Utilizing Fluent Abradant Patents (Class 451/36)
  • Patent number: 10987779
    Abstract: A hollow spring includes a steel tube in which the average of surface roughness is smaller than 10 ?m across the entire inner surface of the steel tube and/or compressive residual stress is given to the entire inner surface of the steel tube. The hollow spring may be manufactured by a step of polishing the inner surface of the steel tube by flowing a viscoelastic abrasive medium (200) within the tubular member (10), between a first opening (11) and a second opening (12) of the tubular member (10). The abrasive medium (200) may include a viscoelastic base material and a granular abrasive. The inner surface of the steel tube is polished evenly to reduce the surface roughness and/or is given compressive residual stress to increase the fatigue life of the hollow spring.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: April 27, 2021
    Inventor: Hironobu Sayama
  • Patent number: 10937670
    Abstract: A megasonic cleaner includes a water tank that includes a pair of opposite inner walls and a bottom wall connected thereto, and that accommodates a fluid therein; a plurality of supporting units arranged in the water tank at predetermined positions that support a wafer; and at least one transducer arranged on the bottom wall that transmits energy in the form of waves into the fluid, where each of the opposite inner walls has a first protrusion that protrudes into an internal space of the water tank, the first protrusion being spaced above the bottom wall and positioned at an height that is greater than or equal to a height of the centers of the plurality of supporting units.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: March 2, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung-Yong Park, Sung-Hyup Kim, Sung-Gwang Lee, Kwang-Sung Lee
  • Patent number: 10913254
    Abstract: In debonding a temporarily adhesive-bonded carrier-workpiece pair by a combination of chemical and mechanical methods, solvents or chemicals are used to remove the adhesives primarily through dissolution, and a thin wire, filament, or blade is used to exert a cutting or wedging action between the carrier and workpiece. The two methods are used together during the debonding process. In the carrier-workpiece pair, the workpiece can be a semiconductor wafer that has been thinned and processed. The carrier and the workpiece are temporarily bonded using an adhesive dissolvable in a selected chemical or solvent. The chemical and mechanical debonding (CMDB) method can be carried out in solvent immersion or in solvent spray to provide high throughput debonding. The dissolved adhesives can be recycled and later reused, thus lowering the cost of the whole bonding and debonding process.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: February 9, 2021
    Assignee: DIDREW TECHNOLOGY (BVI) LIMITED
    Inventor: Chunbin Zhang
  • Patent number: 10898375
    Abstract: A paranasal sinus access implant device may include one or more material or geometric features that may enhance performance of one or more portions of the implant device, for example an exposed surface including an antimicrobial agent. Various products and methods may include or use such an implant device.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: January 26, 2021
    Assignee: Sinopsys Surgical, Inc.
    Inventors: Michael Lawrence Reo, Brian James Willoughby, Christopher Lee Oliver, Harry Ross, Donald F. Schomer
  • Patent number: 10844243
    Abstract: Embodiments relate to a polishing composition including colloidal silica, pulverized wet-process silica particles, and at least one of a nitrogen-containing organic compound and a nitrogen-containing polymer compound. According to another embodiment, the polishing composition includes colloidal silica, pulverized wet-process silica particles, and a copolymer containing a monomer having a carboxylic acid group and a monomer having a sulfonic acid group as essential monomers. According to another embodiment, the polishing composition includes colloidal silica, pulverized wet-process silica particles, a nitrogen-containing organic compound and/or a nitrogen-containing polymer compound, and a copolymer containing a monomer having a carboxylic acid group and a monomer having a sulfonic acid group as essential monomers.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: November 24, 2020
    Assignee: YAMAGUCHI SEIKEN KOGYO CO., LTD.
    Inventors: Toru Iwata, Akina Ban, Yuka Ishida
  • Patent number: 10759018
    Abstract: The present subject matter relates to a method and an apparatus in the form of a machine system (1200) for machining a component (100) with an internal passage (115). In an aspect, the method comprises periodically injecting 5 abrasive slurry back and forth through the internal passage (115) at a pressure ranging from about 25 bar to about 35 bar. The abrasive slurry comprises a mixture of abrasive particles having a size in the range of about 40 ?m to about 60 ?m, and a slurry medium. The volume fraction of the abrasive particles in the slurry medium is about 40% to about 50%. Further, the injection of the abrasive 10 slurry is performed for a predefined number of process cycles at predetermined time versus pressure changes to obtain the component having a final average surface roughness of less than about 3.0 ?m.
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: September 1, 2020
    Assignee: Sundaram-Clayton Limited
    Inventor: Telikicherla Venkata Lakshmi Narasimha Rao
  • Patent number: 10662272
    Abstract: Embodiments provide a polishing composition for a magnetic disk substrate containing colloidal silica, a water-soluble polymer, and water. The water-soluble polymer compound is a copolymer containing a monomer having a carboxylic acid group, a monomer having an amide group, and a monomer having a sulfonic acid group as essential monomers. The water-soluble polymer compound has a weight average molecular weight of 1,000 to 1,000,000.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: May 26, 2020
    Assignee: YAMAGUCHI SEIKEN KOGYO CO., LTD.
    Inventor: Akira Sugawa
  • Patent number: 10351732
    Abstract: Provided are a polishing composition comprising a water-soluble polymer that has a molecular structure comprising a plurality of repeat unit species having different SP values and a polishing composition exhibiting an etching rate and an abrasive adsorption in prescribed ranges when determined by prescribed methods. Also provided is a method for producing a polishing composition, using an abrasive, a basic compound, a water-soluble polymer having an alkaline-hydrolytic functional group, and water. The method comprises a step of obtaining an agent A comprising at least the basic compound and a step of obtaining an agent B comprising at least the water-soluble polymer H.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: July 16, 2019
    Assignee: FUJIMI INCORPORATED
    Inventors: Kohsuke Tsuchiya, Hisanori Tansho, Taiki Ichitsubo
  • Patent number: 10344617
    Abstract: A device for cleaning, for example degritting or desanding, a turbomachine module comprising: (i) structure for isolating bearings of the module, by containment in a closed enclosure; (ii) structure for overpressurizing said enclosure; (iii) means for stripping material deposited in the walls of annular recesses of the module; and (iv) structure for sucking up the material thus stripped.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: July 9, 2019
    Assignee: SAFRAN AIRCRAFT ENGINES
    Inventors: Vincent Domalain, Frédéric Gourlet, Sylvain Vareecke
  • Patent number: 10246620
    Abstract: The present invention is a CMP polishing agent, including polishing particles, a protective film-forming agent, and water, wherein the protective film-forming agent is a copolymer of styrene and acrylonitrile, and an average molecular weight of the copolymer is 500 or more and 20000 or less. This provides a polishing agent which can polish an insulation film with few polishing scratches and has high polishing selectivity of an insulation film to a polishing stop film in a CMP step, a method for manufacturing the polishing agent, and a method for polishing a substrate by using the polishing agent.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: April 2, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Mitsuhito Takahashi
  • Patent number: 10217645
    Abstract: Chemical mechanical polishing (CMP) compositions, methods and systems for polish cobalt or cobalt-containing substrates are provided. Dual, or at least two chelators were used in the CMP polishing compositions as complexing agents for achieving the unique synergetic effects to afford high, tunable Co removal rates and with low static etch rates on Co film surface for the efficient Co corrosion protection during CMP process. The cobalt chemical mechanical polishing compositions also provide very high selectivity of Co film vs. other barrier layers, such as Ta, TaN, Ti, and TiN, and dielectric film, such as TEOS, SiNx, low-k, and ultra low-k films.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: February 26, 2019
    Assignee: VERSUM MATERIALS US, LLC
    Inventors: Xiaobo Shi, James Allen Schlueter, Mark Leonard O'Neill
  • Patent number: 10119049
    Abstract: A polishing agent for chemomechanically polishing a base having a carbon-based material and an insulating material to remove at least a part of the carbon-based material, the carbon-based material having a carbon content of 60 to 95 atm % as measured by X-ray photoelectron spectroscopy, the polishing agent comprising: an abrasive grain comprising silica; an allylamine-based polymer; and water, wherein a mass ratio of a content of the allylamine-based polymer with respect to a content of the abrasive grain is 0.002 to 0.400, and the abrasive grain has a positive charge in the polishing agent.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: November 6, 2018
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Makoto Mizutani, Satoyuki Nomura, Haruaki Sakurai, Masaya Nishiyama, Masayuki Hanano
  • Patent number: 10066126
    Abstract: Described are compositions (e.g., slurries) useful in methods for chemical-mechanical processing (e.g. polishing or planarizing) a surface of a substrate that contains tungsten, the slurries containing abrasive particles, metal cation catalyst, phosphorus-containing zwitterionic compound, and optional ingredients such as oxidizer; also described are methods and substrates used or processed on combination with the compositions.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: September 4, 2018
    Assignee: Cabot Microelectronics Corporation
    Inventors: Kevin P. Dockery, Helin Huang, Matthew Carnes, Glenn Whitener
  • Patent number: 9993905
    Abstract: An apparatus (1) for polishing cavities in mechanical components (4), characterized in that said apparatus (1) comprises a supporting framework (2) supporting a working plane (3) thereon are housed the mechanical workpieces (4) to be subjected to the polishing process, said mechanical workpieces (4) being clamped to said working plane (3) by clamping means (5), said apparatus further comprising vibration generating means (6) cooperating with resilient components (7) adapted to transmit a vibration motion and amplify the action of said vibrating means (6), said apparatus (1) comprising furthermore a closed loop distributing system for distributing a mixture (8) containing a polishing and buffing cleansing material and a micro-abrading material, said mixture (8) being fed within said mechanical workpieces (4) together with metal bodies (9) having a ball shape and a different size and mass, adapted to move and stir said mixture (8) against the inner walls of the cavity of said mechanical workpieces (4) being pro
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: June 12, 2018
    Assignees: LUBEN GLASS S.R.L., ARNMEC S.R.L.
    Inventors: Filippo Giacomo Mombelli, Andrea Marco Arnello
  • Patent number: 9915867
    Abstract: Systems and methods for isolating a membrane during fabrication. The membrane is connected to a substrate wafer using a plurality of magnets of uniform dimensions formed into two or more magnet stack beams. The magnet stack beams provide a gap between the wafer and the membrane. The wafer connected to the membrane by the magnet stack beams is received by a substrate holder so that a space is present between the membrane and the substrate holder. The membrane is rinsed by immersing, soaking, and withdrawing the substrate holder and the wafer connected to the membrane by the magnet stack beams using a rinse bath solution.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: March 13, 2018
    Assignee: International Business Machines Corporation
    Inventor: Dario L. Goldfarb
  • Patent number: 9884400
    Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a polymeric elastomer and a plurality of hollow structures. The hollow structures are distributed in the polymeric elastomer uniformly, and the sizes of the hollow structures are substantially equal to each other.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: February 6, 2018
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD
    Inventors: Chung-Chih Feng, I-Peng Yao, Wen-Chieh Wu, Hsin-Ru Song
  • Patent number: 9855529
    Abstract: A method for cleaning a cross-flow filter (20), comprising the steps of: A) providing a cross-flow filter (20), wherein the cross-flow filter (20) comprises a filter membrane (21) and is configured to remove a liquid permeate stream and the filter membrane (21) comprises a first side facing the permeate stream and a second side opposite the first side, the second side facing the feed stream, and wherein at least some of the deposits (1010) to be removed are located on the second side of the filter membrane (21); B) applying a back-flushing liquid stream through the filter membrane (21). Prior to applying the back-flushing liquid stream in Step B), permeate located on the first side of the filter membrane (21) is at least partially displaced from the first side of the filter membrane (21) by a gas, wherein the gas that is in contact with the back-flushing liquid stream has a pressure of >1 bar at least during Step B).
    Type: Grant
    Filed: December 18, 2012
    Date of Patent: January 2, 2018
    Assignee: HIGHQ-FACTORY GMBH
    Inventor: Franz Brummer
  • Patent number: 9817238
    Abstract: An optical device includes a structured light generation unit and a beam splitter assembly. The structured light generation unit generates a structured light. The beam splitter assembly is arranged in a travelling path of the structured light. The beam splitter assembly includes a semi-transmissive semi-reflective structure. A portion of the structured light is transmitted through the semi-transmissive semi-reflective structure of the beam splitter assembly and projected on a projection surface. Consequently, a first structured light pattern is formed on the projection surface. Another portion of the structured light is reflected by the semi-transmissive semi-reflective structure of the beam splitter assembly and projected on the projection surface along a different path. Consequently, a second structured light pattern different from the first structured light pattern is formed on the projection surface. The number of structured light patterns or the projected area is correspondingly adjusted.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: November 14, 2017
    Assignee: EVERREADY PRECISION IND. CORP.
    Inventors: Jyh-Long Chern, Chih-Ming Yen
  • Patent number: 9816010
    Abstract: A polishing composition of the present invention is to be used for polishing an object including a portion containing a high-mobility material and a portion containing a silicon material. The polishing composition comprises an oxidizing agent and abrasive grains having an average primary particle diameter of 40 nm or less. The polishing composition preferably further contains a hydrolysis-suppressing compound that bonds to a surface OH group of the portion containing a silicon material of the object to function to suppress hydrolysis of the portion containing a silicon material. Alternatively, a polishing composition of the present invention contains abrasive grains, an oxidizing agent, and a hydrolysis-suppressing compound. The polishing composition preferably has a neutral pH.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: November 14, 2017
    Assignee: FUJIMI INCORPORATED
    Inventors: Shuugo Yokota, Yasuyuki Yamato, Satoru Yarita, Tomohiko Akatsuka, Shuichi Tamada
  • Patent number: 9793613
    Abstract: A method and apparatus is presented. A structure having an interior channel is formed using additive manufacturing equipment. A viscous media containing abrasive particles is sent through the interior channel using abrasive flow machining equipment to form a desired surface roughness for the interior channel.
    Type: Grant
    Filed: October 9, 2013
    Date of Patent: October 17, 2017
    Assignee: THE BOEING COMPANY
    Inventors: Allen Wayne Wilson, Patrick Chalit Pattamanuch, Leonard Rosenheck
  • Patent number: 9751187
    Abstract: Systems and methods for finish portions of parts for gas turbine engines are provided. More specifically, systems and methods for finishing flow elements (e.g., stator vanes and turbine blades) or gas turbine engines are provided. The systems and methods may employ grit blasting, fluidic machining, and/or super polishing. Moreover, the flow elements may be inspected and/or evaluated between the one or more processing steps.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: September 5, 2017
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: Micah Beckman, Osamuyimen A. Oyegun
  • Patent number: 9685341
    Abstract: The polishing composition has a pH of 7 or more and is used in applications for polishing a silicon substrate. The polishing composition contains abrasive grains and a water-soluble polymer. The water-soluble polymer is a copolymer including a first monomer unit having a characteristic value P of 50-100 inclusive, and a second monomer unit having a characteristic value P of at least ?100 and less than 50. The characteristic value P is the result of subtracting an adsorption coefficient S2 of the abrasive grains obtained through a specific standard test B from a wettability coefficient S1 of the silicon substrate obtained through a specific standard test A.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: June 20, 2017
    Assignee: FUJIMI INCORPORATED
    Inventors: Yoshio Mori, Kohsuke Tsuchiya, Maki Asada, Shuhei Takahashi
  • Patent number: 9680094
    Abstract: According to one embodiment, a memory device includes a first electrode, a first resistance change layer, a first insulating section, a second electrode and an intermediate layer. The first resistance change layer is provided on the first electrode. The first insulating section is provided on the first resistance change layer. The second electrode is provided on the first resistance change layer. The second electrode is in contact with the first resistance change layer. The intermediate layer is provided between the second electrode and the first insulating section. The intermediate layer is in contact with the second electrode and the first insulating section.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: June 13, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Shosuke Fujii, Takashi Haimoto
  • Patent number: 9536752
    Abstract: The present invention provides a slurry for chemical mechanical polishing comprising water-soluble clathrate compound (a), polymer compound (b) having an acidic group optionally in a salt form as a side chain, polishing abrasive grain (c) and water (d), wherein the content of the water-soluble clathrate compound (a) is 0.001 mass %-3 mass % of the total amount of the slurry, the polymer compound (b) has a weight average molecular weight of not less than 1,000 and less than 1,000,000, and the content of the polymer compound (b) is 0.12 mass %-3 mass % of the total amount of the slurry, and a polishing method for substrate using the slurry.
    Type: Grant
    Filed: November 8, 2010
    Date of Patent: January 3, 2017
    Assignee: KURARAY CO., LTD.
    Inventors: Minori Takegoshi, Mitsuru Kato, Chihiro Okamoto, Shinya Kato
  • Patent number: 9486892
    Abstract: [Problem] Provided is a polishing composition which is suitable for polishing a polishing object having a metal wiring layer and capable of diminishing the step defect while maintaining a high polishing rate. [Solution] Provided is a polishing composition used in polishing a polishing object having a metal wiring layer, which contains a metal corrosion inhibitor, a complexing agent, a surfactant, and water and in which the solid surface energy of the polishing object surface after polishing the polishing object using the polishing composition is 30 mN/m or less, and the surfactant is preferably an anionic surfactant.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: November 8, 2016
    Assignee: FUJIMI INCORPORATED
    Inventors: Shogo Onishi, Yasuto Ishida, Tatsuhiko Hirano
  • Patent number: 9468894
    Abstract: Disclosed herein is a device comprising a pair of bellows pumps configured for efficient mixing at a microfluidic scale. By moving a fluid sample and particles in suspension through an aperture between the paired bellows pump mixing chambers, molecular collisions leading to binding between the particles and ligands in the sample are enhanced. Such devices provide an alternative for mixing that does not use a vent and can be used with a variety of particles in suspension such as magnetic beads to capture or purify useful cells and molecules.
    Type: Grant
    Filed: May 2, 2011
    Date of Patent: October 18, 2016
    Assignee: Micronics, Inc.
    Inventors: John Clemmens, C. Frederick Battrell, John Gerdes, Denise Maxine Hoekstra
  • Patent number: 9437446
    Abstract: The present invention provides a slurry for chemical mechanical polishing, containing abrasive grain (a), compound (b) having an amino group having a pKa of more than 9, and not less than 3 hydroxyl groups, and water.
    Type: Grant
    Filed: May 27, 2013
    Date of Patent: September 6, 2016
    Assignee: KURARAY CO., LTD.
    Inventors: Mitsuru Kato, Chihiro Okamoto, Shinya Kato
  • Patent number: 9422456
    Abstract: A chemical-mechanical polishing composition includes colloidal silica abrasive particles dispersed in a liquid carrier having a pH in a range from about 1.5 to about 7. The colloidal silica abrasive particles include an aminosilane compound or a phosphonium silane compound incorporated therein. The composition may be used to polish a substrate including a silicon oxygen material such as TEOS.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: August 23, 2016
    Assignee: Cabot Microelectronics Corporation
    Inventors: Steven Grumbine, Jeffrey Dysard, Ernest Shen, Mary Cavanaugh
  • Patent number: 9422457
    Abstract: A chemical-mechanical polishing concentrate includes at least 10 weight percent of a colloidal silica abrasive particle dispersed in a liquid carrier having a pH in a range from about 1.5 to about 7. The colloidal silica abrasive includes an aminosilane compound or a phosphonium silane compound incorporated therein. The concentrate may be diluted with at least 3 parts water per one part concentrate prior to use.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: August 23, 2016
    Assignee: Cabot Microelectronics Corporation
    Inventors: Steven Grumbine, Jeffrey Dysard, Ernest Shen, Mary Cavanaugh
  • Patent number: 9368367
    Abstract: Slurry compositions and chemically activated CMP methods for polishing a substrate having a silicon carbide surface using such slurries. In such methods, the silicon carbide surface is contacted with a CMP slurry composition that comprises i) a liquid carrier and ii) a plurality of particles having at least a soft surface portion, wherein the soft surface portion includes a transition metal compound that provides a Mohs hardness <6, and optionally iii) an oxidizing agent. The oxidizing agent can include a transition metal. The slurry is moved relative to the silicon carbide comprising surface, wherein at least a portion of the silicon carbide surface is removed.
    Type: Grant
    Filed: April 13, 2009
    Date of Patent: June 14, 2016
    Assignees: Sinmat, Inc., University of Florida Research Foundation, Inc.
    Inventors: Rajiv K. Singh, Arul Chakkaravarthi Arjunan, Dibakar Das, Deepika Singh, Abhudaya Mishra, Tanjore V. Jayaraman
  • Patent number: 9337103
    Abstract: A method includes forming a first gate above a semiconductor substrate, forming a hard mask on the first gate, and forming a contact etch stop layer (CESL) on the hard mask. No hard mask is removed between the step of forming the hard mask and the step of forming the CESL. The method further includes forming an interlayer dielectric (ILD) layer over the CESL, and performing one or more CMP processes to planarize the ILD layer, remove the CESL on the hard mask, and remove at least one portion of the hard mask.
    Type: Grant
    Filed: December 7, 2012
    Date of Patent: May 10, 2016
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-An Lin, Chun-Wei Chang, Neng-Kuo Chen, Sey-Ping Sun, Clement Hsingjen Wann
  • Patent number: 9333467
    Abstract: An apparatus for manufacturing a polishing pad includes a housing including a body, an interconnection portion, and a discharging portion, and a stirrer located in the housing, the stirrer mixing a polishing pad composition and a pore forming material with each other. A diameter of the discharging portion is in a range of about 9 mm to about 16 mm.
    Type: Grant
    Filed: June 11, 2014
    Date of Patent: May 10, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youngjun Jang, Bong-Su Ahn, Jin-Su Jeong, Jungsik Choi
  • Patent number: 9249273
    Abstract: Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: February 2, 2016
    Assignee: NexPlanar Corporation
    Inventors: Robert Kerprich, William C. Allison, Diane Scott
  • Patent number: 9242340
    Abstract: Magnetic heads are fabricated by slicing and dicing wafers into row bars, which undergo frontside lapping and backside lapping. These lapping processes, as well as other processes, induce stresses on the row bars that are released prior to finalizing the magnetic head. Ultrasonic impact technology is used to release the stress in the row bars and to clean the row bars at the same time. Ultrasonic impact technology is used after the row bars have been wire bonded without having to de-bond the row bars.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: January 26, 2016
    Assignee: Western Digital Technologies, Inc.
    Inventors: Mark D. Moravec, Phanphat Taechangam, Alan H. Brothers
  • Patent number: 9224613
    Abstract: Both sides of a large diameter semiconductor wafer are polished by the following ordered steps: a) polishing the wafer backside on a polishing pad containing a fixed abrasive, a polishing agent solution free of solids being introduced between the wafer backside and the polishing pad; b) stock polishing the wafer frontside on a polishing pad which contains a fixed abrasive, a polishing agent solution free of solids being introduced between the wafer frontside of and the polishing pad; c) removing microroughness and microdamage from the wafer frontside by polishing the frontside on a polishing pad, a polishing agent solution containing abrasives being introduced between the wafer frontside and the polishing pad; and d) final polishing of the wafer frontside by polishing the frontside on a polishing pad containing no fixed abrasive, a polishing agent solution containing abrasives being introduced between the wafer frontside and the polishing pad during the polishing step.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: December 29, 2015
    Assignee: SILTRONIC AG
    Inventor: Juergen Schwandner
  • Patent number: 9217118
    Abstract: Cutting fluids for brittle materials, e.g., silicon ingot, comprise, in weight percent: A. 70-99% polyalkylene glycol (PAG), e.g., polyethylene glycol; B. 0.01-10% PAG-grafted polycarboxylate; and C. 0-30% water. These cutting fluids are used with abrasive materials, e.g., silicon carbide (SiC), to form cutting slurries. The slurry is sprayed on the cutting tool, e.g., a wire saw, to cut a brittle work piece, e.g., a silicon ingot.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: December 22, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Linda Yi-Ping Zhu, Wanglin Yu, Fang Li, Daniel A. Aguilar, David B. Wurm
  • Patent number: 9156127
    Abstract: An object of the invention is to provide a polishing pad that achieves a high polishing rate and has high thickness precision so that the break-in time (dummy polishing time) can be shortened, and to provide a method for producing same. The invention is directed to a polishing pad including a base material layer and a polishing layer provided on the base material layer, wherein the polishing layer includes a thermoset polyurethane foam having roughly spherical interconnected cells with an average cell diameter of 35 to 200 ?m, and the polishing layer has a storage modulus E? (40° C.) of 130 to 400 MPa at 40° C., a ratio of storage modulus E? (30° C.) at 30° C. to storage modulus E? (60° C.) at 60° C. [E?(30° C.)/E?(60° C.)] of 1 to less than 2.5, and a ratio of storage modulus E? (30° C.) at 30° C. to storage modulus E? (90° C.) at 90° C. [E?(30° C.)/E?(90° C.)] of 15 to 130.
    Type: Grant
    Filed: December 24, 2009
    Date of Patent: October 13, 2015
    Assignee: Toyo Tire & Rubber Co., Ltd.
    Inventors: Takeshi Fukuda, Nobuyoshi Ishizaka
  • Patent number: 9033763
    Abstract: A deburring device includes a barrel with a granulated polishing member filled therein. The barrel is configured by a case formed with an opening hole, and drop prevention member which is fixed to the case and prevents the polishing member from being dropped from the opening hole. A gap into which a tubular end section of a workpiece is inserted is formed between the opening hole of the case and the drop prevention member.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: May 19, 2015
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Masakatsu Okoshi, Tatsuya Yahagi
  • Patent number: 9017142
    Abstract: A finishing apparatus and method for surface finishing workpieces. A tub is rotatable about vertical axis and operable to hold and rotate abrasive media completely submerged in water or other liquid. One or more manipulators, each supporting a spindle operable for supporting and rotating a workpiece about a spindle axis of the spindle with the workpiece at least partially submerged in the abrasive media and operable for holding spindle axis normal to and spaced apart from the vertical axis with the spindle horizontal in the tub during the surface finishing process while the tub is rotating. Manipulators are independently operable to present one of the workpieces for loading and unloading on and off spindle while tub is rotating and continuing to process the other workpieces submerged in the media and water. A rake includes a plate and means for lifting the plate up and down vertically through the abrasive media.
    Type: Grant
    Filed: February 14, 2013
    Date of Patent: April 28, 2015
    Inventors: Ericus Andreas van Kleef, Malcolm Southorn
  • Patent number: 9011205
    Abstract: Titanium-containing articles having improved surface finishes and methods for changing the surface of titanium containing articles, for example by removing overstock, are provided. One example method includes passing a fluid at high pressure across a surface of an titanium aluminide alloy-containing article, for example, a turbine blade, at high linear speed and deforming the surface of the titanium aluminide alloy-containing article, and removing material from the surface of the titanium aluminide alloy-containing article. Though aspects of the invention can be used in fabricating high performance turbine blades, the methods disclosed can be applied to the treatment of any titanium-containing article for which it is difficult to obtain an improved surface finish.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: April 21, 2015
    Assignee: General Electric Company
    Inventors: Bernard Patrick Bewlay, Jonathan Sebastian Janssen, Bin Wei, Youdong Zhou
  • Publication number: 20150099429
    Abstract: A system for refurbishing at least one article attached to an assembly includes a refurbishing vessel that contains at least one wall and at least one open portion; means for providing an abrasive media to the vessel, wherein the abrasive media is caused to flow around the surfaces of the at least one article when the vessel is positioned on the at least one article; means for conformably sealing the at least one open portion against the flow of abrasive media, wherein a seal is created that conforms to the contours of the at least one article and prevents the abrasive media from escaping between the at least one article and the at least one wall; and means for removing the abrasive media from the vessel.
    Type: Application
    Filed: October 8, 2013
    Publication date: April 9, 2015
    Applicant: General Electric Company
    Inventors: Sanji Ekanayake, Jon Conrad Schaeffer, Surinder Singh Pabla, Alston Ilford Scipio, Ishmael Dean-EL
  • Publication number: 20150097746
    Abstract: A method and apparatus is presented. A structure having an interior channel is formed using additive manufacturing equipment. A viscous media containing abrasive particles is sent through the interior channel using abrasive flow machining equipment to form a desired surface roughness for the interior channel.
    Type: Application
    Filed: October 9, 2013
    Publication date: April 9, 2015
    Applicant: THE BOEING COMPANY
    Inventors: Allen Wayne Wilson, Patrick Chalit Pattamanuch, Leonard Rosenheck
  • Patent number: 8998679
    Abstract: Methods of treating the polymeric surfaces of a stent with a fluid including a solvent for the surface polymer are disclosed.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: April 7, 2015
    Assignee: Abbott Cardiovascular Systems Inc.
    Inventors: Bin Huang, David C. Gale, Daniel Castro, Timothy A. Limon
  • Patent number: 8986070
    Abstract: A method for trimming two working layers including bonded abrasive applied on mutually facing sides of an upper and a lower working disk of a grinding apparatus configured for simultaneous double-side processing of flat workpiece includes providing at least one trimming apparatus including a trimming disk, a plurality of trimming bodies and an outer toothing. The upper and lower working disks are rotated. The trimming apparatus is moved between the rotating working disks using a rolling apparatus and the outer toothing on cycloidal paths relative to working layers of the working disks. The working layers and the trimming body are brought into contact so as to release abrasive substances from the trimming bodies and so as to effect material removal from the working layers. The direction of the drives of the grinding apparatus is changed at least twice during trimming.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: March 24, 2015
    Assignee: Siltronic AG
    Inventors: Georg Pietsch, Michael Kerstan
  • Patent number: 8974268
    Abstract: A method of preparing an edge-strengthened article comprises polishing of an edge of an article having a first edge strength using magnetorheological finishing, wherein after the polishing the article has a second edge strength and the second edge strength is greater than the first edge strength.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: March 10, 2015
    Assignee: Corning Incorporated
    Inventors: Charles Michael Darcangelo, Steven Edward DeMartino, Joseph Fabian Ellison, Richard A Nasca, Aric Bruce Shorey, David Alan Tammaro, John Christopher Thomas
  • Patent number: 8968053
    Abstract: In order to avoid using anti-stick paints, based on polytetrafluoroethylene or the like, on parts of cheesemaking machines which are to be in contact with hot curds (pastafilata), their surfaces are sandblasted with preferably virgin white corundum powder having a granulometry of about 180 mesh. Surprisingly, surfaces so treated are non-stick for the purposes mentioned above.
    Type: Grant
    Filed: September 20, 2010
    Date of Patent: March 3, 2015
    Assignee: C.M.T. Costruzioni Meccaniche e Tecnologia S.p.A.
    Inventor: Stefano Tomatis
  • Patent number: 8956430
    Abstract: A polishing composition containing a silica, an acid, a surfactant, and water, wherein (a) the acid has solubility in water at 25° C. of 1 g or more per 100 g of an aqueous saturated solution; (b) the surfactant is a sulfonic acid represented by the formula (1) or (2), or a salt thereof; and (c) the polishing composition has a pH of a specified range; and a polishing process of a substrate using the polishing composition are provided. The polishing composition is suitably used, for example in polishing a substrate for disk recording media such as magnetic disks, optical disks and opto-magnetic disks.
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: February 17, 2015
    Assignee: Kao Corporation
    Inventor: Norihito Yamaguchi
  • Patent number: 8951095
    Abstract: Various embodiments of a semiconductor processing fluid delivery system and a method delivering a semiconductor processing fluid are provided. In aspect, a system for delivering a liquid for performing a process is provided that includes a first flow controller that has a first fluid input coupled to a first source of fluid and a second flow controller that has a second fluid input coupled to a second source of fluid. A controller is provided for generating an output signal to and thereby controlling discharges from the first and second flow controllers. A variable resistor is coupled between an output of the controller and an input of the second flow controller whereby the output signal of the controller and the resistance of the variable resistor may be selected to selectively control discharge of fluid from the first and second flow controllers.
    Type: Grant
    Filed: April 25, 2005
    Date of Patent: February 10, 2015
    Assignees: Samsung Austin Semiconductor, L.P., Samsung Electronics Co., Ltd.
    Inventors: Randall Lujan, Ahmed Ali, Michelle Garel, Josh Tucker
  • Publication number: 20150017882
    Abstract: In one embodiment, a system for extending cutting tool life includes a vise, a jig provided in the vise adapted to hold or support a magnetic cutting tool insert, a magnet holder positioned above the jig that can be rotated, a magnet held in proximity to the jig by the magnet holder, and a mixture including abrasive particles that extends between the magnet and the jig, the mixture being supported by a magnetic field generated by the magnet, wherein when the magnet holder rotates, the magnet and the mixture of magnetic and abrasive particles rotate to finish a surface of the tool insert.
    Type: Application
    Filed: February 28, 2013
    Publication date: January 15, 2015
    Inventors: Hitomi Greenslet, Anil K. Srivastava
  • Publication number: 20150014903
    Abstract: A die for extrusion molding includes a first face, a second face, a raw material supply section, a molding section, and a treated surface. The second face is provided opposite the first face. The molding section has a second through hole that extends from the second face toward the first face so as to communicate with a first through hole. The treated surface is provided on an inner wall surface of the second through hole to have a structure such that a material for the die is machined to form the material into a die shape and to provide a machining-affected layer on the inner wall surface of the second through hole in the molding section, an oxidized layer is provided by heating the machining-affected layer to oxidize the machining-affected layer so as to convert the machining-affected layer into the oxidized layer, and the oxidized layer is removed.
    Type: Application
    Filed: September 29, 2014
    Publication date: January 15, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Makoto ASAI, Shuichi KAWANO