Abstract: A contact terminal for an electrical connector includes a mating section (21) defining a receiving cavity adapted for receiving a mating component. The mating section includes opposed side walls having thereon protrusions (210) extending into the receiving cavity. The protrusions define thereof mating surfaces adapted to engage the mating component. This configuration of employing surface engagement has the advantage of attaining reliable mechanical and electrical connection between the mated connector and component over the prior art of employing point engagement.

Abstract: A circuit board includes an antenna substrate and a main substrate. The antenna substrate has at least one first linking portion. The main substrate has at least one second linking portion. The first linking portion connects with the second portion so that the antenna substrate assembles with the main substrate. Herein, the antenna is substantially perpendicular to the main substrate.

Abstract: A circuit board including a board body, at least one first connector, and at least one second connector is provided. The board body has an edge and at least one auxiliary scribed line. The auxiliary scribed line is substantially parallel to the edge. The first connector is disposed on the board body and adjacent to the edge. The second connector is disposed on the board body and adjacent to the auxiliary scribed line. The second connector is electrically connected to the first connector. The first connector and the second connector are located on the different sides of the auxiliary scribed line.

Abstract: A semiconductor chip is disclosed and includes a plurality of bond pads disposed on a semiconductor chip, and a plurality of chip bumps of different heights disposed on a corresponding bond pad.

Abstract: A hardware assembly of a non-volatile solid state drive and a processor is made more compact by eliminating elements previously associated with such assemblies. For embodiments implementing a SATA cable to electrically connect the solid state drive and processor, the SATA cable directly connects the two elements without implementing intervening bulky SATA connectors. For embodiments implementing a printed circuit board for mounting the solid state drive and processor, the SATA cable itself may be eliminated by replacing it with a hardwired signal path on the printed circuit board. These compact hardware assemblies are manufactured by hardwiring the signal path to the solid state drive at a SATA interface and hardwiring the same signal path to the processor also such that the hardwired signal path electrically connects the solid state drive to the processor.

Abstract: A convex portion which inclines in the direction of the short side is created by press work along the direction of the short side of a terminal, which extends longitudinally, from one end to the other end, and another terminal is pressed onto the convex portion with pressure and bonded together by electric resistance welding. At this time, because the convex portion inclines in the direction of the short side, the convex portion is not deformed and crushed; consequently, it is possible to ensure the area of the contact at which terminals are bonded together.

Abstract: A socket contact includes a base bottom portion and a contact connection portion. The base bottom portion is mounted on a printed board. The contact connection portion is provided on both sides of the base bottom portion in a lateral direction, and connected with a counterpart contact. The base bottom portion includes an opening and a pair of first feet. The pair of first feet extends in longitudinal directions substantially perpendicular to the lateral direction. The first feet are soldered to the printed board. The contact connection portion includes an elastic arm, a first bent arm, a rigid arm, a second bent arm, and a second foot. The first bent arm includes a contact point having contact with a first surface of the counterpart contact, and the second bent arm includes a guide face along which a second surface of the counterpart contact slides.

Abstract: A modular power distribution unit (PDU) for supplying electric power to attached equipment in environments such as data centers, computer rooms, and communication centers, where power requirements for attached equipment may vary. The power distribution unit includes a frame and one or more user-replaceable power modules, which fit into slots in the frame. Each power module provides one of more plug receptacles for attaching equipment to provide power thereto. The power modules are available in a variety of receptacle types, receptacle numbers, and power rating configurations to accommodate various equipment in a particular environment, as needed. The frame includes an internal connector panel for distributing power from a power source to the power modules when they are inserted in the frame. The power modules may be removed, installed, and interchanged in the frame without interrupting power to other power modules or to the power distribution unit.

Abstract: A system and method for performing optical inspection are provided. At least one “invariant feature” of an object design is determined, and such invariant feature is used in inspecting objects having the corresponding design. An “invariant feature” is a feature that is invariant certain transformations occurring in a captured image of an object under inspection, such as brightness, color, and/or other transformations in the captured image. Accordingly, an inspection template may comprise information corresponding to at least one pre-selected invariant feature of an object's design. In certain embodiments, the template is a shape description of a feature that provides an intrinsic invariance to a specified set of basic transformations. Accordingly, the amount of pixel values stored in a template may be minimized, which minimizes the number of pixel comparisons made between a captured image of the object under inspection and the inspection template during the inspection analysis.

Abstract: A system may include a conductive plane defining a non-conductive antipad area and a second non-conductive area extending from the antipad area in at least a first direction, a dielectric plane coupled to the conductive plane, a conductive via passing through the dielectric plane and the antipad area, a conductive pad connected to an end of the conductive via, and a conductive trace coupled to the dielectric plane and connected to the conductive pad, the conductive trace extending from the conductive pad in the first direction.

Abstract: A printed board includes a printed board body having a first side, a second side opposing the first side, and a through-hole; a printed conductor disposed on the first side of the printed board body; and a bus bar disposed on the second side of the printed board body, the bus bar including a terminal that extends through the through-hole. The terminal includes a plurality of branched terminal portions at a position corresponding to an interior of the through-hole, and at least one of the branched terminal portions is bent and attached to the printed conductor.

Abstract: A signal exchange system includes a circuit board, a transforming connector and a network port. The transforming connector is electrically connected to the circuit board and includes at least one connecting terminal. The connecting terminal is electrically connected to an external device. The network port is disposed on the circuit board and electrically connected to the transforming connector for receiving a power signal transmitted from the transforming connector and transmitting a data signal.

Abstract: A socket for electrically connection an electronic package to a circuit board, comprises: a socket body (10) receiving a number of terminals; a floating board (11) located upon the socket body; a cover (12) rotatablely assembled to the socked body, the cover formed with at least a position portion; a pressure board (13) correspondingly formed with at least one clasp for latching with the position portion of the cover to retain the pressure board to the cover.

Abstract: Disclosed is a pivoting apparatus comprising a pivot base defining a connection cavity, a pivot slot including an L-shape, and an alignment slot including a curvature that bulges towards a riser card, a key structure extending from at least one of the riser card and a processor in an electronic enclosure, the key structure being fixedly associated with the connection cavity of the pivot base, and a pivotor rotateably associated with the pivot base and fixedly associated with a power supply, the pivotor including an alignment ramp, an alignment pin, and a pivot pin, wherein the alignment pin is removably disposed in the alignment slot, and the pivot pin is pivotably disposed in the pivot slot.

Abstract: A design rule for a printed wiring board is provided. A conductive layer and a pad are separate from each other in a distance defined by the design rule, which sufficiently prevents the capacitance coupling between the conductive layer and the pad.

Abstract: A board-to-board connector assembly includes a first connector (100) having a first housing (10) defining two opposite first longitudinal peripheral walls (11a) and two opposite first transverse peripheral walls (11b) connecting the first longitudinal walls. A rib (114) and a locking portion (116) are respectively defined in corresponding inner wall of the first longitudinal and transverse peripheral walls. A second connector (200) comprises a second housing (30), a plurality of terminals (40) received in the second housing and a pair of metal ears (50) engaged with two opposite second peripheral walls. The terminal and the metal ear respectively define a protrusion (431) and a projection (54) extending outward thereof and snugly fit against the corresponding rib and the locking portion when the first and second connectors engage with each other.

Abstract: A via provides a plurality of electrical connections between conductors on different layers of a circuit board. The via includes an opening through the circuit board formed by a plurality of substantially partially overlapping bores. An electrically conductive plating is formed on an inner surface of the opening. The plating forms a plurality of distinct electrically conductive paths.

Abstract: A data tracking method applied in semiconductor manufacturing is provided. Split historical data of a wafer lot is retrieved and it is determined whether the end of lot data of the wafer lot is read. If not, a maximum split number required for a split processing applied to the wafer lot is determined. Next, a virtual sub split number required for the current process station is determined according to the maximum split number and a current split number. At least one virtual sub lot for the current process station is created according to the virtual sub split number. Process data of an original wafer lot corresponding to the virtual sub lot is copied to the virtual sub lot and virtual sub lots for the next process station is continuously created when creation is complete.

Abstract: A plugtype power supply unit includes an enclosure, a plug portion secured thereto, and a low-voltage cord extending from said enclosure. Each cross-sectional configuration of said enclosure with said plug portion corresponds to and does not exceed the cross-sectional configuration of a plug face of an American type plug according to the NEMA 1-15P standard. A switch mode power supply circuit mounted on a PCB is built into said enclosure, said switch mode power supply circuit includes a transformer for power converting and a capacitor for regulating an input voltage, a central axis of said capacitor is disposed parallel to the direction of said PCB.

Abstract: A printed circuit board and manufacturing method thereof are disclosed. A printed circuit board composed of an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.

Abstract: An electrical connector includes a terminal block defining a plurality of receiving passageways extending therethrough, a plurality of terminals respectively received in the terminal block and a protective member assembled to the front side of the terminal block. Each terminal defines a media portion positioned in the corresponding receiving passageways and a contacting portion extending forwardly from the media portion and beyond the corresponding receiving passageways. The protective member further defines a plurality of channels corresponding to the receiving passageways for entirely receiving the plurality of contacting portions of the terminals.

Abstract: The invention relates to an electrical printed circuit board serving for electrical contact-connection of an integrated circuit. The printed circuit board has a dielectric forming the printed circuit board material; at least one ground inner layer connected to ground potential; and a supply voltage inner layer connected to the potential of the supply voltage. The invention further includes at least one locally formed inner layer electrically connected to the supply voltage inner layer; a first external terminal contact serving for electrical connection to a ground terminal of an integrated circuit; and a second external terminal contact serving for electrical connection to a supply voltage terminal of an integrated circuit. In addition, a first contact-connection is provided between the first external terminal contact and the at least one ground inner layer; and a second contact-connection is provided between the second external terminal contact and the at least one locally formed inner layer.

Abstract: An anisotropic conductive sheet manufactured through improved manufacturing steps and a method of manufacturing the same. Conductive portions are unevenly arranged in a nonconductive elastomer having fluidity and serving as a matrix, the conductive portions highly densely containing the conductive particles having a specific gravity greater than that of the matrix component, the conductive particles are unevenly dispersed to form substantially nonconductive portions, and the conductive portions and the nonconductive portions are integrally cured to mold anisotropic conductive pieces. The anisotropic conductive pieces are so laminated that the conductive portions and the nonconductive portions are alternately arranged thereby to obtain a first laminate, and the first laminate is cut maintaining a predetermined thickness to obtain a zebra-like sheet.

Abstract: Disclosed are an optical module interfacing device for connecting an RJ interface and an SFP type optical module to an SFP type optical module connector without additional processing, and an Ethernet system using the optical module interfacing device, thus supporting data transmission and reception. The optical module interfacing device includes a board having the same dimensions as those of the optical module, a male connector, having the same dimensions as those of the optical module, formed at a side surface of one end of the board to be connected to the female connector for the optical module mounted on a host board, and an RJ female connector provided with a plurality of pins formed on an upper surface of the board, respectively corresponding to pins of the male connector, according to standards. Further, UTP data is provided to MDI supporting ports of a physical layer through an interfacing unit.

Abstract: A print circuit substrate is composed of a base material, a wiring pattern formed on the base material, the wiring pattern constituting a predetermined circuit pattern, and a connection terminal of a shape narrowing toward an end thereof, the connection terminal being formed on the base material and extending from the wiring pattern.

Abstract: A hybrid circuit board includes a first circuit board and a second circuit boards. The first circuit board includes a first body having a slot, and a first circuit pattern formed on the first body and extended to the slot. The second circuit board includes a second body, a protruding portion, a second circuit pattern, and a separating member. The protruding portion extends from the second body. The protruding portion is inserted into the slot of the first circuit board to combine the second circuit board to the first circuit board. The second circuit pattern is formed on the second body to be extended to the protruding portion, so that the second circuit pattern is electrically connected to the first circuit pattern of the first circuit board. The separating member is disposed between the second body and the protruding portion to separate the protruding portion from the second body.

Abstract: A method for manufacturing a probe card includes a first contact formation step of forming a first contact on a first surface of a first sacrificial substrate, a second contact formation step of forming a second contact on a first surface of a second sacrificial substrate, a signal transmission line formation step of forming a signal transmission line in the base substrate, a first contact joining step of attaching the first surface of the first sacrificial substrate to the base substrate and joining the first contact to the signal transmission line, and a second contact joining step of attaching the first surface of the second sacrificial substrate to the base substrate and joining the second contact to the signal transmission line.

Abstract: A multifunction modular electronic apparatus for performing information technology and telecommunications functions comprises a first module (101) for performing a plurality of first functions; a second module (102) having substantially the same physical dimensions as the first module for performing second functions; and a hinging mechanism (103, 104, 105) for enabling the two modules to be mechanically coupled, to rotate relative to each other over a full range of 360 degrees while remaining stably mechanically coupled in any intermediate position over the range, and to be fully separated from each other.

Abstract: An electrical connector (10) having a contact element (50) retained in a hollow body (12). The body (12) has an internal socket structure (44) for receiving an end of the contact element (50) so that insulation displacement contacts (54) of this engage and make electrical connection to wires (70) of an incoming cable (16) to which the connector is connected. Fingers (56) of the connector element (50) extend externally of the connector body and carry electrical contacts (82).

Abstract: A connection structure for a printed wiring board which enables high density integration is provided. A FCP 2 includes an exposed conductor part 2A including an insulating substrate 22 and a reinforcing plate 24 stacked with this substrate 22 via an elastic member 23. In the exposed conductor part 2A, conductors 21 each having a protrusion 20 formed on a surface is placed on the insulating substrate. The exposed conductor part 2A can be elastically deformed in the thickness direction in which the substrate 22, the reinforcing plate 24 and the like are stacked. A printed wiring board 1 is constructed by stacking an inner layer board 10 and a first outer layer board 11 and a second outer layer board 12 which sandwich this inner layer board 10. A notched groove 10A is formed on the inner layer board 10, and an insertion opening 10B is formed. Through-hole ports 11 which appear on the notched groove 10A side is placed on the first outer layer board.

Abstract: A semiconductor device (10) includes a semiconductor die (20) and an inductor (30, 50) formed with a bonding wire (80) attached to a top surface (21) of the semiconductor die. The bonding wire is extended laterally a distance (L30, L150) greater than its height (H30, H50) to define an insulating core (31, 57). In one embodiment, the inductor is extended beyond an edge (35, 39) of the semiconductor die to reduce loading.

Abstract: According to one embodiment of the present invention, a method for low impedance power delivery is disclosed. The method includes: providing a module, the module having a plurality of layers including a top layer; removing the top layer of the module to expose a power delivery plane; and providing a plurality of signal contacts on the top layer of the module to communicate signals between the module and an external device.

Abstract: Disclosed is a PCB in which a waveguide is embedded, and a method of producing the same. The PCB includes a substrate, and a lower clad layer formed on the substrate through a predetermined process to allow an optical signal irradiated thereto to be total-reflected thereby. A core layer is formed on the lower clad layer through a predetermined process and exposed using an exposing film on which a waveguide pattern is formed to form the waveguide with a predetermined shape therefrom. Furthermore, an upper clad layer is formed on the core layer through a predetermined process to allow the optical signal irradiated thereto to be total-reflected thereby.

Abstract: The invention provides an IC socket of synthetic resin, whose surface resistivity is strictly controlled to the desired level and which is much more improved in terms of electrical insulation properties, mechanical properties, heat resistance, chemical resistance, dimensional stability, etc. The IC socket is obtained by molding or otherwise forming a thermoplastic resin composition comprising 40 to 94% by mass of a thermoplastic resin, 5 to 30% by mass of a carbon precursor having a volume resistivity of 102 to 1010 ?·cm and 1 to 30% by mass of an electrical conductive filler having a volume resistivity of less than 102 ?·cm.

Abstract: Disclosed is a printed circuit board comprising a contact terminal, which prevents a poor contact and reduces a manufacturing cost, and an image forming apparatus having the same. The printed circuit board comprises a circuit part for controlling and processing an operation of electronic appliance, and a large-area contact terminal formed by a group of small-area terminals for electric connection with external device. The small-area terminals can be formed in various types, respectively having regular size and shape and being distanced a predetermined interval. Accordingly, unevenness of the large-area contact terminal surface caused by soldering is prevented since a plurality of small-area terminals constitute a unit contact terminal of over a predetermined size. Therefore, quality of contact with external terminal improves. Further, manufacturing cost is reduced, and the manufacturing process becomes simple.

Abstract: An approach is provided for mounting individual wires from multi-wire cables onto circuit boards. A wire comb is mounted adjacent one or more ends of the circuit board to permit a way to space apart individual wires, to hold them in place; and to permit welding or soldering of the wires to the appropriate connections or the circuit board during an overmolding process.

Abstract: A process is described in which surfaces of foamed plastics are provided with electrical conductor tracks, with the aid of selectively ablating processes. The process permits low-cost production of moldings from plastic with conductor tracks integrated on the surface. The products of the process may be used in the electrical and electronics industries, for example.

Abstract: A via provides a plurality of electrical connections between conductors on different layers of a circuit board. The via includes an opening through the circuit board formed by a plurality of substantially partially overlapping bores. An electrically conductive plating is formed on an inner surface of the opening. The plating forms a plurality of distinct electrically conductive paths.

Abstract: A motherboard (100) in accordance with a preferred embodiment includes an audio connection area (10) defining a first jack layout (12). The first jack layout integrates second and third jack layouts for two audio connectors of different specifications, so that jacks (121, 122) of the first jack layout can selectively connect with the audio connectors.

Abstract: A connector for a flat multilayer element that includes a first rigid glazing pane provided with one or more electrical functional elements and a second rigid glazing pane joined flat to that side of the first rigid glazing pane that is provided with the functional elements. The second pane has at least one cutout for making an electrical connection to the functional elements. A liner is fastened in the cutout by a projection, the edge of which lies in the plane between the two rigid panes and/or catches, via the rear, on an undercut of the cutout. The liner serves as a counterbearing surface for fastening at least one connection piece electrically connected to the functional elements.

Abstract: A circuit carrier includes a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.

Abstract: A via provides a plurality of electrical connections between conductors on different layers of a circuit board. The via includes an opening through the circuit board formed by a plurality of substantially partially overlapping bores. An electrically conductive plating is formed on an inner surface of the opening. The plating forms a plurality of distinct electrically conductive paths.

Abstract: A scalable mass interconnect device having a receiver assembly with module mounting members positioned in the receiver frame in a direction parallel to a plane of movement of the engagement cams in the receiver. Modules are mounted in the module mounting members such that the modules are perpendicular to a plane of movement of the engagement cams in the receiver.

Abstract: A pin support structure comprising a first foil having opening and a second foil having openings. The first foil is secured to a foil support frame and the second foil is secured to a foil support frame. The foils are maintained in spaced apart relationship by a separation frame. The holes of the foil are in registration with the holes of the foil. The holes in the foils are formed by electro-chemical etching. A pin has a base end and a support end.

Abstract: A microcolumn including an assembly substrate and a plurality of beam modification components. The assembly substrate includes a plurality of sockets, and the beam modification components each include a connector coupled to a corresponding one of the sockets. Assembly of the beam modification components to the assembly substrate may employ automation and/or automated calibration, including automated motion of robotic stages in a substantially automated manner.

Abstract: An efficient substrate fabrication method is disclosed. A method of fabricating a substrate having a via terminal includes the steps of: forming a concave part on a front surface of a source substrate; forming a front surface side conductive part by filling the concave part with a conductor; forming the core substrate by back-grinding up to a position immediately before the front surface side conductive part is exposed such that a tip of the front surface side conductive part is covered with a portion of the core substrate; exposing the tip of the front surface side conductive part by forming a concave part in a rear surface of the core substrate; forming a rear surface side conductive part by filling the concave part with a conductor; and electrically and mechanically connecting the front surface side conductive part with the rear surface side conductive part.

Abstract: A method of reducing the record of a multi-cavity terminal connector comprising the steps of assigning cavity numbers and locations to a properly oriented, full-scale CAD graphic of the connector, creating an integer from a concatenation of the cavity numbers and coordinates and performing a mathematical operation on the integer, such as a cyclical redundancy check, to produce a code which is substituted for the graphic in the connector record.

Abstract: A main board with a base comprising a first port and a second port parallel to each other and with a gap formed therebetween. First and second connectors are selectively disposed on the base. When the first connector is disposed on the base, a first distance is formed between first pins and a standard surface. When the second connector is disposed on the base, a second distance is formed between second pins and the standard surface. The difference between the first and second distances is equal to the gap. The first connector connects PATA hard disk drive, and the second connector connects SATA hard disk drive.

Abstract: The present invention provides a module comprising a circuit board, a plurality of first contacts adjacent to an edge of the circuit board configured to conduct a plurality of signals to the module and a plurality of second contacts adjacent to the edge of the circuit board configured to receive the plurality of signals from the module to outside the module. Memory modules, sockets, circuit boards, and systems are also provided.

Abstract: The invention relates to a circuit carrier and a method for producing it, the circuit carrier having a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.