosphosilicate glass (PSG) including phosphorus pentoxide (P.sub.2 O.sub.5) and phosphorus trioxide (P.sub.2 O.sub.3) and deposited using a PECVD technique.
Type:
Grant
Filed:
May 15, 1996
Date of Patent:
April 20, 1999
Assignee:
Advanced Micro Devices, Inc.
Inventors:
W. Mark Carter, Allen L. Evans, John G. Zvonar
Abstract: The present invention is a method of manufacturing a high/low resistance on a mix-mode product. The method includes forming a polysilicon layer over a wafer. A blanket ion implantation is performed to implant ions into the entire polysilicon layer. The polysilicon layer is then separated into a high resistance area and a low resistance area. The low resistance area top surface is raised higher than the high resistance area. A photoresist is then formed on the polysilicon areas. The photoresist is subsequently etched back to the top surface of the low resistance areas. A second implant is done on the low resistance area.
Abstract: Thermal dye sublimation transfer recording element for receiving sublimable basic dye-precursors, comprising a support having thereon a dye-developing layer containing a dye-developing copolymer having sulfonic acid side-groups that can react with the basic dye-precursor to produce a dye image, characterized in that said dye-developing vinyl copolymer comprises plasticizing comonomers, the weight percentage of plasticizing comonomers in the dye-developing vinyl copolymer being such that the glass transition temperature of the dye-developing vinyl copolymer is between 30.degree. C. and 90.degree. C.
Type:
Grant
Filed:
February 27, 1990
Date of Patent:
July 9, 1991
Assignee:
Agfa-Gevaert, N.V.
Inventors:
Herman J. Uytterhoeven, Roderich Raue, Siegfried Korte