Abstract: An object of the invention is to effectively remove particles on the glass substrate surfaces, even in the case wherein abrasive particles having a small particle size is used in the polishing step of the glass substrate and a supersonic treatment is performed at a high frequency at the supersonic cleaning step after the polishing step. In a manufacturing method of a glass substrate for a magnetic disk comprising a polishing step for performing polishing of the glass substrate and a supersonic cleaning step for performing supersonic cleaning of the glass substrate after the polishing step, the polishing step uses abrasive particles having a particle size of 10 nm to 30 nm and a first supersonic cleaning is performed at a frequency of 300 kHz to 1,000 kHz to form secondary particles and then a second supersonic cleaning is performed at a frequency of 30 kHz to 100 kHz in the supersonic cleaning step.

Abstract: A substrate is prepared by polishing a surface of the substrate using a polishing pad while feeding a slurry. The polishing pad has a porous nap layer which comes in contact with the substrate surface and is made of a base resin comprising at least three resins, typically an ether resin, ester resin, and polycarbonate resin. The polished substrate has a highly flat surface with a minimal number of defects.

Abstract: Provided is a surface treatment method of a polishing pad. The surface treatment method of the polishing pad includes locating a wafer on the polishing pad including a polishing material, supplying a polishing pad polishing material between the polishing pad and the wafer to expose the polishing material included in the polishing pad, and polishing the wafer using the exposed polishing material.

Abstract: The present invention provides a method of recycling a water-based wire saw cutting slurry waste fluid comprising abrasive particles and waste solids in a water-based carrier.

Abstract: The present invention provides a polishing composition for polishing copper or copper alloy, comprising: an oxidizing agent (A); at least one acids (B) selected from amino acids, carboxylic acids of 8 or less carbon atoms, or inorganic acids; a sulfonic acid (C) having an alkyl group of 8 or more carbon atoms; a fatty acid (D) having an alkyl group of 8 or more carbon atoms; and an N-substituted imidazole (E) represented by the following general formula (1). (In the formula (1), Ra, Rb, and Rc represent H or an alkyl group of 1 to 4 carbon atoms, and Rd represents a group selected from the group consisting of a benzyl group, a vinyl group, an alkyl group of 1 to 4 carbon atoms, and a group in which a portion of H of these groups has been substituted with OH or NH2.

Abstract: According to one embodiment, a method for manufacturing a thin film magnetic head includes forming on a substrate magnetic head portions having a magnetoresistive element and resistance detection elements for measuring an amount of polishing; slicing the substrate to form at least one row bar; polishing the ABS of each row bar; forming rails on the polished ABS; and cutting each row bar to separate each magnetic head portion. The step of polishing the ABS includes measuring a resistance of each resistance detection element and a resistance of each magnetoresistive element; calculating an offset value between the resistance detection element and the magnetoresistive element; and calculating a final resistance of the resistance detection element by using the calculated offset value. When the resistance of the resistance detection element reaches the final resistance, polishing of the ABS of the row bar is terminated. Other methods are presented as well.

Abstract: An abrasive has a plate shape with a flat surface, in which a maximum diameter of the flat surface thereof is in the range of 0.05 mm to 10 mm, and 1.5 to 100 times as the maximum diameter as thick of the abrasive, and the blast processing method is one in which this abrasive is ejected by being inclined at an incident angle with respect to a surface of a product to be treated. The ejected plate-shaped abrasive slides along the surface of the product to be treated while having the flat surface in slidable contact with the surface of the product to be treated which is an object surface to be treated, so that the surface of the product to be treated is flattened by removing the peaks only, without increasing the depth of the valleys of the roughness curve.

Abstract: A polishing composition for a hard disk substrate includes alumina particles, silica particles, and water. The volume median diameter of secondary particles of the alumina particles measured by a laser beam diffraction method is 0.1 to 0.8 ?m. The volume median diameter of primary particles of the silica particles measured by transmission electron microscope observation is 40 to 150 nm. The standard deviation in number-basis particle size of the primary particles of the silica particles measured by the transmission electron microscope observation is 11 to 35 nm. The polishing composition for a hard disk substrate can preferably reduce the embedding of alumina abrasive grains into the substrate without impairing the productivity.

Abstract: An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.

Abstract: A polishing device for zone polishing of optical lenses with a tilting base part for direct or indirect holding of a polishing pad, wherein the base part for driving purposes is rotationally driven and connected to a spindle shaft, rotationally mounted, of a polishing spindle, and a rotary leadthrough is provided, by which the feeding of polishing compound in a polishing compound channel of the base part is assured, wherein the rotary leadthrough is directly or indirectly arranged on the spindle shaft and the base part can tilt relative to the rotary leadthrough. The rotary leadthrough stands in a flow connection with the base part via a flexible fluid connection.

Abstract: There are disclosed a polishing method and a polishing device in which cleaning of a glass substrate surface can be achieved to a high level. A glass substrate (MD substrate 1) in the shape of a circular disc having a circular hole in a center portion is polished with an abrasive liquid 50 containing free abrasive grains being supplied, and an inner peripheral end surface of the glass substrate is polished using the abrasive liquid containing the free abrasive grains by rotating a rotary brush 4 or a polishing pad in contact with the inner peripheral end surface.

Abstract: A method for polishing the edge of a semiconductor wafer comprises (a) providing a semiconductor wafer which has been polished on its side surfaces and which has a rounded edge; (b) polishing the edge of the wafer by fixing the semiconductor wafer on a centrally rotating chuck, delivering the wafer to a centrally rotating polishing drum, which is inclined with respect to the chuck and to which a polishing pad containing fixedly bonded abrasives is applied, and pressing semiconductor wafer and polishing drum onto one another while a polishing agent solution containing no solids is continuously supplied.

Abstract: Disclosed is a portable demilitarization apparatus and system for segmenting an ordnance and is comprised of a fixed housing having a gantry/robotic positioning system, a high pressure water jet cutting head, and a rotational drive subassembly and a slideable main assembly comprised of a cradle subassembly, a centering ring subassembly, a collection subassembly and a rotational drive mechanism.

Abstract: According to one embodiment, a supercritical drying method comprises cleaning a semiconductor substrate with a chemical solution, rinsing the semiconductor substrate with pure water after the cleaning, changing a liquid covering a surface of the semiconductor substrate from the pure water to alcohol by supplying the alcohol to the surface after the rinsing, guiding the semiconductor substrate having the surface wetted with the alcohol into a chamber, discharging oxygen from the chamber by supplying an inert gas into the chamber, putting the alcohol into a supercritical state by increasing temperature in the chamber to a critical temperature of the alcohol or higher after the discharge of the oxygen, and discharging the alcohol from the chamber by lowering pressure in the chamber and changing the alcohol from the supercritical state to a gaseous state. The chamber contains SUS. An inner wall face of the chamber is subjected to electrolytic polishing.

Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.

Abstract: A lapping carrier includes a base having first and second opposed major surfaces and at least one aperture extending from the first major surface to the second major surface. A wear layer is disposed on the first major surface of the base.

Abstract: The disclosure is directed to a processing fluid including at least 50 wt % of an aliphatic hydrocarbon having an average chain length of 8 to 16 carbons, 0.005 wt % to 10.0 wt % of Lewis active components, and not greater than 1.0 wt % water. The Lewis active components includes a Lewis acid and a Lewis base. The processing fluid has a conductivity of at least 10 nS/m and a Cannon viscosity of about 0.5 cp to about 5 cp at 25° C.

Abstract: The present invention provides a polishing technique which enables polishing of silicon carbide, which is difficult to be polished, with high efficiency and high surface accuracy. The present invention relates to a polishing slurry for polishing a substrate, which comprises abrasive particles containing manganese oxide as a main component and in which the content of the abrasive particles is less than 10% by weight based on the polishing slurry. The polishing slurry of the present invention has a pH of preferably 7 or more. It is particularly preferable to use manganese dioxide as abrasive particles. The polishing slurry of the present invention is suitable for a substrate of silicon carbide.

Abstract: An abrasive composition for polishing substrates including a plurality of abrasive particles having a poly-dispersed particle size distribution with median particle size, by volume, being about 20 nanometers to about 100 nanometers; a span value, by volume, being greater than or equal to about 15 nanometers, wherein the fraction of particles greater than about 100 nanometers is less than or equal to about 20% by volume of the abrasive particles.

Abstract: A device and method is disclosed for reducing turbulent blood flow over stent struts of an intravascular stent implanted in, for example, a coronary artery. An abrasive slurry is passed over the struts of an intravascular stent in order to remove a portion of the stent struts to form an airfoil shape. When the stent having airfoil-shaped struts is implanted in an artery, the flow of blood over the airfoil shape will reduce the likelihood of turbulent blood flow and thereby will reduce the likelihood of turbulent blood flow and thereby reduce the likelihood of a buildup in plaque or injury to the vessel wall.

Abstract: A chemical mechanical polishing aqueous dispersion includes (A) silica particles that include at least one functional group selected from the group consisting of a sulfo group or salts thereof, and (B) an acidic compound.

Abstract: The polishing liquid according to the embodiment comprises abrasive grains, an additive and water, wherein the abrasive grains satisfy either or both of the following conditions (a) and (b). (a) Producing absorbance of at least 1.50 for light with a wavelength of 400 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %, and also producing light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %. (b) Producing absorbance of at least 1.000 for light with a wavelength of 290 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 0.0065 mass %, and also producing light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %.

Abstract: A manufacturing method is provided. The manufacturing method includes forming one or more grooves in a component comprising a substrate. Each groove extends at least partially along the substrate and has a base, a top and at least one discharge end. The manufacturing method further includes forming a crater, such that the crater is in fluid connection with the respective discharge end for each groove, and disposing a coating over at least a portion of an outer surface of the substrate. The groove(s) and the coating together define one or more channels for cooling the component. The coating does not completely bridge each of the one or more craters, such that each crater defines a film exit. A component with cratered film exits is also provided.

Abstract: The slurry of the invention comprises abrasive grains and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %. The polishing liquid of the invention comprises abrasive grains, an additive and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %.

Abstract: The present disclosure discloses a device for measuring physical parameters of a slurry used in a chemical mechanical polishing apparatus and measuring method using the same. The chemical mechanical polishing apparatus comprises a polishing head, a rotary table, a polishing platen and a polishing pad having a through-hole. The device for measuring physical parameters of slurry comprises: a sensor disposed in the polishing platen and adapted to contacted the slurry via the through-hole of the polishing pad for measuring the physical parameters of the slurry; a converter disposed in the rotary table and coupled to the sensor for converting a measuring signal of the sensor into a standard electrical signal; and a processing unit coupled to the converter for acquiring the standard electrical signal to calculate physical parameters of the slurry.

Abstract: The present invention relates to a method of preparing a cerium oxide powder for a CMP slurry and a method of preparing a CMP slurry using the same, and more particularly, to a method of preparing a cerium oxide powder for a CMP slurry and a method of preparing a CMP slurry using the same in which the specific surface area of the powder is increased by preparing a cerium precursor, and then decomposing and calcinating the prepared cerium precursor. The pore distribution is controlled to increase the chemical contact area between a polished film and a polishing material, thereby reducing polishing time while the physical strength of powder is decreased, which remarkably reduces scratches on a polished film.

Abstract: A polishing method can bring a polishing surface to the optimum condition for polishing, without using a dummy wafer, before resuming polishing, thereby eliminating the cost of dummy wafer. The polishing method includes carrying out a stand-by operation during a polishing-resting time period, carrying out a preparatory process to polishing, after completion of the stand-by operation, by dressing a polishing surface while supplying a polishing liquid to the polishing surface, and starting polishing of a workpiece after completion of the preparatory process to polishing. A determination as to whether to carry out the preparatory process to polishing after completion of the stand-by operation may be made based on the total operating time of the stand-by operation or the total effective number of the stand-by operations.

Abstract: A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Abstract: There is provided a method of polishing the inner peripheral end surfaces of disk-like substrates for a recording medium using a brush comprising, providing a plurality of pieces of disk-like substrates having circular holes at the central portion thereof; bringing a polishing material slurry containing a polishing material into contact with the object to be polished; inserting a polishing brush into the circular hole of the object from a first side of the object to be polished, and rotating the polishing brush with the shaft as a center to polish the inner peripheral end surfaces of the substrates; and inserting the polishing brush into the circular hole of the object to be polished from a second side opposite to the first side and rotating the polishing brush with the shaft as a center axis to polish the inner peripheral end surfaces of the substrates.

Abstract: Methods of finishing an edge of a glass sheet comprise the step of machining the edge of the glass sheet into a predetermined cross-sectional profile along a plane taken transverse to the edge of the glass sheet with an initial average edge strength ESi. The methods also include the step of finishing the edge with at least one finishing member, such as an endless belt, without substantially changing a shape of the predetermined cross-sectional profile. In one example, a wet slurry including an abrasive can be applied to at least one of a finishing member and the edge of the glass sheet. After finishing the edge, example finished average edge strengths ESf can be at least about 250 MPa. In addition or alternatively, in another example, the ratio ESf/ESi can be within a range of from about 1.6 to about 5.6.

Abstract: The super abrasive wheel includes a core rotating around a rotation axis and a super abrasive layer bonded to the core. The core has a first surface and a second surface located opposite to the first surface. An annular first protrusion portion protruding in the direction away from the first surface is provided at a portion of the second surface that is surrounded with the super abrasive layer. A reference surface is provided in the second surface on the inside of the first protrusion portion. The height from the reference surface to the first protrusion portion is denoted as A. A top portion having the height B from the reference surface is provided at a portion of the second surface between the first protrusion portion and the super abrasive layer. The height B is greater than the height A.

Abstract: A method of polishing transparent armor, preferably to optical clarity. The method can be used on flat or contoured armor, manually or via robotic automation. The method includes using a step-wise progression of diamond, structured abrasive articles.

Abstract: A waterjet system selectively produces fluid jets for water jet cutting or abrasive jets for abrasive-waterjet-cutting. The abrasive materials in the abrasive jet are determined based on the properties of the workpiece. The waterjet system includes an abrasive delivery system that is capable of delivering either a single abrasive or a plurality of abrasives as an abrasive blend, to a cutting head assembly. The cutting head assembly entrains the abrasive into a fluid jet to form an abrasive jet.

Abstract: The present invention provides a slurry composition and method for polishing organic polymer-based ophthalmic substrates. The slurry composition according to the invention includes an aqueous dispersion of particles of diatomaceous earth and, optionally, particles of abrasives selected from alumina, zirconia, silica, titania and combinations of the foregoing. Slurry compositions according to the invention can be used to polish all types of organic polymer-based ophthalmic substrates, but are particularly useful for polishing organic polymer-based ophthalmic substrates having an index of refraction greater than 1.498 because they remove such materials at a greater efficiency than conventional slurry compositions.

Abstract: The present invention describes a method and an apparatus (12) for surface strengthening and/or smoothing of an integrally bladed rotor area (9) of a jet engine. The rotor area (9) can be connected to a device (13) and held by the latter inside the container (14) in a position equivalent to an at least approximately horizontal orientation of a rotary axis (15) of the rotor area (9). A space delimited by the container (14) and the rotor area (9) between a surface (17) of the rotor area (9) and that surface (18) of the container (14) facing the rotor area (9) is filled at least partially with strengthening and/or smoothing elements (19). A relative movement is generated between the surface (17) of the rotor area (9) and the strengthening and/or smoothing elements (19). The surface region (17) of the rotor area (9) to be strengthened and/or smoothed is at a distance from the surface (18) of the container (14) facing the rotor area (9).

Abstract: There is disclosed a method for manufacturing a polishing pad that is formed of a urethane foam pad and attached to a turn table to polish a wafer, the method comprising at least steps of: slicing a urethane foam cake to provide the urethane foam pad; and performing press processing with respect to the urethane foam pad with a pressure of 15000 g/cm2 or above, a polishing pad manufactured by this method, and a method for polishing a wafer by using this polishing pad. There can be provided a method for manufacturing a polishing pad that can stably obtain a wafer with high flatness, etc.

Abstract: A method for producing a glass substrate for a magnetic disk involving the use of a polishing pad having: a first resin foam layer which forms the polishing surface, includes a resin foam having pores with a pore diameter of more than 20 ?m and has a thickness of 400 ?m or less; and a second resin foam layer which is provided between a platen for fixing the polishing pad and the first resin foam layer, includes a resin foam having pores with a pore diameter of 20 ?m or less and has a thickness of 50 to 250 ?m, and in which a total thickness of the first resin foam layer and the second resin foam layer is 550 ?m or less, and a international rubber hardness degree of the polishing pad measured by the M method according to JIS K6253 is 40 IRHD or more.

Abstract: A method for polishing a substrate using a pad comprising, a polymeric matrix having microspheres dispersed therein, the polymeric matrix being formed of a water-based polymer or blends thereof, wherein the polymeric matrix is applied on a permeable substrate, and wherein the polishing pad exhibits reduced defectivity and improved polishing performance are provided.

Abstract: The present invention is a slicing method and a wire saw apparatus including winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel in a reciprocating direction, in which the ingot is sliced with controlling a temperature of the ingot by supplying a slurry for adjusting an ingot temperature to the ingot independently from the slurry for slicing while the slurry for adjusting an ingot temperature is supplied to the ingot only at the exit side of the wire caused to travel in the reciprocating direction. As a result, there is provided a method and a wire saw apparatus in which rapid cooling of an ingot especially in a time close to end of slicing of the ingot can be alleviated, consequently degradation of a nano-topography can be suppressed, and further high-quality wafers having a uniform thickness can be sliced when slicing the ingot by using a wire saw.

Abstract: Provided is a magnetic recording medium glass substrate manufacturing method capable of manufacturing a magnetic recording medium glass substrate having high surface smoothness and low surface waviness with productivity. In a primary lapping process and a secondary lapping process of the manufacturing method, diamond pads (20A and 20B) in which diamond abrasive grains are fixed by a binder are used. A plurality of convex portions (21) with a flat top are arranged in a tile shape on a lapping surface (20a) of each of the diamond pads (20A and 20B). In the diamond pad (20A) used in the primary lapping process, the average diameter of the diamond abrasive grains is in the range of 4 ?m to 12 ?m and the content of the diamond abrasive grains in the convex portion (20A) is in the range of 5 vol % to 70 vol %.

Abstract: The invention relates to a device for the double-sided processing of flat work pieces, comprising an upper working disc and a lower working disc, wherein the working discs between the working surfaces thereof facing each other, form a working gap for processing the work pieces, and wherein at least one of the working discs comprises a plurality of bores extending through the working surface for feeding a liquid working medium into the working gap, wherein the bores are combined in several groups, wherein each group of bores is connected to a separate pressurized supply line for the working medium, and at least one pressure control apparatus is provided, which makes it possible to control the pressure of the working medium in the supply lines separately from one another.

Abstract: Stent, as well as a method and device for fabricating the stent, wherein the stent has a tubular lattice structure comprising individual struts and at least one strut of which at least one longitudinal section runs with at least one directional component in the radial circumferential direction of the stent, wherein the surface of the longitudinal section facing the outside of the stent is curved only about the longitudinal axis of the stent. According to the invention, the surface of longitudinal section of the strut, which surface faces the inside of the stent, has such a curvature that the strut cross section is fluidically optimized.

Abstract: Cutting fluids for brittle materials, e.g., silicon ingot, comprise, in weight percent: A. 70-99% polyalkylene glycol (PAG), e.g., polyethylene glycol; B. 0.01-10% PAG-grafted polycarboxylate; and C. 0-30% water. These cutting fluids are used with abrasive materials, e.g., silicon carbide (SiC), to form cutting slurries. The slurry is sprayed on the cutting tool, e.g., a wire saw, to cut a brittle work piece, e.g., a silicon ingot.

Abstract: A method for making heated plane of a cooler obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Abstract: In a manufacturing process of a head slider, a plurality of head elements are formed on a wafer, each head element comprising: a return pole, a coil, and a main pole. The wafer is cut into respective head elements so that individual head sliders are formed. A ratio of an amplitude of an electrical signal applied to the coil of the write head on the head slider to an amplitude of output from an independent magnetic field sensor not embedded in the head slider is calculated, where the independent magnetic field sensor is disposed near the main pole so as to be opposed to the main pole across the air bearing surface, and where the ratio is calculated while a displacement between the main pole and the magnetic field sensor is swept. A flare point height of the main pole is determined from the calculated amplitude ratio.

Abstract: Surface treated implantable articles and related methods are disclosed. The surface treated implantable articles can be substantially flash-free, include one or more rounded edges, or include an enhanced optical clarity, one or all of which can be produced by polishing. The polishing can include causing the implantable articles to be repeatedly impacted with polishing media when the articles are swelled to an enlarged state. The polishing process can be particularly useful for smoothing lacrimal implants insertable in a lacrimal canaliculus.

Abstract: A method of manufacturing a multi-layer piezoelectric element is disclosed. The method forms a stack from at least one piezoelectric layer and a plurality of internal electrodes stacked one on another; grinds at least two side faces of the stack, thereby forming one or more cracks on the two side faces; and applies an electrically conductive paste containing 1% by weight or more glass onto the two side faces and firing the stack at such a temperature that is higher than the softening point of the glass and causes the electrically conductive paste that has been applied to shrink by 10% or more in the direction of thickness, thereby forming the external electrodes.

Abstract: The present invention provides a polishing liquid composition for a magnetic disk substrate that can reduce residual inorganic particles and scratches without loss of productivity and a method of producing a magnetic disk substrate using the polishing liquid composition. The polishing liquid composition contains inorganic particles, a diallylamine polymer, an acid and water, the diallylamine polymer includes one or more constitutional units selected from those represented by the following general formulas (I-a), (I-b), (I-c) and (I-d), and the content of the diallylamine polymer in the polishing liquid composition is 0.008 to 0.

Abstract: A prosthetic foot is made by machining or molding a prosthetic foot profile to have a plurality of slots in and along the length of the forefoot region of the foot shape to achieve the appropriate roll-over shape during walking, and slotting the heel region of the machined foot shape to provide shock absorption in early stance phase of walking.

Abstract: A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a surfactant, and a silica sol having silica polishing particles that are surface modified with a surface charge modifier and that have potassium ions attached thereto. A method for preparing the chemical mechanical polishing slurry and a chemical mechanical polishing method using the chemical mechanical polishing slurry are also disclosed.